JP5230796B2 - レーザ加工装置、レーザ加工方法、加工制御装置および加工制御方法 - Google Patents

レーザ加工装置、レーザ加工方法、加工制御装置および加工制御方法 Download PDF

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Publication number
JP5230796B2
JP5230796B2 JP2011502533A JP2011502533A JP5230796B2 JP 5230796 B2 JP5230796 B2 JP 5230796B2 JP 2011502533 A JP2011502533 A JP 2011502533A JP 2011502533 A JP2011502533 A JP 2011502533A JP 5230796 B2 JP5230796 B2 JP 5230796B2
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JP
Japan
Prior art keywords
hole
processing
machining
suction
work
Prior art date
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Expired - Fee Related
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JP2011502533A
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English (en)
Japanese (ja)
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JPWO2010100727A1 (ja
Inventor
俊博 森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Publication date
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Publication of JPWO2010100727A1 publication Critical patent/JPWO2010100727A1/ja
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Expired - Fee Related legal-status Critical Current
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
JP2011502533A 2009-03-04 2009-03-04 レーザ加工装置、レーザ加工方法、加工制御装置および加工制御方法 Expired - Fee Related JP5230796B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2009/054066 WO2010100727A1 (ja) 2009-03-04 2009-03-04 レーザ加工装置、レーザ加工方法、加工制御装置および加工制御方法

Publications (2)

Publication Number Publication Date
JPWO2010100727A1 JPWO2010100727A1 (ja) 2012-09-06
JP5230796B2 true JP5230796B2 (ja) 2013-07-10

Family

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Family Applications (1)

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JP2011502533A Expired - Fee Related JP5230796B2 (ja) 2009-03-04 2009-03-04 レーザ加工装置、レーザ加工方法、加工制御装置および加工制御方法

Country Status (5)

Country Link
JP (1) JP5230796B2 (ko)
KR (1) KR101251084B1 (ko)
CN (1) CN102216023B (ko)
TW (1) TW201032937A (ko)
WO (1) WO2010100727A1 (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013136695A1 (ja) * 2012-03-16 2013-09-19 パナソニック株式会社 レーザ加工装置およびレーザ加工方法
JP2013246885A (ja) * 2012-05-23 2013-12-09 Shin Etsu Polymer Co Ltd 導電パターン形成シートの製造装置および導電パターン形成シートの製造方法
CN106404786A (zh) * 2016-11-04 2017-02-15 中国科学院长春光学精密机械与物理研究所 一种电路板图像扫描装置
CN107127463A (zh) * 2017-05-27 2017-09-05 东莞市盛雄激光设备有限公司 一种hdi电路板钻孔机
CN107734844A (zh) * 2017-09-29 2018-02-23 奥士康科技股份有限公司 一种印刷电路板及其固定方法
CN113500313A (zh) * 2021-06-23 2021-10-15 济南森峰科技有限公司 一种z轴动态移动的激光高速错位打孔方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11254166A (ja) * 1997-12-25 1999-09-21 Matsushita Electric Ind Co Ltd 加工装置及び方法
JP2001138095A (ja) * 1999-11-09 2001-05-22 Matsushita Electric Ind Co Ltd 加工テーブルおよびレーザ加工機
JP2007290039A (ja) * 2006-03-31 2007-11-08 Hitachi Chem Co Ltd レーザ加工方法及びレーザ加工装置
JP2007326129A (ja) * 2006-06-08 2007-12-20 Matsushita Electric Ind Co Ltd レーザ加工装置及びレーザ加工方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4458134A (en) * 1982-06-30 1984-07-03 Burroughs Corporation Method and apparatus for drilling holes with a laser

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11254166A (ja) * 1997-12-25 1999-09-21 Matsushita Electric Ind Co Ltd 加工装置及び方法
JP2001138095A (ja) * 1999-11-09 2001-05-22 Matsushita Electric Ind Co Ltd 加工テーブルおよびレーザ加工機
JP2007290039A (ja) * 2006-03-31 2007-11-08 Hitachi Chem Co Ltd レーザ加工方法及びレーザ加工装置
JP2007326129A (ja) * 2006-06-08 2007-12-20 Matsushita Electric Ind Co Ltd レーザ加工装置及びレーザ加工方法

Also Published As

Publication number Publication date
KR20110059736A (ko) 2011-06-03
CN102216023A (zh) 2011-10-12
TWI378840B (ko) 2012-12-11
CN102216023B (zh) 2014-05-07
TW201032937A (en) 2010-09-16
JPWO2010100727A1 (ja) 2012-09-06
WO2010100727A1 (ja) 2010-09-10
KR101251084B1 (ko) 2013-04-05

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