JP2010118535A - 運搬装置 - Google Patents
運搬装置 Download PDFInfo
- Publication number
- JP2010118535A JP2010118535A JP2008291204A JP2008291204A JP2010118535A JP 2010118535 A JP2010118535 A JP 2010118535A JP 2008291204 A JP2008291204 A JP 2008291204A JP 2008291204 A JP2008291204 A JP 2008291204A JP 2010118535 A JP2010118535 A JP 2010118535A
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/14—Wafer cassette transporting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
【解決手段】運搬装置(10)は、内部空間を規定すると共に内部空間が外部空間に開いている開口を規定し、開口を介して外部空間から内部空間に、荷を収容可能な本体部と、本体部における内部空間に面する又は接する位置に配置されており、収容された荷を内部空間内にて保持可能な保持手段(20)と、本体部における外部空間に面する又は接する位置に配置されており、外部空間側から把持可能な一又は複数の取っ手(11)とを備える。
【選択図】図1
Description
<第1実施形態>
<第2実施形態>
<第3実施形態>
Claims (8)
- 内部空間を規定すると共に前記内部空間が外部空間に開いている開口を規定し、該開口を介して前記外部空間から前記内部空間に、荷を収容可能な本体部と、
前記本体部における前記内部空間に面する又は接する位置に配置されており、前記収容された荷を前記内部空間内にて保持可能な保持手段と、
前記本体部における前記外部空間に面する又は接する位置に配置されており、前記外部空間側から把持可能な一又は複数の取っ手と
を備えることを特徴とする運搬装置。 - 前記開口は、少なくとも下方に開いており、
前記本体部は、前記荷が前記開口を介して前記下方から収容されるように構成されている
ことを特徴とする請求項1に記載の運搬装置。 - 前記保持手段は、
前記荷を支持する支持位置、及び前記荷を解放する解放位置間で変位する支持部と、
前記支持部を変位させる際に操作される操作部と、
前記操作部及び前記支持部間に配置され、前記操作部の操作に応じて前記支持部が変位するように前記操作部及び前記支持部を連結する連結部と
を備えることを特徴とする請求項2に記載の運搬装置。 - 前記支持部は、前記荷の上面に取り付けられた凸状の掛かり部、又は前記荷の上部に設けられた凹状の掛かり部を支持することを特徴とする請求項3に記載の運搬装置。
- 前記開口は、少なくとも側方に開いており、
前記本体部は、前記荷が前記開口を介して前記側方から収容されるように構成されている
ことを特徴とする請求項1に記載の運搬装置。 - 前記保持手段は、前記荷の上面に取り付けられた凸状の掛かり部、又は前記荷の上部に設けられた凹状の掛かり部を支持する支持部を有する
ことを特徴とする請求項5に記載の運搬装置。 - 前記一又は複数の取っ手は、前記本体部において、前記側方より他の複数の側方に対応する複数の側面の各々に取り付けられていることを特徴とする請求項5又は6に記載の運搬装置。
- 前記一又は複数の取っ手は、前記複数の側面に加えて前記本体部の上面に取り付けられていることを特徴とする請求項7に記載の運搬装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008291204A JP2010118535A (ja) | 2008-11-13 | 2008-11-13 | 運搬装置 |
KR1020090101164A KR20100054085A (ko) | 2008-11-13 | 2009-10-23 | 운반 장치 |
TW098138419A TW201022091A (en) | 2008-11-13 | 2009-11-12 | Transportation device |
US12/616,934 US20100117391A1 (en) | 2008-11-13 | 2009-11-12 | Transporting apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008291204A JP2010118535A (ja) | 2008-11-13 | 2008-11-13 | 運搬装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2010118535A true JP2010118535A (ja) | 2010-05-27 |
Family
ID=42164515
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008291204A Pending JP2010118535A (ja) | 2008-11-13 | 2008-11-13 | 運搬装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20100117391A1 (ja) |
JP (1) | JP2010118535A (ja) |
KR (1) | KR20100054085A (ja) |
TW (1) | TW201022091A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20180065876A (ko) * | 2016-12-07 | 2018-06-18 | 가부시키가이샤 다이후쿠 | 이송기 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102127113B1 (ko) | 2013-10-29 | 2020-06-29 | 삼성전자 주식회사 | 카세트 이송장치 및 이를 이용하여 카세트 이송방법 |
