EP1545836A1 - Anneau de fixation de plaquettes en semiconducteurs dans un dispositif de polissage par voie chimique-mecanique - Google Patents

Anneau de fixation de plaquettes en semiconducteurs dans un dispositif de polissage par voie chimique-mecanique

Info

Publication number
EP1545836A1
EP1545836A1 EP03757898A EP03757898A EP1545836A1 EP 1545836 A1 EP1545836 A1 EP 1545836A1 EP 03757898 A EP03757898 A EP 03757898A EP 03757898 A EP03757898 A EP 03757898A EP 1545836 A1 EP1545836 A1 EP 1545836A1
Authority
EP
European Patent Office
Prior art keywords
ring
support ring
support
carrier
retaining ring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP03757898A
Other languages
German (de)
English (en)
Inventor
Wilfried Ensinger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ensinger Kunststofftechnologie GbR
Original Assignee
Ensinger Kunststofftechnologie GbR
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ensinger Kunststofftechnologie GbR filed Critical Ensinger Kunststofftechnologie GbR
Publication of EP1545836A1 publication Critical patent/EP1545836A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings

Definitions

  • the invention relates to a retaining ring for holding semiconductor wafers in a chemical mechanical polishing device, as described, for example, in US Pat. No. 6,251,215.
  • integrated circuits are typically produced on semiconductor substrates, in particular silicon wafers, with conductive, semiconducting and insulating layers being successively deposited on the wafer. After each layer is deposited, etching is carried out to implement the circuit functions. After a series of layers have been sequentially stored and etched, the top surface of the semiconductor substrate, i.e. the outer surface of the substrate, more and more uneven. This uneven surface causes problems in photolithographic steps in the manufacturing process of the integrated circuits. That is why there is always a need to make the surface of the semiconductor substrate flat.
  • CMP chemical mechanical polishing
  • a recurrent problem in the CMP process is the so-called edge effect, i.e. the tendency to polish the edge of the substrate to be polished at a different speed than the center of the substrate. This typically results in too much edge polishing, i.e. too much material is removed from the edge here, especially in the outermost 5 to 10 mm of a wafer with a diameter of 200 mm.
  • Too much polishing reduces the flatness of the substrate as a whole and makes the edge of the substrate unsuitable for the production of integrated circuits and thus reduces the process yield.
  • US Pat. No. 6,251,215 proposes to design the retaining ring in two parts, one part being made from a rigid material, namely a metal part, and a second part made from a plastic material which has a lower rigidity, so that on the one hand it is abrasive and on the other hand in contact with the semiconductor wafer it cannot damage it.
  • US Pat. No. 6,251,215 proposes to connect the plastic part of the retaining ring and the metal ring to one another with an epoxy adhesive. Alternatively, it is proposed to press-fit the two parts together.
  • the refurbishment of the retaining ring causes problems after the plastic part has been abraded to a certain extent.
  • the complete retaining rings have to be sent to the manufacturer, where the plastic part is mechanically removed and the adhesive residues from the metal part are subsequently thermally decomposed by heating to approx. 200 ° C. Then the metal part has to be sandblasted to remove the last residues of the adhesive, and only then can a new plastic ring be stuck on again.
  • the retaining rings as such become very expensive.
  • the metallic holding elements which are more expensive than the plastic elements in terms of production costs, only survive a small number of cycles, in particular because of the temperature treatment during thermal degradation of the adhesive and the sandblasting treatment subsequently required.
  • the object of the invention is to propose a retaining ring which can be produced more cost-effectively and, in particular, can be provided with a new plastic part more cost-effectively.
  • a retaining ring which comprises: a carrier ring made of a first material, which comprises mounting elements with which the carrier ring can be mounted on the polishing device;
  • a support ring arranged concentrically on the carrier ring and made of a plastic material, which rests with a first end face on a polishing surface of the polishing device and which axially opposes the first end face set side on the carrier ring is adhesive-free, detachable, non-rotatable, positive and / or non-positive,
  • the first material has a higher rigidity than the plastic material of the support ring.
  • the releasable, non-rotatable positive and / or non-positive connection of the support ring and the carrier ring is preferably produced in the region of an outer peripheral surface of the support ring. This allows optimal conditions when absorbing the forces acting on the carrier ring during the chemical-mechanical polishing process.
  • a particularly secure fit of the support ring on the support ring is obtained if the support ring has a recess which follows the circumference and in which the support ring is received, on the side of the support ring.
  • the peripheral surface for producing the positive and / or non-positive connection is a peripheral surface of the recess.
  • the recess can be circumferential all round or consist of recessed ring segment-like recessed areas.
  • the outer circumferential surface of the carrier ring is preferably substantially aligned with the outer circumferential surface of the support ring.
  • the support ring comprises a circumferential, radially outwardly projecting flange which enlarges the support surface of the end face of this ring.
  • This outwardly projecting flange of the support ring offers additional protection of the support ring against contamination during the chemical-mechanical see polishing process.
  • the idea comes into effect in an economical form, to design the carrier ring, which is more expensive to manufacture, as a permanent and reusable part and only to replace the support ring regularly, depending on the wear situation.
  • the support ring likewise comprises an outwardly projecting flange which stabilizes the flange of the support ring in its geometric shape.
  • the flange of the support ring can support the flange of the support ring partially or even over the entire surface.
  • the support ring and the carrier ring lie flat against one another in predetermined surface areas in the connected state and that the support ring and the carrier ring complement or complement each other.
  • the surface areas on which the support ring and the support ring lie flat against one another are preferably aligned radially and form a flat support and thus support for the support ring on the support ring.
  • the complementary projections and recesses of the support and support ring, which center the support ring with respect to the support ring, are preferably in the range of Surface areas on which the support ring and the support ring lie flat against one another are arranged.
  • the complementary projections and recesses of the support ring and carrier ring can be used to produce a press fit connection.
  • the support ring comprises on its outer circumference a circumferential collar which points in the axial direction away from the first end face and which lies against the outer circumferential surface of the carrier ring and covers it essentially over the entire surface.
  • This embodiment has the advantage that the material of the carrier ring is even better shielded from the influences of the chemical-mechanical polishing process, so that there is a greater choice here for the materials for producing the carrier ring.
  • the carrier ring has, on its surface area in contact with the support ring, an annular groove with a wall which is oriented essentially parallel to the ring axis and comprises a threaded section and with the support ring on its first end face axially opposite side has one or more projections complementary to the annular groove, which have a complementary to the threaded portion of the axially parallel wall of the groove threaded portion.
  • the ring collar can also be divided into a plurality of ring segments spaced apart from one another.
  • the annular groove has two axially parallel walls which are radially spaced from one another and define the width of the annular groove, each with a threaded section.
  • the projection or annular collar of the support ring has an inward and an outwardly facing complementary threaded section.
  • the course of the threads of the threaded sections of the ring groove is parallel, i.e. radially aligned, with the same radially aligned thread start and lead angle.
  • connection of the support ring and carrier ring is to provide them with cooperating locking means, which form a locking connection in the assembled state of the rings and secure the rings against axially acting forces in the assembled state.
  • the latching connection is preferably designed in such a way that it simultaneously acts as an anti-rotation device. This can be done, for example, by providing a plurality of snap connections distributed over the circumference of the ring, locking lugs engaging in individual recesses and thus preventing the support ring from being rotatable relative to the carrier ring when it is engaged.
  • the carrier ring and the support ring have complementary surface areas, via which they abut one another in the assembled state, and that the surface areas have mutually complementary projections and recesses, with the aid of which the rings can be connected to one another by means of shrinking or shrinking.
  • connection between the support ring and the carrier ring can be secured against rotation by appropriate shaping of the projections and recesses.
  • the support ring has a radially outwardly opening ring groove on its circumferential surface
  • the carrier ring is composed of a plurality of ring segments which comprise a flange part which is essentially complementary to the ring groove and one or more Mounting sections which are available in the axial direction from the side facing away from the support surface of the support ring for mounting the carrier ring on the polishing device.
  • the carrier ring consists of two ring segments, i.e. quasi from two ring halves, which are pushed onto the support ring in the radial direction.
  • the flange parts here also form the reinforcement of the support ring and thus ensure its dimensional stability.
  • they carry several assembly sections, via which the entirety of the support ring and carrier ring can then be attached to the device.
  • These assembly sections can consist, for example, of simple bushings which have an internal thread.
  • the flange parts can also have such bores which comprise an internal thread into which mounting bolts can be screwed directly.
  • a plurality of ring segments distributed over the circumference are provided, which form the carrier ring. These ring segments do not necessarily have to be connected directly to one another, but can certainly be spaced apart from one another. How large the distance between the individual ring segments or their flange parts can be in the circumferential direction depends on the rigidity of the material of the support ring.
  • the groove is designed such that it comprises recesses in its groove wall which faces axially away from the bearing surface of the bearing ring.
  • elements of the mounting sections can then be inserted radially from the outside.
  • These can be bushings, for example, which are placed on the flange parts.
  • the recesses can also make bores with internal threads, which are formed in the flange itself, accessible.
  • An embodiment of the present invention which is significantly different from the previously described embodiments, provides that the support ring and the carrier ring have surfaces which are complementary to one another and, in the assembled state, are aligned with one another and form an annular channel between them, which is sealed off from the environment via annular sealing elements and the carrier ring has a closable opening which is accessible from the outside and leads into the ring channel and through which the ring channel can be evacuated.
  • the closable opening leading into the ring channel could of course also be arranged on the support ring. For cost reasons, however, this will preferably be done on the carrier ring.
  • a non-positive connection between the support ring and carrier ring can then be established by evacuating the ring channel.
  • the support ring can be removed and replaced by simply venting the ring channel.
  • an anti-rotation lock can preferably be achieved by providing a cavity on the support ring and the carrier ring on at least one surface area on which these rings are adjacent to one another, which has recesses both in the surface of the support ring and is formed in the surface of the carrier ring.
  • This cavity can then be filled with a hardenable mass. As soon as the hardenable mass has hardened, it prevents a rotary movement between the support ring and the carrier ring. Appropriate design and arrangement of such a cavity can also secure the support ring on the support ring and vice versa in the axial direction.
  • the support ring can be connected to the carrier ring in a rotationally fixed manner by means of a bolt which engages in recesses on both sides.
  • a threaded bolt is preferably used here, which can then be secured in the recess at the same time by screwing in.
  • Such bolts can be inserted into corresponding recesses both in the axial and in the radial direction and in each case serve equally to prevent rotation.
  • the plastic material comprises a thermoplastic, a thermoset, an elastomer and / or a plastic mixture.
  • the plastic material is a reinforced, in particular a fiber-reinforced plastic material.
  • the plastic material has friction and / or wear-reducing additives.
  • Substances are mixed, for example PTFE, polyimide, molybdenum disulfide, graphite, boron nitride, nanoparticles or the like.
  • the support ring is constructed from at least two layers or components in the manner of a sandwich.
  • FIG. 1A to 1D a first embodiment of a retaining ring according to the invention
  • 7A to 7D a further embodiment of the retaining ring according to the invention
  • 8A to 8D a further embodiment of the retaining ring according to the invention
  • FIG. 1A shows a retaining ring 10 according to the invention for mounting on a chemical-mechanical polishing device for semiconductor wafers, from the side facing the polishing device in plan view.
  • the retaining ring 10 consists of a carrier ring 12, which is made of a first material, in particular metallic materials and / or plastic materials that have the same strength as metallic materials, in particular fiber-reinforced plastics.
  • a support ring 14 made of a plastic material is arranged concentrically on the carrier ring 12.
  • the first material has a higher rigidity than this plastic material.
  • the carrier ring 12 has on its side facing the polishing device at regular angular intervals threaded holes 16, by means of which the retaining ring can be fastened to the chemical mechanical polishing device.
  • the carrier ring 12 has on its side facing the polishing device a recess 18 into which the retaining ring in FIG a protrusion (not shown) protrudes into the polishing device on the part of the polishing device, so that there is always a defined installation position of the retaining ring in the polishing device.
  • This in particular facilitates the alignment of the threaded bores 16 with corresponding openings on the side of the polishing device, through which threaded bolts are screwed into the threaded bores 16 and thus the retaining ring is fastened to the polishing device.
  • Figure IB shows a sectional view of the retaining ring 10 of Figure 1A along the line A-A and illustrates the principle with which the support ring made of plastic material is held on the carrier ring without adhesive, releasably, non-rotatably, positively and / or non-positively.
  • the support ring 14 has, on its side facing the carrier ring 12, a shoulder 22 that springs back from the outer circumference 20, as can be seen in the enlarged detailed illustration of FIG.
  • the support ring which is made of steel in the present example, is shrunk onto the support ring made of plastic.
  • the plastic material of the support ring is preferably a polyphenylene sulfide material (PPS), a PEEK, PAI, PI, PA, POM, PET or a PBT in pure or in modified form.
  • PPS polyphenylene sulfide material
  • PAI polyphenylene sulfide material
  • PA polyphenylene sulfide material
  • POM polyphenylene sulfide material
  • PET or a PBT in pure or in modified form.
  • friction and / or wear-reducing additives can be added, for example PTFE, polyimide, molybdenum disulfide, graphite, boron nitride, nanoparticles or the like.
  • the retaining ring 10 Due to the greater rigidity of the steel material of the carrier ring 12, the retaining ring 10 is given an overall excellent dimensional stability, while the plastic material of the support ring 14 slidably rests on the abrasion surface of the chemical-mechanical polishing device and the semiconductor wafer is held within the annular space 24 defined by the support ring during the polishing process ,
  • the advantage of this embodiment is, in particular, that the steel ring can be shrunk onto the plastic receiving ring 14, with a non-positive, detachable and non-rotatable connection is obtained.
  • the support ring 14 When the support ring 14 is worn, it can be removed very easily from the carrier ring 12 and replaced by a new support ring 14.
  • the exchange process is significantly easier than is the case in the prior art, and no adhesive residues etc. need to be removed.
  • the carrier ring 12 also does not have to be prepared separately before it can be fitted with a new bearing ring 14 and is therefore itself subject to significantly less wear.
  • the peripheral surface 20 of the retaining ring 10 is essentially stepless, i.e. the outer circumference of the support ring 14 is flush with the outer circumference of the support ring 12.
  • the fact that the support ring 14 extends radially further inwards than the support ring 12 and also accommodates it in a shoulder 22 (FIG. IC) that springs back from the outer circumference 20 is Annulus 24 essentially limited exclusively by the support ring 14.
  • the semiconductor wafer to be polished in the chemical-mechanical polishing device comes into contact exclusively with the comparatively soft plastic material of the support ring 14, so that the risk of damage to the edge of the semiconductor wafer is minimized.
  • FIG. 1D finally shows the retaining ring 10 again in a perspective view and in particular clarifies that the interior of the retaining ring 10 is mainly delimited by the support ring 14.
  • FIGS. 2A to 2D show a further variant of a retaining ring 30 according to the invention, which, like the retaining ring 10 of FIGS. 1A to 1D, is made of a carrier ring 32 made of steel and a support ring 34 made of plastic material.
  • the carrier ring 32 has threaded bores 36 at regular angular intervals, which are used to fasten the retaining ring 30 to the chemical mechanical polishing device.
  • a recess 38 ensures a defined installation position of the retaining ring in the chemical-mechanical polishing device, since in the assembled state a projection of this device is inserted into it. attacks.
  • the threaded holes 36 are thus aligned with the corresponding fastening elements on the part of the polishing device, and assembly by means of screw bolts can be carried out in a simple manner.
  • the outer circumference of the retaining ring 30 is designed such that the outer circumferential surfaces of the carrier ring 32 and the support ring 34 are aligned with one another.
  • the support ring 34 extends in the radial direction further to the center than is the case with the carrier ring 32. From the outer circumference 40, a recess 42 is provided on the support ring 34, which receives the carrier ring 32 (FIG. 2C).
  • An inner space 44 formed by the holding ring 30 is in turn essentially limited exclusively by the supporting ring 34 or by its relatively soft plastic material.
  • the support ring 34 has, on its radial surface in contact with the carrier ring 32, an annular rib 43 which engages in a complementary annular groove 45 on the underside of the carrier ring 32.
  • connection between the support ring 34 and the carrier ring 32 can be created by a press fit, in which the annular rib 43 is pressed into the annular groove 45.
  • the carrier ring 32 again takes on the task of mechanically stabilizing the ring and thus ensuring the geometry of the ring is fixed.
  • the support ring 34 with its comparatively soft material protects the semiconductor wafers from contact with the carrier ring 32 and thus avoids damage to the edge of the semiconductor wafers.
  • FIGS. 3A to 3D A further variant of a retaining ring 50 according to the invention is shown in FIGS. 3A to 3D.
  • a carrier ring 52 takes on the task of mechanically stabilizing the retaining ring 50 and guaranteeing its exact geometry. It is preferably made of steel.
  • the carrier ring 52 carries on its side facing the support surface of the chemical mechanical polishing device a support ring 54, which in turn is made of plastic material.
  • the carrier ring 52 On its side facing the polishing device, the carrier ring 52 has threaded bores 56 at regular angular intervals, via which the retaining ring 50 can be connected to the polishing device via threaded bolts.
  • FIG. 3B shows a retaining ring 50 according to the invention in a sectional view along line AA of FIG. 3A, it being evident here that the outer circumference 60 of the retaining ring 50 is formed here by a collar 66 which runs in the axial direction and is supported by the support ring 54 and which forms the outer peripheral surface of the carrier ring 52 substantially completely covered.
  • the carrier ring 52 is thus arranged in an annular channel 62 of the support ring 54 and is essentially covered on its surfaces running in the axial direction by the plastic material of the support ring.
  • the carrier ring 52 is connected to the support ring 54 in a press fit, so that again there is an adhesive-free connection.
  • the frictional connection between the carrier ring 52 and the support ring 54 is normally sufficient to also ensure a rotationally fixed connection here.
  • an anti-rotation lock can be provided, as is shown by way of example in FIG. 3D.
  • recesses are provided at one or more points of the carrier ring 52 and the support ring 54 distributed over the circumference of the retaining ring 50, which together create a cavity into which a curable one organic or inorganic material can be filled.
  • the material is still soft and deformable and therefore essentially fills the cavities formed by the recesses on the part of the support ring 54 and the support ring 52.
  • the material is then hardened in the recesses and thus represents an anti-twist device.
  • a kind of safeguard is created to ensure that the support ring cannot be easily removed from the carrier ring 52.
  • curable materials to be introduced into the cavity 68, which then form a filling 69 is very large, since these volumes are completely shielded from the environment and only have to withstand the mechanical requirements which dictate the mechanical stress during the polishing process.
  • Thermally curable materials are preferably used.
  • the support ring 54 extends so far inward in the radial direction of the retaining ring 50 that the interior space 64 formed is essentially limited by the relatively soft material of the support ring 54 and the edges of the semiconductor wafers held therein do not during the chemical-mechanical polishing process can be damaged.
  • the anti-rotation device described above with reference to FIG. 3B in the retaining rings according to the invention can also be applied to the previously described embodiments of the retaining rings 10 and 30, as well as for the majority of the retaining rings discussed below, even if this is not mentioned in detail later.
  • FIGS. 4A to 4D show a further variant of a retaining ring 70 according to the invention, which is essentially composed of two parts, namely a carrier ring 72 and a support ring 74.
  • the carrier ring 72 again has threaded bores 76 arranged at regular angular intervals and a recess 78, the latter Function of the threaded holes and Corresponds to recesses of the retaining rings described above.
  • the support ring 74 extends further radially inward than the carrier ring 72 and thereby provides an interior 84 which is essentially delimited by the plastic material of the support ring 74 and is therefore gentle on the semiconductor wafers accommodated therein.
  • the outer circumference 80 of the retaining ring 70 is in turn formed here by the plastic material of the support ring 74 or its collar 86, so that the material of the carrier ring 72 can be selected entirely from the point of view of the strength required here, regardless of whether it is sufficiently inert towards the chemical agents that are used in the chemical mechanical polishing process.
  • the collar 86 protects the outer surface of the carrier ring 72 against a possible attack by these materials.
  • the carrier ring 72 is pressed into an annular channel 82, as best expressed in the detailed illustration of FIG. 4B, which includes a sectional view along line AA in FIG. 4A, as well as in FIG. 4C.
  • FIG. 4C A detail of this variant of the retaining ring 70 can also be seen from the detailed illustration in FIG. 4C, which is otherwise constructed similarly to the retaining ring 50 in FIGS. 3A to 3D.
  • a latching connection 85 is provided at at least one point, but better distributed at regular angular intervals over the entire circumference of the ring channel 82, which comprises a nose 87 held resiliently on the bearing ring 74 and a nose located in the inside thereof Circumferential wall of the support ring 72 arranged recess there.
  • the latching connection 85 engages in the end position, ie the lug 87 engages in the complementary recess provided here on the part of the carrier ring 72 and thus leads to a pull-off protection on the one hand and to a rotationally fixed connection between the carrier ring 72 and the support ring 74 on the other hand.
  • a sufficient torsional strength is usually already achieved by pressing the carrier ring 72 into the support ring 74, so that the latching connection 85 here only represents an additional anti-rotation lock.
  • FIGS. 5A to 5D show a further variant of a retaining ring 90 according to the invention.
  • the retaining ring 90 is composed of a carrier ring 92 and a bearing ring 94, the carrier ring 92 again preferably being made of steel, and the bearing ring 94 made of a plastic material, in particular Polyphenylene sulfide, PEEK, PAI, PI, PA, POM, PET or from PBT in pure or modified form.
  • a plastic material in particular Polyphenylene sulfide, PEEK, PAI, PI, PA, POM, PET or from PBT in pure or modified form.
  • friction and / or wear-reducing additives can be added to improve the tribological properties, for example PTFE, polyimide, molybdenum disulfide, graphite, boron nitride, nanoparticles or the like.
  • the outer circumference 100 of the retaining ring 90 is formed here by the aligned outer surfaces of the carrier ring 92 and the support ring 94.
  • a radial surface 102 which lies opposite the carrier ring 92.
  • This radial surface 102 includes one or more, in the present case five, concentric annular ribs 103 which project from the radial surface 102 in the axial direction.
  • the complementary to the radial surface 102 The surface of the carrier ring 92 has corresponding concentric undercuts 104 into which the ribs 103 can be received.
  • the ribs 103 are preferably received in the undercuts 104 by shrinking or shrinking, either first heating the metallic material of the carrier ring so that the undercuts 104 expand, then placing the support ring 94 with its ribs 103 on the carrier ring 92 and the ribs are introduced into the undercuts, whereupon the undercuts are narrowed when the carrier ring 92 cools down, so that they then grip the ribs 103 in a positive and non-positive manner.
  • the plastic material can be cooled and the ribs 103 inserted into the undercuts 104.
  • the positive and non-positive connection provides security against rotation, which, however, as shown in the previous variants, can be additionally improved, for example, by providing additional security against rotation.
  • FIG. 5B represents a sectional illustration along line A-A in FIG. 5A, and in the detailed illustration in FIG. 5C.
  • FIGS. 6A to 6D show a further variant of the holding ring HO according to the invention with a carrier ring 112 and a support ring 114.
  • the special feature of this embodiment is that the carrier ring 112 is segmented, ie is no longer formed in one piece, as was the case with the retaining rings 10, 30, 50, 70 and 90 discussed so far.
  • the receiving ring 114 has on its outer circumference a radially recessed shoulder 116, which has a radially inwardly extending annular groove 118 on its radially outer circumferential wall.
  • the carrier ring 112 has at its end facing the bearing ring 114 a radially inwardly projecting flange 120 which is pressed into the annular groove 118 of the receiving ring 114 when the retaining ring 110 is assembled.
  • FIG. 6B shows this in detail with its sectional view along line AA of FIG. 6A. For the rest, this can also be seen again in the enlarged detailed illustration in FIG. 6C.
  • FIG. 6D shows the segmentation of the carrier ring 112 into two semicircular segments 122, which together form the carrier ring 112.
  • threaded bores 124 are provided in the carrier ring segments 122, via which the carrier ring can be screwed to the polishing device.
  • a recess 126 on the upper side of the carrier ring 112 again ensures the correct installation position of the retaining ring in the polishing device.
  • the support ring 112 can be separated from the support ring 114 in a particularly simple manner and, in turn, no further preparatory work is necessary before a new support ring 114 is connected to the support ring 112.
  • FIGS. 7A to 7D show a further variant of a retaining ring 130 according to the invention with a carrier ring 132 and a support ring 134.
  • the idea of segmenting the carrier ring 132 is continued, as is already expressed in the embodiment of FIGS. 6A to 6D, and here there are a total of 12 segments 133 (cf. in particular the spatial representation in FIG. 7D together with the Carrier ring 132).
  • the receiving ring 134 is formed in one piece and has on its outer circumference 136 a circumferential slot 137 (see sectional view along line AA of FIG. 7A as shown in FIG. 7B) and on the side facing the polishing device at regular angular intervals from the outer circumference and in Recesses 138 continuous to the polishing device.
  • the carrier ring segments 133 are made of a flange part 139, which can be made of flat material, for example.
  • the flange part 139 On its surface facing the polishing device, the flange part 139 carries a threaded bush 140 which, when the flange part 139 is inserted into the ring slot 137, engages in the recesses 138 and is thus accessible from the polishing device for screwing the retaining ring 130 (FIG. 7C).
  • the flange parts 139 When the flange parts 139 are inserted into the ring slot 137 on the outer circumference 136 of the support ring 134, the flange parts 139 are pressed in, so that they are held in a press fit in the support ring 134.
  • An anti-rotation lock is automatically created here by the engagement of the threaded bushings 140 in the recesses 138, so that further anti-rotation lock measures are not necessary here.
  • the support ring 134 has a recess 142 into which a projection on the side of the polishing device (not shown) engages and thus ensures a clear positioning of the holding ring 130 in the polishing device ,
  • FIGS. 8A to 8D A further variant of a retaining ring 150 according to the invention with segmented carrier ring 152 is shown in FIGS. 8A to 8D.
  • the support ring 154 has a radially outwardly opening annular groove 158 in the region of a shoulder 156, while the carrier ring 152, which is formed from ring segments 153, carries a segment flange, which points radially inward, at its end facing the support surface.
  • this ring segment flange 160 engages in the annular groove 158 and is pressed in there.
  • the threaded bores 162 are made in the ring segments 153, just as a corresponding recess 164 is formed by the ring segments 153.
  • FIGS. 9A to 9D show a further variant of a retaining ring 170 according to the invention with a one-piece carrier ring 172 and a one-part receiving ring 174.
  • the carrier ring 172 is provided with a concentric annular groove 176, with an essentially axially parallel wall 178, which does this best 9B (sectional view along line AA of FIG. 9A) and the detailed illustration of FIG. 9C.
  • a threaded section 179 is machined into the axially parallel wall 178.
  • the support ring 174 has an annular rib 180 on its side facing the carrier ring side, which can also consist of ring segments. This means that the rib 180 need not be present over the entire circumference of 360 °, but can also be formed only in sections.
  • This rib 180 has on its inner, axially parallel wall an internally threaded section with which the bearing ring 174 can be screwed to the carrier ring 172.
  • the carrier ring 172 and the support ring 174 can be connected to one another in a non-positive and positive manner, and as a rule a non-rotatable connection can also be achieved by appropriately selecting the force or the torque with which the threaded connection is tightened at the end.
  • the non-rotatable connection between the carrier ring 172 and the support ring 174 can additionally be secured by using securing means as described in the context of FIG. 3D.
  • threaded bores 182 are again arranged at regular angular intervals, via which the retaining ring 170 can be mounted overall in the polishing device.
  • a recess 184 in which a corresponding projection on the part of the polishing device engages, in turn serves for correct orientation of the retaining ring during assembly in the polishing device.
  • FIG. 9E shows a sectional illustration of a development of the embodiment of FIGS. 9A to 9D.
  • carrier ring 172' and support ring 174 ' are screwed together, as is also the case with retaining ring 170 in FIGS. 9A to D.
  • the carrier ring 172' has an annular groove 176 'which has parallel threads in both radially spaced side walls which are aligned parallel to the axis of rotation of the ring. This means that the threads run radially in line with a common thread start 181 ', 182' in the radial direction and the same thread pitch.
  • the support ring 174 ' has an annular collar 180' which is complementary to the annular groove 176 'and has parallel threads 175', 177 'on its inner and on its outer side wall.
  • FIG. 9F shows this in a sectional view along line AA of FIG. 9E.
  • This embodiment offers an even better stabilizing connection between support ring 172 'and support ring 174' than is the case with retaining ring 170.
  • the support ring 174 ' is held very securely against tilting moments on the carrier ring 172'.
  • the retaining ring 170 ' is secured against rotation by the fact that when the support ring 174' is screwed into the support ring 172 ', a locking screw 183' is screwed in from the side of the support ring 172 'facing away from the support ring 174' and extends into a recess parallel to the axis of rotation of the ring 185 'in the support ring 174' is sufficient and thus prevents the screw connection between the support and support ring from unintentionally becoming loose.
  • a fuse can e.g. also use in the embodiment of Figures 9A to D.
  • FIGS. 10A to 10F show a further variant of a retaining ring 190 according to the invention, in which the positive and non-positive connection between a carrier ring 192 and a support ring 194 is likewise produced by means of a screw connection.
  • the carrier ring 192 is accommodated in a shoulder 198 which springs back from the outer circumference 196 and which has an axially parallel wall 199 with a threaded section 200 integrated therein.
  • the carrier ring 192 also has a threaded section on its inner, axially parallel surface, with which it can then be screwed to the support ring 194.
  • a non-positive and positive connection between the carrier ring 192 and the support ring 194 can be established via the screw connection, this connection generally being sufficiently rotationally fixed.
  • flowable, curable material can either be introduced into recesses, as shown in FIG. 3D, and this can be cured after assembly or, as in FIG 10D and 10E, the rotation of the support ring 194 relative to the carrier ring 192 is prevented with a locking pin or locking bolt.
  • a radially inserted pin 202 is provided, which both penetrates the carrier ring 192 in the radial direction and engages in the support ring 194.
  • FIG. 10E An alternative variant for this type of securing is shown in FIG. 10E, where, in an arrangement parallel to the axis, a securing bolt 204 is inserted into a bore jointly formed by a recess on the part of the carrier ring 192 and on the part of the support ring 194. In turn, threaded bores 206 are arranged on the carrier ring 192, by means of which retaining rings 190 can be fastened in the polishing device.
  • a recess 208 ensures the correct installation of the retaining ring 190 in the polishing device.
  • FIGS. HA to HD show a further variant of a retaining ring 210 according to the invention, which is formed from a carrier ring 212 and a support ring 214.
  • the carrier ring again has threaded bores 216 arranged at regular angular intervals on its surface facing the polishing device and a recess 218 via which a correct fit of the retaining ring 210 is ensured in the polishing device.
  • the carrier ring 212 and the support ring 214 lie opposite one another with two essentially parallel surfaces, one or more, in the present case three, concentric ring channels 221, 222, 223 being incorporated into the surface of the carrier ring 212 (see enlarged detail representation of the figure HC).
  • Grooves 224, 225 are arranged adjacent to the radially outer regions of the carrier ring 212, which are arranged annularly and concentrically and accommodate sealing elements 226, 227.
  • the ring channels 221, 222, 223 are in fluid communication with one another (not shown in detail).
  • the carrier ring 212 has a radial bore 228 which meets an axial bore 230 which leads from the surface of the carrier ring 212 facing away from the support ring 214 into at least one of the ring channels 221, 222 or 223.
  • a sealing plug 232 can be screwed into the axial bore 230, which is initially held in the bore 230 in only a few screwed-in state.
  • a vacuum can be applied via the radial bore 228 and the volume of the ring channels 221, 222, 223 can thus be evacuated. Due to the vacuum created in the ring channels, the support ring 214 is then easily held on the carrier ring 212.
  • the locking bolt 232 can then be screwed further into the bore 230, so that the radial bore 228 is closed. The vacuum in the ring channels 221, 222, 223 is thus maintained without further evacuation via the radial bore 228.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)

Abstract

L'invention concerne un anneau de fixation (10) destiné à la fixation de plaquettes en semiconducteurs dans un dispositif de polissage par voie chimique-mécanique. Cet anneau est, par rapport aux anneaux actuels, plus économique à produire et notamment plus économique à pourvoir d'un nouvel élément plastique. L'anneau de fixation (10) se monte dans un dispositif de polissage par voie chimique-mécanique destiné à des plaquettes en semiconducteurs et comprend un anneau support (12) réalisé dans un premier matériau et comportant des éléments de montage destinés au montage de l'anneau support (12) sur le dispositif de polissage; un anneau de recouvrement qui, réalisé en matériau plastique et placé de façon concentrique sur l'anneau support, repose sur la surface de polissage du dispositif de polissage par une première face frontale et qui, par sa face axialement opposée à la première face frontale, est maintenu par liaison de forme et/ou de force sur l'anneau support (12) sans colle, de manière amovible et bloqué en rotation. Le premier matériau a une rigidité supérieure à celle du matériau plastique de l'anneau de recouvrement.
EP03757898A 2002-10-02 2003-10-01 Anneau de fixation de plaquettes en semiconducteurs dans un dispositif de polissage par voie chimique-mecanique Withdrawn EP1545836A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10247179A DE10247179A1 (de) 2002-10-02 2002-10-02 Haltering zum Halten von Halbleiterwafern in einer chemisch-mechanischen Poliervorrichtung
DE10247179 2002-10-02
PCT/EP2003/010869 WO2004033151A1 (fr) 2002-10-02 2003-10-01 Anneau de fixation de plaquettes en semiconducteurs dans un dispositif de polissage par voie chimique-mecanique

Publications (1)

Publication Number Publication Date
EP1545836A1 true EP1545836A1 (fr) 2005-06-29

Family

ID=32010414

Family Applications (1)

Application Number Title Priority Date Filing Date
EP03757898A Withdrawn EP1545836A1 (fr) 2002-10-02 2003-10-01 Anneau de fixation de plaquettes en semiconducteurs dans un dispositif de polissage par voie chimique-mecanique

Country Status (9)

