JP6712939B2 - 静電容量測定用の測定器、及び、測定器を用いて処理システムにおける搬送位置データを較正する方法 - Google Patents
静電容量測定用の測定器、及び、測定器を用いて処理システムにおける搬送位置データを較正する方法 Download PDFInfo
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- 238000012545 processing Methods 0.000 title claims description 63
- 238000000034 method Methods 0.000 title claims description 45
- 238000005259 measurement Methods 0.000 title claims description 38
- 238000012546 transfer Methods 0.000 title description 49
- 239000000758 substrate Substances 0.000 claims description 90
- 230000032258 transport Effects 0.000 claims description 48
- 230000002093 peripheral effect Effects 0.000 claims description 47
- 230000000149 penetrating effect Effects 0.000 claims description 15
- 238000006243 chemical reaction Methods 0.000 description 37
- 239000007789 gas Substances 0.000 description 27
- 230000008569 process Effects 0.000 description 26
- 238000004891 communication Methods 0.000 description 11
- 229910052710 silicon Inorganic materials 0.000 description 9
- 239000010703 silicon Substances 0.000 description 9
- 239000004020 conductor Substances 0.000 description 8
- 239000002344 surface layer Substances 0.000 description 8
- 229910052782 aluminium Inorganic materials 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 230000005855 radiation Effects 0.000 description 5
- 239000003507 refrigerant Substances 0.000 description 5
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 4
- 229910004541 SiN Inorganic materials 0.000 description 4
- 229910004298 SiO 2 Inorganic materials 0.000 description 4
- 239000002826 coolant Substances 0.000 description 4
- 230000006837 decompression Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000012636 effector Substances 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000003550 marker Substances 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000007743 anodising Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000003708 edge detection Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009616 inductively coupled plasma Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
- G01D5/12—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means
- G01D5/14—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage
- G01D5/24—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying capacitance
- G01D5/241—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying capacitance by relative movement of capacitor electrodes
- G01D5/2412—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying capacitance by relative movement of capacitor electrodes by varying overlap
- G01D5/2415—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying capacitance by relative movement of capacitor electrodes by varying overlap adapted for encoders
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- G01D18/00—Testing or calibrating apparatus or arrangements provided for in groups G01D1/00 - G01D15/00
- G01D18/001—Calibrating encoders
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
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- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
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Description
