HK1019117A1 - Heat-conductive and pressure-sensitive adhesive sheets and method for fixing electronic parts to heat-radiating members with the use of the same - Google Patents

Heat-conductive and pressure-sensitive adhesive sheets and method for fixing electronic parts to heat-radiating members with the use of the same

Info

Publication number
HK1019117A1
HK1019117A1 HK99104143A HK99104143A HK1019117A1 HK 1019117 A1 HK1019117 A1 HK 1019117A1 HK 99104143 A HK99104143 A HK 99104143A HK 99104143 A HK99104143 A HK 99104143A HK 1019117 A1 HK1019117 A1 HK 1019117A1
Authority
HK
Hong Kong
Prior art keywords
heat
conductive
pressure
sensitive adhesive
same
Prior art date
Application number
HK99104143A
Other languages
English (en)
Inventor
Kazuyuki Kitakura
Masahiro Oura
Shigeki Muta
Takao Yoshikawa
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of HK1019117A1 publication Critical patent/HK1019117A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472—Sheet interfaces
    • H05K7/20481—Sheet interfaces characterised by the material composition exhibiting specific thermal properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2479/00—Presence of polyamine or polyimide
    • C09J2479/08—Presence of polyamine or polyimide polyimide
    • C09J2479/086—Presence of polyamine or polyimide polyimide in the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
HK99104143A 1997-12-22 1999-09-23 Heat-conductive and pressure-sensitive adhesive sheets and method for fixing electronic parts to heat-radiating members with the use of the same HK1019117A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP35310197A JP4337991B2 (ja) 1997-12-22 1997-12-22 熱伝導性感圧接着シ―ト類およびこれを用いた電子部品と放熱部材との固定方法

Publications (1)

Publication Number Publication Date
HK1019117A1 true HK1019117A1 (en) 2000-01-21

Family

ID=18428579

Family Applications (1)

Application Number Title Priority Date Filing Date
HK99104143A HK1019117A1 (en) 1997-12-22 1999-09-23 Heat-conductive and pressure-sensitive adhesive sheets and method for fixing electronic parts to heat-radiating members with the use of the same

Country Status (5)

Country Link
EP (1) EP0924761B1 (xx)
JP (1) JP4337991B2 (xx)
KR (1) KR19990063288A (xx)
DE (1) DE69837072T2 (xx)
HK (1) HK1019117A1 (xx)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003049144A (ja) * 2001-08-08 2003-02-21 Sekisui Chem Co Ltd 熱伝導性感圧接着剤及び熱伝導性感圧接着シート
US7589147B2 (en) 2003-05-19 2009-09-15 Nippon Shokubai Co., Ltd. Resin composition for thermal conductive material and thermal conductive material
TW200427806A (en) * 2003-05-22 2004-12-16 Zeon Corp Heat-conductive pressure sensitive adhesive composition, heat-conductive sheet-form shaped article, and process for producing the shaped article
JP2005105028A (ja) * 2003-09-29 2005-04-21 Nippon Zeon Co Ltd 熱伝導性感圧接着剤組成物並びに熱伝導性シート状成形体及びその製造方法
JP2005272599A (ja) * 2004-03-24 2005-10-06 Nippon Shokubai Co Ltd 放熱材料用脂組成物および放熱材料
EP1855511A1 (en) 2006-05-12 2007-11-14 Nederlandse Organisatie voor Toegepast-Natuuurwetenschappelijk Onderzoek TNO A process for preparing a heatsink system and heatsink system obtainable by said process
JP4848434B2 (ja) * 2009-01-30 2011-12-28 日東電工株式会社 熱伝導性粘着剤組成物および熱伝導性粘着シート
CN102516896A (zh) * 2011-12-30 2012-06-27 常熟市富邦胶带有限责任公司 覆铜用导热涂层型聚酰亚胺薄膜及其制作方法
WO2013122117A1 (ja) * 2012-02-14 2013-08-22 日東電工株式会社 熱伝導性粘着シート
TWI521032B (zh) * 2012-06-28 2016-02-11 羅門哈斯公司 濕性膠
DE102014207837A1 (de) 2014-04-25 2015-10-29 Tesa Se Dünnglasverbund und Verfahren zur Lagerung von Dünnglas
DE102014221245A1 (de) 2014-10-20 2016-04-21 Tesa Se Dünnglasfolienverbundbahn mit Versteifungsstreifen
CN108178991A (zh) * 2017-12-28 2018-06-19 张家港康得新光电材料有限公司 新型导热胶带及其制备方法
KR102069709B1 (ko) * 2018-01-22 2020-01-23 에스케이씨코오롱피아이 주식회사 2 종 이상의 필러를 포함하는 고열전도성 폴리이미드 필름
JP7126424B2 (ja) * 2018-10-09 2022-08-26 日東シンコー株式会社 剥離シート付絶縁放熱シート
CN111434725A (zh) * 2019-01-15 2020-07-21 湖南国柔科技有限公司 一种便于导热的聚酰亚胺薄膜及其生产工艺

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57195172A (en) * 1981-05-25 1982-11-30 Nitto Electric Ind Co Ltd Pressure-sensitive adhesive composition
JPS62216732A (ja) * 1986-03-19 1987-09-24 Hitachi Chem Co Ltd 金属複合積層体の製造方法
JPS63125532A (ja) * 1986-11-14 1988-05-28 Hitachi Chem Co Ltd ポリイミド成形品の接着法
JPS63189458A (ja) * 1987-02-03 1988-08-05 Dainippon Ink & Chem Inc 電子部品封止用ポリアリ−レンスルフイド樹脂組成物及び電子部品
JPS63283918A (ja) * 1987-05-18 1988-11-21 Toyoda Gosei Co Ltd ガラス・樹脂一体成形品
US5213868A (en) * 1991-08-13 1993-05-25 Chomerics, Inc. Thermally conductive interface materials and methods of using the same
CA2093191A1 (en) * 1992-04-15 1993-10-16 Richard J. Webb Psa containing thermally conductive, electrically insulative particles and a transfer tape from this psa
JPH10292157A (ja) * 1997-04-17 1998-11-04 Nitto Denko Corp 熱伝導性感圧接着シ―ト類およびこれを用いた電子部品と放熱部材との固定方法

Also Published As

Publication number Publication date
KR19990063288A (ko) 1999-07-26
DE69837072T2 (de) 2007-06-06
JP4337991B2 (ja) 2009-09-30
JPH11181368A (ja) 1999-07-06
EP0924761B1 (en) 2007-02-14
DE69837072D1 (de) 2007-03-29
EP0924761A1 (en) 1999-06-23

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20101221