TWI378840B - - Google Patents

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Info

Publication number: TWI378840B
Authority: TW; Taiwan
Prior art keywords: hole; processing; workpiece; laser; machining
Prior art date: 2009-03-04

Application number

TW098135227A

Other languages

English (en)

Chinese (zh)

Other versions

TW201032937A (en

Inventor

Toshihiro Mori

Original Assignee

Mitsubishi Electric Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2009-03-04

Filing date

2009-10-19

Publication date

2012-12-11

2009-10-19 Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp

2010-09-16 Publication of TW201032937A publication Critical patent/TW201032937A/zh

2012-12-11 Application granted granted Critical

2012-12-11 Publication of TWI378840B publication Critical patent/TWI378840B/zh

Links

Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation

Landscapes

Engineering & Computer Science (AREA)
Physics & Mathematics (AREA)
Optics & Photonics (AREA)
Plasma & Fusion (AREA)
Mechanical Engineering (AREA)
Laser Beam Processing (AREA)

TW098135227A 2009-03-04 2009-10-19 Laser processing device, laser processing method, processing control device and processing control method TW201032937A (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
PCT/JP2009/054066 WO2010100727A1 (ja)	2009-03-04	2009-03-04	レーザ加工装置、レーザ加工方法、加工制御装置および加工制御方法

Publications (2)

Publication Number	Publication Date
TW201032937A TW201032937A (en)	2010-09-16
TWI378840B true TWI378840B (ko)	2012-12-11

Family

ID=42709305

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW098135227A TW201032937A (en)	2009-03-04	2009-10-19	Laser processing device, laser processing method, processing control device and processing control method

Country Status (5)

Country	Link
JP (1)	JP5230796B2 (ko)
KR (1)	KR101251084B1 (ko)
CN (1)	CN102216023B (ko)
TW (1)	TW201032937A (ko)
WO (1)	WO2010100727A1 (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
WO2013136695A1 (ja) *	2012-03-16	2013-09-19	パナソニック株式会社	レーザ加工装置およびレーザ加工方法
JP2013246885A (ja) *	2012-05-23	2013-12-09	Shin Etsu Polymer Co Ltd	導電パターン形成シートの製造装置および導電パターン形成シートの製造方法
CN106404786A (zh) *	2016-11-04	2017-02-15	中国科学院长春光学精密机械与物理研究所	一种电路板图像扫描装置
CN107127463A (zh) *	2017-05-27	2017-09-05	东莞市盛雄激光设备有限公司	一种hdi电路板钻孔机
CN107734844A (zh) *	2017-09-29	2018-02-23	奥士康科技股份有限公司	一种印刷电路板及其固定方法
CN113500313A (zh) *	2021-06-23	2021-10-15	济南森峰科技有限公司	一种z轴动态移动的激光高速错位打孔方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4458134A (en) *	1982-06-30	1984-07-03	Burroughs Corporation	Method and apparatus for drilling holes with a laser
JP3225230B2 (ja) *	1997-12-25	2001-11-05	松下電器産業株式会社	加工装置及び方法
JP4046913B2 (ja) *	1999-11-09	2008-02-13	松下電器産業株式会社	加工テーブルおよびレーザ加工機
JP5012147B2 (ja) *	2006-03-31	2012-08-29	日立化成工業株式会社	レーザ加工方法及びレーザ加工装置
JP2007326129A (ja) *	2006-06-08	2007-12-20	Matsushita Electric Ind Co Ltd	レーザ加工装置及びレーザ加工方法

2009
- 2009-03-04 KR KR1020117007145A patent/KR101251084B1/ko not_active IP Right Cessation
- 2009-03-04 CN CN200980145692.6A patent/CN102216023B/zh not_active Expired - Fee Related
- 2009-03-04 WO PCT/JP2009/054066 patent/WO2010100727A1/ja active Application Filing
- 2009-03-04 JP JP2011502533A patent/JP5230796B2/ja not_active Expired - Fee Related
- 2009-10-19 TW TW098135227A patent/TW201032937A/zh not_active IP Right Cessation

Also Published As

Publication number	Publication date
TW201032937A (en)	2010-09-16
KR101251084B1 (ko)	2013-04-05
CN102216023B (zh)	2014-05-07
JPWO2010100727A1 (ja)	2012-09-06
JP5230796B2 (ja)	2013-07-10
KR20110059736A (ko)	2011-06-03
CN102216023A (zh)	2011-10-12
WO2010100727A1 (ja)	2010-09-10

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Legal Events

Date	Code	Title	Description
2019-09-11	MM4A	Annulment or lapse of patent due to non-payment of fees