CN1904676A - Laser repairing device - Google Patents

Abstract

The invention provides a laser repairing apparatus which can accurately and quickly carry out a laser repairing treatment. A CCD camera 11 produces image information by picking-up the image of a glass substrate 2 to be inspected. An image processing section 12 produces the defective feature information showing the feature of the defect from the image information, and decides the radiating condition in the case of radiating a laser beam based on the defective feature information. A repairing light source 14 sets the power, etc. of the laser beam based on the information about the radiating condition output from the image processing section 12, and radiates the laser beam r for repairing the defective portion of the glass substrate 2. A DMD unit 16 carries out the shaping of the laser beam.

Description

Laser repairing device

Technical field

The defective part irradiating laser that the present invention relates to produce in the inspected object thing of glass substrate, semiconductor wafer or the printed base plate etc. of LCD (below be designated as LCD) is repaired the laser repairing device of (correction).

Background technology

In the manufacturing process of LCD, handled glass substrate in the photoetching treatment operation is carried out various inspections.The result of this inspection is, in the resist figure or etched figure on being formed at glass substrate, if detect being involved in or such defective part such as residual of graphic films of foreign matter, then this defective part carried out coming the repairing of corrective pitting portion to handle by irradiating laser.As repairing the method for handling, be generally the Ultra-Violet Laser that for example will from the ultraviolet laser oscillator, export and incide the variable rectangular opening, (knife edge) opens and closes the variable rectangular opening by removable each edge of a knife, and the rectangle that the cross sectional shape of ultraviolet laser is shaped as desired size shines the method for defective part.

Method as defect mending is handled has following method.In the technology that patent documentation 1 is put down in writing, to 1 defective part, the illuminate condition difference of irradiation position by making laser or irradiated area, laser energy is carried out 2 times and is repaired treatment process, to reduce the residue of irradiation area as far as possible, handles thereby carry out high-precision repairing.In addition, in the technology that patent documentation 2 is put down in writing, by in the inspected object that relatively moves as the slit of the variable rectangular opening of irradiating laser and defective part etc., repairing processing, can reduce the residue of irradiation area equally, handle thereby carry out high-precision repairing.

When the cross sectional shape with laser is shaped as the method for rectangle, also proposed the cross sectional shape of laser is shaped as the method for arbitrary shape.For example in the technology that patent documentation 3 is put down in writing, utilize small reflecting optics as the spatial modulation device, by switching the angle of this reflecting optics, come the irradiation (ON) of switched laser and cover (OFF), be that unit carries out the transfer printing that figure is carried out in Laser Processing with each reflecting optics.

[patent documentation 1] TOHKEMY 2000-347385 communique

[patent documentation 2] TOHKEMY 2000-347387 communique

[patent documentation 3] Japanese kokai publication hei 8-174242 communique

In fact, in the manufacturing process of LCD various defectives can take place, also had nothing in common with each other by the disposal route of this defective of laser preparing.For example, cause in the such defective part of electric short circuit the residual of film owing to the resist figure, for the irradiation area that does not relate to normal resist figure,, then can remove defective part by 1 time or 2 laser radiations if set suitable laser energy.But, in exposure process, be involved in the defective part that foreign matter produces, even can not remove with 1 time or 2 laser radiations indrawn foreign matter self irradiating laser sometimes because of the resist figure.Like this, infer kind, the defective situation of living in of defective, for example the defective part of foreign matter is because contact with a plurality of normal resist figure with different potentials, so cause situation such as electric short circuit, to carry out efficiently and repair processing accurately be important to the result by inference.

In addition, extension along with the size (area) of the glass substrate of making LCD, the miniaturization of the figure of semiconductor wafer and development of technology, as the production environment of the substrate of checking object also in that great changes will take place, therefore can envision and continue to use former repairing disposal route, supervision time (producing interval time) can increase, and how reducing to produce becomes big problem interval time.

In the repairing disposal route that patent documentation 1 and patent documentation 2 are put down in writing, the main high precision int of paying close attention to, essential factor because of relatively moving of the change (the especially on-off action of rectangular aperture) of illuminate condition and inspected object and laser beam axis etc. might increase the processing time.In addition, in the method for repairing and mending that patent documentation 3 is put down in writing, because can carry out the control of reflecting optics at a high speed, the transfer process of figure also can be carried out at a high speed, but do not put down in writing concrete method for the shape of transfer printing object, therefore be difficult to realize high-precision transfer process.

Summary of the invention

The present invention proposes in view of the above problems, and its purpose is to provide a kind of laser repairing device that can carry out high precision and the processing of laser preparing at a high speed.

The present invention proposes in order to address the above problem, laser repairing device of the present invention, from LASER Light Source institute emitting laser, this laser repairing device has to the irradiation of the correction subject area on the inspected object: image unit, and it takes described inspected object to generate image information; Graphics processing unit, it is from the described image information that described image unit generated, and generates determining defects information, according to described determining defects information, the illuminate condition during the described laser of decision irradiation; The laser shaping unit, it carries out shaping according to the described illuminate condition that described graphics processing unit determined to described laser; And illuminating optical system, its described laser after to described correction subject area irradiation shaping.

And in laser repairing device of the present invention, preferred described laser shaping unit has: the spatial modulation device, and it is had a plurality of micro devices in one dimension direction or two-dimensional directional arrangement by the described laser radiation from described LASER Light Source; And spatial modulation device control module, it controls the state of described spatial modulation device according to described illuminate condition.

And in laser repairing device of the present invention, preferred described spatial modulation device control module is controlled the state of described spatial modulation device according to the shape of described correction subject area.

And in laser repairing device of the present invention, preferred described spatial modulation device control module is used information with the laser radiation prohibited area of described inspected object with the covering of described correction subject area of opposing, and controls the state of described spatial modulation device.

And in laser repairing device of the present invention, preferred described spatial modulation device control module was controlled the having or not of described laser radiation in each the described micro devices that constitutes described spatial modulation device.

And, in laser repairing device of the present invention, the information that described graphics processing unit uses in the time of also can having explicitly the described illuminate condition of storage decision and the illuminate condition resume storage unit of described illuminate condition, when the described illuminate condition of decision, preferably read described illuminate condition by the past of described illuminate condition resume cell stores.

And in laser repairing device of the present invention, one or more information is obtained color, area, brightness, position and the number that preferred described determining defects information is the defective in described correction subject area.

And, in laser repairing device of the present invention, preferably by the described illuminate condition that described graphics processing unit determined comprise the irradiation number of times of described laser, with the corresponding shot shape of each irradiation, shine the energy of corresponding described laser and shine in oscillation period of corresponding described laser one or more with each with each.

And in laser repairing device of the present invention, preferred described graphics processing unit comparison decides described correction subject area about the benchmark image information of described inspected object and the described image information that is generated by described image unit.

And, in laser repairing device of the present invention, preferably have image-display units, it shows the image of described inspected object, and superposition show the expression defective shape image and represent in the image of shape of irradiation area of described laser one or more.

According to the present invention,, carry out the effect that high-precision laser preparing is handled so can access owing to decide illuminate condition according to the feature of defective.And, control the spatial modulation device that constitutes by micro devices according to illuminate condition, and laser carried out shaping, thereby, therefore can access and carry out repairing at a high speed the effect of handling even revising the state change of object also can tackle fast.

Description of drawings

Fig. 1 is the block diagram of structure of the laser repairing device of expression the 1st embodiment of the present invention.

Fig. 2 is the approximate three-dimensional map of the DMD of the 1st embodiment of the present invention.

Fig. 3 is the array of figure of arrangement of each tiny mirror on the DMD unit of expression the 1st embodiment of the present invention.

Fig. 4 is the block diagram of structure of the image processing part that laser repairing device had of expression the 1st embodiment of the present invention.

Fig. 5 A, 5B, 5C are the reference diagrams of the example of the view data handled of the image processing part that laser repairing device had of expression the 1st embodiment of the present invention.

Fig. 6 A, 6B, 6C are the reference diagrams of the example of the view data handled of the image processing part that laser repairing device had of expression the 1st embodiment of the present invention.

Fig. 7 is the process flow diagram of step of the processing that image processing part carried out that laser repairing device had of expression the 1st embodiment of the present invention.

Fig. 8 A, 8B, 8C are the reference diagrams that is used to illustrate the processing that the defect state detection unit that laser repairing device had of the 1st embodiment of the present invention is carried out.

Fig. 9 A, 9B, 9C are the reference diagrams that is used to illustrate the processing that the defect state detection unit that laser repairing device had of the 1st embodiment of the present invention is carried out.

Figure 10 A, 10B, 10C, 10D are the reference diagrams that is used to illustrate the laser irradiating method of the 1st embodiment of the present invention.

Figure 11 A, 11B are the reference diagrams that is used to illustrate the laser irradiating method of the 1st embodiment of the present invention.

Figure 12 A, 12B, 12C are the reference diagrams that is used to illustrate the laser irradiating method of the 1st embodiment of the present invention.

Figure 13 A, 13B, 13C, 13D are the reference diagrams of the content of employed form when being illustrated in the 1st embodiment of the present invention from the characteristics determined determining defects information of defective and LASER Light Source set information.

Figure 14 A, 14B, 14C are the pixel of the view data of expression in the 1st embodiment of the present invention, the size of tiny mirror that constitutes DMD and the reference diagram of the relation between the configuration.

Figure 15 is the block diagram of structure of the image processing part that laser repairing device had of expression the 2nd embodiment of the present invention.

Figure 16 is the reference diagram of structure of the illuminate condition record information of expression the 2nd embodiment of the present invention.

Figure 17 A, 17B are the reference diagrams that is used to illustrate the processing that the illuminate condition resume handling part that laser repairing device had of the 2nd embodiment of the present invention is carried out.

Figure 18 A, 18B, 18C, 18D are the reference diagrams that makes use-case that is used for illustrating the illuminate condition record information of the 2nd embodiment of the present invention.

Embodiment

Below, with reference to the description of drawings embodiments of the present invention.The laser repairing device utilization of each following embodiment can with the irradiation area of complicated shape accordingly with the spatial modulation device of the cross sectional shape shaping of laser, the image that processing is imported from the image input part of CCD camera etc., use the result of Flame Image Process, infer situation as the position of repairing object, based on inferring the result that, realize efficiently and repair accurately and handle.

Fig. 1 represents the structure of the laser repairing device of the 1st embodiment of the present invention.In the present embodiment, as the spatial modulation device that carries out laser shaping, utilize to have the Digital Micromirror Device (DigitalMicro mirror Device) (hereinafter referred to as DMD) of arranging the micro devices group of a plurality of tiny mirror (micro devices) at one dimension or two-dimensional directional.And the control of the DMD during about laser radiation is supposed by the angle that changes the tiny mirror that constitutes DMD and is controlled having or not of irradiation.

On XY platform 1, mounting has the LCD glass substrate 2 (inspection substrate) as inspected object.Inspected object can be semiconductor wafer, printed base plate, LCD with any substrates that is formed with Micropicture such as colored filter, figure masks, in the present embodiment, be made as the LCD glass substrate as an official holiday.By the drive controlling that mobile drive control part 3 carries out, XY platform 1 moves to the XY direction.

Be connected with base board checking device 4 on the mobile drive control part 3.Base board checking device 4 for example is an image inspecting device, glass substrate 2 is carried out defect inspection, generate the inspection result data of the kind etc. of the coordinate that comprises the defective part on the glass substrate 2, size, defective, or to the processing of the required information of the condition of inspection reading part 26 transfer checks etc.Mobile drive control part 3 is from base board checking device 4 receiving check result datas, coordinate data according to each defective part in this inspection result data, moving of the XY direction of control XY platform 1, automatically each defective part on the glass substrate 2 is positioned at and repairs on the L of position, promptly described later from the irradiation position of repairing the repairing light r that uses 14 outgoing of light source.

The illumination light that lighting source 5 outgoing are used to shine glass substrate 2.On optical path of illuminating light, be provided with optical splitter 7 across image rotation lenses 6.On the reflected light path of optical splitter 7, be provided with object lens 9 across optical splitter 8.On the extended line of the optical axis p that passes through object lens 9, optical splitter 7 and optical splitter 8, be provided with CCD camera 11 (image unit) across image rotation lenses 10.CCD camera 11 is taken glass substrate 2 by image rotation lenses 10 and object lens 9, generates image information and output.

Image processing part 12 (graphics processing unit) obtains from the defect image data as image information of CCD camera 11 outputs, and, obtain the required information of checking from checking condition reading part 26.As information, for example be the benchmark image data that form of the inspected object by normal condition etc. from checking that condition reading part 26 obtains.The benchmark image data for example are the data that generate by the method that TOHKEMY 2005-10042 communique is put down in writing.Image processing part 12 is extracted the defective part on the glass substrate 2 out from resulting differential image data of these defect image data and benchmark image data relatively, carry out binary conversion treatment, and the defective that generates the expression defect shape is extracted view data out.In addition, image processing part 12 can also be obtained the profile of defective part from defect image data or differential image data, generates the data of expression defect shape.Display defect view data, defective are extracted view data out or the defect shape view data of the shape in the expression laser radiation zone obtained from these two in monitor 13 (image-display units).

Repair the laser r that is used to repair the defective part of glass substrate 2 with light source 14 (LASER Light Source) outgoing.As repairing, for example use the YAG laser oscillator of outgoing wavelength as one way (1shot) the laser r of 355nm with light source 14.And, repair with light source 14 and receive the information of being exported from image processing part 12 (the LASER Light Source set information that the laser when expression described later is shone is set), can carry out the setting that energy (energy intensity on the unit area etc.) with laser r is set at any number or selects etc. from the numerical value that is predetermined, constitute the part of laser shaping of the present invention unit.

From repairing on the light path with light source 14 emitting laser r, be provided with DMD unit 16 (laser shaping unit, spatial modulation device) across catoptron 15.DMD unit 16 by a plurality of DMD 17 (micro devices) as shown in Figure 2 according to arranging in length and breadth and constitute at two-dimensional directional as shown in Figure 3.As shown in Figure 2, DMD 17 is driving the tiny mirror 19 that top with storage unit 18 for example is provided with can be digital control angled ± 10 ° and 0 ° (level).

DMD 17 utilizes each tiny mirror 19 and drives the electrostatic attraction that causes with the voltage difference that acts in the gap between the storage unit 18 and comes high speed handoff angle ± 10 ° and 0 °, and known for example have a disclosed device in the TOHKEMY 2000-28937 communique.For example the rotation of tiny mirror 19 is constrained to angle ± 10 ° by block piece, rotates to angle ± 10 ° when driving with storage unit 18 " ON ", is reset to 0 ° of level angle when " OFF ".In addition, tiny mirror 19 for example is to use semiconductor fabrication to form the tiny mirror of the rectangular shape of a few μ m～tens μ m levels, driving with on the storage unit 18, as shown in Figure 3, by tiny mirror 19 two-dimensional arrangements are constituted DMD unit 16.

