JP2022169731A - 基板搬送システム、および基板搬送方法 - Google Patents
基板搬送システム、および基板搬送方法 Download PDFInfo
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- Microelectronics & Electronic Packaging (AREA)
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Dicing (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
Abstract
Description
10 基板
14 保護テープ
18 粘着テープ
19 フレーム
20 制御部
30 搬入部
35 搬入カセット
40 搬出部
45 搬出カセット
50 主搬送路
58 主搬送部
100 ダイシング部
200 薄板化部
300 受渡部
400 紫外線照射部
500 マウント部
600 剥離部
700 ID貼付部
910 第1副搬送部
920 第2副搬送部
930 第3副搬送部
Claims (4)
- 粘着テープを基板とフレームとに貼合させることで、前記粘着テープを介して前記基板が前記フレームに装着された装着物を形成するマウント部と、前記粘着テープを介して前記フレームに装着される前の前記基板を収納した搬入カセットが外部から搬入される搬入部と、前記粘着テープを介して前記フレームに装着された後の前記基板を収納した搬出カセットが外部に搬出される搬出部と、前記基板の強度が低下する加工を行う処理部との間で前記基板を搬送する基板搬送システムにおいて、
鉛直方向視で前記搬入部、前記マウント部、前記搬出部および前記処理部が隣接して設けられる主搬送路と、
前記基板を保持すると共に前記主搬送路に沿って移動し、前記基板を搬送する主搬送部とをさらに備え、
前記主搬送部は、前記搬入カセットからの前記基板の取り出しに用いられる第1保持部と、前記処理部による加工によって強度が低下した基板の搬送に用いられる第2保持部とを備えていることを特徴とする基板搬送システム。 - 前記第2保持部は、前記フレームに装着される前の前記基板の搬送に用いられることを特徴とする請求項1に記載の基板搬送システム。
- 前記主搬送部は、前記フレームに装着された後の基板の搬送に用いられる第3保持部をさらに備えていることを特徴とする請求項1または請求項2に記載の基板搬送システム。
- 粘着テープを基板とフレームとに貼合させることで、前記粘着テープを介して前記基板が前記フレームに装着された装着物を形成するマウント部と、前記粘着テープを介して前記フレームに装着される前の前記基板を収納した搬入カセットが外部から搬入される搬入部と、前記粘着テープを介して前記フレームに装着された後の前記基板を収納した搬出カセットが外部に搬出される搬出部と、前記基板の強度が低下する加工を行う処理部との間で前記基板を搬送する基板搬送方法において、
前記搬入部、前記マウント部、前記搬出部および前記処理部が隣接して設けられる主搬送路に沿って、前記基板を保持する主搬送部を移動させる基板移動工程をさらに行い、
前記基板移動工程では、前記搬入カセットからの前記基板の取り出しを第1保持部を用いて行い、前記処理部による加工によって強度が低下した基板の搬送を第2保持部を用いて行うことを特徴とする基板搬送方法。
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JP2021113047A JP7133686B2 (ja) | 2017-08-28 | 2021-07-07 | 基板処理システム、および基板処理方法 |
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JP2020191430A (ja) * | 2019-05-24 | 2020-11-26 | 株式会社ディスコ | ウェーハの処理方法及びテープ剥離装置 |
JP7358014B2 (ja) * | 2019-10-29 | 2023-10-10 | 株式会社ディスコ | 加工装置 |
WO2023176611A1 (ja) * | 2022-03-14 | 2023-09-21 | 株式会社荏原製作所 | 基板研磨装置、基板研磨方法、研磨装置および研磨方法 |
Citations (4)
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WO2019044506A1 (ja) | 2019-03-07 |
JP7434463B2 (ja) | 2024-02-20 |
JPWO2019044506A1 (ja) | 2020-09-10 |
KR20200039008A (ko) | 2020-04-14 |
KR102649682B1 (ko) | 2024-03-21 |
TW201921463A (zh) | 2019-06-01 |
CN111052341A (zh) | 2020-04-21 |
JP7133686B2 (ja) | 2022-09-08 |
JP2021170659A (ja) | 2021-10-28 |
CN116435236A (zh) | 2023-07-14 |
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