CN207883687U

CN207883687U - SOP-8 encapsulating leads

Info

Publication number: CN207883687U
Application number: CN201820172274.2U
Authority: CN
Inventors: 陈力
Original assignee: Fujian Fushun Semiconductor Manufacturing Co Ltd
Current assignee: Fujian Fushun Semiconductor Manufacturing Co Ltd
Priority date: 2018-02-01
Filing date: 2018-02-01
Publication date: 2018-09-18
Anticipated expiration: 2028-02-01

Abstract

The utility model discloses a kind of 8 encapsulating leads of SOP comprising chassis body, structural unit, encapsulation bar and encapsulation unit；It is provided with several structural units in the chassis body, and the encapsulation bar is provided between two structural units；The encapsulation unit is arranged on the structural unit, and Ji Dao, middle pin, interior pin and outer pin are provided on the encapsulation unit；The Ji Dao is connect by the middle pin with the chassis body；The Ji Dao is provided with technology groove close to the side of the middle pin.The utility model proposes 8 encapsulating leads of SOP can make the binding force bigger between frame and plastic packaging material, effectively prevent lamination, improve the reliability and product quality of integrated circuit.

Description

SOP-8 encapsulating leads

Technical field

The utility model is related to leadframe technologies fields, and in particular to a kind of SOP-8 encapsulating leads.

Background technology

Chip carrier of the lead frame as integrated circuit is that one kind realizing that chip internal circuits draw by means of bonding material The electrical connection of outlet and outer lead, forms the key structure part of electric loop, it plays the bridge connected with outer lead It acts on, is required for using lead frame in most semiconductor integrated blocks, lead frame is important in electronics and information industry Basic material.

On the one hand the process of encapsulation is electrical connection, be on the one hand to be formed to protect to chip.Mainly use plastic packaging material will Chip and lead frame package wherein, between material match credit union because the factors such as material property, structure cause interfacial failure, commonly referred to as For layering, layering will cause integrated circuit unqualified, and reduce the quality of integrated circuit, cause economic loss.

Utility model content

The main purpose of the utility model is to provide a kind of SOP-8 encapsulating leads, it is intended to solve collection caused by layering It is unqualified at circuit, the problem of reducing the quality of integrated circuit, cause economic loss.

To achieve the above object, the utility model proposes a kind of SOP-8 encapsulating leads comprising chassis body, Structural unit, encapsulation bar and encapsulation unit；Several structural units, and two knots are provided in the chassis body The encapsulation bar is provided between structure unit；The encapsulation unit is arranged on the structural unit, is set on the encapsulation unit It is equipped with Ji Dao, middle pin, interior pin and outer pin；The Ji Dao is connect by the middle pin with the chassis body； The Ji Dao is provided with technology groove close to the side of the middle pin.

Preferably, the technology groove is arc shaped groove.

Preferably, the groove depth of the technology groove is not more than 0.5mm.

Preferably, it is provided with semi-circular groove on the middle pin and the described one end of interior pin far from the Ji Dao.

Preferably, lock glue hole is provided on the interior pin, the lock glue hole is arranged in the groove close to the Ji Dao Side.

Preferably, the chassis body is rectangular.

Preferably, being arranged side by side in the chassis body has the 9 row structural unit, and includes 4 in the structural unit The encapsulation unit is arranged, the 4 row encapsulation units are divided into 2 groups, and every group is made of the 2 row encapsulation units, is encapsulated described in each column The number of unit is 12.

Preferably, the outer pin of two encapsulation units adjacent in same row intersects dislocation.

Preferably, the shape of the interior pin is L-type or T-type.

In the technical solution of the utility model, technology groove can make the combination of chip and plastic packaging material more secured, and can lock core Movement of the piece in plastic packaging material effectively prevents lamination to make the binding force bigger between chip and plastic packaging material, improves The reliability and product quality of integrated circuit.

Description of the drawings

In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only It is some embodiments of the utility model, for those of ordinary skill in the art, in the premise not made the creative labor Under, the structure that can also be shown according to these attached drawings obtains other attached drawings.

Fig. 1 is the SOP-8 packaging lead frame structure schematic diagrames of one embodiment of the utility model；

Fig. 2 is the enlarged drawing at Fig. 1 SOP-8 encapsulating leads I；

Fig. 3 is the enlarged drawing at Fig. 2 SOP-8 encapsulating leads II；

Fig. 4 is the structural schematic diagram of the encapsulation unit of the SOP-8 encapsulating leads of one embodiment of the utility model.

Drawing reference numeral explanation：

Label	Title	Label	Title
				1	Chassis body	43	Interior pin
2	Structural unit	44	Outer pin
				3	Encapsulation bar	45	Groove
4	Encapsulation unit	46	Technology groove
				41	Ji Dao	47	Lock glue hole
42	Middle pin

The embodiments will be further described with reference to the accompanying drawings for the realization, functional characteristics and advantage of the utility model aim.

Specific implementation mode

The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model Clearly and completely describing, it is clear that described embodiment is only a part of the embodiment of the utility model, rather than all Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are not making creative work premise Lower obtained every other embodiment, shall fall within the protection scope of the present invention.

It is to be appreciated that the directional instruction (such as up, down, left, right, before and after ...) of institute in the utility model embodiment It is only used for explaining relative position relation, the motion conditions etc. under a certain particular pose (as shown in the picture) between each component, such as When the fruit particular pose changes, then directionality instruction also correspondingly changes correspondingly.

In addition, the description for being such as related to " first ", " second " in the present invention is used for description purposes only, and cannot manage Solution is instruction or implies its relative importance or implicitly indicates the quantity of indicated technical characteristic.Define as a result, " the One ", the feature of " second " can explicitly or implicitly include at least one of the features.It is " more in the description of the present invention, It is a " it is meant that at least two, such as two, three etc., unless otherwise specifically defined.

In the present invention unless specifically defined or limited otherwise, term " connection ", " fixation " etc. should do broad sense reason Solution, for example, " fixation " may be a fixed connection, may be a detachable connection, or integral；It can be mechanical connection, also may be used To be electrical connection；It can be directly connected, can also can be indirectly connected through an intermediary the connection inside two elements Or the interaction relationship of two elements, unless otherwise restricted clearly.It for the ordinary skill in the art, can be with The concrete meaning of above-mentioned term in the present invention is understood as the case may be.

In addition, the technical solution between each embodiment of the utility model can be combined with each other, but must be with ability Domain those of ordinary skill can be implemented as basis, will be understood that when the combination of technical solution appearance is conflicting or cannot achieve The combination of this technical solution is not present, also not within the protection domain of the requires of the utility model.

The utility model proposes a kind of SOP-8 encapsulating leads.

Please refer to Fig. 1 to Fig. 4, in one embodiment of the utility model, SOP-8 encapsulating leads include chassis body 1, Structural unit 2, encapsulation bar 3 and encapsulation unit 4；Several structural units 2, and two are provided in the chassis body 1 The encapsulation bar 3 is provided between the structural unit 2；The encapsulation unit 4 is arranged on the structural unit 2, the envelope It is provided with base island 41, middle pin 42, interior pin 43 and outer pin 44 on dress unit 4；Drawn by the centre on the base island 41 Foot 42 is connect with the chassis body 1；The base island 41 is provided with technology groove 46 close to the side of the middle pin 42.

SOP-8 is a kind of small outline packages form, on encapsulation unit 4 tool there are two middle pin 42, the islands Ge Ji 41, 8 interior pins 43 and 8 outer pins 44 corresponding with 8 interior pins 43；Its base island 41 is rectangular, and 8 interior pins 43 divide At two groups, every group of 4 both sides for being evenly distributed on base island 41；Middle pin 42 is distributed in the other both sides on base island 41.This practicality In novel technical solution, the technology groove 46 being arranged on base island 41 firmly locks movement of the chip in plastic packaging material, to make core Binding force bigger between piece and plastic packaging material, effectively prevents lamination, improves the reliability and product matter of integrated circuit Amount.

The middle pin 42 and the interior pin 43 are provided with semi-circular groove on one end far from the base island 41 45, the semi-circular groove 45 that middle pin 42 and interior pin 43 are arranged on one end far from base island 41 can effectively prevent being molded In the process in moisture injection encapsulation unit 4, semi-circular groove 45 can reduce answering for during injection molding or rib cutting structural unit 2 Power concentration phenomenon improves the binding force between chip and plastic packaging material, effectively avoids lamination.Wherein, the depth of groove 45 is answered It is moderate, it is unsuitable it is too deep also should not be excessively shallow, the too deep strength reduction that can lead to chassis body 1 influences package quality；Cross shallow will reach not To the purpose for preventing injection moulding process moisture from injecting encapsulation unit 4.It is wide if the size of chassis body 1 is long 269.6 ± 0.102mm When degree is 83 ± 0.051mm, the depth of groove 45 is preferably 1.75mm.

