JP4955222B2 - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法 Download PDFInfo
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- JP4955222B2 JP4955222B2 JP2005147914A JP2005147914A JP4955222B2 JP 4955222 B2 JP4955222 B2 JP 4955222B2 JP 2005147914 A JP2005147914 A JP 2005147914A JP 2005147914 A JP2005147914 A JP 2005147914A JP 4955222 B2 JP4955222 B2 JP 4955222B2
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- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
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- Semiconductor Integrated Circuits (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Description
絶縁膜7をパターニングする。ここまでの工程を実施したチップ領域CRの平面図を図14に示す。図14において、保護ダイオード形成領域には、p−型半導体領域(アノード領域)8aが形成され、パワーMISFET形成領域の外周には、ダミーゲート電極用引き出し部9bが形成されていることがわかる。
することにより、ゲート電極とドレイン領域との間の寄生容量(帰還容量)を低減することができ、高速スイッチングを実現できる利点がある。すなわち、ゲート電極とドレイン領域との間には寄生容量が発生するが、ゲート電極とドレイン領域の間に形成されているダミーゲート電極をソース電位に接続することにより、シールド効果が得られる。このシールド効果により寄生容量を低減できる。
2 n型エピタキシャル層
3 p型ウェル
4 素子分離領域
5 絶縁膜
6 溝
7 絶縁膜
8 ポリシリコン膜
8a p−型半導体領域
8b n+型半導体領域
9a ダミーゲート電極
9b ダミーゲート電極用引き出し部
10 ゲート絶縁膜
11a ゲート電極
11b ゲート電極用引き出し部
12 サイドウォール
13 半導体領域
14 ソース領域
15 n+型半導体領域
16 層間絶縁膜
17 コンタクト孔
18 コンタクト孔
19 コンタクト孔
20 p型半導体領域
21 コンタクト孔
22 チタンタングステン膜
23 アルミニウム膜
24 ソース電極
25 ゲート配線
26 電極
27 ポリイミド樹脂膜
28a チタン膜
28b ニッケル膜
28c 金膜
29 ドレイン電極
30 ゲートドライブ回路
31 モータ
32〜35 パワーMISFET
36 直流電源
37〜40 保護ダイオード
40a 凸部
40b 凹部
41a 凸部
41b 凹部
101 パワーMISFET
102 横型MISFET
103 保護ダイオード
CP 半導体チップ
CR チップ領域
GP ゲートパッド
SP ソースパッド
Claims (6)
- (a)半導体基板に溝を形成する工程と、
(b)前記溝の内面を含む前記半導体基板上に絶縁膜を形成する工程と、
(c)前記絶縁膜上に第1ポリシリコン膜を形成する工程と、
(d)前記第1ポリシリコン膜に不純物を導入する工程と、
(e)前記不純物を導入した前記第1ポリシリコン膜をアニールする工程と、
(f)前記第1ポリシリコン膜をパターニングすることにより、前記溝内に前記第1ポリシリコン膜の一部を残してダミーゲート電極を形成し、かつ前記半導体基板上に保護ダイオードのアノード領域を形成する工程と、
(g)前記溝内を含む前記半導体基板上にゲート絶縁膜を形成する工程と、
(h)前記ゲート絶縁膜上に導電型不純物を導入した第2ポリシリコン膜を形成する工程と、
(i)前記第2ポリシリコン膜をパターニングすることにより、前記溝内に前記第2ポリシリコン膜の一部を残してゲート電極を形成する工程と、
(j)前記半導体基板の所定領域に不純物を導入することにより、チャネル形成用半導体領域を形成する工程と、
(k)前記半導体基板の所定領域に不純物を導入することにより、ソース領域を形成する工程と、
(l)前記半導体基板の所定領域に不純物を導入することにより、前記保護ダイオードのカソード領域を形成する工程とを備えることを特徴とする半導体装置の製造方法。 - 前記(k)工程と前記(l)工程は同一工程で実施することを特徴とする請求項1記載の半導体装置の製造方法。
- 前記(e)工程は、前記(j)工程より前に行われることを特徴とする請求項1記載の半導体装置の製造方法。
- 前記第1ポリシリコン膜に導入されている不純物濃度は、前記第2ポリシリコン膜に導入されている不純物濃度よりも低いことを特徴とする請求項1記載の半導体装置の製造方法。
- 前記(d)工程は、前記第1ポリシリコン膜を形成した後にイオン注入法を用いて不純物を導入する一方、前記(h)工程は、予め不純物を含んだ第2ポリシリコン膜を堆積することを特徴とする請求項1記載の半導体装置の製造方法。
- 前記ダミーゲート電極の引き出し部の膜厚を、前記ゲート電極の引き出し部の膜厚よりも薄く形成することを特徴とする請求項1記載の半導体装置の製造方法。
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JP2005147914A JP4955222B2 (ja) | 2005-05-20 | 2005-05-20 | 半導体装置の製造方法 |
US11/432,491 US20060261391A1 (en) | 2005-05-20 | 2006-05-12 | Semiconductor device and manufacturing method of the same |
US12/471,680 US7834407B2 (en) | 2005-05-20 | 2009-05-26 | Semiconductor device |
US12/873,495 US8232610B2 (en) | 2005-05-20 | 2010-09-01 | Semiconductor device and manufacturing method of the same |
US13/486,676 US8592920B2 (en) | 2005-05-20 | 2012-06-01 | Semiconductor device and manufacturing method of the same |
US13/486,738 US8604563B2 (en) | 2005-05-20 | 2012-06-01 | Semiconductor device and manufacturing method of the same |
US14/100,462 US9013006B2 (en) | 2005-05-20 | 2013-12-09 | Semiconductor device and manufacturing method of the same |
US14/690,783 US9245973B2 (en) | 2005-05-20 | 2015-04-20 | Semiconductor device and manufacturing method of the same |
US15/001,767 US9478530B2 (en) | 2005-05-20 | 2016-01-20 | Semiconductor device and manufacturing method of the same |
US15/333,430 US9837528B2 (en) | 2005-05-20 | 2016-10-25 | Semiconductor device and manufacturing method of the same |
US15/829,046 US10211332B2 (en) | 2005-05-20 | 2017-12-01 | Semiconductor device and manufacturing method of the same |
US16/272,601 US11107912B2 (en) | 2005-05-20 | 2019-02-11 | Trench gate semiconductor device with dummy gate electrode and manufacturing method of the same |
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US20120241855A1 (en) | 2012-09-27 |
US20100327359A1 (en) | 2010-12-30 |
US20190189798A1 (en) | 2019-06-20 |
US7834407B2 (en) | 2010-11-16 |
US20170040445A1 (en) | 2017-02-09 |
US20120241856A1 (en) | 2012-09-27 |
US8592920B2 (en) | 2013-11-26 |
US11107912B2 (en) | 2021-08-31 |
JP2006324570A (ja) | 2006-11-30 |
US9478530B2 (en) | 2016-10-25 |
US8232610B2 (en) | 2012-07-31 |
US20090230467A1 (en) | 2009-09-17 |
US10211332B2 (en) | 2019-02-19 |
US9013006B2 (en) | 2015-04-21 |
US8604563B2 (en) | 2013-12-10 |
US20180090610A1 (en) | 2018-03-29 |
US9245973B2 (en) | 2016-01-26 |
US20160148923A1 (en) | 2016-05-26 |
US20150228758A1 (en) | 2015-08-13 |
US20060261391A1 (en) | 2006-11-23 |
US20140193968A1 (en) | 2014-07-10 |
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