CN209526084U - A kind of modified SOT223 frame - Google Patents
A kind of modified SOT223 frame Download PDFInfo
- Publication number
- CN209526084U CN209526084U CN201920418693.4U CN201920418693U CN209526084U CN 209526084 U CN209526084 U CN 209526084U CN 201920418693 U CN201920418693 U CN 201920418693U CN 209526084 U CN209526084 U CN 209526084U
- Authority
- CN
- China
- Prior art keywords
- pin
- dao
- sot223
- plastic packaging
- packaging material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
A kind of modified SOT223 frame, its binding force that base island pin and plastic packaging material can be improved, reduce the layering between frame and plastic packaging material, can avoid properties of product reduces, and guarantees product quality comprising Ji Dao, pin, the periphery setting of the Ji Dao is fluted, through-hole is provided on the pin, the Ji Dao, pin are encapsulated by plastic packaging material, and the plastic packaging material is filled in the groove, through-hole.
Description
Technical field
The utility model relates to integrated antenna package technical field, specially a kind of modified SOT223 frame.
Background technique
With the raising and chip manufacture work of the portable small-sized digital electronic goods demand such as mobile phone, laptop
Skill is constantly progressive, and IC Chip Production enters mass-production stage, make integrated circuit towards small size, high stability,
High quality direction is developed, and the problem of those skilled in the art increasingly pay close attention to is become.Integrated circuit mainly by bonding wire frame, chip and
Plastic-sealed body constitute, by plastic-sealed body by bonding wire frame, chip package together, currently used bonding wire frame includes SOT223 frame
Frame, but existing SOT223 frame base island is bigger, as shown in Figure 1, in bonding, the knot of pin and plastic packaging material on Ji Dao
Resultant force degree is poor, by external environment influence, is easily layered between frame and plastic packaging material, reduces so as to cause properties of product, is of poor quality
The problems such as occur.
Utility model content
For the pin on Ji Dao existing in the prior art and plastic packaging material combination dynamics is poor, between frame and plastic packaging material
Easily layering, leads to problems such as properties of product low, of poor quality, the utility model provides a kind of modified SOT223 frame, can
The binding force of base island pin and plastic packaging material is improved, the layering between frame and plastic packaging material is reduced, can avoid properties of product reduces, and protects
Demonstrate,prove product quality.
A kind of modified SOT223 frame comprising Ji Dao, pin, it is characterised in that: the periphery of the Ji Dao is provided with
Groove is provided with through-hole on the pin, and the Ji Dao, pin are packaged as a whole with plastic packaging material, are filled in the groove, through-hole
The plastic packaging material.
It is further characterized by the pin includes at least three, and respectively the first pin, second pin, third is drawn
Foot, first pin, third pin are respectively arranged in the two sides of the Ji Dao, the side of first pin, third pin
Arrangement corresponding with the two sides of the Ji Dao respectively, is provided with gap between first pin, third pin and the base island,
The second pin is arranged between first pin, third pin and connects and composes one with the side of the Ji Dao；
First pin, second pin have the through-hole on third pin；
The two sides of the Ji Dao corresponding with first pin, third pin side have the groove；
The groove is arc surface shape, and the through-hole is circle；
The plastic packaging material is filled in the through-hole respectively, forms cylinder in groove；
Chip is installed, the pad on the chip is connect by bonding wire with pin on the Ji Dao；
The Ji Dao, pin material be copper, the electroplate of the Ji Dao, pin；
The material of the plastic packaging material is epoxy resin；
The model of the chip are as follows: BL1117-3.3, the bonding wire include the six roots of sensation, respectively the first bonding wire to the 6th weldering
Line, first bonding wire are connect with first pin, second bonding wire, third bonding wire, the 4th bonding wire respectively with the base
Island connection, the 5th bonding wire, the 6th bonding wire are connect with the third pin respectively.
Using the above structure of the utility model, the periphery of Ji Dao is provided with groove, when encapsulating base island using plastic packaging material, plastic packaging
Material, which is filled in groove, forms cylinder, and cylinder can prevent Ji Dao from being shaken by external environment influence, to enhance plastic packaging
The binding force on the island Liao Yuji similarly opens hole on pin, and plastic packaging material, which is filled in through-hole, forms cylinder, and cylinder can prevent from drawing
Foot is shaken by external environment influence, i.e., by the plastic-sealed body locking of plastic packaging material and plastic packaging material composition in through-hole, thus
Enhance the binding force of plastic packaging material and pin；And it the cylinder that is formed while being played to Ji Dao and pin after groove and through-hole filling
Supporting role on vertical plane reduces the layering between Ji Dao, pin and plastic packaging material, significantly so as to avoid product
Reduced performance ensure that product quality and reliability.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the vertical view of existing SOT223 frame；
Fig. 2 is the structural schematic diagram of the utility model main view；
Fig. 3 is the structural schematic diagram that the utility model passes through that chip is connect by bonding wire with pin；
Fig. 4 is the structural schematic diagram after the utility model is encapsulated by plastic packaging material.