Country Link
US (1) US6913669B2 (fr)
EP (1) EP1545836A1 (fr)
JP (1) JP2006502016A (fr)
KR (1) KR20050067148A (fr)
CN (1) CN1694784A (fr)
AU (1) AU2003273931A1 (fr)
DE (1) DE10247179A1 (fr)
TW (1) TW200531782A (fr)
WO (1) WO2004033151A1 (fr)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040261945A1 (en) * 2002-10-02 2004-12-30 Ensinger Kunststofftechnoligie Gbr Retaining ring for holding semiconductor wafers in a chemical mechanical polishing apparatus
WO2004033152A1 (fr) * 2002-10-11 2004-04-22 Semplastics, L.L.C. Anneau de retenue s'utilisant sur un support de dispositif de polissage
TWM255104U (en) * 2003-02-05 2005-01-11 Applied Materials Inc Retaining ring with flange for chemical mechanical polishing
DE10311830A1 (de) * 2003-03-14 2004-09-23 Ensinger Kunststofftechnologie Gbr Abstandhalterprofil für Isolierglasscheiben
US6974371B2 (en) * 2003-04-30 2005-12-13 Applied Materials, Inc. Two part retaining ring
US20050005416A1 (en) * 2003-07-08 2005-01-13 Sather Alvin William Method for hardening the wear portion of a retaining ring
US7086939B2 (en) * 2004-03-19 2006-08-08 Saint-Gobain Performance Plastics Corporation Chemical mechanical polishing retaining ring with integral polymer backing
US7485028B2 (en) 2004-03-19 2009-02-03 Saint-Gobain Performance Plastics Corporation Chemical mechanical polishing retaining ring, apparatuses and methods incorporating same
DE102004062799A1 (de) * 2004-12-20 2006-06-29 Ensinger Kunststofftechnologie GbR (vertretungsberechtigter Gesellschafter Wilfried Ensinger, 71154 Nufringen) Kunststoffmaterial zur Herstellung von Halteringen
JP4814677B2 (ja) * 2006-03-31 2011-11-16 株式会社荏原製作所 基板保持装置および研磨装置
US7210991B1 (en) 2006-04-03 2007-05-01 Applied Materials, Inc. Detachable retaining ring
US7654888B2 (en) * 2006-11-22 2010-02-02 Applied Materials, Inc. Carrier head with retaining ring and carrier ring
KR100907899B1 (ko) * 2007-07-25 2009-07-15 주식회사 동부하이텍 가이드 링
JP5308213B2 (ja) 2009-03-31 2013-10-09 セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー 半導体装置の製造方法
KR200460150Y1 (ko) * 2009-06-15 2012-05-07 시너스(주) 화학기계적 연마장치용 리테이너 링 구조물
KR101938706B1 (ko) * 2012-06-05 2019-01-15 어플라이드 머티어리얼스, 인코포레이티드 인터로크 피쳐들을 갖는 2-파트 리테이닝 링
KR101328411B1 (ko) * 2012-11-05 2013-11-13 한상효 웨이퍼 연마용 리테이너 링 제조 방법
JP5821883B2 (ja) * 2013-03-22 2015-11-24 信越半導体株式会社 テンプレートアセンブリ及びテンプレートアセンブリの製造方法
CN105453234B (zh) * 2013-08-10 2018-11-02 应用材料公司 抛光新的或翻新的静电夹盘的方法
CN104416456A (zh) * 2013-08-20 2015-03-18 Cnus株式会社 化学机械抛光装置用扣环结构物
KR102323430B1 (ko) * 2014-03-31 2021-11-09 가부시키가이샤 에바라 세이사꾸쇼 연마 장치 및 연마 방법
US9368371B2 (en) 2014-04-22 2016-06-14 Applied Materials, Inc. Retaining ring having inner surfaces with facets
TWI656945B (zh) * 2015-05-25 2019-04-21 日商荏原製作所股份有限公司 研磨裝置、研磨頭、及保持環
US10500695B2 (en) * 2015-05-29 2019-12-10 Applied Materials, Inc. Retaining ring having inner surfaces with features
TWD179095S (zh) * 2015-08-25 2016-10-21 荏原製作所股份有限公司 基板保持環
JP6392193B2 (ja) * 2015-10-14 2018-09-19 株式会社荏原製作所 基板保持装置および基板研磨装置ならびに基板保持装置の製造方法
TW201725092A (zh) * 2016-01-14 2017-07-16 jian-zhong Sun 用於半導體晶圓化學機械研磨製程之研磨定位環
CN106826560A (zh) * 2016-11-21 2017-06-13 北京工商大学 一种柔轮磁流体磨削工装
CN108214278A (zh) * 2016-12-13 2018-06-29 台湾积体电路制造股份有限公司 固定环及抛光设备
EP3671368B1 (fr) * 2018-12-20 2022-11-23 The Swatch Group Research and Development Ltd Palier, notamment amortisseur de choc, et mobile tournant d'un mouvement horloger
JP1651623S (fr) * 2019-07-18 2020-01-27
JP7222844B2 (ja) * 2019-08-08 2023-02-15 キオクシア株式会社 研磨装置およびリテーナリング
USD940670S1 (en) * 2019-09-26 2022-01-11 Willbe S&T Co., Ltd. Retainer ring for chemical mechanical polishing device
KR102102131B1 (ko) * 2019-10-31 2020-04-20 주식회사 테크놀로지메이컬스 결합형 포커스 링
US11623321B2 (en) * 2020-10-14 2023-04-11 Applied Materials, Inc. Polishing head retaining ring tilting moment control
TWI791305B (zh) * 2021-10-18 2023-02-01 尚源股份有限公司 晶圓研磨嵌合結構

