CN207052570U - A kind of lead frame - Google Patents
A kind of lead frame Download PDFInfo
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- CN207052570U CN207052570U CN201720745187.7U CN201720745187U CN207052570U CN 207052570 U CN207052570 U CN 207052570U CN 201720745187 U CN201720745187 U CN 201720745187U CN 207052570 U CN207052570 U CN 207052570U
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Abstract
The utility model discloses the method and lead frame that a kind of lead frame improves encapsulation, product region and non-product region are separated on the lead frames, non-product region is located at the periphery of product region；The back side increase half-etching design of transitional region between product region and non-product region, the width of transitional region are more than the thickness of cutter；The injection region and the non-injection region of non-product region of non-product region are determined in non-product region, the injection region of non-product region is located between non-injection region and the product region of non-product region, and the front increase total eclipse in the injection region of non-product region and the non-injection region of non-product region is carved and half-etching design respectively；Product region includes multiple finished products, has dowel between adjacent finished product, in the increase half-etching design of the back side of dowel.The utility model is designed reasonably, reduce cutter loss, reduce clipping time, effectively improve cutter service life and the product competitive advantage between industry, reduce production cost.
Description
Technical field
It the utility model is related to leadframe technologies field, more particularly to a kind of lead frame.
Background technology
Chip carrier of the lead frame as integrated circuit, it is a kind of real by means of bonding material (spun gold, aluminium wire, copper wire)
The electrical connection of existing chip internal circuits exit and outer lead, the key structure part of electric loop is formed, it is served and outside
The function served as bridge of portion wire connection, it is required for use lead frame in most semiconductor integrated blocks, is that electronic information is produced
Important basic material in industry.
Fig. 1 is the lead frame single-sided structure schematic diagram of prior art, and multiple single encapsulation are arranged with lead frame 1 '
Finished product 2 '.After lead-frame packages in road finished product cutting process, the service life of rear road cutter, which is assessed, usually to be influenced whether
The price fluctuation of single encapsulating products, if the service life of cutter is shorter, the price of product is directly influenced, also has influence on production
The competitiveness of product in the industry.
Utility model content
Purpose of utility model：In order to solve the problems, such as that prior art is present, the use of lead frame product cutter is improved
Life-span, the utility model provide a kind of lead frame.
Technical scheme：A kind of lead frame, including product region and non-product region, the non-product region are located at finished product
The periphery in region, the product region are used to place finished product, there is transitional region, the mistake between product region and non-product region
It is half-etching to cross region, and the width of transitional region is more than the thickness of cutter；The non-product region includes non-product region
Region and the non-injection region of non-product region are molded, the injection region of non-product region is located at the non-injection area of non-product region
Between domain and product region, the front in the non-injection region of non-product region is half-etching, the injection region of non-product region
Front includes the full etching area of multiple rectangles；Product region includes multiple finished products, and finished product is used to place and connect finished product, it is adjacent into
There is dowel between product, the position of the dowel is cutter track, and the back side of the dowel is half-etching.
Preferably, the injection region of the non-product region is provided with the full etching area of multiple rectangles, the full etching area of rectangle
Including the full etching area of big rectangle and the full etching area of small rectangle, the part big full etching area of the rectangle extended line along dowel point
Cloth, the big full etching area of rectangle in part are centered around product region periphery；The small rectangle total eclipse carves area arrangement in transitional region
Side, the opposite side of transitional region is arranged with the pin of finished product, on the full etching area of small rectangle and finished product between adjacent leads
Gap is alignd.
Preferably, the length of the full etching area of small rectangle is the length of finished product pin, the small full etching area of rectangle
Width is the spacing of finished product pin.
Preferably, the half-etching thickness in the non-injection region of the non-product region is the 1/3 of leadframe thickness.
Preferably, the half-etching projected depth of the transitional region is the 1/2 of frame thickness；The half-etching of the dowel
Projected depth is the 1/2 of frame thickness.
Beneficial effect：A kind of lead frame provided by the utility model, half-etching area is designed in non-product region, due to
The position of the cutter track of non-product region adds half-etching, and the position of cutting is thinned needed for cutter, reduces
Loss, the technical parameter of product cutting action is improved, reduce cutter loss, reduce clipping time.Due to position is thinned
Symmetrically, it is and thinned highly moderate, substrate intensity itself will not be substantially reduced.
Dowel of the utility model between finished product is improved, due to adding auxiliary half-etching between finished product,
Metal is thinned at cutter track, reduces loss, further improves the technical parameter of product cutting action, reduces cutter damage
Consume, reduce clipping time.For thinned design size between product by calculating and assessing, the connection that will not reduce between product is strong
Degree.
Transitional region between product region and non-product region increases half-etching, and metal is thinned at cutter track,
Reduce loss, further improve the technical parameter of product cutting action, reduce cutter loss, reduce clipping time,
Non- product region carves design close to one side of transitional region increase total eclipse so that relative equilibrium at left and right sides of cutter track, enters
One step increases the service life of cutter.
The utility model is designed reasonably, reduce cutter loss, reduce clipping time, effectively improve cutter and use the longevity
Life and product competitive advantage between industry, reduce production cost.
Brief description of the drawings
Fig. 1 is the lead frame single-sided structure schematic diagram of prior art；
Fig. 2 is to improve the lead frame one side knot after the method encapsulated is improved by a kind of lead frame of the present utility model
Structure schematic diagram；
Fig. 3 is Fig. 2 close-up schematic view.
In figure：1 is lead frame；2 be product region；3 be non-product region；21 be finished product；22 be product region with it is non-
Transitional region between product region；31 be the injection region of non-product region；32 be the non-injection region of non-product region；
311 be the full etching area of big rectangle；312 be the full etching area of small rectangle；4 dowel between finished product；5 be chip pin pin.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the embodiment of the utility model is carried out
Clearly and completely describing, it is clear that described embodiment is only the utility model part of the embodiment, rather than whole
Embodiment.
S1：It is determined that lead frame 1 to be improved, separates product region 2 and non-product region 3 on lead frame 1, it is described
Non- product region 3 is located at the periphery of product region 2, and the product region 2 is used to place finished product；
S2：There is transitional region 22 between the product region 2 and non-product region 3, the back side of the transitional region 22 increases
Half-etching is added to design, transitional region 22 is cutter track, and the width of transitional region 22 needs the thickness more than cutter；
S3：Carved in non-product region 3 increase total eclipse and half-etching designs：Non- product region is determined in non-product region 3
Region 31 and the non-injection region 32 of non-product region are molded, the injection region 31 of the non-product region is located at non-product region
Non- injection region 32 and product region 2 between, the non-injection region 32 of non-product region front increase half-etching design,
Front increase total eclipse in the injection region 31 of non-product region carves design.The injection region 31 of the non-product region is disposed with
Multiple square injection blocks.The injection region 31 of the non-product region is provided with multiple big full etching areas 311 of rectangle, the big square in part
Extended line distribution of the full etching area 311 of shape along dowel, the big full etching area 311 of rectangle in part are centered around outside product region 2
Enclose；The injection region 31 of the non-product region is provided with multiple small full etching areas 312 of rectangle close to the edge of transitional region 22,
The full etching area 312 of small rectangle is arranged in the side of transitional region 22, and the opposite side of transitional region 22 is arranged with finished product
Pin 5, the small full etching area 312 of rectangle align with the gap of adjacent leads on finished product 5.The full etching area 312 of small rectangle
Length be finished product pin 5 length, the width of the small full etching area 312 of rectangle is the spacing of finished product pin pin 5 (pin).
S4：The product region 2 includes multiple finished products 21, has dowel 4 between adjacent finished product 21, the dowel 4
Position is cutter track (i.e. Cutting Road), in the increase half-etching design of the back side of the dowel 4.The finished product 21 is pros
Shape, the dowel 4 are cross-shaped.
