JP2012038945A - ロードポート - Google Patents
ロードポート Download PDFInfo
- Publication number
- JP2012038945A JP2012038945A JP2010178235A JP2010178235A JP2012038945A JP 2012038945 A JP2012038945 A JP 2012038945A JP 2010178235 A JP2010178235 A JP 2010178235A JP 2010178235 A JP2010178235 A JP 2010178235A JP 2012038945 A JP2012038945 A JP 2012038945A
- Authority
- JP
- Japan
- Prior art keywords
- door
- container
- opening
- wafer
- load port
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000003860 storage Methods 0.000 claims abstract description 44
- 230000007246 mechanism Effects 0.000 claims abstract description 43
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 239000004065 semiconductor Substances 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 6
- 235000012431 wafers Nutrition 0.000 abstract description 85
- 238000007789 sealing Methods 0.000 abstract description 3
- 230000003749 cleanliness Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
【解決手段】板状のフレーム部11に形成された開口部に対して着脱可能に設けられて容器載置台12に載置されたウェーハ格納容器2の容器ドア22を保持し得るドア部13と、ドア部13に対するドア開閉機構14とを備えたロードポート1に、ドア開閉機構14によるドア部13の閉止動作の過程において、開口部の近傍に位置付けられたドア部13を、開口部を完全に閉止する位置まで移動させる強制閉止機構15を設けた構成とした。
【選択図】図1
Description
Application Carrier、H−MAC(Horizontal-MAC)と呼ばれるものもある)、FOSB(Front Open Shipping Box)等が例示されるが、これらは共通して一方の起立面側に開閉可能且つ密閉可能なドアを備えている。このドアは、ウェーハ格納用容器がロードポートの容器載置台に載置された状態で、ロードポートに備えられたドア開閉機構によって開閉される。ドアが開放状態の際には、ロードポートが設けられているEFEM(Equipment Front End Module)に設置された搬送ロボットによって、ウェーハ格納用容器内外へのウェーハの出し入れが行われる。
図1に概略的に示した本実施形態に係るロードポート1は、図示しない半導体製造装置に隣接して配置されるEFEM(Equipment Front End Module)100を、ウェーハ搬送ロボット(図示省略)等が設置されたウェーハ搬送室110と共に構成し、ウェーハ格納用容器2の内部と半導体製造装置との間でのウェーハ(図示省略)の出し入れを行うインターフェースとして機能するものである。ウェーハ格納用容器2には、FOUP(Front-Opening Unified Pod)、H−MAC(Horizontal-Multi
Application Carrier)、FOSB(Front Open Shipping Box)等の所定の規格に適合したものが用いられる。本実施形態のロードポート1は、何れかのウェーハ格納用容器2に対するウェーハの出し入れに対応させたものである。
2…ウェーハ格納用容器
11…フレーム部
11a…開口部
12…容器載置台
13…ドア部
14…ドア開閉機構
15…強制閉止機構
21…容器本体
22…容器ドア
Claims (1)
- 開閉可能且つ密閉可能な容器ドアを備えたウェーハ格納用容器と半導体製造装置との間でのウェーハの出し入れのインターフェースであるロードポートであって、
起立姿勢で配置されてロードポートの本体部を構成する板状のフレーム部と、
当該フレーム部から略水平姿勢で突設される容器載置台と、
前記フレーム部に形成された開口部に対して着脱可能に設けられ前記容器載置台に載置されたウェーハ格納容器の容器ドアを保持し得るドア部と、
当該ドア部を、前記容器ドアと共に前記開口部から退避させて前記ウェーハ格納用容器及び前記開口部を開放する位置と、前記開口部を閉止することで前記容器ドアにより前記ウェーハ格納用容器を閉止させる位置との間で移動させるドア開閉機構と、
前記ドア開閉機構による前記ドア部の閉止動作の過程において、前記開口部の近傍に位置付けられた前記ドア部を、前記開口部を完全に閉止する位置まで移動させる強制閉止機構を具備してなることを特徴とするロードポート。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010178235A JP5736686B2 (ja) | 2010-08-07 | 2010-08-07 | ロードポート |
KR1020110074953A KR101811453B1 (ko) | 2010-08-07 | 2011-07-28 | 로드 포트 |
TW100127220A TWI523140B (zh) | 2010-08-07 | 2011-08-01 | Loading port |
CN201110225179.7A CN102376609B (zh) | 2010-08-07 | 2011-08-05 | 装载口 |
US13/204,865 US8540473B2 (en) | 2010-08-07 | 2011-08-08 | Load port |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010178235A JP5736686B2 (ja) | 2010-08-07 | 2010-08-07 | ロードポート |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012038945A true JP2012038945A (ja) | 2012-02-23 |
JP5736686B2 JP5736686B2 (ja) | 2015-06-17 |
Family
ID=45556281
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010178235A Active JP5736686B2 (ja) | 2010-08-07 | 2010-08-07 | ロードポート |
Country Status (5)
Country | Link |
---|---|
US (1) | US8540473B2 (ja) |
JP (1) | JP5736686B2 (ja) |
KR (1) | KR101811453B1 (ja) |
CN (1) | CN102376609B (ja) |
TW (1) | TWI523140B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2013005363A1 (ja) * | 2011-07-06 | 2015-02-23 | 平田機工株式会社 | 容器開閉装置 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6045946B2 (ja) * | 2012-07-13 | 2016-12-14 | 株式会社Screenホールディングス | 基板処理装置、プログラムおよび記録媒体 |
JP6260109B2 (ja) * | 2013-05-16 | 2018-01-17 | シンフォニアテクノロジー株式会社 | ロードポート装置 |
KR101608831B1 (ko) | 2014-06-13 | 2016-04-05 | 우범제 | 배출가속기 및 이를 구비한 로드 포트 |
JP6679907B2 (ja) * | 2015-12-11 | 2020-04-15 | Tdk株式会社 | ロードポート装置及びロードポート装置における容器内への清浄化ガス導入方法 |
CN105575862B (zh) * | 2015-12-24 | 2018-06-12 | 北京中电科电子装备有限公司 | 一种foup装载门装置 |
JP6687840B2 (ja) * | 2016-03-29 | 2020-04-28 | シンフォニアテクノロジー株式会社 | ロードポート |
CN110217741B (zh) * | 2019-05-07 | 2020-12-25 | 芯导精密(北京)设备有限公司 | 一种开盒机 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05109863A (ja) * | 1991-10-17 | 1993-04-30 | Shinko Electric Co Ltd | 機械式インターフエース装置 |
JP2002184831A (ja) * | 2000-12-11 | 2002-06-28 | Hirata Corp | Foupオープナ |
JP2006074033A (ja) * | 2004-08-30 | 2006-03-16 | Alcatel | ミニエンバイロメントポッドと装置との間の真空インタフェース |
US20120000816A1 (en) * | 2010-06-30 | 2012-01-05 | Crossing Automation, Inc. | Port Door Positioning Apparatus and Associated Methods |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5449289A (en) | 1992-06-15 | 1995-09-12 | Semitool, Inc. | Semiconductor processor opening and closure construction |
US6106213A (en) | 1998-02-27 | 2000-08-22 | Pri Automation, Inc. | Automated door assembly for use in semiconductor wafer manufacturing |
JP4012190B2 (ja) * | 2004-10-26 | 2007-11-21 | Tdk株式会社 | 密閉容器の蓋開閉システム及び開閉方法 |
JP2007238242A (ja) * | 2006-03-07 | 2007-09-20 | Shin Meiwa Ind Co Ltd | チャンバの扉開閉機構及びそれを備える真空装置 |
JP2009070868A (ja) | 2007-09-11 | 2009-04-02 | Panasonic Corp | 基板収納用容器 |
JP5796279B2 (ja) | 2009-07-10 | 2015-10-21 | シンフォニアテクノロジー株式会社 | ロードポート装置、並びにその蓋体着脱装置及びマッピング装置の各昇降機構の制御方法 |
-
2010
- 2010-08-07 JP JP2010178235A patent/JP5736686B2/ja active Active
-
2011
- 2011-07-28 KR KR1020110074953A patent/KR101811453B1/ko active IP Right Grant
- 2011-08-01 TW TW100127220A patent/TWI523140B/zh active
- 2011-08-05 CN CN201110225179.7A patent/CN102376609B/zh active Active
- 2011-08-08 US US13/204,865 patent/US8540473B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05109863A (ja) * | 1991-10-17 | 1993-04-30 | Shinko Electric Co Ltd | 機械式インターフエース装置 |
JP2002184831A (ja) * | 2000-12-11 | 2002-06-28 | Hirata Corp | Foupオープナ |
JP2006074033A (ja) * | 2004-08-30 | 2006-03-16 | Alcatel | ミニエンバイロメントポッドと装置との間の真空インタフェース |
US20120000816A1 (en) * | 2010-06-30 | 2012-01-05 | Crossing Automation, Inc. | Port Door Positioning Apparatus and Associated Methods |
JP2013539203A (ja) * | 2010-06-30 | 2013-10-17 | ブルックス オートメーション インコーポレイテッド | ポートドア位置決め装置及び関連の方法 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2013005363A1 (ja) * | 2011-07-06 | 2015-02-23 | 平田機工株式会社 | 容器開閉装置 |
US9324599B2 (en) | 2011-07-06 | 2016-04-26 | Hirata Corporation | Container opening/closing device |
US9761472B2 (en) | 2011-07-06 | 2017-09-12 | Hirata Corporation | Container opening/closing device |
Also Published As
Publication number | Publication date |
---|---|
KR101811453B1 (ko) | 2017-12-21 |
TW201222703A (en) | 2012-06-01 |
CN102376609A (zh) | 2012-03-14 |
US20120034051A1 (en) | 2012-02-09 |
KR20120013898A (ko) | 2012-02-15 |
CN102376609B (zh) | 2016-03-23 |
JP5736686B2 (ja) | 2015-06-17 |
US8540473B2 (en) | 2013-09-24 |
TWI523140B (zh) | 2016-02-21 |
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