JPS6144897U - Ic用チユ−ブ - Google Patents
Ic用チユ−ブInfo
- Publication number
- JPS6144897U JPS6144897U JP1984128583U JP12858384U JPS6144897U JP S6144897 U JPS6144897 U JP S6144897U JP 1984128583 U JP1984128583 U JP 1984128583U JP 12858384 U JP12858384 U JP 12858384U JP S6144897 U JPS6144897 U JP S6144897U
- Authority
- JP
- Japan
- Prior art keywords
- transparency
- conductivity
- mounting pieces
- sides
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0084—Containers and magazines for components, e.g. tube-like magazines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Packaging Frangible Articles (AREA)
- Elimination Of Static Electricity (AREA)
- Laminated Bodies (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
め要約のデータは記録されません。
Description
【図面の簡単な説明】
第1図は一部拡大断面図、第2図は一部切除した部分拡
大平面図、第3図は一部切除した部分拡大底面図、第4
図は一部をさらに拡大した導電性基材シートの部分拡大
断面図、第5図は他の導電性基材シ一トの部分拡大断面
図であ名。 3・・・導電性基材シ一ト、8・・・上板、9,10・
・・垂下り外側板、11.12・・・底板、13.14
・・・立上り内側板、15・・・間隙、16,17・・
・載置片、18・・・被覆部材、22・・・導電性帯状
シート、25・・・載置部材。
大平面図、第3図は一部切除した部分拡大底面図、第4
図は一部をさらに拡大した導電性基材シートの部分拡大
断面図、第5図は他の導電性基材シ一トの部分拡大断面
図であ名。 3・・・導電性基材シ一ト、8・・・上板、9,10・
・・垂下り外側板、11.12・・・底板、13.14
・・・立上り内側板、15・・・間隙、16,17・・
・載置片、18・・・被覆部材、22・・・導電性帯状
シート、25・・・載置部材。
Claims (1)
- 透明性と導電性を有する導電性基材シ一ト3を複数回華
行して折曲し、上板8と左右の垂下り外側板9,10と
左右の底板11,12と左右の立上り内側板13.14
と中間に間隙15を保持して左右にICを載置する載置
片16,17とを連続して形成して被覆部材18として
、透明性と導電性を有する導電性帯状シ一ト22を前記
左右の載置片16,17の下面に固着して載置部材25
を形成してなるIC用チューブ。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1984128583U JPS6144897U (ja) | 1984-08-27 | 1984-08-27 | Ic用チユ−ブ |
US06/706,668 US4590534A (en) | 1984-08-27 | 1985-02-28 | Tubes for integrated circuits |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1984128583U JPS6144897U (ja) | 1984-08-27 | 1984-08-27 | Ic用チユ−ブ |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6144897U true JPS6144897U (ja) | 1986-03-25 |
Family
ID=14988341
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1984128583U Pending JPS6144897U (ja) | 1984-08-27 | 1984-08-27 | Ic用チユ−ブ |
Country Status (2)
Country | Link |
---|---|
US (1) | US4590534A (ja) |
JP (1) | JPS6144897U (ja) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4662514A (en) * | 1983-11-01 | 1987-05-05 | Charleswater Products, Inc. | Electrically conductive polymeric tubes for static sensitive electronic devices |
US4709297A (en) * | 1984-06-29 | 1987-11-24 | Siemens Aktiengesellschaft | Guiding device for semiconductor components with DIL casings |
DE8433243U1 (de) * | 1984-11-13 | 1986-05-07 | Siemens AG, 1000 Berlin und 8000 München | Horde für Halb- und Fertigprodukte |
JPS6216378A (ja) * | 1985-07-10 | 1987-01-24 | 株式会社日立製作所 | 収納容器 |
KR960015106B1 (ko) * | 1986-11-25 | 1996-10-28 | 가부시기가이샤 히다찌세이사꾸쇼 | 면실장형 반도체패키지 포장체 |
US4949868A (en) * | 1987-04-30 | 1990-08-21 | Molex Incorporated | Universal packaging system for electrical components and the like |
US4815594A (en) * | 1987-04-30 | 1989-03-28 | Molex Incorporated | Universal packaging system for electrical components and the like |
US4914890A (en) * | 1987-04-30 | 1990-04-10 | Molex Incorporated | Universal packaging system for electrical components and the like |
US4848566A (en) * | 1987-10-23 | 1989-07-18 | W. R. Grace & Co. | Antistatic/conductive container |
US4829432A (en) * | 1987-12-28 | 1989-05-09 | Eastman Kodak Company | Apparatus for shielding an electrical circuit from electromagnetic interference |
DE3810594A1 (de) * | 1988-03-29 | 1989-10-12 | Heigl Helmuth | Anordnung zum schutz integrierter bauelemente vor beschaedigung durch unkontrollierte elektrostatische entladung in handhabungssystemen |
US5232091A (en) * | 1992-10-22 | 1993-08-03 | Eastman Kodak Company | Semiconductor device shipping container |
US5441809A (en) * | 1993-10-28 | 1995-08-15 | Brady U.S.A., Inc. | Dissipative cover tape surface mount device packaging |
JPH08295001A (ja) * | 1995-04-27 | 1996-11-12 | Dainippon Printing Co Ltd | 蓋材とキャリアテープおよびこれらを用いたテーピング |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4327832A (en) * | 1980-06-26 | 1982-05-04 | Thielex Plastics Corporation | Container for packaging semiconductor components |
GB2112753B (en) * | 1981-12-29 | 1985-05-22 | Mitsubishi Plastics Ind | Magazine for electronic devices |
US4463851A (en) * | 1982-04-26 | 1984-08-07 | Meritex Plastic Inc. | Protective enclosure for electronic devices |
US4485531A (en) * | 1983-02-08 | 1984-12-04 | Robert Murphy | Stop pin |
US4487315A (en) * | 1983-02-24 | 1984-12-11 | Fujimori Kogyo Co., Ltd. | Tube assembly for integrated circuits |
-
1984
- 1984-08-27 JP JP1984128583U patent/JPS6144897U/ja active Pending
-
1985
- 1985-02-28 US US06/706,668 patent/US4590534A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US4590534A (en) | 1986-05-20 |
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