JP2009094519A - Rc遅延を減少するために誘電体層にエアギャップを生成する方法及び装置 - Google Patents
Rc遅延を減少するために誘電体層にエアギャップを生成する方法及び装置 Download PDFInfo
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- H01L21/76822—Modification of the material of dielectric layers, e.g. grading, after-treatment to improve the stability of the layers, to increase their density etc.
- H01L21/76825—Modification of the material of dielectric layers, e.g. grading, after-treatment to improve the stability of the layers, to increase their density etc. by exposing the layer to particle radiation, e.g. ion implantation, irradiation with UV light or electrons etc.
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Abstract
【解決手段】 相互接続構造体の誘電体材料にエアギャップを生成するための方法及び装置。一実施形態では、半導体構造体を形成する方法において、基板上に第1の誘電体層を堆積し、第1の誘電体層にトレンチを形成し、トレンチに導電性材料を充填し、導電性材料を平坦化して第1の誘電体層を露出させ、導電性材料及び露出された第1の誘電体層に誘電体バリア膜を堆積し、この誘電体バリア膜の上に硬質マスク層を堆積し、誘電体バリア膜及び硬質マスク層にパターンを形成して基板の選択された領域を露出させ、基板の選択された領域において第1の誘電体層の少なくとも一部分を酸化させ、第1の誘電体層の酸化された部分を除去して、導電性材料の周りに逆のトレンチを形成し、逆のトレンチに第2の誘電体材料を堆積しながら逆のトレンチにエアギャップを形成することを含む方法が提供される。
【選択図】 図5C
Description
[0001]本発明の実施形態は、一般的に、集積回路の製造に関する。より詳細には、本発明の実施形態は、誘電率の低い誘電体材料を含む多レベル相互接続構造体を形成するための方法に関する。
[0002]集積回路の幾何学形状は、このようなデバイスが数十年以前に最初に導入されて以来、そのサイズが劇的に減少した。それ以来、集積回路は、一般的に、2年/半サイズルール(しばしばムーアの法則と称される)をたどり、これは、チップ上のデバイスの数が2年ごとに倍増することを意味する。今日の製造設備は、特徴部サイズが0.1μmのデバイスを日常生産し、明日の設備は、まもなく、特徴部サイズが更に小さなデバイスを生産することになろう。
[0034]図5A−図5Gは、本発明の一実施形態に基づきエアギャップを有する基板スタック200aの形成を概略的に示す。基板スタック200aは、図2Aのプロセスシーケンス110aを使用し、その後、図3Aのプロセスシーケンス130aを使用し、その後、図4Aのプロセスシーケンス150aを使用して形成される。
銅の導電性の線が、窒素ドープされた二酸化シリコン層に形成される。銅の導電性の線は、深さが約257nmのトレンチに堆積される。隣接する導電性の線間の距離は、約88nmである。CMP及びマスキングの後に、窒素ドープされた二酸化シリコン層は、150ドーズの電子ビームによって硬化される。この電子ビーム硬化中に、アルゴンが約50sccmの流量で処理チャンバーへ流される。硬化された構造体は、水/HFの比が100:1の希釈HFのエッチング溶液を受ける。エッチング深さは、1分のウェットエッチングの後に約150nmであり、2分のウェットエッチングの後に約180nmであり、約3分のウェットエッチングの後に約190nmである。
[0064]図6A−図6Cは、本発明の一実施形態に基づくエアギャップを有する基板スタック200bの形成を概略的に示す。この基板スタック200bは、図2Aのプロセスシーケンス110aを使用し、その後、図3Aのプロセスシーケンス130aを使用し、その後、図4Bのプロセスシーケンス150bを使用して、形成される。基板スタック200bのプロセスシーケンスは、図5A−5Dに示されたエアギャップ形成前の基板スタック200aと同様である。
[0072]図7及び図8A−図8Bは、本発明の一実施形態によるエアギャップを有する基板スタック200cの形成を概略的に示す。この基板スタック200cは、図2Bのプロセスシーケンス110bを使用し、その後、図3Aのプロセスシーケンス130aを使用し、その後、図4Bのプロセスシーケンス150bを使用して、形成される。
[0083]図7及び図9A−図9Bは、本発明の一実施形態に基づくエアギャップを有する基板スタック200dの形成を概略的に示す。
Claims (15)
- 半導体構造体を形成する方法において、
基板上に第1の誘電体層を堆積するステップと、
上記第1の誘電体層にトレンチを形成するステップと、
上記トレンチに導電性材料を充填するステップと、
上記導電性材料を平坦化して上記第1の誘電体層を露出させるステップと、
上記導電性材料及び上記露出された第1の誘電体層に誘電体バリア膜を堆積するステップと、
上記誘電体バリア膜の上に硬質マスク層を堆積するステップと、
上記誘電体バリア膜及び上記硬質マスク層にパターンを形成して基板の選択された領域を露出させるステップと、
基板の上記選択された領域において上記第1の誘電体層の少なくとも一部分を酸化させるステップと、
上記第1の誘電体層の上記酸化された部分を除去して、上記導電性材料の周りに逆のトレンチを形成するステップと、
上記逆のトレンチに第2の誘電体材料を堆積しながら上記逆のトレンチにエアギャップを形成するステップと、
を備えた方法。 - 上記第1の誘電体層は多孔性の低k誘電体材料を含み、第1の誘電体層を堆積する上記ステップは、
不安定な有機群を有するシリコン/酸素含有材料を堆積する段階と、
上記シリコン/酸素含有材料を硬化して、上記第1の誘電体層に均一に分散された極微ガスポケットを形成する段階と、
を含む請求項1に記載の方法。 - 第1の誘電体層を酸化させる上記ステップは、上記第1の誘電体材料を電子ビームで処置する段階を含む、請求項1に記載の方法。
- 電子ビームを使用して第1の誘電体材料を処置する上記段階は、処置される第1の誘電体の厚みを制御するようにカソード電圧を調整することを含む、請求項3に記載の方法。
- 第1の誘電体層を酸化させる上記ステップは、上記第1の誘電体材料を不活性雰囲気又は酸素雰囲気の1つにおいて紫外線(UV)エネルギーで処置する段階を含む、請求項1に記載の方法。
- 上記第2の誘電体材料は、上記逆のトレンチに非従順に堆積される誘電体バリア材料を含み、該誘電体バリア材料内にエアギャップが形成されてシールされるようにする、請求項1に記載の方法。
- エアギャップを有する誘電体構造体を形成する方法において、
基板上に多孔性の誘電体層を堆積するステップと、
上記多孔性の誘電体層にトレンチを形成するステップと、
上記トレンチに導電性材料を充填するステップと、
上記導電性材料を平坦化して上記多孔性の誘電体層を露出させるステップと、
上記導電性材料及び上記露出された多孔性の誘電体層に誘電体バリア膜を堆積するステップと、
上記誘電体バリア膜の上に硬質マスク層を堆積するステップと、
上記誘電体バリア膜及び上記硬質マスク層にパターンを形成して基板の選択された領域を露出させるステップと、
電子ビームを使用して基板を処置して、上記選択された領域において上記多孔性の誘電体層の少なくとも一部分を酸化させるステップと、
上記多孔性の誘電体層の上記酸化された部分を除去して、上記導電性材料の周りに逆のトレンチを形成するステップと、
上記逆のトレンチに第2の誘電体材料を堆積しながら上記逆のトレンチにエアギャップを形成するステップと、
を備えた方法。 - 電子ビームを使用して基板を処置する前記ステップは、所望の厚みの上記多孔性の誘電体層を酸化する段階を含む、請求項7に記載の方法。
- 上記所望の厚みは、電子ビーム処理チャンバーのカソードに印加される電圧を調整することにより制御される、請求項8に記載の方法。
- 多孔性の誘電体層を堆積する上記ステップは、
不安定な有機群を有するシリコン/酸素含有材料を堆積する段階と、
上記シリコン/酸素含有材料を硬化して、上記第1の誘電体層に均一に分散された極微ガスポケットを形成する段階と、
を含む請求項7に記載の方法。 - エアギャップを形成する上記ステップは、誘電体材料を上記逆のトレンチに非従順に堆積して、その誘電体バリア材料内にエアギャップが形成されシールされるようにする段階を含む、請求項7に記載の方法。
- エアギャップを有する誘電体構造体を形成する方法において、
基板上に第1の誘電体層を堆積するステップと、
上記第1の誘電体層上に第2の誘電体層を堆積するステップと、
上記第1及び第2の誘電体層にトレンチ−ビア構造体を形成するステップであって、上記第1の誘電体層にはビアを形成し、上記第2の誘電体層にはトレンチを形成するステップと、
上記トレンチ−ビア構造体に導電性材料を充填するステップと、
上記導電性材料を平坦化して上記第2の誘電体層を露出させるステップと、
上記導電性材料及び上記露出した第2の誘電体層に誘電体バリア膜を堆積するステップと、
上記誘電体バリア膜及び硬質マスク層にパターンを形成して、基板の上記選択された領域を露出させるステップと、
基板の上記選択された領域において上記第2の誘電体層を除去して、上記トレンチに充填された導電性材料の周りに逆のトレンチを形成するステップと、
上記逆のトレンチに誘電体材料を堆積しながら上記逆のトレンチにエアギャップを形成するステップと、
を備えた方法。 - 第2の誘電体層を堆積する上記ステップは、
不安定な有機群を有するシリコン/酸素含有材料を堆積する段階と、
上記シリコン/酸素含有材料を硬化して、上記第1の誘電体層に均一に分散された極微ガスポケットを形成する段階と、
を含む請求項12に記載の方法。 - 第2の誘電体層を除去する上記ステップは、上記パターンにより露出された上記第2の誘電体層をエッチングする段階を含む、請求項12に記載の方法。
- 上記第1の誘電体層及び第2の誘電体層は、上記第1の誘電体層が、上記第2の誘電体層をエッチングする間にエッチングストッパとして働くように特性が異なる、請求項14に記載の方法。
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KR20090036519A (ko) | 2009-04-14 |
JP5501596B2 (ja) | 2014-05-21 |
KR101019356B1 (ko) | 2011-03-07 |
TWI446486B (zh) | 2014-07-21 |
TW200929438A (en) | 2009-07-01 |
US7879683B2 (en) | 2011-02-01 |
CN101431046A (zh) | 2009-05-13 |
US20110104891A1 (en) | 2011-05-05 |
US20090093112A1 (en) | 2009-04-09 |
CN101431046B (zh) | 2011-03-30 |
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