JP2021535586A - ヒータペデスタル上の基板の位置を測定するための方法および装置 - Google Patents
ヒータペデスタル上の基板の位置を測定するための方法および装置 Download PDFInfo
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- JP2021535586A JP2021535586A JP2021503160A JP2021503160A JP2021535586A JP 2021535586 A JP2021535586 A JP 2021535586A JP 2021503160 A JP2021503160 A JP 2021503160A JP 2021503160 A JP2021503160 A JP 2021503160A JP 2021535586 A JP2021535586 A JP 2021535586A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J13/00—Controls for manipulators
- B25J13/08—Controls for manipulators by means of sensing devices, e.g. viewing or touching devices
- B25J13/086—Proximity sensors
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/16—Programme controls
- B25J9/1679—Programme controls characterised by the tasks executed
- B25J9/1692—Calibration of manipulator
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
- G01B7/14—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring distance or clearance between spaced objects or spaced apertures
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
- G01D5/12—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means
- G01D5/14—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage
- G01D5/24—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying capacitance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Human Computer Interaction (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
本願は、2018年9月4日出願の米国特許仮出願第62/726,887号の利益を主張する、2019年8月20日出願の米国特許出願第16/545,824号の優先権を主張し、その全内容は参照によって本明細書に組み込まれる。
半導体ウエハなどの基板の処理では、基板が、様々な製造工程のために加熱ペデスタル上に配置され得る。典型的には、加熱ペデスタルは、基板が載置される平坦な表面および基板を取り囲む環状リング(ポケットとも称される)を備える。環状リングは、一般に、処理される基板よりも厚い。
Claims (15)
- ペデスタルに対するセンサウエハの位置を特定する方法であって、
前記ペデスタルによって支持される第1の表面、前記第1の表面の反対側の第2の表面、および、前記第1の表面を前記第2の表面に接続する端面であって複数のセンサ領域が形成された端面を備える、センサウエハを、主要面と前記センサウエハを取り囲む環状壁とを備える前記ペデスタル上に配置すること、
前記複数のセンサ領域の各々と前記環状壁との間の間隙距離を特定すること、ならびに
前記環状壁の中心点に対する前記センサウエハの中心点の中心点オフセットを前記間隙距離から特定すること、
を含む、方法。 - 前記複数のセンサ領域が自己参照容量センサを備える、請求項1に記載の方法。
- 前記自己参照容量センサが第1のプローブおよび第2のプローブを含み、前記第1のプローブに供給される電流の出力位相が前記第2のプローブに供給される電流の出力位相から180度オフセットされている、請求項2に記載の方法。
- 前記センサウエハが前記センサ領域の各々の下方に電界ガードをさらに備える、請求項1に記載の方法。
- 前記センサ領域の各々に近接した前記センサウエハの前記第2の表面の中に凹部が形成される、請求項1に記載の方法。
- 測定される前記間隙距離のうちの最大のものが1mm未満である、請求項1に記載の方法。
- 前記中心点オフセットを使用して、前記ペデスタル上に後続のウエハを配置することをさらに含む、請求項1に記載の方法。
- 後続して配置された前記ウエハが、前記環状壁の前記中心点から200μm以内である中心点を有する、請求項7に記載の方法。
- 前記複数のセンサ領域が少なくとも3つのセンサ領域を含む、請求項1に記載の方法。
- 配置コントローラであって、
センサウエハの端面に沿って複数の外向きセンサを備える前記センサウエハから、センサ情報を受信するセンサインターフェースと、
前記センサ情報を利用して、前記センサウエハが載置される加熱ペデスタルの中心点に対する前記センサウエハの中心点を特定する、中心点モジュールとを備え、
前記配置コントローラが、前記ペデスタル上に前記センサウエハを配置する位置決めロボットを制御する、配置コントローラ。 - 前記配置コントローラが、データベースに記憶される位置オフセット値を生成する、請求項10に記載の配置コントローラ。
- 前記位置オフセットを使用して、前記位置決めロボットが前記ペデスタル上にウエハを配置する際に、前記位置決めロボットを制御する、請求項11に記載の配置コントローラ。
- 前記ペデスタルがヒータペデスタルである、請求項10に記載の配置コントローラ。
- 前記センサウエハの前記センサが、自己参照容量センサである、請求項10に記載の配置コントローラ。
- 前記複数の外向きセンサが、少なくとも3つの外向きセンサを含む、請求項10に記載の配置コントローラ。
Priority Applications (1)
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JP2023082439A JP2023120187A (ja) | 2018-09-04 | 2023-05-18 | ヒータペデスタル上の基板の位置を測定するための方法および装置 |
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201862726887P | 2018-09-04 | 2018-09-04 | |
US62/726,887 | 2018-09-04 | ||
US16/545,824 US11404296B2 (en) | 2018-09-04 | 2019-08-20 | Method and apparatus for measuring placement of a substrate on a heater pedestal |
US16/545,824 | 2019-08-20 | ||
PCT/US2019/047752 WO2020050989A1 (en) | 2018-09-04 | 2019-08-22 | Method and apparatus for measuring placement of a substrate on a heater pedestal |
Related Child Applications (1)
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JP2023082439A Division JP2023120187A (ja) | 2018-09-04 | 2023-05-18 | ヒータペデスタル上の基板の位置を測定するための方法および装置 |
Publications (2)
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JP2021535586A true JP2021535586A (ja) | 2021-12-16 |
JP7284248B2 JP7284248B2 (ja) | 2023-05-30 |
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JP2023082439A Pending JP2023120187A (ja) | 2018-09-04 | 2023-05-18 | ヒータペデスタル上の基板の位置を測定するための方法および装置 |
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US (2) | US11404296B2 (ja) |
JP (2) | JP7284248B2 (ja) |
KR (2) | KR102622898B1 (ja) |
CN (1) | CN112470264A (ja) |
TW (2) | TWI771609B (ja) |
WO (1) | WO2020050989A1 (ja) |
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KR20240012756A (ko) * | 2022-07-21 | 2024-01-30 | 삼성전자주식회사 | 웨이퍼형 센서, 웨이퍼형 센서를 이용한 웨이퍼 정렬 방법 및 웨이퍼형 센서의 보정 장치 |
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2019
- 2019-08-20 US US16/545,824 patent/US11404296B2/en active Active
- 2019-08-22 WO PCT/US2019/047752 patent/WO2020050989A1/en active Application Filing
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- 2019-08-22 KR KR1020227038977A patent/KR102622898B1/ko active IP Right Grant
- 2019-08-22 CN CN201980048663.1A patent/CN112470264A/zh active Pending
- 2019-08-22 KR KR1020217002652A patent/KR102466391B1/ko active IP Right Grant
- 2019-08-26 TW TW108130362A patent/TWI771609B/zh active
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- 2022-06-21 US US17/845,816 patent/US11908724B2/en active Active
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Publication number | Publication date |
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JP7284248B2 (ja) | 2023-05-30 |
KR102622898B1 (ko) | 2024-01-08 |
TWI771609B (zh) | 2022-07-21 |
TWI784325B (zh) | 2022-11-21 |
CN112470264A (zh) | 2021-03-09 |
US11404296B2 (en) | 2022-08-02 |
WO2020050989A1 (en) | 2020-03-12 |
US20220319887A1 (en) | 2022-10-06 |
KR20220154254A (ko) | 2022-11-21 |
KR102466391B1 (ko) | 2022-11-10 |
US11908724B2 (en) | 2024-02-20 |
KR20210013331A (ko) | 2021-02-03 |
US20200075370A1 (en) | 2020-03-05 |
TW202011509A (zh) | 2020-03-16 |
JP2023120187A (ja) | 2023-08-29 |
TW202119536A (zh) | 2021-05-16 |
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