JP5223778B2 - 基板処理装置、基板処理方法及び記憶媒体 - Google Patents

基板処理装置、基板処理方法及び記憶媒体 Download PDF

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Publication number
JP5223778B2
JP5223778B2 JP2009129499A JP2009129499A JP5223778B2 JP 5223778 B2 JP5223778 B2 JP 5223778B2 JP 2009129499 A JP2009129499 A JP 2009129499A JP 2009129499 A JP2009129499 A JP 2009129499A JP 5223778 B2 JP5223778 B2 JP 5223778B2
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substrate
carrier
module
delivery
delivery module
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JP2009129499A
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Japanese (ja)
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JP2010278249A (ja
Inventor
健一郎 松山
知広 金子
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Priority to JP2009129499A priority Critical patent/JP5223778B2/ja
Priority to KR1020100049815A priority patent/KR101513748B1/ko
Priority to CN2010101931017A priority patent/CN101901748B/zh
Publication of JP2010278249A publication Critical patent/JP2010278249A/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes

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  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
JP2009129499A 2009-05-28 2009-05-28 基板処理装置、基板処理方法及び記憶媒体 Active JP5223778B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2009129499A JP5223778B2 (ja) 2009-05-28 2009-05-28 基板処理装置、基板処理方法及び記憶媒体
KR1020100049815A KR101513748B1 (ko) 2009-05-28 2010-05-27 기판 처리 장치, 기판 처리 방법 및 기억 매체
CN2010101931017A CN101901748B (zh) 2009-05-28 2010-05-28 基板处理装置和基板处理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009129499A JP5223778B2 (ja) 2009-05-28 2009-05-28 基板処理装置、基板処理方法及び記憶媒体

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2012158903A Division JP5348290B2 (ja) 2012-07-17 2012-07-17 基板処理装置、基板処理方法及び記憶媒体

Publications (2)

Publication Number Publication Date
JP2010278249A JP2010278249A (ja) 2010-12-09
JP5223778B2 true JP5223778B2 (ja) 2013-06-26

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Family Applications (1)

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JP2009129499A Active JP5223778B2 (ja) 2009-05-28 2009-05-28 基板処理装置、基板処理方法及び記憶媒体

Country Status (3)

Country Link
JP (1) JP5223778B2 (ko)
KR (1) KR101513748B1 (ko)
CN (1) CN101901748B (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8685708B2 (en) 2012-04-18 2014-04-01 Pathogenetix, Inc. Device for preparing a sample
US8999636B2 (en) 2007-01-08 2015-04-07 Toxic Report Llc Reaction chamber

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5187274B2 (ja) * 2009-05-28 2013-04-24 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
JP6046007B2 (ja) * 2013-08-29 2016-12-14 東京エレクトロン株式会社 接合システム
US9966289B2 (en) 2013-09-30 2018-05-08 Hitachi Kokusai Electric Inc. Substrate processing apparatus, method for manufacturing semiconductor device, and non-transitory computer-readable recording medium
JP6607744B2 (ja) * 2015-09-04 2019-11-20 リンテック株式会社 供給装置および供給方法
JP6880913B2 (ja) * 2017-03-28 2021-06-02 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
JP7126750B2 (ja) * 2018-03-20 2022-08-29 株式会社ディスコ 切削装置
JP7360849B2 (ja) * 2019-08-30 2023-10-13 株式会社Ｓｃｒｅｅｎホールディングス 基板処理システムおよび基板搬送方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05275511A (ja) * 1991-03-01 1993-10-22 Tokyo Electron Ltd 被処理体の移載システム及び処理装置
JP4069236B2 (ja) * 2000-06-05 2008-04-02 東京エレクトロン株式会社 液処理装置
JP3916468B2 (ja) 2002-01-11 2007-05-16 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP4307132B2 (ja) * 2003-04-16 2009-08-05 大日本スクリーン製造株式会社 基板処理装置
JP4381121B2 (ja) * 2003-12-11 2009-12-09 大日本スクリーン製造株式会社 基板処理装置
JP4685584B2 (ja) * 2005-03-11 2011-05-18 東京エレクトロン株式会社 塗布、現像装置
JP2007287909A (ja) * 2006-04-17 2007-11-01 Tokyo Electron Ltd 塗布、現像装置及び塗布、現像装置の制御方法並びに記憶媒体
JP4893425B2 (ja) * 2007-03-30 2012-03-07 東京エレクトロン株式会社 枚葉式の基板処理装置、枚葉式の基板処理装置の運転方法及び記憶媒体
JP4957426B2 (ja) * 2007-07-19 2012-06-20 東京エレクトロン株式会社 塗布、現像装置及び塗布、現像装置の運転方法並びに記憶媒体

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8999636B2 (en) 2007-01-08 2015-04-07 Toxic Report Llc Reaction chamber
US8685708B2 (en) 2012-04-18 2014-04-01 Pathogenetix, Inc. Device for preparing a sample

Also Published As

Publication number Publication date
KR20100129211A (ko) 2010-12-08
CN101901748B (zh) 2012-04-25
KR101513748B1 (ko) 2015-04-20
CN101901748A (zh) 2010-12-01
JP2010278249A (ja) 2010-12-09

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