JP5230796B2 - レーザ加工装置、レーザ加工方法、加工制御装置および加工制御方法 - Google Patents
レーザ加工装置、レーザ加工方法、加工制御装置および加工制御方法 Download PDFInfo
- Publication number
- JP5230796B2 JP5230796B2 JP2011502533A JP2011502533A JP5230796B2 JP 5230796 B2 JP5230796 B2 JP 5230796B2 JP 2011502533 A JP2011502533 A JP 2011502533A JP 2011502533 A JP2011502533 A JP 2011502533A JP 5230796 B2 JP5230796 B2 JP 5230796B2
- Authority
- JP
- Japan
- Prior art keywords
- hole
- processing
- machining
- suction
- work
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2009/054066 WO2010100727A1 (ja) | 2009-03-04 | 2009-03-04 | レーザ加工装置、レーザ加工方法、加工制御装置および加工制御方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2010100727A1 JPWO2010100727A1 (ja) | 2012-09-06 |
JP5230796B2 true JP5230796B2 (ja) | 2013-07-10 |
Family
ID=42709305
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011502533A Expired - Fee Related JP5230796B2 (ja) | 2009-03-04 | 2009-03-04 | レーザ加工装置、レーザ加工方法、加工制御装置および加工制御方法 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5230796B2 (ko) |
KR (1) | KR101251084B1 (ko) |
CN (1) | CN102216023B (ko) |
TW (1) | TW201032937A (ko) |
WO (1) | WO2010100727A1 (ko) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013136695A1 (ja) * | 2012-03-16 | 2013-09-19 | パナソニック株式会社 | レーザ加工装置およびレーザ加工方法 |
JP2013246885A (ja) * | 2012-05-23 | 2013-12-09 | Shin Etsu Polymer Co Ltd | 導電パターン形成シートの製造装置および導電パターン形成シートの製造方法 |
CN106404786A (zh) * | 2016-11-04 | 2017-02-15 | 中国科学院长春光学精密机械与物理研究所 | 一种电路板图像扫描装置 |
CN107127463A (zh) * | 2017-05-27 | 2017-09-05 | 东莞市盛雄激光设备有限公司 | 一种hdi电路板钻孔机 |
CN107734844A (zh) * | 2017-09-29 | 2018-02-23 | 奥士康科技股份有限公司 | 一种印刷电路板及其固定方法 |
CN113500313A (zh) * | 2021-06-23 | 2021-10-15 | 济南森峰科技有限公司 | 一种z轴动态移动的激光高速错位打孔方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11254166A (ja) * | 1997-12-25 | 1999-09-21 | Matsushita Electric Ind Co Ltd | 加工装置及び方法 |
JP2001138095A (ja) * | 1999-11-09 | 2001-05-22 | Matsushita Electric Ind Co Ltd | 加工テーブルおよびレーザ加工機 |
JP2007290039A (ja) * | 2006-03-31 | 2007-11-08 | Hitachi Chem Co Ltd | レーザ加工方法及びレーザ加工装置 |
JP2007326129A (ja) * | 2006-06-08 | 2007-12-20 | Matsushita Electric Ind Co Ltd | レーザ加工装置及びレーザ加工方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4458134A (en) * | 1982-06-30 | 1984-07-03 | Burroughs Corporation | Method and apparatus for drilling holes with a laser |
-
2009
- 2009-03-04 CN CN200980145692.6A patent/CN102216023B/zh not_active Expired - Fee Related
- 2009-03-04 KR KR1020117007145A patent/KR101251084B1/ko not_active IP Right Cessation
- 2009-03-04 JP JP2011502533A patent/JP5230796B2/ja not_active Expired - Fee Related
- 2009-03-04 WO PCT/JP2009/054066 patent/WO2010100727A1/ja active Application Filing
- 2009-10-19 TW TW098135227A patent/TW201032937A/zh not_active IP Right Cessation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11254166A (ja) * | 1997-12-25 | 1999-09-21 | Matsushita Electric Ind Co Ltd | 加工装置及び方法 |
JP2001138095A (ja) * | 1999-11-09 | 2001-05-22 | Matsushita Electric Ind Co Ltd | 加工テーブルおよびレーザ加工機 |
JP2007290039A (ja) * | 2006-03-31 | 2007-11-08 | Hitachi Chem Co Ltd | レーザ加工方法及びレーザ加工装置 |
JP2007326129A (ja) * | 2006-06-08 | 2007-12-20 | Matsushita Electric Ind Co Ltd | レーザ加工装置及びレーザ加工方法 |
Also Published As
Publication number | Publication date |
---|---|
KR20110059736A (ko) | 2011-06-03 |
CN102216023A (zh) | 2011-10-12 |
TWI378840B (ko) | 2012-12-11 |
CN102216023B (zh) | 2014-05-07 |
TW201032937A (en) | 2010-09-16 |
JPWO2010100727A1 (ja) | 2012-09-06 |
WO2010100727A1 (ja) | 2010-09-10 |
KR101251084B1 (ko) | 2013-04-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5230796B2 (ja) | レーザ加工装置、レーザ加工方法、加工制御装置および加工制御方法 | |
JP6064519B2 (ja) | レーザー加工装置、および、パターン付き基板の加工条件設定方法 | |
CN100587914C (zh) | 处理半导体晶片的激光束处理设备、方法及半导体晶片 | |
JP6127526B2 (ja) | レーザー加工装置、および、パターン付き基板の加工条件設定方法 | |
JP6223091B2 (ja) | 位置計測装置、アライメント装置、パターン描画装置および位置計測方法 | |
JP2007090632A (ja) | マーク認識方法および印刷装置 | |
JP6241174B2 (ja) | レーザー加工装置、および、パターン付き基板の加工条件設定方法 | |
JP5798026B2 (ja) | アライメントマークの検出方法およびレーザ加工装置 | |
JP6036173B2 (ja) | レーザー加工装置 | |
JP6003496B2 (ja) | パターン付き基板の加工方法 | |
JP2015093300A (ja) | レーザ加工機 | |
JP6309220B2 (ja) | 搬送システム | |
JPH04363047A (ja) | 半導体ウェーハのダイシング方法 | |
JP6884203B2 (ja) | 作業機、および演算方法 | |
JP2009241095A (ja) | エネルギービーム加工装置及びエネルギービーム加工物製造方法 | |
JP6710234B2 (ja) | 搬送装置及び製造システム | |
TW202124076A (zh) | 雷射加工裝置及方法 | |
JP2005302833A (ja) | バックアップピン認識方法、同認識装置、同認識装置を備えたスクリーン印刷装置および表面実装機 | |
WO2019239573A1 (ja) | 作業機 | |
KR20150032772A (ko) | 묘화 장치, 기판 처리 시스템 및 묘화 방법 | |
JP7128362B2 (ja) | 作業機 | |
WO2024150410A1 (ja) | 対基板作業機 | |
JP2021184436A (ja) | 加工装置 | |
JP2024006434A (ja) | レーザー加工装置の検査方法及びレーザー加工装置 | |
JP2022052111A (ja) | 基板位置検出方法、描画方法、基板位置検出装置および描画装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20130219 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20130319 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20160329 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |