CN105470233A - SOT223 lead frame and packaging scheme therefor - Google Patents
SOT223 lead frame and packaging scheme therefor Download PDFInfo
- Publication number
- CN105470233A CN105470233A CN201610017355.0A CN201610017355A CN105470233A CN 105470233 A CN105470233 A CN 105470233A CN 201610017355 A CN201610017355 A CN 201610017355A CN 105470233 A CN105470233 A CN 105470233A
- Authority
- CN
- China
- Prior art keywords
- sot223
- lead frame
- installation unit
- pin
- frame structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 12
- 239000004033 plastic Substances 0.000 claims abstract description 37
- 229920003023 plastic Polymers 0.000 claims abstract description 37
- 238000009434 installation Methods 0.000 claims description 60
- 239000005022 packaging material Substances 0.000 claims description 27
- 239000003292 glue Substances 0.000 claims description 12
- 238000005538 encapsulation Methods 0.000 claims description 9
- 150000001875 compounds Chemical class 0.000 abstract 3
- 238000002347 injection Methods 0.000 abstract 3
- 239000007924 injection Substances 0.000 abstract 3
- 238000000465 moulding Methods 0.000 abstract 3
- 238000001816 cooling Methods 0.000 abstract 2
- 238000010586 diagram Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 210000003205 muscle Anatomy 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 239000002699 waste material Substances 0.000 description 3
- 241000707825 Argyrosomus regius Species 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P80/00—Climate change mitigation technologies for sector-wide applications
- Y02P80/30—Reducing waste in manufacturing processes; Calculations of released waste quantities
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The invention discloses an SOT223 lead frame structure and a packaging scheme therefor. The SOT223 lead frame structure comprises a frame and a plurality of mounting units, wherein each mounting unit comprises a base island, cooling fins and a plurality of pins; the cooling fins are arranged at two opposite sides of the base island respectively; each pin comprises an inner pin and an outer pin; a glue-injection opening is formed in the side of each mounting unit; the plurality of mounting units are arranged on the frame in a manner of A rows and XB columns; two columns of mounting units are taken as a group; in the two columns of mounting units in the same group, the outer pins of the two mounting units in the same row are crosswise staggered with each other; and the SOT223 lead frame structure is not provided with a runner, so that the utilization rate of the frame and a molding compound can be improved. The glue-injection openings of all mounting units are arranged towards one side; the molding compound is injected into the glue-injection openings of the mounting units at the bottom end of the frame in plastic package; and the molding compound is sequentially filled into each mounting unit in the column.
Description
Technical field
The present invention relates to a kind of integrated circuit packaging lead framework, particularly relate to a kind of SOT223 lead frame and encapsulation scheme thereof.
Background technology
Chip package is the technology of a kind of plastics of being insulated by integrated circuit or ceramic material packing, not only play lay, fix, seal, the effect of protect IC and increased thermal conductivity energy, but also be the bridge of the communication chip internal world and external circuit.SOT223 lead frame structure is multiplex encapsulates the product such as triode and high power MOSFET, as shown in Figure 1, it comprises a framework 10 and is arranged at multiple installation units on framework 10 20 and runner 205, each installation unit 20 comprises base island 201, is arranged at fin 202 and the pin of two opposite sides, base island 201, pin comprises interior pin and outer pin 203, and the side of each installation unit 20 is provided with gum-injecting port 204.SOT223 lead frame structure traditional at present, two installation units 20 of adjacent two rows are complete matchings, fin and fin, outer pin and outer pin are in a straight line separately, space between the outer pin of adjacent like this two row's installation units 20 and outer pin has just been wasted, add runner 205 and also will take certain area, thus framework 10 utilance is lower; In addition, plastic packaging runner 205 is arranged on framework 10, the each each plastic packaging of runner 205 the right and left 1 product, namely the gum-injecting port 204 of each installation unit 20 is all towards the runner 205 of correspondence, during encapsulation, first in runner 205, inject plastic packaging material, the plastic packaging material then in runner 205 fills up installation unit 20 through both sides gum-injecting port 204, and the area shared by runner 205 can waste a part of plastic packaging material, thus cause plastic packaging material utilance lower.Along with encapsulation is more and more tending towards meagre profit, how effectively to utilize the raw material such as framework 10 and plastic packaging material, the key become and reduce packaging cost, improving product competitiveness.
Summary of the invention
The object of the present invention is to provide a kind of SOT223 lead frame structure and encapsulation scheme thereof, its utilization rate of raw materials is high.
For achieving the above object, the technical solution adopted in the present invention is:
A kind of SOT223 lead frame structure, comprise framework and be arranged at the multiple installation units on framework, each installation unit described includes Ji Dao, be arranged at the fin of described Ji Dao two opposite sides and multiple pin respectively, each pin described comprises interior pin and outer pin, the side of each installation unit described is provided with gum-injecting port, described SOT223 lead frame structure does not arrange runner, the mode that described multiple installation unit arranges XB row with A is arranged on said frame, and be one group with two row, in the two row installation units of same group, the setting of staggering intersected with each other of the outer pin of two installation units of same row, the gum-injecting port of all installation units is arranged towards side.
The other two opposite sides of the Ji Dao of each installation unit described are provided with a female locks glue groove, and described female locks glue groove and gum-injecting port are arranged on the same line.
Described female locks glue groove and gum-injecting port are arranged on the vertical position of framework, and described fin and pin are arranged on the lateral attitude of framework.
The interior pin of each installation unit described is set to bent angle shape.
An encapsulation scheme for SOT223 lead frame structure, during plastic packaging, the gum-injecting port toward the installation unit of framework lowermost end pours into plastic packaging material, and plastic packaging material fills each installation unit on these row successively, until the installation unit of this row distalmost end also fills full plastic packaging material.
Beneficial effect of the present invention is: the outer pin utilance that can improve framework arranged in a crossed manner, do not arrange the utilance that runner can improve framework further, but also can improve the utilance of plastic packaging material, thus raw-material utilance is high; And plastic packaging mode of the present invention can not need runner, and decrease plastic packaging material waste, thus improve plastic packaging material utilance, automated production can also be made to realize better.
Accompanying drawing explanation
Fig. 1 is traditional SOT223 lead frame structure schematic diagram;
Fig. 2 SOT223 lead frame structure of the present invention schematic diagram;
Fig. 3 is the single installation unit enlarged diagram of SOT223 lead frame structure of the present invention.
Embodiment
As Fig. 2, shown in 3, SOT223 lead frame structure of the present invention comprises framework 1 and is arranged at the multiple installation units 2 on framework 1, each installation unit 2 described includes base island 21, be arranged at the fin 22 of two opposite sides, described base island 21 and multiple pin 23 respectively, each pin 23 described comprises interior pin 231 and outer pin 232, the side of each installation unit 2 described is provided with gum-injecting port 24, described SOT223 lead frame structure does not arrange runner, the mode that described multiple installation unit 2 arranges XB row with A is arranged on described framework 1, and be one group with two row, in the two row installation units 2 of same group, outer pin 232 setting of staggering intersected with each other of two installation units 2 of same row, the gum-injecting port 24 of all installation units 2 is arranged towards side.
Specifically, in the two row installation units 2 of same group, wherein one of them arranging is defined as the first installation unit 2A, one of them of an other row correspondence position is defined as the second installation unit 2B, the 3rd outer pin B3 of the second installation unit 2B is between the first outer pin A1 and the second outer pin A2 of the first installation unit 2A, and the second outer pin B2 of the second installation unit 2B is between the second outer pin A2 and the 3rd outer pin A3 of the first installation unit 2A; The 3rd outer pin A3 of the first installation unit 2A is between the first outer pin B1 and the second outer pin B2 of the second installation unit 2B, and the second outer pin A2 of the first installation unit 2A is between the second outer pin B2 and the 3rd outer pin B3 of the second installation unit 2B.Outer pin 232 due to two relative installation units 2 intersects Heterogeneous Permutation, these two installation units 2 are also misplaced up and down, and then the row at these two installation unit 2 places also misplaces up and down.Adopt the structure that this outer pin 232 intersects, make the installation unit 2 that the framework 1 of same length can be arranged more multiple row, high several times of the SOT223 scheme that makes framework 1 density ratio of the present invention traditional, thus framework 1 utilance is high, and plastic packaging, cut muscle production efficiency and also can significantly improve.In addition, because framework of the present invention 1 does not arrange runner, thus saved the area that runner will take, so, saved part may be used for again settling installation unit 2, and so, the utilance of framework 1 of the present invention improves further.
Preferably, the other two opposite sides on the base island 21 of each installation unit 2 described are provided with a female locks glue groove 211, and described female locks glue groove 211 and gum-injecting port 24 are arranged on the same line.In the present embodiment, described female locks glue groove 211 is arranged on the vertical position of framework 1 with gum-injecting port 24, and described fin 22 is arranged on the lateral attitude of framework 1 with pin 23.
Preferably, the interior pin 231 of each installation unit 2 described is set to bent angle shape.
Encapsulate for SOT223 lead frame structure of the present invention, during plastic packaging, gum-injecting port 24 toward the installation unit 2 of framework 1 lowermost end pours into plastic packaging material, and plastic packaging material fills each installation unit 2 on these row successively, until the installation unit 2 of this row distalmost end also fills full plastic packaging material.Adopt this plastic packaging scheme, saved flow area, decrease plastic packaging material waste, thus improve plastic packaging material utilance, and automated production can be made to realize better.
Other steps of encapsulation as load, bonding, cut muscle etc. and can adopt known technology.
Because base island 21 is provided with and gum-injecting port 24 female locks glue groove 211 on the same line, thus when encapsulating, plastic packaging material can flow through this female locks glue groove 211, as this reduced resistance during plastic packaging material flowing, is conducive to the filling of plastic packaging material.And upper and lower plastic packaging material can be connected as a single entity through the plastic packaging material of female locks glue groove 211, increase the adhesion of plastic packaging material and framework 1, reduce risk of delamination, improve product package reliability; The interior pin 231 of bent angle shape can improve the adhesion of the rear pin 23 of encapsulation and plastic packaging material, and when preventing from cutting muscle, pin 23 pulls by applied force in plastic packaging material, further increases the package reliability of product.
Claims (5)
1. a SOT223 lead frame structure, comprise framework and be arranged at the multiple installation units on framework, each installation unit described includes Ji Dao, be arranged at the fin of described Ji Dao two opposite sides and multiple pin respectively, each pin described comprises interior pin and outer pin, the side of each installation unit described is provided with gum-injecting port, it is characterized in that: described SOT223 lead frame structure does not arrange runner, the mode that described multiple installation unit arranges XB row with A is arranged on said frame, and be one group with two row, in the two row installation units of same group, the setting of staggering intersected with each other of the outer pin of two installation units of same row, the gum-injecting port of all installation units is arranged towards side.
2. SOT223 lead frame structure according to claim 1, is characterized in that: the other two opposite sides of the Ji Dao of each installation unit described are provided with a female locks glue groove, and described female locks glue groove and gum-injecting port are arranged on the same line.
3. SOT223 lead frame structure according to claim 2, is characterized in that: described female locks glue groove and gum-injecting port are arranged on the vertical position of framework, and described fin and pin are arranged on the lateral attitude of framework.
4. the SOT223 lead frame structure according to claim 1 or 2 or 3, is characterized in that: the interior pin of each installation unit described is set to bent angle shape.
5. the encapsulation scheme of a SOT223 lead frame structure, it is characterized in that: during plastic packaging, gum-injecting port toward the installation unit of framework lowermost end pours into plastic packaging material, and plastic packaging material fills each installation unit on these row successively, until the installation unit of this row distalmost end also fills full plastic packaging material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610017355.0A CN105470233A (en) | 2016-01-12 | 2016-01-12 | SOT223 lead frame and packaging scheme therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610017355.0A CN105470233A (en) | 2016-01-12 | 2016-01-12 | SOT223 lead frame and packaging scheme therefor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105470233A true CN105470233A (en) | 2016-04-06 |
Family
ID=55607786
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610017355.0A Pending CN105470233A (en) | 2016-01-12 | 2016-01-12 | SOT223 lead frame and packaging scheme therefor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105470233A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109300873A (en) * | 2018-11-28 | 2019-02-01 | 铜陵中锐电子科技有限公司 | Pin staggered type multi-row lead frame frame suitable for TO252 |
| CN109935566A (en) * | 2019-03-29 | 2019-06-25 | 无锡红光微电子股份有限公司 | Modified SOT223 frame |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6316821B1 (en) * | 1998-09-28 | 2001-11-13 | Cypress Semiconductor Corporation | High density lead frames and methods for plastic injection molding |
| CN102903695A (en) * | 2012-10-30 | 2013-01-30 | 天水华天科技股份有限公司 | SOT223 matrix lead frame capable of increasing utilization ratio of materials |
| CN105161479A (en) * | 2015-08-24 | 2015-12-16 | 日月光封装测试(上海)有限公司 | Lead frame bar and semiconductor packaging method employing same |
| CN205488113U (en) * | 2016-01-12 | 2016-08-17 | 气派科技股份有限公司 | SOT223 frame construction that goes between |
-
2016
- 2016-01-12 CN CN201610017355.0A patent/CN105470233A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6316821B1 (en) * | 1998-09-28 | 2001-11-13 | Cypress Semiconductor Corporation | High density lead frames and methods for plastic injection molding |
| CN102903695A (en) * | 2012-10-30 | 2013-01-30 | 天水华天科技股份有限公司 | SOT223 matrix lead frame capable of increasing utilization ratio of materials |
| CN105161479A (en) * | 2015-08-24 | 2015-12-16 | 日月光封装测试(上海)有限公司 | Lead frame bar and semiconductor packaging method employing same |
| CN205488113U (en) * | 2016-01-12 | 2016-08-17 | 气派科技股份有限公司 | SOT223 frame construction that goes between |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109300873A (en) * | 2018-11-28 | 2019-02-01 | 铜陵中锐电子科技有限公司 | Pin staggered type multi-row lead frame frame suitable for TO252 |
| CN109935566A (en) * | 2019-03-29 | 2019-06-25 | 无锡红光微电子股份有限公司 | Modified SOT223 frame |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160406 |
|
| RJ01 | Rejection of invention patent application after publication |