JP2020194925A - 搬送方法及び搬送システム - Google Patents
搬送方法及び搬送システム Download PDFInfo
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- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
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- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
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- H01L21/67781—Batch transfer of wafers
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- G05B2219/20—Pc systems
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Abstract
Description
一実施形態の基板処理システムの構成例について、図1及び図2を参照して説明する。図1及び図2は、それぞれ一実施形態の基板処理システムの構成例を示す断面図及び平面図である。
基板処理装置1の構成例について、図1及び図2を参照して説明する。基板処理装置1は、装置の外装体を構成する筐体2に収容されて構成される。筐体2内には、キャリア搬送領域S1と、ウエハ搬送領域S2とが形成されている。キャリア搬送領域S1とウエハ搬送領域S2とは、隔壁4により仕切られている。隔壁4には、キャリア搬送領域S1とウエハ搬送領域S2とを連通させ、ウエハWを搬送するための搬送口6が設けられている。搬送口6は、FIMS(Front-Opening Interface Mechanical Standard)規格に従ったドア機構8により開閉される。ドア機構8には、蓋体開閉装置7の駆動機構が接続されており、駆動機構によりドア機構8は前後方向及び上下方向に移動自在に構成され、搬送口6が開閉される。
制御装置90について説明する。制御装置90は、基板処理装置1の全体の制御を行う。制御装置90は、レシピに従い、レシピに示された種々の処理条件下で熱処理が行われるように、基板処理装置1内の種々の機器の動作を制御する。また、制御装置90は、後述する、ウエハ搬送装置60のティーチング時期を知らせる処理(以下「予防保全処理」という。)、機械学習を用いてウエハ搬送装置60のティーチングをサポート(支援)する処理(以下「ティーチング支援処理」)を実行する。
制御装置90が実行する予防保全処理について、図5を参照して説明する。図5は、予防保全処理の流れを説明する図である。
制御装置90が実行するティーチング支援処理について、図6を参照して説明する。図6は、ティーチング支援処理の流れを説明する図である。図6に示されるようにティーチング支援処理は、ステップS201〜S202を含む学習処理と、ステップS301〜S303を含むウエハ搬送処理と、を含む。
60 ウエハ搬送装置
63 フォーク
C キャリア
W ウエハ
Claims (8)
- 基板を保持して搬送する搬送部と、基板の搬送先又は搬送元である基板載置部と、の間で基板を搬送する搬送方法であって、
前記搬送部の位置情報及び前記基板載置部の位置情報を取得するステップと、
前記取得した前記搬送部の位置情報及び前記基板載置部の位置情報に基づいて、前記基板が前記基板載置部に接触するおそれがあるか否かを判定するステップと、
前記判定するステップにおいて前記基板が前記基板載置部に接触するおそれがあると判定された場合、その旨を報知するステップと、
を有する、
搬送方法。 - 前記判定するステップは、
前記搬送部の位置情報が予め定められた範囲内に含まれているかを判定するステップと、
前記基板載置部の位置情報が予め定められた範囲内に含まれているかを判定するステップと、
を含む、
請求項1に記載の搬送方法。 - 前記判定するステップは、
前記搬送部の位置情報と前記基板載置部の位置情報とに基づいて、前記搬送部を前記基板載置部との間で前記基板を受け渡す位置に移動させたときの前記搬送部と前記基板載置部との相対位置を算出するステップと、
前記算出するステップにおいて算出された前記相対位置に基づいて、前記基板が前記基板載置部に接触するおそれがあるか否かを判定するステップと、
を含む、
請求項1に記載の搬送方法。 - 前記搬送部の位置情報は、光学センサにより測定される値を含む、
請求項1乃至3のいずれか一項に記載の搬送方法。 - 前記基板載置部の位置情報は、光学センサにより測定される値を含む、
請求項1乃至4のいずれか一項に記載の搬送方法。 - 前記基板載置部は、複数の基板を上下方向に所定間隔を有して略水平に保持する複数の保持部を有し、
前記基板載置部の位置情報は、隣接する前記保持部間の距離を含む、
請求項1乃至5のいずれか一項に記載の搬送方法。 - 前記搬送部は、上下方向に間隔を有して設けられた前記基板を保持するための複数のフォークを有し、
前記搬送部の位置情報は、隣接する前記フォーク間の距離を含む、
請求項1乃至6のいずれか一項に記載の搬送方法。 - 基板を保持して搬送する搬送部と、基板の搬送先又は搬送元である基板載置部と、の間で基板を搬送する搬送システムであって、
前記搬送部の位置情報及び前記基板載置部の位置情報を取得する取得部と、
前記取得した前記搬送部の位置情報及び前記基板載置部の位置情報に基づいて、前記基板が前記基板載置部に接触するおそれがあるか否かを判定する判定部と、
前記判定部が判定した結果を表示する表示部と、
を有する、
搬送システム。
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JP2019100659A JP7246256B2 (ja) | 2019-05-29 | 2019-05-29 | 搬送方法及び搬送システム |