Claims (8)
- 静電容量測定用の測定器であって、
円盤形状を有するベース基板と、
前記ベース基板のエッジに沿って配列された複数の側部電極をそれぞれ提供する複数の第1センサと、
各々が前記ベース基板の底面に沿って設けられた底部電極を有する一以上の第2センサと、
前記ベース基板上に搭載されており、前記複数の第1センサ及び前記一以上の第2センサのそれぞれに接続された回路基板であって、前記複数の側部電極及び前記底部電極に高周波信号を与え、前記複数の側部電極における電圧振幅のそれぞれから静電容量を表す複数の第1の測定値を生成し、前記底部電極における電圧振幅から静電容量を表す第2の測定値を生成するよう構成された、該回路基板と、
を備える測定器。 - 前記一以上の第2センサの各々の前記底部電極は、円形状を有し、
前記一以上の第2センサの各々は、前記底部電極を囲むように配置された周辺電極を更に有し、
前記回路基板は、前記周辺電極に前記高周波信号を与え、前記周辺電極における電圧振幅から静電容量を表す第3の測定値を生成するよう更に構成されている、
請求項1に記載の測定器。 - 前記一以上の第2センサは、複数の第2センサであり、
前記複数の第2センサは、前記ベース基板の中心軸線を共有する円に沿って配置されている、
請求項1又は2に記載の測定器。 - 前記一以上の第2センサの各々は、前記ベース基板の上面から該ベース基板の板厚方向に延びるように該ベース基板に設けられた複数の電極を更に有し、
前記一以上の第2センサの各々の前記底部電極は、前記複数の電極の前記底面の側の端面によって構成されている、
請求項1〜3のいずれか一項に記載の測定器。 - 前記一以上の第2センサの各々は、前記ベース基板を貫通する一以上の貫通電極を更に有し、
前記一以上の第2センサの各々の前記底部電極は、前記一以上の貫通電極を介して前記回路基板に接続されている、
請求項1〜3のいずれか一項に記載の測定器。 - 前記一以上の第2センサは、三以上の第2センサであり、
前記三以上の第2センサの各々は、前記ベース基板の底面に沿って設けられた底部電極を有し、前記ベース基板の中心軸線を共有する円に沿って配置されており、
前記三以上の第2センサの各々の前記底部電極のエッジの一部は、円弧形状を有し前記円上で延在する、
請求項1に記載の測定器。 - 請求項6に記載の測定器を用いて処理システムにおける搬送位置データを較正する方法であって、
前記処理システムは、
チャンバ本体、及び、該チャンバ本体によって提供されるチャンバ内に設けられており、円形のエッジを有する載置領域を有し、該載置領域上に被加工物が載置される静電チャックを有する処理装置と、
搬送位置データに基づき前記載置領域上に前記被加工物を搬送する搬送装置と、
を備え、該方法は、
前記搬送位置データによって特定される前記載置領域上の位置に、前記搬送装置を用いて前記測定器を搬送する工程と、
前記載置領域上に搬送された前記測定器の前記三以上の第2センサにより三以上の静電容量を測定する工程と、
前記三以上の静電容量の測定値から、前記測定器が搬送された前記載置領域上の位置の、前記載置領域上の所定の搬送位置に対する誤差を求める工程と、
前記誤差を用いて前記搬送位置データを較正する工程と、
を含む方法。 - 前記底部電極のエッジの前記一部の曲率は、前記載置領域のエッジの曲率に一致している、請求項7に記載の方法。
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KR1020170075800A KR102381838B1 (ko) | 2016-06-20 | 2017-06-15 | 정전 용량 측정용 측정기, 및 측정기를 이용하여 처리 시스템에 있어서의 반송 위치 데이터를 교정하는 방법 |
TW106120306A TWI724185B (zh) | 2016-06-20 | 2017-06-19 | 靜電電容檢測用之檢測器及使用檢測器來校正處理系統中之搬送位置資料之方法 |
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JP7037964B2 (ja) * | 2018-03-09 | 2022-03-17 | 東京エレクトロン株式会社 | 測定器、及びフォーカスリングを検査するためのシステムの動作方法 |
JP7029983B2 (ja) * | 2018-03-09 | 2022-03-04 | 東京エレクトロン株式会社 | 測定器及び測定器のずれ量を求める方法 |
US10847393B2 (en) | 2018-09-04 | 2020-11-24 | Applied Materials, Inc. | Method and apparatus for measuring process kit centering |
US11342210B2 (en) | 2018-09-04 | 2022-05-24 | Applied Materials, Inc. | Method and apparatus for measuring wafer movement and placement using vibration data |
US11521872B2 (en) | 2018-09-04 | 2022-12-06 | Applied Materials, Inc. | Method and apparatus for measuring erosion and calibrating position for a moving process kit |
US11404296B2 (en) | 2018-09-04 | 2022-08-02 | Applied Materials, Inc. | Method and apparatus for measuring placement of a substrate on a heater pedestal |
US10794681B2 (en) | 2018-09-04 | 2020-10-06 | Applied Materials, Inc. | Long range capacitive gap measurement in a wafer form sensor system |
JP2020085452A (ja) * | 2018-11-15 | 2020-06-04 | オムロン株式会社 | 近接センサユニットおよび距離観測装置 |
JP7129325B2 (ja) * | 2018-12-14 | 2022-09-01 | 東京エレクトロン株式会社 | 搬送方法及び搬送システム |
JP2020115499A (ja) * | 2019-01-17 | 2020-07-30 | 東京エレクトロン株式会社 | プラズマ処理装置、及びリング部材の位置ずれ測定方法 |
KR20220143742A (ko) * | 2020-03-20 | 2022-10-25 | 에이에스엠엘 네델란즈 비.브이. | 웨이퍼의 검사 동안 정전 척을 동적으로 제어하기 위한 방법, 장치 및 시스템 |
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