A kind of lead frame is obtained according to the method, as shown in Figures 2 and 3, including product region 2 and non-product region 3, institute
The periphery that non-product region 3 is located at product region 2 is stated, the product region 2 is used to place finished product, product region 2 and non-finished product
There is transitional region 22 between region 3, the transitional region 22 is half-etching, and the half-etching width of transitional region 22 is more than cutter
Thickness；The non-product region 3 includes the injection region 31 and the non-injection region 32 of non-product region of non-product region, non-
The injection region 31 of product region is located between non-injection region 32 and the product region 2 of non-product region, non-product region
The front in non-injection region 32 is half-etching, and the front in the injection region 31 of non-product region includes the full etching region of multiple rectangles
Domain；Product region 2 includes multiple finished products 21, has dowel 4 between adjacent finished product 21, the position of the dowel 4 is cutter
Track, the back side of the dowel 4 is half-etching.
The full etching area of rectangle on the injection region 31 of the non-product region includes the full He of etching area 311 of big rectangle
The small full etching area 312 of rectangle, extended line distribution of the big full etching area 311 of rectangle in part along dowel 4, the big rectangle in part are complete
Etching area 311 is centered around the periphery of product region 2；The full etching area 312 of small rectangle is located at the edge of transitional region 22, institute
The side that the full etching area 311 of small rectangle is arranged in transitional region 22 is stated, the opposite side of transitional region 22 is arranged with drawing for finished product
Pin 5, the small full etching area 312 of rectangle align with the gap of adjacent leads on finished product 5.
The length of the full etching area 312 of small rectangle is the length of finished product pin 5, the small full etching area 312 of rectangle
Width is the spacing of finished product pin 5.
The non-injection region 32 of non-product region is designed as half-etching by the present embodiment, due to cutting the non-rail of product region 32
Road position adds half-etching, and the position of cutting is thinned needed for cutter, reduces loss, improves product cutting action
Technical parameter, reduce cutter loss, reduce clipping time.Due to position is thinned symmetrically, and it is thinned highly moderate,
Substrate intensity itself will not be substantially reduced；The half-etching design at transition region 22 and dowel 4 is added in product region 2,
Because finishing room connection adds auxiliary half-etching, metal is thinned at cutter track, reduces loss, further improves product
The technical parameter of cutting action, reduce cutter loss, reduce clipping time.Thinned design size between product is by calculating
And assessment, the bonding strength between product will not be reduced.
This leadframe design mainly for lead frame cutter losing quantity it is big the problem of, lead frame is improved,
Increase a large amount of positive half-etching designs in the non-injection region 32 of the non-product region of non-product region 3, control half-etching thickness
The intensity of lead frame is neither influenceed, reduces the resistance in cutting processing procedure again, adds the life-span of cutter, general control is non-
The leadframe thickness that the half-etching thickness in the non-injection region 32 of product region is 1/3 is optimal；The injection area of non-product region
Domain 31 increases the full etching area 312 of small rectangle, controls the full spacing of etching area 312 of small rectangle and size neither to influence lead frame
Intensity, reduce the resistance in cutting process again, make to balance as far as possible at left and right sides of transition region, add the life-span of cutter,
The length of the general small full etching area 312 of rectangle is the length of finished product pin 5, the width of the small full etching area 312 of rectangle be into
The spacing of product pin 5；Transitional region 22 between product region 2 and non-product region 3 increases half-etching and designed, between control design case
Away from the depth with size and control half-etching, the intensity for neither influenceing lead frame can be reached, reduced again in cutting process
Resistance, add life-spans of cutter, the spacing of half-etching herein is greater than the size of cutter, is generally located on 0.3mm,
Half-etching is deep-controlled in the 1/2 optimal of frame thickness, and described cutter are road finished product cutting process after lead-frame packages
The position of middle cutting；Dowel 4 between adjacent finished product 21 is cutter track and increase half-etching design, controls half-etching
Width and depth, the intensity for neither influenceing lead frame can be reached, reduce the resistance in cutting processing procedure again, add cutting
The life-span of knife, half-etching size herein for proof strength, reserve 0.02mm width no more than the position of pins of products
Degree, half-etching herein are deep-controlled in the 1/2 optimal of frame thickness.