KR1020200059060A KR102637441B1 (ko) | 2019-05-29 | 2020-05-18 | 반송 방법 및 반송 시스템 |
US16/883,965 US11908717B2 (en) | 2019-05-29 | 2020-05-26 | Transfer method and transfer system for transferring substrate between transfer device and substrate stage |
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US20200381281A1 (en) * | 2019-05-29 | 2020-12-03 | Tokyo Electron Limited | Transfer method and transfer system |
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US20210352835A1 (en) * | 2020-05-05 | 2021-11-11 | Integrated Dynamics Engineering Gmbh | Method for processing substrates, in particular wafers, masks or flat panel displays, with a semi-conductor industry machine |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008235841A (ja) * | 2007-03-23 | 2008-10-02 | Tokyo Electron Ltd | 基板移載装置及び基板移載方法並びに記憶媒体 |
JP2009152396A (ja) * | 2007-12-20 | 2009-07-09 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JP2010056469A (ja) * | 2008-08-29 | 2010-03-11 | Tokyo Electron Ltd | 熱処理装置及び熱処理方法並びに記憶媒体 |
JP2017050372A (ja) * | 2015-09-01 | 2017-03-09 | 東京エレクトロン株式会社 | 基板処理装置及び基板搬送方法並びに基板搬送プログラムを記憶したコンピュータ読み取り可能な記憶媒体 |
Family Cites Families (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4770590A (en) * | 1986-05-16 | 1988-09-13 | Silicon Valley Group, Inc. | Method and apparatus for transferring wafers between cassettes and a boat |
US5944857A (en) * | 1997-05-08 | 1999-08-31 | Tokyo Electron Limited | Multiple single-wafer loadlock wafer processing apparatus and loading and unloading method therefor |
US6042623A (en) * | 1998-01-12 | 2000-03-28 | Tokyo Electron Limited | Two-wafer loadlock wafer processing apparatus and loading and unloading method therefor |
JP4239572B2 (ja) * | 2002-11-27 | 2009-03-18 | 東京エレクトロン株式会社 | 搬送システムの搬送位置合わせ方法及び処理システム |
US7361920B2 (en) * | 2004-12-24 | 2008-04-22 | Tokyo Electron Limited | Substrate processing apparatus and transfer positioning method thereof |
KR101258251B1 (ko) * | 2005-12-30 | 2013-04-25 | 엘지디스플레이 주식회사 | 기판 파손 방지 이재 로봇 시스템 및 이를 이용한 제어방법 |
JP4382052B2 (ja) * | 2006-03-28 | 2009-12-09 | 川崎重工業株式会社 | 駆動体の制御装置および制御方法 |
JP2008173744A (ja) * | 2007-01-22 | 2008-07-31 | Tokyo Electron Ltd | 搬送システムの搬送位置合わせ方法 |
KR20110065888A (ko) * | 2009-12-10 | 2011-06-16 | 한미반도체 주식회사 | 웨이퍼 핸들링장치용 픽커 및 이를 이용한 웨이퍼 핸들링방법 |
JP5452349B2 (ja) * | 2010-05-11 | 2014-03-26 | 東京エレクトロン株式会社 | 被処理体の搬送方法、被処理体の搬送装置、及び、プログラム |
JP2012038922A (ja) * | 2010-08-06 | 2012-02-23 | Tokyo Electron Ltd | 基板搬送装置、基板搬送方法及びその基板搬送方法を実行させるためのプログラムを記録した記録媒体 |
JP5333408B2 (ja) * | 2010-10-22 | 2013-11-06 | 東京エレクトロン株式会社 | 保持部材の姿勢判定装置、その方法、基板処理装置及び記憶媒体 |
JP5673577B2 (ja) * | 2012-02-07 | 2015-02-18 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法及び記憶媒体 |
