DE69837072D1 - Wärmeleitende und druckempfindliche Klebefolie und Verfahren zur Befestigung elektronischer Bauteile auf wärmeabstrahlende Teile mittels derselben - Google Patents
Wärmeleitende und druckempfindliche Klebefolie und Verfahren zur Befestigung elektronischer Bauteile auf wärmeabstrahlende Teile mittels derselbenInfo
- Publication number
- DE69837072D1 DE69837072D1 DE69837072T DE69837072T DE69837072D1 DE 69837072 D1 DE69837072 D1 DE 69837072D1 DE 69837072 T DE69837072 T DE 69837072T DE 69837072 T DE69837072 T DE 69837072T DE 69837072 D1 DE69837072 D1 DE 69837072D1
- Authority
- DE
- Germany
- Prior art keywords
- heat
- pressure
- sensitive adhesive
- electronic components
- thermally conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/08—Homopolymers or copolymers of acrylic acid esters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20472—Sheet interfaces
- H05K7/20481—Sheet interfaces characterised by the material composition exhibiting specific thermal properties
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2479/00—Presence of polyamine or polyimide
- C09J2479/08—Presence of polyamine or polyimide polyimide
- C09J2479/086—Presence of polyamine or polyimide polyimide in the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Thermal Sciences (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP35310197 | 1997-12-22 | ||
JP35310197A JP4337991B2 (ja) | 1997-12-22 | 1997-12-22 | 熱伝導性感圧接着シ―ト類およびこれを用いた電子部品と放熱部材との固定方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69837072D1 true DE69837072D1 (de) | 2007-03-29 |
DE69837072T2 DE69837072T2 (de) | 2007-06-06 |
Family
ID=18428579
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69837072T Expired - Fee Related DE69837072T2 (de) | 1997-12-22 | 1998-12-21 | Wärmeleitende und druckempfindliche Klebefolie und Verfahren zur Befestigung elektronischer Bauteile auf wärmeabstrahlende Teile mittels derselben |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP0924761B1 (de) |
JP (1) | JP4337991B2 (de) |
KR (1) | KR19990063288A (de) |
DE (1) | DE69837072T2 (de) |
HK (1) | HK1019117A1 (de) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003049144A (ja) * | 2001-08-08 | 2003-02-21 | Sekisui Chem Co Ltd | 熱伝導性感圧接着剤及び熱伝導性感圧接着シート |
US7589147B2 (en) | 2003-05-19 | 2009-09-15 | Nippon Shokubai Co., Ltd. | Resin composition for thermal conductive material and thermal conductive material |
TW200427806A (en) * | 2003-05-22 | 2004-12-16 | Zeon Corp | Heat-conductive pressure sensitive adhesive composition, heat-conductive sheet-form shaped article, and process for producing the shaped article |
JP2005105028A (ja) * | 2003-09-29 | 2005-04-21 | Nippon Zeon Co Ltd | 熱伝導性感圧接着剤組成物並びに熱伝導性シート状成形体及びその製造方法 |
JP2005272599A (ja) * | 2004-03-24 | 2005-10-06 | Nippon Shokubai Co Ltd | 放熱材料用脂組成物および放熱材料 |
EP1855511A1 (de) | 2006-05-12 | 2007-11-14 | Nederlandse Organisatie voor Toegepast-Natuuurwetenschappelijk Onderzoek TNO | Herstellungsverfahren einer Kühlungsanordnung sowie nach dem Verfahren erhaltene Kühlungsanordnung |
JP4848434B2 (ja) * | 2009-01-30 | 2011-12-28 | 日東電工株式会社 | 熱伝導性粘着剤組成物および熱伝導性粘着シート |
CN102516896A (zh) * | 2011-12-30 | 2012-06-27 | 常熟市富邦胶带有限责任公司 | 覆铜用导热涂层型聚酰亚胺薄膜及其制作方法 |
WO2013122117A1 (ja) * | 2012-02-14 | 2013-08-22 | 日東電工株式会社 | 熱伝導性粘着シート |
TWI521032B (zh) * | 2012-06-28 | 2016-02-11 | 羅門哈斯公司 | 濕性膠 |
DE102014207837A1 (de) | 2014-04-25 | 2015-10-29 | Tesa Se | Dünnglasverbund und Verfahren zur Lagerung von Dünnglas |
DE102014221245A1 (de) | 2014-10-20 | 2016-04-21 | Tesa Se | Dünnglasfolienverbundbahn mit Versteifungsstreifen |
CN108178991A (zh) * | 2017-12-28 | 2018-06-19 | 张家港康得新光电材料有限公司 | 新型导热胶带及其制备方法 |
KR102069709B1 (ko) * | 2018-01-22 | 2020-01-23 | 에스케이씨코오롱피아이 주식회사 | 2 종 이상의 필러를 포함하는 고열전도성 폴리이미드 필름 |
JP7126424B2 (ja) * | 2018-10-09 | 2022-08-26 | 日東シンコー株式会社 | 剥離シート付絶縁放熱シート |
CN111434725A (zh) * | 2019-01-15 | 2020-07-21 | 湖南国柔科技有限公司 | 一种便于导热的聚酰亚胺薄膜及其生产工艺 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57195172A (en) * | 1981-05-25 | 1982-11-30 | Nitto Electric Ind Co Ltd | Pressure-sensitive adhesive composition |