It is described above, the only preferable embodiment of the utility model, but the scope of protection of the utility model is not
This is confined to, any one skilled in the art is in the technical scope that the utility model discloses, according to this practicality
New technical scheme and its utility model design are subject to equivalent substitution or change, should all cover in protection model of the present utility model
Within enclosing.
Claims (5)
1. a kind of lead frame, it is characterised in that including product region and non-product region, the non-product region is located at finished product
The periphery in region, the product region are used to place finished product, there is transitional region, the mistake between product region and non-product region
It is half-etching to cross region, and the width of transitional region is more than the thickness of cutter；The non-product region includes non-product region
Region and the non-injection region of non-product region are molded, the injection region of non-product region is located at the non-injection area of non-product region
Between domain and product region, the front in the non-injection region of non-product region is half-etching, the injection region of non-product region
Front includes the full etching area of multiple rectangles；Product region includes multiple finished products, has dowel, the connection between adjacent finished product
The position of muscle is cutter track, and the back side of the dowel is half-etching.
2. lead frame according to claim 1, it is characterised in that the injection region of the non-product region is provided with multiple
The full etching area of rectangle, the full etching area of rectangle include the full etching area of big rectangle and the full etching area of small rectangle, the big square in part
Extended line distribution of the full etching area of shape along dowel, the big full etching area of rectangle in part are centered around product region periphery；It is described
Small rectangle total eclipse carves area arrangement and is arranged with the pin of finished product, small rectangle in the side of transitional region, the opposite side of transitional region
Full etching area aligns with the gap of adjacent leads on finished product.
3. lead frame according to claim 2, it is characterised in that the length of the small full etching area of rectangle is finished product
The length of pin, the width of the small full etching area of rectangle are the spacing of finished product pin.
4. according to the lead frame described in claim 1 or 2 or 3, it is characterised in that the non-injection region of the non-product region
Half-etching thickness be leadframe thickness 1/3.
5. according to the lead frame described in claim 1 or 2 or 3, it is characterised in that the half-etching design of the transitional region is deep
Spend for the 1/2 of frame thickness；The half-etching projected depth of the dowel is the 1/2 of frame thickness.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720745187.7U CN207052570U (en) | 2017-06-20 | 2017-06-20 | A kind of lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720745187.7U CN207052570U (en) | 2017-06-20 | 2017-06-20 | A kind of lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207052570U true CN207052570U (en) | 2018-02-27 |
Family
ID=61494235
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720745187.7U Active CN207052570U (en) | 2017-06-20 | 2017-06-20 | A kind of lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207052570U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107369624A (en) * | 2017-06-20 | 2017-11-21 | 南京矽邦半导体有限公司 | A kind of lead frame improves the method and lead frame of encapsulation |
-
2017
- 2017-06-20 CN CN201720745187.7U patent/CN207052570U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107369624A (en) * | 2017-06-20 | 2017-11-21 | 南京矽邦半导体有限公司 | A kind of lead frame improves the method and lead frame of encapsulation |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Two-stage time effect process for copper alloy materials of lead frame Effective date of registration: 20190314 Granted publication date: 20180227 Pledgee: Bank of Nanjing Jiangbei District branch of Limited by Share Ltd Pledgor: NANJING MIRCOBONDING TECHNOLOGY CO., LTD. Registration number: 2019320000130 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20220518 Granted publication date: 20180227 Pledgee: Bank of Nanjing Jiangbei District branch of Limited by Share Ltd. Pledgor: NANJING MICROBONDING SEMICONDUCTOR CO.,LTD. Registration number: 2019320000130 |