JP5874629B2 (ja) * | 2012-12-27 | 2016-03-02 | 東京エレクトロン株式会社 | 基板搬送方法、基板搬送装置及び記憶媒体 |
JP2014203890A (ja) * | 2013-04-02 | 2014-10-27 | 東京エレクトロン株式会社 | 移載装置及び移載方法 |
JP6199199B2 (ja) * | 2014-02-20 | 2017-09-20 | 東京エレクトロン株式会社 | 基板処理装置、位置ずれ補正方法及び記憶媒体 |
JP6415220B2 (ja) * | 2014-09-29 | 2018-10-31 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
JP6509103B2 (ja) * | 2015-12-17 | 2019-05-08 | 東京エレクトロン株式会社 | 基板処理方法、基板処理装置、及び基板処理システム |
CN112652557A (zh) * | 2016-03-29 | 2021-04-13 | 株式会社国际电气 | 处理装置、装置管理控制器、计算机可读的记录介质、半导体器件的制造方法以及显示方法 |
KR102377165B1 (ko) * | 2017-07-28 | 2022-03-21 | 가부시키가이샤 코쿠사이 엘렉트릭 | 반도체 장치의 제조 방법, 기판 처리 장치 및 프로그램 |
JP6632583B2 (ja) | 2017-08-30 | 2020-01-22 | 東京エレクトロン株式会社 | 搬送装置及び基板処理装置 |
JP7097691B2 (ja) * | 2017-12-06 | 2022-07-08 | 東京エレクトロン株式会社 | ティーチング方法 |
JP7008573B2 (ja) * | 2018-05-16 | 2022-01-25 | 東京エレクトロン株式会社 | 搬送方法および搬送装置 |
JP6808684B2 (ja) * | 2018-06-14 | 2021-01-06 | キヤノン株式会社 | 情報処理装置、判定方法、プログラム、リソグラフィシステム、および物品の製造方法 |
JP7101102B2 (ja) * | 2018-11-15 | 2022-07-14 | 東京エレクトロン株式会社 | 搬送ロボットシステム、教示方法、及びウエハ収容容器 |
JP7246256B2 (ja) * | 2019-05-29 | 2023-03-27 | 東京エレクトロン株式会社 | 搬送方法及び搬送システム |
JP7319162B2 (ja) * | 2019-10-02 | 2023-08-01 | 株式会社荏原製作所 | 搬送異常予測システム |
JP7263225B2 (ja) * | 2019-12-12 | 2023-04-24 | 東京エレクトロン株式会社 | 搬送するシステム及び方法 |
JP7365924B2 (ja) * | 2020-02-13 | 2023-10-20 | 東京エレクトロン株式会社 | ティーチング方法 |
JP7399035B2 (ja) * | 2020-06-23 | 2023-12-15 | 東京エレクトロン株式会社 | ティーチング方法、搬送システム及びプログラム |
JP2022184175A (ja) * | 2021-05-31 | 2022-12-13 | 東京エレクトロン株式会社 | 情報処理装置、移載位置教示方法及び基板処理装置 |
JP2022186429A (ja) * | 2021-06-04 | 2022-12-15 | 東京エレクトロン株式会社 | 情報処理装置、移載位置補正方法及び基板処理装置 |
KR102528797B1 (ko) * | 2021-08-10 | 2023-05-03 | 세메스 주식회사 | 기판 이송 어셈블리 및 방법 |
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008235841A (ja) * | 2007-03-23 | 2008-10-02 | Tokyo Electron Ltd | 基板移載装置及び基板移載方法並びに記憶媒体 |
JP2009152396A (ja) * | 2007-12-20 | 2009-07-09 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JP2010056469A (ja) * | 2008-08-29 | 2010-03-11 | Tokyo Electron Ltd | 熱処理装置及び熱処理方法並びに記憶媒体 |
JP2017050372A (ja) * | 2015-09-01 | 2017-03-09 | 東京エレクトロン株式会社 | 基板処理装置及び基板搬送方法並びに基板搬送プログラムを記憶したコンピュータ読み取り可能な記憶媒体 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20200381281A1 (en) * | 2019-05-29 | 2020-12-03 | Tokyo Electron Limited | Transfer method and transfer system |
US11908717B2 (en) * | 2019-05-29 | 2024-02-20 | Tokyo Electron Limited | Transfer method and transfer system for transferring substrate between transfer device and substrate stage |
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US20200381281A1 (en) | 2020-12-03 |
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