JPS62216732A (ja) * | 1986-03-19 | 1987-09-24 | Hitachi Chem Co Ltd | 金属複合積層体の製造方法 |
JPS63125532A (ja) * | 1986-11-14 | 1988-05-28 | Hitachi Chem Co Ltd | ポリイミド成形品の接着法 |
JPS63189458A (ja) * | 1987-02-03 | 1988-08-05 | Dainippon Ink & Chem Inc | 電子部品封止用ポリアリ−レンスルフイド樹脂組成物及び電子部品 |
JPS63283918A (ja) * | 1987-05-18 | 1988-11-21 | Toyoda Gosei Co Ltd | ガラス・樹脂一体成形品 |
US5213868A (en) * | 1991-08-13 | 1993-05-25 | Chomerics, Inc. | Thermally conductive interface materials and methods of using the same |
CA2093191A1 (en) * | 1992-04-15 | 1993-10-16 | Richard J. Webb | Psa containing thermally conductive, electrically insulative particles and a transfer tape from this psa |
JPH10292157A (ja) * | 1997-04-17 | 1998-11-04 | Nitto Denko Corp | 熱伝導性感圧接着シ―ト類およびこれを用いた電子部品と放熱部材との固定方法 |
-
1997
- 1997-12-22 JP JP35310197A patent/JP4337991B2/ja not_active Expired - Fee Related
-
1998
- 1998-12-21 EP EP98124343A patent/EP0924761B1/de not_active Expired - Lifetime
- 1998-12-21 DE DE69837072T patent/DE69837072T2/de not_active Expired - Fee Related
- 1998-12-22 KR KR1019980057001A patent/KR19990063288A/ko not_active Application Discontinuation
-
1999
- 1999-09-23 HK HK99104143A patent/HK1019117A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR19990063288A (ko) | 1999-07-26 |
DE69837072T2 (de) | 2007-06-06 |
JP4337991B2 (ja) | 2009-09-30 |
JPH11181368A (ja) | 1999-07-06 |
HK1019117A1 (en) | 2000-01-21 |
EP0924761B1 (de) | 2007-02-14 |
EP0924761A1 (de) | 1999-06-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE69837072D1 (de) | Wärmeleitende und druckempfindliche Klebefolie und Verfahren zur Befestigung elektronischer Bauteile auf wärmeabstrahlende Teile mittels derselben | |
DE69825365D1 (de) | Einrichtung zur Montage von elektronischen Bauteilen und Speisevorrichtung dafür | |
DE69733229D1 (de) | Einrichtung zur Montage von elektronischen Bauteilen | |
DE69824363D1 (de) | Härtbare Siliconzusammensetzung und elektronische Bauteile | |
ATE256168T1 (de) | Verfahren zur adhesiven trennung von klebeverbunden | |
DE69709176D1 (de) | Gegossene fassungen zur befestigung von elektronischen bauelementen | |
KR960011509A (ko) | 편광판의 점착장치 | |
DE69807447D1 (de) | Einrichtung zur montage von elektronischen bauteilen | |
DE69809833D1 (de) | Vorrichtung und Verfahren zur Stromversorugung von elektronischen Einrichtungen | |
DE59812848D1 (de) | Gehäuse zur Aufnahme elektronischer Bauelemente | |
DE59802499D1 (de) | Hitzeschutzmantel für ein elektronisches Gerät | |
DE19782254T1 (de) | Verfahren und Vorrichtung zur Strommessung auf der Basis von angelegter Spannung | |
DE69410739D1 (de) | Klebeband für elektronische Bauteile und Flüssigklebstoff | |
ATE282249T1 (de) | Kühlkörper für elektronische bauelemente | |
DE69602888D1 (de) | Klebeband für elektronische Bauelemente und Flüssigklebstoff | |
DE69407538D1 (de) | Flüssigklebstoff für elektronische Teile und deren Anwendung zur Bildung einer isolierenden Klebeschicht | |
DE69839520D1 (de) | Temperaturregelvorrichtung fuer ein elektronisches bauelement | |
DE69800483D1 (de) | Wärmeleitende und druckempfindliche Klebefolien und Verfahren zur Befestigung elektronischer Bauelemente | |
DE10194457T1 (de) | System und Verfahren zum Anbringen elektronischer Komponenten auf flexiblen Substraten | |
DE60310653D1 (de) | Vorrichtung zur thermischen Aktivierung von wärmeempfindlicher Klebefolie und Drucker | |
DE602004020946D1 (de) | Vorrichtung zur thermischen Aktivierung von wärmeempfindlicher Klebefolie | |
DE59100616D1 (de) | Verfahren zur montage und isolationsprüfung von elektronischen leistungsbauelementen auf kühlkörpern. | |
ATA185095A (de) | Vorrichtung zur rückgewinnung von an schüttfähigen teilen anhaftenden flüssigkeiten | |
KR960013150A (ko) | 히트 싱크에 전자동력 부품의 체결장치 및 인쇄회로판에서의 장착방법 | |
DE60045700D1 (de) | Klebstoffmaterial und Verfahren zur elektronischen Stromkreisschaltung |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |