CN207217519U - A kind of encapsulating lead - Google Patents
A kind of encapsulating lead Download PDFInfo
- Publication number
- CN207217519U CN207217519U CN201721294857.4U CN201721294857U CN207217519U CN 207217519 U CN207217519 U CN 207217519U CN 201721294857 U CN201721294857 U CN 201721294857U CN 207217519 U CN207217519 U CN 207217519U
- Authority
- CN
- China
- Prior art keywords
- dao
- plastic packaging
- lockhole
- packaging material
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Package Frames And Binding Bands (AREA)
Abstract
The utility model discloses a kind of encapsulating lead, its drip irrigation device includes pin and Ji Dao, the Ji Dao is provided with chip, the Ji Dao and chip are provided with the plastic packaging material of parcel Ji Dao and chip, it is fixed on the pin on plastic packaging material, the Ji Dao is provided with lockhole, and the reinforced hole communicated with lockhole is provided with the base island.The utility model has the effect for strengthening encapsulation fastness.
Description
Technical field
A kind of field of semiconductor devices is the utility model is related to, more specifically it is related to a kind of encapsulating lead.
Background technology
SOP8 encapsulation is a kind of small paster type form popularized very much, and it is general by current semiconductor die package institute
All over use.Traditional SOP-8L lead frames include eight outer pins, eight interior pins and two loads for being used to carry chip
Body.On the one hand the process of encapsulation is electrical connection, be on the one hand that chip is formed to protect.Protection mainly uses plastic packaging material by core
Piece, framework parcel wherein, with credit union because the factors such as material property, structure cause interfacial failure between material, commonly referred to as " divide
Layer ", and framework, plastic packaging material are as main encapsulating material, the direction of cooperation always package reliability research between the two.
In the prior art, Authorization Notice No. is a CN204424316U Chinese patent document, discloses a kind of big work(
The SOP8 encapsulating leads of rate LED drive chip, including pin, side connect muscle, the first Ji Dao and the second Ji Dao, expand first
Ji Dao loaded area, there is the effect of perfect heat-dissipating, but this encapsulating lead, after having encapsulated, adhesion is relative
Than difference, easily it is layered in actual use, causes damage of product.
Utility model content
In view of the deficienciess of the prior art, the purpose of this utility model is to provide a kind of encapsulating lead, have
Strengthen the effect of encapsulation fastness.
To achieve the above object, the utility model provides following technical scheme：A kind of encapsulating lead, including pin
And Ji Dao, the Ji Dao are provided with chip, the Ji Dao and chip are provided with the plastic packaging material of parcel Ji Dao and chip, the pin
On be fixed on plastic packaging material, the Ji Dao is provided with lockhole, and the reinforced hole communicated with lockhole is provided with the base island.
By using above-mentioned technical proposal, lockhole be arranged on plastic packaging material solidification after, plastic packaging material by lockhole integrally generate,
The fastness between reinforcement plastic packaging material and base island is served, is provided with base island and is solidifying with lockhole reinforcement by connection hole, plastic packaging material
When, a part of plastic packaging material solidifies in reinforced hole, and when plastic packaging material curing molding, plastic packaging material and Ji Dao contact area increase
Greatly so that more firm between plastic packaging material and base island.
The utility model is further arranged to：The reinforced hole is in flat setting, and the reinforced hole surround lockhole one week.
By using above-mentioned technical proposal, the flat setting of reinforced hole and reinforced hole communicates with lockhole, when plastic packaging material is by vertical
During power in the horizontal direction of Zhi Yuji islands, the lifting surface area of plastic packaging material and Ji Dao in reinforced hole is maximum, has not only acted as protection
Ji Dao effect, also enhance the fastness between Ji Dao and plastic packaging material.
The utility model is further arranged to：Multiple perforation through reinforced hole are provided with the base island.
By using above-mentioned technical proposal, multiple perforation cause plastic packaging material after hardening through the setting of reinforced hole, one
The plastic packaging material divided improves the fastness between substrate and plastic packaging material by perforation, reinforced hole and lockhole.
The utility model is further arranged to：The lockhole is less than lockhole in the middle part of base island in the opening of base island upper and lower ends
Opening position, the lockhole is in spherical.
By using above-mentioned technical proposal, the diameter in the middle part of plastic packaging material solidification Hou Ji islands is more than base island upper and lower ends lockhole
Opening diameter, the plastic packaging material in base island is more firm.
The utility model is further arranged to：Elargol layer is provided between the Ji Dao and chip.
By using above-mentioned technical proposal, elargol layer has heat-insulated and radiating effect, plays a part of protecting chip
The utility model is further arranged to：One end that the pin is fixed in plastic packaging material is provided with lockhole.
By using above-mentioned technical proposal, the fastness between pin and plastic packaging material is improved so that pin is unlikely to deform.
In summary, the setting of the lockhole and reinforced hole in this city embodiment, which serves, reinforces between plastic packaging material and base island
Fastness effect, Ji Dao is provided with the perforation through Ji Dao and reinforced hole, after plastic packaging material fixation, a part of plastic packaging material
Integrally generated by perforation, reinforced hole and lockhole, further strengthen the fastness between plastic packaging material and base island.
Brief description of the drawings
Fig. 1 is the overall schematic of the present embodiment；
Fig. 2 is the partial cutaway schematic of the present embodiment.
Description of reference numerals：1st, plastic packaging material；2nd, pin；3rd, Ji Dao；4th, chip；5th, elargol layer；6th, bonding wire；7th, lockhole；8、
Reinforced hole；9th, perforate.
Embodiment
The utility model is described in further detail below in conjunction with accompanying drawing.
Present embodiment discloses a kind of encapsulating lead, as shown in figure 1, including plastic packaging material 1, and the two of the plastic packaging material 1
Side is respectively and fixedly provided with four pins 2.
As shown in Fig. 2 being provided with base island 3 in plastic packaging material 1, chip 4 is housed on base island 3, and be provided between base island 3 and chip 4
Elargol layer 5, the elargol layer 5 play heat-insulated and radiating effect, connected between chip 4 and pin 2 by bonding wire 6, plastic packaging material 1 wraps
The one end on Guo Ji islands 3, chip 4 and pin 2.
As shown in Fig. 2 being provided with lockhole 7 on base island 3, the lockhole 7 is less than lockhole 7 in base in the opening of the upper and lower ends of base island 3
The opening position at the middle part of island 3, and the lockhole 7 hollows out in spherical, after plastic packaging solidifies, plastic packaging material 1 is connected by lockhole about 7, is made
More firmly, lockhole 7 is in spherical to plastic packaging material 1 of the get Ji islands about 3, after the solidification of the plastic packaging of plastic packaging material 1, the plastic packaging at lockhole 7
Material 1 contacts with the upper and lower ends of base island 3, and the diameter of plastic packaging material 1 positioned at the middle part of lockhole 7 be more than lockhole about 7 two be open it is straight
Footpath so that plastic packaging material 1 is more stable in base island 3.
As shown in Fig. 2 being provided with the reinforced hole 8 communicated with lockhole 7 in base island 3, the reinforced hole 8 encloses around lockhole 7 one and in flat
It is flat to set, when plastic packaging material 1 solidifies, increase the contact area of plastic packaging material 1 and base island 3 so that between base island 3 and plastic packaging material 1 more
Add firmly；Multiple perforation 9 through reinforced hole 8 are also provided with base island 3, and the perforation 9 runs through whole base island 3, when plastic packaging material 1 is solid
After change, there is plastic packaging material 1 to be connected in perforation 9, reinforced hole 8 and lockhole 7, progressive one strengthens between base island 3 and plastic packaging material 1
Fastness.
As shown in Fig. 2 being provided with lockhole 7 on one end that eight pins 2 are fixed in plastic packaging material 1, pin 2 and modeling are strengthened
Fastness between envelope material 1 so that pin 2 is not susceptible to deformation.
Preferred embodiment of the present utility model is the foregoing is only, is not limited to the utility model, it is all in this practicality
Within new design concept, any modification, equivalent substitution and improvements made etc., protection of the present utility model should be included in
Within the scope of.
Claims (6)
1. a kind of encapsulating lead, including pin (2) and Ji Dao (3), it is characterised in that：The Ji Dao (3) is provided with chip
(4), the Ji Dao (3) and chip (4) are provided with the plastic packaging material (1) of parcel Ji Dao (3) and chip (4), consolidate on the pin (2)
It is scheduled on plastic packaging material (1), the Ji Dao (3) is provided with lockhole (7), and the reinforcing communicated with lockhole (7) is provided with the Ji Dao (3)
Hole (8).
A kind of 2. encapsulating lead according to claim 1, it is characterised in that：The reinforced hole (8) is in flat setting,
The reinforced hole (8) is around lockhole（7）One week.
A kind of 3. encapsulating lead according to claim 2, it is characterised in that：Multiple wear is provided with the Ji Dao (3)
Cross the perforation (9) of reinforced hole (8).
A kind of 4. encapsulating lead according to claim 1, it is characterised in that：The lockhole (7) in Ji Dao (3) up and down
The opening at both ends is less than opening position of the lockhole (7) in the middle part of Ji Dao (3), and the lockhole (7) is in spherical.
A kind of 5. encapsulating lead according to claim 1, it is characterised in that：Between the Ji Dao (3) and chip (4)
Provided with elargol layer (5).
A kind of 6. encapsulating lead according to claim 1, it is characterised in that：The pin (2) is fixed on plastic packaging material
(1) one end in is provided with lockhole (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721294857.4U CN207217519U (en) | 2017-10-09 | 2017-10-09 | A kind of encapsulating lead |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721294857.4U CN207217519U (en) | 2017-10-09 | 2017-10-09 | A kind of encapsulating lead |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207217519U true CN207217519U (en) | 2018-04-10 |
Family
ID=61820575
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721294857.4U Expired - Fee Related CN207217519U (en) | 2017-10-09 | 2017-10-09 | A kind of encapsulating lead |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207217519U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110556343A (en) * | 2019-10-11 | 2019-12-10 | 合肥矽迈微电子科技有限公司 | Packaging structure and packaging process for preventing layering |
-
2017
- 2017-10-09 CN CN201721294857.4U patent/CN207217519U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110556343A (en) * | 2019-10-11 | 2019-12-10 | 合肥矽迈微电子科技有限公司 | Packaging structure and packaging process for preventing layering |
| CN110556343B (en) * | 2019-10-11 | 2024-04-12 | 合肥矽迈微电子科技有限公司 | Packaging structure and packaging process for preventing layering |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180410 Termination date: 20191009 |