JP2008021941A5 - - Google Patents

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Publication number
JP2008021941A5
JP2008021941A5 JP2006194753A JP2006194753A JP2008021941A5 JP 2008021941 A5 JP2008021941 A5 JP 2008021941A5 JP 2006194753 A JP2006194753 A JP 2006194753A JP 2006194753 A JP2006194753 A JP 2006194753A JP 2008021941 A5 JP2008021941 A5 JP 2008021941A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2006194753A
Other versions
JP5173160B2 (ja
JP2008021941A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2006194753A external-priority patent/JP5173160B2/ja
Priority to JP2006194753A priority Critical patent/JP5173160B2/ja
Priority to KR1020070069940A priority patent/KR20080007124A/ko
Priority to US11/826,263 priority patent/US20080012120A1/en
Priority to TW096125530A priority patent/TW200806147A/zh
Priority to EP07013920A priority patent/EP1879227A1/en
Publication of JP2008021941A publication Critical patent/JP2008021941A/ja
Publication of JP2008021941A5 publication Critical patent/JP2008021941A5/ja
Publication of JP5173160B2 publication Critical patent/JP5173160B2/ja
Application granted granted Critical
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2006194753A 2006-07-14 2006-07-14 多層配線基板及びその製造方法 Expired - Fee Related JP5173160B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2006194753A JP5173160B2 (ja) 2006-07-14 2006-07-14 多層配線基板及びその製造方法
KR1020070069940A KR20080007124A (ko) 2006-07-14 2007-07-12 다층 배선 기판 및 그 제조 방법
US11/826,263 US20080012120A1 (en) 2006-07-14 2007-07-13 Multilayer wiring substrate and manufacturing method thereof
TW096125530A TW200806147A (en) 2006-07-14 2007-07-13 Multilayer wiring substrate and manufacturing method thereof
EP07013920A EP1879227A1 (en) 2006-07-14 2007-07-16 Multilayer wiring substrate and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006194753A JP5173160B2 (ja) 2006-07-14 2006-07-14 多層配線基板及びその製造方法

Publications (3)

Publication Number Publication Date
JP2008021941A JP2008021941A (ja) 2008-01-31
JP2008021941A5 true JP2008021941A5 (ja) 2009-07-16
JP5173160B2 JP5173160B2 (ja) 2013-03-27

Family

ID=38621177

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006194753A Expired - Fee Related JP5173160B2 (ja) 2006-07-14 2006-07-14 多層配線基板及びその製造方法

Country Status (5)

Country Link
US (1) US20080012120A1 (ja)
EP (1) EP1879227A1 (ja)
JP (1) JP5173160B2 (ja)
KR (1) KR20080007124A (ja)
TW (1) TW200806147A (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7202785B2 (ja) * 2018-04-27 2023-01-12 新光電気工業株式会社 配線基板及び配線基板の製造方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3918148A (en) * 1974-04-15 1975-11-11 Ibm Integrated circuit chip carrier and method for forming the same
US4642160A (en) * 1985-08-12 1987-02-10 Interconnect Technology Inc. Multilayer circuit board manufacturing
US4977105A (en) * 1988-03-15 1990-12-11 Mitsubishi Denki Kabushiki Kaisha Method for manufacturing interconnection structure in semiconductor device
JPH01257397A (ja) * 1988-04-07 1989-10-13 Mitsubishi Heavy Ind Ltd 金属プリント基板
JPH0372693A (ja) * 1989-08-11 1991-03-27 Hitachi Ltd 配線部材及びその形成方法
JPH04242088A (ja) * 1991-01-16 1992-08-28 Nec Corp Ｉｃソケット
JPH0653350A (ja) * 1992-07-30 1994-02-25 Hitachi Ltd 多層回路基板及びその製造方法とそれを用いた電子回路モジュール並びに電子回路装置
US5871868A (en) * 1993-02-26 1999-02-16 General Dynamics Information Systems, Inc. Apparatus and method for machining conductive structures on substrates
JPH06291518A (ja) * 1993-03-31 1994-10-18 Nippon Chemicon Corp マイクロストリップラインによるインピーダンス変換器
US5510758A (en) * 1993-04-07 1996-04-23 Matsushita Electric Industrial Co., Ltd. Multilayer microstrip wiring board with a semiconductor device mounted thereon via bumps
JP3260941B2 (ja) * 1993-06-18 2002-02-25 株式会社日立製作所 多層配線基板および多層配線基板の製造方法
US6331680B1 (en) * 1996-08-07 2001-12-18 Visteon Global Technologies, Inc. Multilayer electrical interconnection device and method of making same
JP3531573B2 (ja) * 2000-03-17 2004-05-31 株式会社村田製作所 積層型セラミック電子部品およびその製造方法ならびに電子装置
US7164197B2 (en) * 2003-06-19 2007-01-16 3M Innovative Properties Company Dielectric composite material
JP4413573B2 (ja) * 2003-10-16 2010-02-10 株式会社半導体エネルギー研究所 半導体装置及びその作製方法
CN100367491C (zh) * 2004-05-28 2008-02-06 日本特殊陶业株式会社 中间基板

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