TWI569351B (zh) | 2015-04-30 | 2017-02-01 | 環球晶圓股份有限公司 | 晶圓旋轉裝置 |
JP6693356B2 (ja) * | 2016-09-09 | 2020-05-13 | 株式会社ダイフク | 物品搬送装置 |
TWI693671B (zh) * | 2019-04-16 | 2020-05-11 | 家登精密工業股份有限公司 | 光罩盒及其夾持件 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001343621A (ja) * | 2000-05-31 | 2001-12-14 | Sharp Corp | 液晶表示装置の搬送方法および搬送システム |
JP2003229477A (ja) * | 2002-02-04 | 2003-08-15 | Matsushita Electric Ind Co Ltd | 標準製造インターフェイス装置 |
JP2005500954A (ja) * | 2001-08-27 | 2005-01-13 | エンテグリス・インコーポレーテッド | 半導体ウエハディスクおよび同様物品のモジュールキャリア |
JP2005194009A (ja) * | 2004-01-05 | 2005-07-21 | Asyst Shinko Inc | 懸垂型搬送台車 |
JP2008085025A (ja) * | 2006-09-27 | 2008-04-10 | Shin Etsu Polymer Co Ltd | 基板の取り扱い装置及び基板の取り扱い方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3258091A (en) * | 1963-11-22 | 1966-06-28 | E Z Bag Inc | Automatic bottom-loading bowling bag |
US3756450A (en) * | 1972-04-07 | 1973-09-04 | R Crose | Hood for pressurized container |
US3795420A (en) * | 1973-03-07 | 1974-03-05 | Atomic Energy Commission | Lift coupling |
FR2486480A1 (fr) * | 1980-07-11 | 1982-01-15 | Commins Eric Jean | Caisson porte-bouteille de gaz |
US5845809A (en) * | 1997-06-27 | 1998-12-08 | Garrett; James Kelly | Protective cover for a compressed gas bottle |
AU6059600A (en) * | 1999-07-01 | 2001-01-22 | Duke M. Jordan | Exercise support bar |
US6926489B2 (en) * | 2002-05-09 | 2005-08-09 | Taiwan Semiconductor Manufacturing Co., Ltd | Latch sensor for pod transport gripper |
-
2008
- 2008-11-13 JP JP2008291204A patent/JP2010118535A/ja active Pending
-
2009
- 2009-10-23 KR KR1020090101164A patent/KR20100054085A/ko not_active Application Discontinuation
- 2009-11-12 TW TW098138419A patent/TW201022091A/zh unknown
- 2009-11-12 US US12/616,934 patent/US20100117391A1/en not_active Abandoned
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001343621A (ja) * | 2000-05-31 | 2001-12-14 | Sharp Corp | 液晶表示装置の搬送方法および搬送システム |
JP2005500954A (ja) * | 2001-08-27 | 2005-01-13 | エンテグリス・インコーポレーテッド | 半導体ウエハディスクおよび同様物品のモジュールキャリア |
JP2003229477A (ja) * | 2002-02-04 | 2003-08-15 | Matsushita Electric Ind Co Ltd | 標準製造インターフェイス装置 |
JP2005194009A (ja) * | 2004-01-05 | 2005-07-21 | Asyst Shinko Inc | 懸垂型搬送台車 |
JP2008085025A (ja) * | 2006-09-27 | 2008-04-10 | Shin Etsu Polymer Co Ltd | 基板の取り扱い装置及び基板の取り扱い方法 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20180065876A (ko) * | 2016-12-07 | 2018-06-18 | 가부시키가이샤 다이후쿠 | 이송기 |
TWI717553B (zh) | 2016-12-07 | 2021-02-01 | 日商大福股份有限公司 | 移載機 |
KR102356962B1 (ko) | 2016-12-07 | 2022-01-28 | 가부시키가이샤 다이후쿠 | 이송기 |
Also Published As
Publication number | Publication date |
---|---|
TW201022091A (en) | 2010-06-16 |
KR20100054085A (ko) | 2010-05-24 |
US20100117391A1 (en) | 2010-05-13 |
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