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4212137A (en) * 1978-07-20 1980-07-15 Norton Company Segmental grinding wheel and composite abrading segments therefor
US6024630A (en) * 1995-06-09 2000-02-15 Applied Materials, Inc. Fluid-pressure regulated wafer polishing head
US5643061A (en) * 1995-07-20 1997-07-01 Integrated Process Equipment Corporation Pneumatic polishing head for CMP apparatus
US5695392A (en) * 1995-08-09 1997-12-09 Speedfam Corporation Polishing device with improved handling of fluid polishing media
US6183354B1 (en) 1996-11-08 2001-02-06 Applied Materials, Inc. Carrier head with a flexible membrane for a chemical mechanical polishing system
US6030280A (en) * 1997-07-23 2000-02-29 Speedfam Corporation Apparatus for holding workpieces during lapping, honing, and polishing
US6068548A (en) * 1997-12-17 2000-05-30 Intel Corporation Mechanically stabilized retaining ring for chemical mechanical polishing
US5993302A (en) * 1997-12-31 1999-11-30 Applied Materials, Inc. Carrier head with a removable retaining ring for a chemical mechanical polishing apparatus
JP2917992B1 (ja) * 1998-04-10 1999-07-12 日本電気株式会社 研磨装置
US6390904B1 (en) * 1998-05-21 2002-05-21 Applied Materials, Inc. Retainers and non-abrasive liners used in chemical mechanical polishing
US6251215B1 (en) * 1998-06-03 2001-06-26 Applied Materials, Inc. Carrier head with a multilayer retaining ring for chemical mechanical polishing
DE19827308A1 (de) 1998-06-19 1999-12-30 Philipps Hans Joachim Einstellbares Befestigungsgrundelement
US6439984B1 (en) * 1998-09-16 2002-08-27 Entegris, Inc. Molded non-abrasive substrate carrier for use in polishing operations
US6390908B1 (en) * 1999-07-01 2002-05-21 Applied Materials, Inc. Determining when to replace a retaining ring used in substrate polishing operations
US6186880B1 (en) * 1999-09-29 2001-02-13 Semiconductor Equipment Technology Recyclable retaining ring assembly for a chemical mechanical polishing apparatus
JP2001121411A (ja) * 1999-10-29 2001-05-08 Applied Materials Inc ウェハー研磨装置
US6264540B1 (en) * 2000-03-30 2001-07-24 Speedfam-Ipec Corporation Method and apparatus for disposable bladder carrier assembly
US6354927B1 (en) * 2000-05-23 2002-03-12 Speedfam-Ipec Corporation Micro-adjustable wafer retaining apparatus
US6471566B1 (en) * 2000-09-18 2002-10-29 Lam Research Corporation Sacrificial retaining ring CMP system and methods for implementing the same
JP3627143B2 (ja) * 2000-10-23 2005-03-09 株式会社東京精密 ウェーハ研磨装置

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO2004033151A1 *

Also Published As

Publication number Publication date
WO2004033151A1 (fr) 2004-04-22
KR20050067148A (ko) 2005-06-30
JP2006502016A (ja) 2006-01-19
AU2003273931A1 (en) 2004-05-04
US6913669B2 (en) 2005-07-05
DE10247179A1 (de) 2004-04-15
TW200531782A (en) 2005-10-01
CN1694784A (zh) 2005-11-09
US20040065412A1 (en) 2004-04-08

Similar Documents

Publication Publication Date Title
EP1545836A1 (fr) Anneau de fixation de plaquettes en semiconducteurs dans un dispositif de polissage par voie chimique-mecanique
EP1549464B1 (fr) Anneau de fixation de plaquettes en semiconducteurs dans un dispositif de polissage par voie chimique-mecanique
DE60112336T3 (de) Radhalter für fahrzeuge mit scheibenbremsen
EP2461061A2 (fr) Outil de démontage pour le démontage d'une palier à roulement
EP3800375B1 (fr) Pièce de support de couronne dentée pour une roue dentée bi- ou multicomposant ainsi que roue dentée bi- ou multicomposant dotée d'une telle pièce de support de couronne dentée
DE102013105527B4 (de) Planetengetriebe eines Kraftfahrzeugaktuators
EP1233193A2 (fr) Tige à bague de serrage pour l'obtention d'une liaison mécanique solide de deux pièces ou plus rendue étanche par une masse de produit
EP2764260B1 (fr) Ensemble de raccordement pour un véhicule
EP2843135A1 (fr) Support interchangeable pour un rouleau de compactage et un rouleau compresseur
DE60111322T2 (de) Verriegelungsanordnung für sphärische Lager und Verrieglungsverfahren davon
EP3049232B1 (fr) Douille d'usure destinee à reçevoir des double-vis pour extruder de matière fusible
EP1782918B1 (fr) Dispositif de serrage pour une meule, meule et élément porteur d'une meule
EP0965729B1 (fr) Elément de verrouillage pour des aubes de turbine
DE2537449A1 (de) Ring aus voneinander loesbaren segmenten und verfahren zu dessen herstellung
WO2019105663A1 (fr) Entraînement à broche et actionneur d'un système de direction muni d'un entraînement à broche
DE10008606B4 (de) Kraftübertragungsmechanismus mit einem Sprengring zu dessen Montage
EP2646181A1 (fr) Disque de pression
DE202019105432U1 (de) Zahnkranzträgerteil für ein Zwei- oder Mehrkomponenten-Zahnrad sowie Zwei- oder Mehrkomponenten-Zahnrad mit einem derartigen Zahnkranzträgerteil
DE10046525A1 (de) Stützscheibe
EP3974680A1 (fr) Roue à composants multiples, pignon et train épicycloïdal
DE102019217959A1 (de) Exzenterachse mit Lagerhülsen und Verfahren zur Herstellung einer Exzenterachse
DE112017000296B4 (de) Radgeschwindigkeitssensorvorrichtung
DE102018208571B4 (de) Spindelantrieb und Aktuator einer Lenkung mit Spindelantrieb
WO2017167445A1 (fr) Dispositif d'étanchéité pour l'étanchéification de l'articulation à rotule d'un pivot de fusée
DE112018001786T5 (de) Angetriebenes Werkzeug

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20050217

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR

AX Request for extension of the european patent

Extension state: AL LT LV MK

DAX Request for extension of the european patent (deleted)
17Q First examination report despatched

Effective date: 20061030

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20100316