JP5549011B2 - 半導体面発光素子及びその製造方法 - Google Patents
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- 239000004065 semiconductor Substances 0.000 title claims description 124
- 238000004519 manufacturing process Methods 0.000 title claims description 18
- 239000004038 photonic crystal Substances 0.000 claims description 31
- 239000000758 substrate Substances 0.000 claims description 18
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims description 16
- 150000001875 compounds Chemical class 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 14
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 8
- 229910052725 zinc Inorganic materials 0.000 claims description 8
- 239000011701 zinc Substances 0.000 claims description 8
- 238000005530 etching Methods 0.000 claims description 3
- 229910000980 Aluminium gallium arsenide Inorganic materials 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 description 19
- 235000012431 wafers Nutrition 0.000 description 18
- 238000000635 electron micrograph Methods 0.000 description 17
- 230000000052 comparative effect Effects 0.000 description 15
- 230000003287 optical effect Effects 0.000 description 14
- 238000005253 cladding Methods 0.000 description 12
- 238000010586 diagram Methods 0.000 description 12
- 238000000879 optical micrograph Methods 0.000 description 12
- 239000013078 crystal Substances 0.000 description 11
- 230000005484 gravity Effects 0.000 description 9
- 230000007246 mechanism Effects 0.000 description 9
- 239000000463 material Substances 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 4
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 239000012535 impurity Substances 0.000 description 4
- 229910000530 Gallium indium arsenide Inorganic materials 0.000 description 3
- 238000010894 electron beam technology Methods 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- 238000005429 filling process Methods 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000007772 electrode material Substances 0.000 description 2
- 229910052733 gallium Inorganic materials 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000002086 nanomaterial Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- WGPCGCOKHWGKJJ-UHFFFAOYSA-N sulfanylidenezinc Chemical group [Zn]=S WGPCGCOKHWGKJJ-UHFFFAOYSA-N 0.000 description 2
- JLTRXTDYQLMHGR-UHFFFAOYSA-N trimethylaluminium Chemical compound C[Al](C)C JLTRXTDYQLMHGR-UHFFFAOYSA-N 0.000 description 2
- 229910052984 zinc sulfide Inorganic materials 0.000 description 2
- -1 zinc-blende compound Chemical class 0.000 description 2
- 230000001154 acute effect Effects 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- RBFQJDQYXXHULB-UHFFFAOYSA-N arsane Chemical compound [AsH3] RBFQJDQYXXHULB-UHFFFAOYSA-N 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- HQWPLXHWEZZGKY-UHFFFAOYSA-N diethylzinc Chemical compound CC[Zn]CC HQWPLXHWEZZGKY-UHFFFAOYSA-N 0.000 description 1
- PZPGRFITIJYNEJ-UHFFFAOYSA-N disilane Chemical compound [SiH3][SiH3] PZPGRFITIJYNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 238000001878 scanning electron micrograph Methods 0.000 description 1
- RGGPNXQUMRMPRA-UHFFFAOYSA-N triethylgallium Chemical compound CC[Ga](CC)CC RGGPNXQUMRMPRA-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/3013—AIIIBV compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y20/00—Nanooptics, e.g. quantum optics or photonic crystals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/11—Comprising a photonic bandgap structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
- H01S5/185—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only horizontal cavities, e.g. horizontal cavity surface-emitting lasers [HCSEL]
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/122—Basic optical elements, e.g. light-guiding paths
- G02B6/1225—Basic optical elements, e.g. light-guiding paths comprising photonic band-gap structures or photonic lattices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0083—Periodic patterns for optical field-shaping in or on the semiconductor body or semiconductor body package, e.g. photonic bandgap structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S2304/00—Special growth methods for semiconductor lasers
- H01S2304/04—MOCVD or MOVPE
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
- H01S5/3202—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures grown on specifically orientated substrates, or using orientation dependent growth
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/34—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
- H01S5/343—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/34313—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser with a well layer having only As as V-compound, e.g. AlGaAs, InGaAs
- H01S5/3432—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser with a well layer having only As as V-compound, e.g. AlGaAs, InGaAs the whole junction comprising only (AI)GaAs
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Crystallography & Structural Chemistry (AREA)
- Biophysics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Semiconductor Lasers (AREA)
- Led Devices (AREA)
Description
(1)大面積の2DPC作製が困難である。すなわち、貼合わせるウェハが反りを有している場合、ウェハ間にゴミがある場合、ウエハ表面に大きな凹凸がある場合などの場合には、これらのウェハを上手く貼り合わせることができない。
(2)2DPC層に空洞を含んでおり、結合係数κが大きく、大面積化に不向きである。その理由は、2DPC層に均一に光を分布させるために、電極長Lに対して面内方向の規格化結合係数κLを1〜2程度とすることが望ましいが、2DPC層に空洞を含む場合、κの値が1000cm−1以上の値となり、Lの値が数十μmに制限されるからである。
(3)貼り合わせられたウェハ間の界面に欠陥が形成されるため、寿命・信頼性に難点がある。
(1)大面積の2DPC作製が容易である。すなわち、再成長を用いた場合、結晶を貼り合わせる必要がない。
(2)2DPC層を完全に埋込んだ場合、その結合係数κはウェハを貼合せた場合の結合係数の1/10程度に小さくなるため、大面積化が容易である。
(3)2DPC層界面をエピ層で埋め込むため、欠陥が少なく、信頼性が改善する。
(4)2DPC層に空洞を含まないので、放熱性に優れ、大出力化に向いている。
・コンタクト層8:P型のGaAs/50〜500nm(200nm)
・上部クラッド層7:P型のAlGaAs(Al0.4Ga0.6As)/1.0〜3.0μm(2.0μm)
・フォトニック結晶層6:
基本層6A:GaAs/50〜200nm(100nm)
埋め込み層6B:AlGaAs(Al0.4Ga0.6As)/50〜200nm(100nm)
・上部光ガイド層5:
上層:GaAs/10〜200nm(50nm)
下層:p型または真性のAlGaAs/10〜100nm(50nm)
・活性層4(多重量子井戸構造):
AlGaAs/InGaAs MQW/10〜100nm(30nm)
・下部光ガイド層3:AlGaAs/0〜300nm(150nm)
・下部クラッド層2:N型のAlGaAs/1.0〜3.0μm(2.0μm)
・半導体基板1:N型のGaAs/80〜350μm(200μm)
長方形の穴の各辺の長さは100nm、200nmであり、穴Hの重心の[1-10]方向の間隔は、335nmであり、短辺が[1-10]方向に平行である。[110]方向の間隔は、580nmである。回転角度φが20度(実施例の回転角度は25度)から、表面モフォロジーが改善されており、それよりもφが小さい場合には、表面モフォロジーは悪化している。
Claims (7)
- 閃亜鉛構造の第1化合物半導体からなる基本層内に複数の穴を周期的に形成し、前記穴内に、閃亜鉛構造であって第2化合物半導体からなる埋め込み層を成長させてなるフォトニック結晶層と、前記フォトニック結晶層に対して光を供給する活性層と、を備え、前記基本層の主表面は(001)面であり、前記穴の側面は、少なくとも異なる3つの{100}面、又は、これらの面を前記主表面の法線の回りに±35度未満の回転角度で回転させた面を含んでいる、ことを特徴とする半導体面発光素子。
- 前記穴の側面は、4つの異なる{100}面、又は、これらの面を前記主表面の法線に回りに±35度未満の回転角度で回転させた面を含んでいる、
ことを特徴とする請求項1に記載の半導体面発光素子。 - 前記回転角度は、±25度以下に設定されている、
ことを特徴とする請求項1又は2に記載の半導体面発光素子。 - 前記回転角度は、±20度以下に設定されている、
ことを特徴とする請求項1又は2に記載の半導体面発光素子。 - 前記第1化合物半導体はGaAsであり、
前記第2化合物半導体はAlGaAsである、
ことを特徴とする請求項1乃至4のいずれか1項に記載の半導体面発光素子。 - 請求項1乃至5のいずれか1項に記載の半導体面発光素子を製造する半導体面発光素子の製造方法において、
前記穴を形成する工程と、
前記埋め込み層の成長を行う工程と、
を備えることを特徴とする半導体面発光素子の製造方法。 - 前記成長を行う工程の前に、エッチングにより{110}面、又は{110}を前記主表面の法線回りに±10度以内の回転角度で回転させた面を含むアライメントマークを、前記基本層の形成される半導体基板に形成する工程を備えることを特徴とする請求項6に記載の半導体面発光素子の製造方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010172578A JP5549011B2 (ja) | 2010-07-30 | 2010-07-30 | 半導体面発光素子及びその製造方法 |
US13/812,561 US8693516B2 (en) | 2010-07-30 | 2011-06-21 | Semiconductor surface light-emitting element and method of manufacturing thereof |
PCT/JP2011/064181 WO2012014604A1 (ja) | 2010-07-30 | 2011-06-21 | 半導体面発光素子及びその製造方法 |
DE112011102549.1T DE112011102549B4 (de) | 2010-07-30 | 2011-06-21 | Lichtemittierendes halbleiteroberflächenelement und dessen herstellungsverfahren |
CN201180037546.9A CN103038959B (zh) | 2010-07-30 | 2011-06-21 | 半导体面发光元件以及其制造方法 |
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JP2010172578A JP5549011B2 (ja) | 2010-07-30 | 2010-07-30 | 半導体面発光素子及びその製造方法 |
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JP2012033747A JP2012033747A (ja) | 2012-02-16 |
JP5549011B2 true JP5549011B2 (ja) | 2014-07-16 |
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US (1) | US8693516B2 (ja) |
JP (1) | JP5549011B2 (ja) |
CN (1) | CN103038959B (ja) |
DE (1) | DE112011102549B4 (ja) |
WO (1) | WO2012014604A1 (ja) |
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JP6213915B2 (ja) * | 2013-03-04 | 2017-10-18 | 国立大学法人京都大学 | 半導体レーザ素子 |
US9307458B1 (en) | 2014-03-24 | 2016-04-05 | Sprint Spectrum L.P. | Controlling reverse-direction neighbor reports based on the characteristics of queued bearer traffic |
DE112015003973T5 (de) * | 2014-08-29 | 2017-06-22 | Hamamatsu Photonics K.K. | Oberflächenemittierender laser mit zweidimensionalem photonischen kristall |
US10938177B2 (en) | 2014-08-29 | 2021-03-02 | Kyoto University | Two-dimensional photonic crystal surface emitting laser |
WO2016148075A1 (ja) * | 2015-03-13 | 2016-09-22 | 浜松ホトニクス株式会社 | 半導体発光素子 |
JP6795853B2 (ja) * | 2016-02-29 | 2020-12-02 | 国立大学法人京都大学 | 熱輻射光源 |
JP6747910B2 (ja) * | 2016-08-10 | 2020-08-26 | 浜松ホトニクス株式会社 | 発光装置 |
US11031751B2 (en) | 2016-08-10 | 2021-06-08 | Hamamatsu Photonics K.K. | Light-emitting device |
US10734786B2 (en) | 2016-09-07 | 2020-08-04 | Hamamatsu Photonics K.K. | Semiconductor light emitting element and light emitting device including same |
US11283243B2 (en) * | 2017-02-27 | 2022-03-22 | Kyoto University | Surface-emitting laser and method for manufacturing surface-emitting laser |
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JP6959042B2 (ja) | 2017-06-15 | 2021-11-02 | 浜松ホトニクス株式会社 | 発光装置 |
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JP2007258261A (ja) * | 2006-03-20 | 2007-10-04 | Kyoto Univ | 2次元フォトニック結晶面発光レーザ |
JP5266789B2 (ja) | 2008-02-26 | 2013-08-21 | 住友電気工業株式会社 | 半導体レーザ素子およびその製造方法 |
JP5376360B2 (ja) | 2008-11-10 | 2013-12-25 | 住友電気工業株式会社 | フォトニック結晶面発光レーザの製造方法 |
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