HK59394A - Packaging of semiconductor elements - Google Patents
Packaging of semiconductor elementsInfo
- Publication number
- HK59394A HK59394A HK59394A HK59394A HK59394A HK 59394 A HK59394 A HK 59394A HK 59394 A HK59394 A HK 59394A HK 59394 A HK59394 A HK 59394A HK 59394 A HK59394 A HK 59394A
- Authority
- HK
- Hong Kong
- Prior art keywords
- packaging
- semiconductor elements
- semiconductor
- elements
- Prior art date
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D73/00—Packages comprising articles attached to cards, sheets or webs
- B65D73/02—Articles, e.g. small electrical components, attached to webs
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/304—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising vinyl halide (co)polymers, e.g. PVC, PVDC, PVF, PVDF
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D79/00—Kinds or details of packages, not otherwise provided for
- B65D79/02—Arrangements or devices for indicating incorrect storage or transport
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
- B65D81/24—Adaptations for preventing deterioration or decay of contents; Applications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants
- B65D81/26—Adaptations for preventing deterioration or decay of contents; Applications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants with provision for draining away, or absorbing, or removing by ventilation, fluids, e.g. exuded by contents; Applications of corrosion inhibitors or desiccators
- B65D81/266—Adaptations for preventing deterioration or decay of contents; Applications to the container or packaging material of food preservatives, fungicides, pesticides or animal repellants with provision for draining away, or absorbing, or removing by ventilation, fluids, e.g. exuded by contents; Applications of corrosion inhibitors or desiccators for absorbing gases, e.g. oxygen absorbers or desiccants
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
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- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H01L23/00—Details of semiconductor or other solid state devices
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- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49503—Lead-frames or other flat leads characterised by the die pad
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- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
- H01L23/49582—Metallic layers on lead frames
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0084—Containers and magazines for components, e.g. tube-like magazines
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/724—Permeability to gases, adsorption
- B32B2307/7242—Non-permeable
- B32B2307/7246—Water vapor barrier
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
- B32B2311/24—Aluminium
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2323/00—Polyalkenes
- B32B2323/04—Polyethylene
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- B32B2327/06—PVC, i.e. polyvinylchloride
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- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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- H01L2924/181—Encapsulation
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- H01L2924/207—Diameter ranges
- H01L2924/20753—Diameter ranges larger or equal to 30 microns less than 40 microns
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10S174/00—Electricity: conductors and insulators
- Y10S174/08—Shrinkable tubes
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10S428/922—Static electricity metal bleed-off metallic stock
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49121—Beam lead frame or beam lead device
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Food Science & Technology (AREA)
- Ceramic Engineering (AREA)
- Packaging Frangible Articles (AREA)
- Packages (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61278610A JPS63138986A (ja) | 1986-11-25 | 1986-11-25 | 面実装型半導体パツケ−ジ包装体 |
JP62206290A JPS6458670A (en) | 1987-08-21 | 1987-08-21 | Moistureproof packaging bag of electronic part |
Publications (1)
Publication Number | Publication Date |
---|---|
HK59394A true HK59394A (en) | 1994-07-08 |
Family
ID=26515558
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK59394A HK59394A (en) | 1986-11-25 | 1994-06-23 | Packaging of semiconductor elements |
HK28496A HK28496A (en) | 1986-11-25 | 1996-02-15 | Packaging of semiconductor elements |
HK214096A HK214096A (en) | 1986-11-25 | 1996-12-12 | Packaging of semiconductor elements |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK28496A HK28496A (en) | 1986-11-25 | 1996-02-15 | Packaging of semiconductor elements |
HK214096A HK214096A (en) | 1986-11-25 | 1996-12-12 | Packaging of semiconductor elements |
Country Status (5)
Country | Link |
---|---|
US (10) | US5095626A (de) |
EP (3) | EP0269410B1 (de) |
KR (2) | KR960015106B1 (de) |
DE (3) | DE3778499D1 (de) |
HK (3) | HK59394A (de) |
Families Citing this family (135)
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- 1987-11-24 EP EP92110466A patent/EP0512579B1/de not_active Expired - Lifetime
-
1989
- 1989-08-10 US US07/392,029 patent/US5095626A/en not_active Expired - Lifetime
- 1989-08-10 US US07/393,120 patent/US4971196A/en not_active Expired - Lifetime
-
1992
- 1992-07-15 KR KR1019920012563A patent/KR970007120B1/ko not_active IP Right Cessation
-
1994
- 1994-06-23 HK HK59394A patent/HK59394A/xx not_active IP Right Cessation
- 1994-06-23 US US08/264,745 patent/US5607059A/en not_active Expired - Fee Related
-
1996
- 1996-02-15 HK HK28496A patent/HK28496A/xx not_active IP Right Cessation
- 1996-09-13 US US08/712,559 patent/US5803246A/en not_active Expired - Fee Related
- 1996-12-12 HK HK214096A patent/HK214096A/xx not_active IP Right Cessation
-
1998
- 1998-06-10 US US09/094,490 patent/US5988368A/en not_active Expired - Fee Related
-
1999
- 1999-08-31 US US09/387,049 patent/US6223893B1/en not_active Expired - Fee Related
-
2001
- 2001-04-30 US US09/843,937 patent/US6443298B2/en not_active Expired - Fee Related
-
2002
- 2002-07-30 US US10/207,059 patent/US20020174627A1/en not_active Abandoned
- 2002-07-30 US US10/207,052 patent/US6981585B2/en not_active Expired - Fee Related
- 2002-07-30 US US10/207,086 patent/US20030057113A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
US20020179460A1 (en) | 2002-12-05 |
HK28496A (en) | 1996-02-23 |
US6443298B2 (en) | 2002-09-03 |
DE3751687T2 (de) | 1996-08-14 |
US4971196A (en) | 1990-11-20 |
DE3778499D1 (de) | 1992-05-27 |
EP0458423A3 (de) | 1991-12-11 |
EP0512579A1 (de) | 1992-11-11 |
HK214096A (en) | 1996-12-13 |
US5803246A (en) | 1998-09-08 |
EP0458423A2 (de) | 1991-11-27 |
DE3750589D1 (de) | 1994-10-27 |
KR960015106B1 (ko) | 1996-10-28 |
EP0458423B1 (de) | 1994-09-21 |
US20020174627A1 (en) | 2002-11-28 |
KR930005175A (ko) | 1993-03-23 |
US5095626A (en) | 1992-03-17 |
US6981585B2 (en) | 2006-01-03 |
US5607059A (en) | 1997-03-04 |
US5988368A (en) | 1999-11-23 |
US20010015327A1 (en) | 2001-08-23 |
EP0269410A3 (en) | 1989-02-08 |
EP0269410A2 (de) | 1988-06-01 |
DE3750589T2 (de) | 1995-01-19 |
EP0512579B1 (de) | 1996-01-24 |
DE3751687D1 (de) | 1996-03-07 |
EP0269410B1 (de) | 1992-04-22 |
KR970007120B1 (ko) | 1997-05-02 |
US6223893B1 (en) | 2001-05-01 |
US20030057113A1 (en) | 2003-03-27 |
KR890004429A (ko) | 1989-04-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PF | Patent in force | ||
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20051124 |