Specific embodiment
See Fig. 2 to Fig. 4, a kind of modified SOT223 frame comprising base island 1, pin 2, base island 1, the material of pin 2 are equal
For copper, base island 1, pin 2 electroplate；Pin 2 includes at least three, respectively the first pin 21, second pin 22, third
Pin 23, the first pin 21, third pin 23 are respectively arranged in the two sides on base island 1, the side of the first pin 21, third pin 23
Arrangement corresponding with the two sides on base island 1 respectively, is provided with gap 25 between the first pin 21, third pin 23 and base island 1, and first
Pin 21, third pin 23 using the vertical centerline on base island 1 as axial symmetry arrange, second pin 22 be arranged in the first pin 21,
Connect and compose one between third pin 23 with the side on base island 1, the first pin 21, second pin 22, on third pin 23 point
It is not provided with through-hole 4, through-hole 4 is circle；
The two sides on base island 1 corresponding with the first pin 21,22 side of second pin have four grooves 3, groove 3
For arc surface shape；
Base island 1, the first pin 21, second pin 22, third pin 23 are surrounded and are fixed by plastic packaging material 6, the material of plastic packaging material 6
Material is epoxy resin, and plastic packaging material 6 is filled in groove 3, through-hole 4, and plastic packaging material 6, which is filled in through-hole 4, forms cylinder, plastic packaging material 6
It is filled in groove 3 and forms cylinder；Upper bonding die glue is put on base island 1, after chip 7 is installed, chip 7 passes through the island bonding die Jiao Yuji 1
Fixed, the pad on chip 7 is connect with the first pin 21, second pin 22, third pin 23 respectively by bonding wire 5；
The model of chip in the present embodiment are as follows: BL1117-3.3, bonding wire 5 include the six roots of sensation, respectively the first bonding wire 51 to the
Six bonding wires 56, the first bonding wire 51 are connect with the first pin 21, the second bonding wire 52, third bonding wire 53, the 4th bonding wire 54 respectively with base
Island 1 connects, because base island 1 and second pin 22 connect and compose one, therefore the second bonding wire 52, third bonding wire 53, the 4th bonding wire 54
It is connect respectively with second pin 22, the 5th bonding wire 55, the 6th bonding wire 56 are connect with third pin 23 respectively；
The utility model reduces the lateral distance on base island 1, and the distance between base island 1 and pin 2 are constant, in the prior art
The lateral distance on base island 1 is L, and the lateral distance for shortening the island Hou Ji 1 is l, and L is 3.7mm, l 2.2mm, the in the present embodiment
One pin 21, third pin 23 are constant at a distance from base island 1, so as to shorten the distance of bonding wire, solve the hidden of bonding wire deformation
Suffer from, while reducing the dosage of bonding wire, improves processing efficiency.
Its working principle is as described below: during being packaged to the improved SOT223 frame, in SOT223 frame
On the island Jia Ji 1 put bonding die glue, chip 7 is bonded on base island 1, pad is provided on chip 7, by bonding wire 5 by chip 7 with
Each pin 2 connects, and rear entirety is put into moulding press grinding tool, and high temperature injects plastic packaging material 6, base island 1, the upper chip 7 of Ji Dao, pin
2, it is surrounded, while plastic packaging material 6 is filled in groove 3, in through-hole 4, constitutes packaging part, it then will be whole by the modes such as blow a cold wind over
A packaging part is cooling, and plastic packaging material 6 is respectively formed cylinder in groove 3, through-hole 4, makes to be formed between frame and plastic packaging material 6 effective
Anti- traction structure greatly reduces the layering situation of packaging part；Frame after plastic packaging is put into the ultrasonic scanner (U.S.
SONOSCAN company) whether detection plastic packaging has gas hole in the process, to detect the delamination of packaging part, pass through detection, this envelope
Assembling structure tool is well bonded, and effectively prevents the layering for the plastic-sealed body that base island 1, pin 2, chip 7 and plastic packaging material 6 are constituted
Situation.
Claims (8)
1. a kind of modified SOT223 frame comprising Ji Dao, pin, it is characterised in that: the periphery of the Ji Dao is provided with recessed
Slot is provided with through-hole on the pin, and the Ji Dao, pin are packaged as a whole with plastic packaging material, are filled in the groove, through-hole
State plastic packaging material.
2. a kind of modified SOT223 frame according to claim 1, which is characterized in that the pin includes at least three
A, respectively the first pin, second pin, third pin, first pin, third pin are respectively arranged in the Ji Dao's
Two sides, first pin, third pin side respectively it is corresponding with the two sides of the Ji Dao arrangement, first pin,
Gap is provided between third pin and the base island, the second pin is arranged between first pin, third pin
One is connected and composed with the side of the Ji Dao.
3. a kind of modified SOT223 frame according to claim 2, which is characterized in that first pin, second are drawn
The through-hole is had on foot, third pin.
4. a kind of modified SOT223 frame according to claim 3, which is characterized in that with first pin, third
The two sides of the corresponding Ji Dao in pin side have the groove.
5. according to claim 1 or a kind of 4 described in any item modified SOT223 frames, which is characterized in that the groove is
Arc surface shape, the through-hole are circle.
6. a kind of modified SOT223 frame according to claim 5, which is characterized in that the plastic packaging material is filled in respectively
Cylinder is formed in the through-hole, groove.
7. a kind of modified SOT223 frame according to claim 6, which is characterized in that be equipped with core on the Ji Dao
Piece, the pad on the chip are connect by bonding wire with pin.
8. according to claim 1 or a kind of 7 described in any item modified SOT223 frames, which is characterized in that the plastic packaging material
Material be epoxy resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920418693.4U CN209526084U (en) | 2019-03-29 | 2019-03-29 | A kind of modified SOT223 frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920418693.4U CN209526084U (en) | 2019-03-29 | 2019-03-29 | A kind of modified SOT223 frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209526084U true CN209526084U (en) | 2019-10-22 |
Family
ID=68231945
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920418693.4U Active CN209526084U (en) | 2019-03-29 | 2019-03-29 | A kind of modified SOT223 frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209526084U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109935566A (en) * | 2019-03-29 | 2019-06-25 | 无锡红光微电子股份有限公司 | Modified SOT223 frame |
-
2019
- 2019-03-29 CN CN201920418693.4U patent/CN209526084U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109935566A (en) * | 2019-03-29 | 2019-06-25 | 无锡红光微电子股份有限公司 | Modified SOT223 frame |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110429075A (en) | The exposed encapsulating structure of the more lateral leads of high density and its production method | |
| CN209526084U (en) | A kind of modified SOT223 frame | |
| CN210182373U (en) | Double-base-island multi-chip multi-process packaging structure | |
| CN109935566A (en) | Modified SOT223 frame | |
| CN102437134B (en) | Ultra-small packing body and production method thereof | |
| CN102074517B (en) | Ball grid array (BGA) package structure | |
| CN201315319Y (en) | Multichip 3D stacked encapsulating structure | |
| CN209544315U (en) | A kind of biradical island packaging frame of ESOP8 | |
| CN207637785U (en) | Novel high-frequency microwave high power limiter welding assembly structure | |
| CN201229941Y (en) | Lead wire frame for transistor | |
| CN100481407C (en) | Pin ball grid array encapsulation structure of wafer | |
| CN109979892A (en) | The biradical island packaging frame of ESOP8 | |
| CN103021882A (en) | Flat package part manufacture process based on grinding plastic package body | |
| CN103021883A (en) | Flat package part manufacturing process based on corrosion plastic package body | |
| CN201732781U (en) | Lead frame | |
| CN102738009A (en) | Manufacturing process of flat packaging piece of AAQFN framework product based on brushing | |
| CN207217480U (en) | A kind of more row high-density lead frame bonding tools | |
| CN201282143Y (en) | Packaging structure for chip integrated circuit | |
| CN212967685U (en) | Novel DFN packaging structure | |
| CN201838575U (en) | Flipchip thin-small outline packaged lead frame and package structure thereof | |
| CN202423267U (en) | Lead frame | |
| CN201345362Y (en) | Lead wire frame | |
| CN103400811A (en) | Frame based flat packaging part adopting special dispensing technology and manufacturing process thereof | |
| CN203481210U (en) | Flat packaging piece employing dispensing technology based on framework | |
| CN201845764U (en) | Lead frame packaged by flip-chip small outline integrated circuit and packaging structure thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |