JP7133686B2 - 基板処理システム、および基板処理方法 - Google Patents
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- H—ELECTRICITY
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- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
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- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
- H01L2221/68386—Separation by peeling
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Dicing (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
Description
10 基板
14 保護テープ
18 粘着テープ
19 フレーム
20 制御部
30 搬入部
35 搬入カセット
40 搬出部
45 搬出カセット
50 主搬送路
58 主搬送部
100 ダイシング部
200 薄板化部
300 受渡部
400 紫外線照射部
500 マウント部
600 剥離部
700 ID貼付部
910 第1副搬送部
920 第2副搬送部
930 第3副搬送部
Claims (6)
- 粘着テープを基板とフレームとに貼合させることで、前記粘着テープを介して前記基板が前記フレームに装着された装着物を形成するマウント部と、
前記粘着テープを介して前記フレームに装着される前の前記基板を収納した搬入カセットが外部から搬入される搬入部と、
前記粘着テープを介して前記フレームに装着された後の前記基板を収納した搬出カセットが外部に搬出される搬出部と、
鉛直方向視で前記搬入部、前記マウント部、および前記搬出部が隣接して設けられる主搬送路と、
前記基板を保持すると共に前記主搬送路に沿って移動し、前記基板を搬送する主搬送部と、
前記基板の識別情報を読み取り、読み取った前記識別情報をラベルに印刷し、印刷したラベルを前記装着物に貼り付けるID貼付部と、
を備え、
前記ID貼付部は、鉛直方向視で前記主搬送路に隣接して設けられる、基板処理システム。 - 前記基板を保護する保護テープに紫外線を照射する紫外線照射部を備え、
前記紫外線照射部は、鉛直方向視で前記マウント部と重ねて設けられ、
前記紫外線照射部は、前記保護テープを基準として前記基板とは反対側から、当該保護テープに紫外線を照射する、請求項1に記載の基板処理システム。 - 前記基板のダイシングを行うダイシング部を備え、
前記ダイシング部は、鉛直方向視で前記主搬送路に隣接して設けられている、請求項1又は2に記載の基板処理システム。 - 前記基板を薄板化する薄板化部を備え、
前記薄板化部は、鉛直方向視で前記主搬送路に隣接して設けられている、請求項1~3のいずれか1項に記載の基板処理システム。 - 粘着テープを基板とフレームとに貼合させることで、前記粘着テープを介して前記基板が前記フレームに装着された装着物を形成するマウント部と、
前記粘着テープを介して前記フレームに装着される前の前記基板を収納した搬入カセッ
トが外部から搬入される搬入部と、
前記粘着テープを介して前記フレームに装着された後の前記基板を収納した搬出カセッ
トが外部に搬出される搬出部と、
鉛直方向視で前記搬入部、前記マウント部、および前記搬出部が隣接して設けられる主搬送路と、
前記基板を保持すると共に前記主搬送路に沿って移動し、前記基板を搬送する主搬送部と、
を備え、
前記主搬送路は水平な所定方向に延びており、前記主搬送路の幅方向片側に前記搬入部および前記搬出部が設けられ、前記主搬送路の長手方向一端部に隣接して前記マウント部が設けられ、
前記マウント部は、前記基板を装着する前の前記フレームを収納したフレームカセットが外部から搬入されるフレーム供給部を有し、
前記フレーム供給部には、前記幅方向片側から、前記フレームカセットが搬入される、基板処理システム。 - マウント部が、粘着テープを基板とフレームとに貼合させることで、前記粘着テープを介して前記基板が前記フレームに装着された装着物を形成することと、
搬入部に置かれた搬入カセットから、前記粘着テープを介して前記フレームに装着される前の前記基板を取り出すことと、
前記粘着テープを介して前記フレームに装着された後の前記基板を、搬出部に置かれた搬出カセットに収納することと、
前記搬入部、前記マウント部、および前記搬出部が隣接して設けられる主搬送路に沿って、前記基板を保持する主搬送部を移動させることと、
ID貼付部が、前記基板の識別情報を読み取り、読み取った前記識別情報をラベルに印刷し、印刷したラベルを前記装着物に貼り付けることと、
鉛直方向視で前記主搬送路に隣接して設けられる前記ID貼付部から前記搬出部に前記基板を搬送することと、
を有する、基板処理方法。
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JP2024017062A JP2024036600A (ja) | 2017-08-28 | 2024-02-07 | マウント装置およびマウント方法 |
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JP2020191430A (ja) * | 2019-05-24 | 2020-11-26 | 株式会社ディスコ | ウェーハの処理方法及びテープ剥離装置 |
JP7358014B2 (ja) * | 2019-10-29 | 2023-10-10 | 株式会社ディスコ | 加工装置 |
WO2023176611A1 (ja) * | 2022-03-14 | 2023-09-21 | 株式会社荏原製作所 | 基板研磨装置、基板研磨方法、研磨装置および研磨方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002343756A (ja) | 2001-05-21 | 2002-11-29 | Tokyo Seimitsu Co Ltd | ウェーハ平面加工装置 |
JP2007214457A (ja) | 2006-02-10 | 2007-08-23 | Tokyo Seimitsu Co Ltd | ウェーハ加工装置及び方法 |
JP2007324516A (ja) | 2006-06-05 | 2007-12-13 | Tokyo Seimitsu Co Ltd | ワーク処理装置 |
JP2009117584A (ja) | 2007-11-06 | 2009-05-28 | Tokyo Seimitsu Co Ltd | ウェーハ処理装置 |
JP2016122763A (ja) | 2014-12-25 | 2016-07-07 | 日東電工株式会社 | 半導体ウエハのマウント方法および半導体ウエハのマウント装置 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3483633B2 (ja) * | 1993-12-24 | 2004-01-06 | 東京エレクトロン株式会社 | 処理装置及び搬送方法 |
JPH11163082A (ja) * | 1997-11-28 | 1999-06-18 | Dainippon Screen Mfg Co Ltd | 基板搬送装置および基板搬送方法 |
JP3560823B2 (ja) * | 1998-08-18 | 2004-09-02 | リンテック株式会社 | ウェハ転写装置 |
JP4748901B2 (ja) * | 2001-09-06 | 2011-08-17 | 日東電工株式会社 | 半導体ウエハのマウント方法およびこれに用いるカセット |
JP4435542B2 (ja) * | 2002-11-18 | 2010-03-17 | 東京エレクトロン株式会社 | 絶縁膜形成装置 |
JP2004193189A (ja) * | 2002-12-09 | 2004-07-08 | Matsushita Electric Ind Co Ltd | 半導体装置の生産管理システム |
JP2004363165A (ja) * | 2003-06-02 | 2004-12-24 | Tokyo Seimitsu Co Ltd | ウェーハ処理装置およびウェーハ処理方法 |
JP4371890B2 (ja) * | 2004-04-14 | 2009-11-25 | リンテック株式会社 | 貼付装置及び貼付方法 |
JP2006278630A (ja) | 2005-03-29 | 2006-10-12 | Lintec Corp | ウエハ転写装置 |
JP4841262B2 (ja) * | 2006-02-13 | 2011-12-21 | 株式会社東京精密 | ウェーハ処理装置 |
JP2007235068A (ja) * | 2006-03-03 | 2007-09-13 | Tokyo Seimitsu Co Ltd | ウェーハ加工方法 |
JP6100484B2 (ja) | 2012-08-09 | 2017-03-22 | リンテック株式会社 | 搬送装置および搬送方法 |
JP6235279B2 (ja) * | 2013-09-18 | 2017-11-22 | 株式会社ディスコ | ウエーハの加工方法 |
JP2015119085A (ja) * | 2013-12-19 | 2015-06-25 | 株式会社ディスコ | デバイスウェーハの加工方法 |
JP6283573B2 (ja) * | 2014-06-03 | 2018-02-21 | 東京エレクトロン株式会社 | 剥離装置、剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体 |
JP2016001677A (ja) * | 2014-06-12 | 2016-01-07 | 株式会社ディスコ | ウエーハの加工方法 |
JP6625857B2 (ja) * | 2015-10-14 | 2019-12-25 | 株式会社ディスコ | ウェーハ加工方法 |
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---|---|---|---|---|
JP2002343756A (ja) | 2001-05-21 | 2002-11-29 | Tokyo Seimitsu Co Ltd | ウェーハ平面加工装置 |
JP2007214457A (ja) | 2006-02-10 | 2007-08-23 | Tokyo Seimitsu Co Ltd | ウェーハ加工装置及び方法 |
JP2007324516A (ja) | 2006-06-05 | 2007-12-13 | Tokyo Seimitsu Co Ltd | ワーク処理装置 |
JP2009117584A (ja) | 2007-11-06 | 2009-05-28 | Tokyo Seimitsu Co Ltd | ウェーハ処理装置 |
JP2016122763A (ja) | 2014-12-25 | 2016-07-07 | 日東電工株式会社 | 半導体ウエハのマウント方法および半導体ウエハのマウント装置 |
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WO2019044506A1 (ja) | 2019-03-07 |
JP7434463B2 (ja) | 2024-02-20 |
KR102649682B1 (ko) | 2024-03-21 |
TWI772493B (zh) | 2022-08-01 |
CN116435236A (zh) | 2023-07-14 |
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