The technology groove 46 is arc shaped groove, and the technology groove 46 of circular arc type avoids stress concentration phenomenon, can not only improve core The intensity of package main body also can be improved in binding force between piece and plastic packaging material.

Specifically, the groove depth of the technology groove 46 is not more than 0.5mm, and groove depth is too deep, can reduce between base island 41 and chip Contact area.

Further, lock glue hole 47 is provided on the interior pin 43, the setting of lock glue hole 47 is leaned in the groove 45 The side on the nearly base island 41, in injection moulding process, when plastic packaging material flows through interior pin 43, plastic packaging material passes through lock glue hole 47, waits coagulating Gu after, the plastic packaging material in lock glue hole 47 is equivalent to a pin on interior pin 43 so that interior pin 43 is firmly fixed on modeling In envelope material, the binding force between the intensity and interior pin 43 and plastic packaging material of interior pin 43 is improved.

The chassis body 1 is rectangular, and being arranged side by side in the chassis body 1 has the 9 row structural unit 2, and described The encapsulation unit 4 being arranged including the 4 row encapsulation units 4,4 in structural unit 2 and being divided into 2 groups, every group by the 2 row encapsulation units 4 are constituted, and the number of encapsulation unit 4 described in each column is 12, the outer pin 44 of two adjacent encapsulation units 4 in same row Intersect dislocation.4 outer pin 44 of encapsulation unit in rectangular chassis body 1 intersects dislocation, and totally 432 encapsulation units 4 are arranged in IDF matrix type structures shorten the spacing between encapsulation unit 4, and the arrangement mode of matrix form makes the arrangement of encapsulation unit 4 more Step up close, effectively raise the utilization rate of raw material, saved raw material, improves packaging efficiency and reduce and be produced into This.

It these are only the preferred embodiment of the utility model, it does not limit the scope of the patent of the present invention, every Under the design of the utility model, equivalent structure transformation made based on the specification and figures of the utility model, or directly/ Indirectly other related technical areas are used in be included in the scope of patent protection of the utility model.

Claims

1. a kind of SOP-8 encapsulating leads, which is characterized in that single including chassis body, structural unit, encapsulation bar and encapsulation Member；It is provided with several structural units in the chassis body, and the envelope is provided between two structural units Fill item；The encapsulation unit is arranged on the structural unit, and Ji Dao is provided on the encapsulation unit, middle pin, interior is drawn Foot and outer pin；The Ji Dao is connect by the middle pin with the chassis body；The Ji Dao draws close to the centre The side of foot is provided with technology groove.

2. SOP-8 encapsulating leads as described in claim 1, which is characterized in that the technology groove is arc shaped groove.

3. SOP-8 encapsulating leads as claimed in claim 2, which is characterized in that the groove depth of the technology groove is not more than 0.5mm。

4. SOP-8 encapsulating leads as described in claim 1, which is characterized in that the middle pin and the interior pin It is provided with semi-circular groove on one end far from the Ji Dao.

5. SOP-8 encapsulating leads as claimed in claim 4, which is characterized in that lock glue hole is provided on the interior pin, The lock glue hole is arranged in the groove close to the side of the Ji Dao.

6. SOP-8 encapsulating leads as described in any one in claim 1-5, which is characterized in that the chassis body is side Shape.

7. SOP-8 encapsulating leads as described in any one in claim 1-5, which is characterized in that in the chassis body simultaneously Row is provided with the 9 row structural unit, and includes the 4 row encapsulation units, the 4 row encapsulation unit point in the structural unit At 2 groups, every group is made of the 2 row encapsulation units, and the number of encapsulation unit described in each column is 12.

8. SOP-8 encapsulating leads as claimed in claim 7, which is characterized in that two adjacent envelopes in same row The outer pin for filling unit intersects dislocation.

9. SOP-8 encapsulating leads as described in any one in claim 1-5, which is characterized in that the shape of the interior pin For L-type or T-type.