When the emergence angle of establishing laser r is θ i with respect to incident light axis, and each tiny mirror 19 is when " ON " during angle of inclination+10 °, the benchmark reflecting surface 16a (reflecting surface the when angle of each tiny mirror 19 is 0 °) of DMD unit 16 becomes tiltangle a with respect to the XY plane inclination, thereby the emergence angle of laser r is set at θ o.In order to be set at θ o with respect to the reflection angle of the incident angle optical axis of laser r, the relation according to the allocation position of catoptron 15, image rotation lenses 20, optical splitter 8 etc. makes benchmark reflecting surface 16a tilt with tiltangle a.Corresponding to incident direction and the exit direction of laser r, DMD unit 16 is installed in the tiltangle a of benchmark reflecting surface 16a can be on the support platform 16b that XY θ direction is adjusted.

The emergence angle θ o of laser r ° is decided by the anglec of rotation+10 that for example will drive each tiny mirror 19 when being changed to " ON " with storage unit 18.Be incident to optical splitter 8 with the emergence angle θ o emitting laser r of institute via image rotation lenses 20.And, be changed to " OFF " if will drive with storage unit 18, then laser r can not be incident to optical splitter 8 via image rotation lenses 20 to the reflection of h direction.In addition, reflect by catoptron 15, go into to inject in the DMD unit 16 with incident angle θ i, but also can not have catoptron 15, make from repairing with 14 emitting laser r of light source directly into injecting the DMD unit 16 from repairing with 14 emitting laser r of light source.Be used to shine the repairing location confirmation light source 25 that visible light is also confirmed range of exposures in advance across being arranged on the catoptron of repairing with in the light path between light source 14 and the catoptron 15 24 with plugging, being provided with.

In the optical system of this structure, dispose CCD camera 11 from glass substrate 2 across optical splitter 8, and dispose DMD unit 16 from glass substrate 2 across optical splitter 8, the allocation position of these CCD cameras 11 and DMD unit 16, the position that is conjugation with respect to glass substrate 2 concerns.Laser shape control unit 21 (spatial modulation device control module) reads the defect shape view data of each defective part of the glass substrate 2 that is generated by image processing part 12, corresponding to this defect shape view data, the control information following to DMD driver 22 (spatial modulation device control module) output: the driving that will be configured in each tiny mirror 19 of the DMD unit 16 in the zone of irradiating laser is changed to the driving that " ON " and handle be configured in each tiny mirror 19 in other zone with storage unit 18 and is changed to " OFF " with storage unit 18.

Be connected with correction portion 23 on the laser shape control unit 21, this correction portion 23 is in the defect shape view data that is generated by image processing part 12, under the situation of for example defective part being failed to extract all defect zone out or normal zone being extracted out as the defective part mistake, the zone of the defective part of these extractions of manual correction.Correction portion 23 is carried out zone with the defect area of failing to extract out and is set and be registered as defective part by using the manual operation of draw tool, or will be as defective part and wrong zone of extracting out is carried out the zone setting and is registered as the normal region.By the operation of correction portion 23, consistent for the cross sectional shape that makes laser r with the defective part of glass substrate 2, can also will support platform 16b to control to the fine motion of XY θ direction.According to the control information of being sent from laser shape control unit 21, DMD driver 22 is " ON " or " OFF " with each driving of DMD unit 16 with storage unit 18 drivings.

After the defective part irradiating laser r to glass substrate 2 repairs, image processing part 12 also obtains the view data of same position from CCD camera 11, the differential image data that obtain, judge whether the repairing of defective part is complete from this view data relatively with from checking the benchmark image data that condition reading part 26 obtains.Result in this judgement repairs under the incomplete situation, generates the defect shape view data of defective part the differential image data of image processing part 12 after repairing once more.Laser shape control unit 21 reads the defect shape view data that is generated by image processing part 12 once more, and the driving of each tiny mirror 19 of DMD unit 16 that will be corresponding with this defect shape view data is changed to " ON " with storage unit 18.

The structure of image processing part 12 then, is described with reference to Fig. 4.Defective extraction unit 31 is imported defect image data aa and the benchmark image data b b that is exported from CCD camera 11 from checking that condition reading part 26 is exported.The control treatment (figure coupling) of separately the figure of defect processing portion 31 by utilizing initial defect image data aa and benchmark image data b b is carried out the position contrast.After the contrast of position, the brightness separately of defective extraction unit 31 contrast defect image data aa and benchmark image data b b.After the brightness contrast, defective extraction unit 31 relatively both, generate differential image data (image that constitutes by the absolute value of the luminance difference of each pixel).

Then, defective extraction unit 31 is about the differential image data, according to the absolute value of luminance difference more than or equal to threshold value Th1 (for example under the situation that view data is made of 256 gray scales, if the benchmark image data b b of part Th1=30 etc.) is different with defect image data aa, promptly this part is the such judgement of defective part on the defect image data, generate and export whether the expression zone is defective part, perhaps in other words, the defective of expression defect shape is extracted view data cc out.For example, from the benchmark image data b b shown in the defect image data aa shown in Fig. 5 A and Fig. 5 B, generate the defective shown in Fig. 5 C and extract view data cc out.

Extract view data cc out to defect state detection unit 32 input defect image data aa, benchmark image data b b with from the defective of defective extraction unit 31 outputs.Defect state detection unit 32 is from these view data, carrying out defective and be which kind of kind (for example be that foreign matter is involved in, or the film of resist figure being residual etc.), defective is what shape, defective and is positioned at which type of position (for example cause short circuit between different current potentials or do not contact with any current potential and independent exist etc.) and whether needs to repair such judgement about the project of expression defect characteristic such as processing.As its result, defect state detection unit 32 output expression comprises the feature in irradiation object zone of defective and the irradiation object view data dd and the determining defects information ee of state.Irradiation object view data dd is the zone with the irradiation object in the graphical representation defect image, and determining defects information ee is with the state of non-image information representation defective.

For example, shown in Fig. 5 A～5C, according to following such generation irradiation object view data dd as shown in Figure 6A.Defective part is because cause electric short circuit respectively having between the rectangular resist figure of different potentials near the central authorities of image and have between the horizontal bus of different potentials, so be judged as the repairing object.And, owing in defective part, also comprise the resist figure and the bus that should exist, so, therefore become Fig. 6 A removes normal resist figure and bus place like that from defective part part to they irradiating lasers not.The details of determining defects information ee is narrated in the back.

Irradiation condition enactment portion 33 is imported irradiation object view data dd and the defect information determination information ee that is exported from defect state detection unit 32.33 decisions of illuminate condition configuration part are to the laser irradiation condition of inspected object.Illuminate condition specifically is meant, shot shape, the energy of laser and the oscillation period of laser of the irradiation number of times of laser, corresponding each irradiation.For example work as defective and be positioned on the position that makes short circuit between different potentials, and be under the situation of " resist film is residual ", even the energy of laser not too greatly also can be removed defective.Under this situation, illuminate condition is set as follows: the irradiation number of times is that 3 (by-levels) in 2 times, the energy of 5 level lasers, the oscillation period of laser are 3Hz (being meant 3 laser of internal radiation in 1 second), in addition, in the 1st irradiation, be shape, be the shape of the part irradiation that the lateral profile to defective part relates to the 2nd irradiation defective part WBR laser.

Like this, because after the state of considering irradiation object, determine the illuminate condition of laser, so with compare with the former method of same illumination condition irradiating laser, can realize then reducing the irradiation number of times, in each irradiation, dwindle irradiation area gradually, reducing the efficient activities such as energy of laser gradually with what less irradiation number of times was finished.The LASER Light Source set information gg that laser when then, illuminate condition configuration part 33 is exported with the defect shape view data ff of pictorial data representation shot shape and expression irradiation is respectively set.The defect shape view data ff give laser shape control unit 21, and LASER Light Source set information gg sends to and repairs with light source 14.

For example, from the irradiation object view data dd shown in Fig. 6 A to the defect shape view data ff of irradiation number of times when being 2 times, when the 1st irradiation with the pictorial data representation shown in Fig. 6 B, when the 2nd irradiation with the pictorial data representation shown in Fig. 6 C.Here, relative therewith for the regional integration irradiating laser that becomes irradiation object in Fig. 6 B, in Fig. 6 C, to causing the position of electric short circuit, promptly the periphery irradiating laser of resist figure and bus does not shine the position of leaving resist pattern and bus.The purpose of Fig. 6 C is to repair reliably electric short circuit.

Defect image data aa in the image processing part 12 handled images, defective are extracted view data cc and defect shape view data ff out, via selector switch 34, to monitor 13 outputs, can in monitor 13, show image as monitor display message hh based on these view data.Selector switch 34 carries out by not shown hand switch, and the view data that selection will show perhaps automatically is presented at image the first-class action of monitor 13 when newly-generated view data is transfused to.And being differed by selector switch 34 selected view data is decided to be one, for example for defect image data aa, also can generate monitor display message hh, extracts view data cc and defect shape view data ff out with overlapping defective and carries out superposition and show.

The action of image processing part 12 then, is described with reference to Fig. 7.From the defect image data aa of CCD camera 11 with come the benchmark image data b b of self-check condition reading part 26 to be transfused to defective extraction unit 31 and defect state detection unit 32.Defective extraction unit 31 at first contrasts position and the brightness on the picture of defect image data aa and benchmark image data b b, generates differential image data (image that is made of the absolute value of the luminance difference in each pixel) (step S701) then.Then, the luminance difference of each pixel of defective extraction unit 31 comparing difference view data and at the threshold value Th1 that defective is extracted out that is used for shown in the explanation of defective extraction unit 31, the defective that generates two-value is extracted view data cc out, to 32 outputs (step S702) of defect state detection unit.Defective is extracted view data cc out shown in Fig. 5 C, defective part, is that the pixel value of differential image is a white pixel more than or equal to the pixel of threshold value Th1, beyond the defective part, be that the pixel value of differential image is black pixel less than the pixel of threshold value Th1.

Then, defect state detection unit 32 is extracted view data cc out according to defective, judges whether defective part exists (step S703).Not only for whether having the white pixel of representing defective part, whether the area that also comprises the position that white pixel connects is more than or equal to setting for the judgment standard of step S703.Be judged as when not having defective part, handle and enter step S709, be judged as when having defective part, handle entering step S704.

In step S703, be judged as under the situation that has defective part (being), defect state detection unit 32 benchmark view data bb with graphics field data and defective extract view data cc out, calculate the graphics field number (step S704) that contacts with defective part.The graphics field data are to represent to become the data of the graphics field of revising object (=generated by up-to-date manufacturing process) with bianry image, if the situation of benchmark image data b b Fig. 8 A for example, then image pattern 8B sets like that.

By the zone that figure constituted (black region) shown in Fig. 8 B is to become the graphics field of revising object.This graphics field is set at different zones to the position with different potentials.That is, be present under the situation of crossing over the different graphic zone in defective part, originally will be because of flowing through identical electric current and cause electric short circuit in the place that potential difference (PD) is arranged.Therefore, according to the defect image data aa and the benchmark image data b b that have carried out the position contrast, utilize the position relation of having known defective part and graphics field, the processing of carrying out step S704 in order to judge whether to cause electric short circuit.

For example, for the defect image data shown in Fig. 8 C, shown in Fig. 9 A, when defective part 901 and graphics field superposition, defective part 901 does not all contact with any graphics field, so under this situation, the graphics field number of contact is 0.In addition, for the defect image data shown in Fig. 9 B, shown in Fig. 9 C, when defective part 902 and graphics field superposition, the bus 904 that exists between defective part 902 and two electrode pattern 903a that are present in picture central authorities and 903b and each electrode pattern contacts, therefore under this situation, the graphics field number of contact is 3.

Defect state detection unit 32 is according to the graphics field number of calculating as described below.Defect state detection unit 32 is extracted view data cc out from defective and is obtained the number " Nc1 " of defective part, and obtains the number " Np1 " of graphics field from the graphics field data.Then, defect state detection unit 32 get data after defective is extracted that view data cc is black in vain out and put upside down (=defective part is changed to the data of black pixel) and graphics field data " with ", at this result, obtain the number " Nb1 " of black region.Then, defect state detection unit 32 utilizes formula (1), calculates the graphics field number " Nt1 " of contact.

Nt1＝(Nc1+Np1)-Nb1…(1)

For example in Fig. 8 A～8C and Fig. 9 A～9C, the number of the graphics field of Fig. 8 B " Np1 " is 16.In addition, the defect image data are 1 defective under the situation of Fig. 8 C and Fig. 9 B, so the number of defective part " Nc1 " is 1 under both situations.Calculate graphics field number " Nt1 " according to above-mentioned situation.

In the defect image data is under the situation of Fig. 8 C, defective is extracted view data cc out white black put upside down with the graphics field data shown in Fig. 8 B " with " the result by the region representation beyond the white of Fig. 9 A, therefore the number " Nb1 " of the zone beyond the white (=be equivalent to black region) is 17.Therefore, graphics field number " Nt1 " is (Nc1+Np1)-Nb1=(1+16)-17=0.

On the other hand, in the defect image data is under the situation of Fig. 9 B, defective is extracted view data cc out white black put upside down with the graphics field data shown in Fig. 8 B " with " the result by the region representation beyond the white of Fig. 9 C, therefore the number " Nb1 " of the zone beyond the white (=be equivalent to black region) is 14.Therefore, graphics field number " Nt1 " is (Nc1+Np1)-Nb1=(1+16)-14=3.

After the processing of step S704 finished, defect state detection unit 32 judged that whether the graphics field number of contact is greater than 1 (step S705).The graphics field number of contact greater than 1 situation under, handle to enter step S706, handle entering step S709 under smaller or equal to 1 situation.

For example in Fig. 8 A～8C and Fig. 9 A～9C, when the defect image data were Fig. 8 C, graphics field number " Nt1 " was 0, was "No" in step S705 therefore, the next step S709 that is treated to.In addition, when the defect image data were Fig. 9 B, graphics field number " Nt1 " was 3, was "Yes" in step S705 therefore, the next step S706 that is treated to.

The graphics field number of contact is greater than 1, and expression causes electric short circuit.

In the present embodiment, because the function to inspected object is caused that unusual position is as modification region, so carry out the such judgement of step S705, but as stricter condition, if set modification region with the purpose that is shaped as of keeping figure, then the judgment standard of step S705 can be made as " whether the graphics field number of contact is more than or equal to 1 ", and promptly whether defective part contacts with the graphics field.

In step S705, under the situation of graphics field number greater than 1 (being) of contact, defect state detection unit 32 is extracted the characteristic quantity of extracting out the view data cc about defective part (for example defect characteristic information of area, lightness distribution etc.) out from defect image data aa, benchmark image data b b and defective, result from characteristic quantity, generate irradiation object view data dd and determining defects information ee, and to 33 outputs (step S706) of illuminate condition configuration part.Irradiation object view data dd is generated by preceding method.Generation method about determining defects information ee will be narrated in the back.

When the processing of step S706 finishes, illuminate condition configuration part 33 is according to irradiation object view data dd and determining defects information ee, decision is as the irradiation number of times of one of illuminate condition, and generates the shot shape (step S707) when being shone by each time of the represented laser of defect shape view data ff.And as other illuminate condition, the information in laser energy when each time shone in illuminate condition configuration part 33 or laser generation cycle etc. is generated as LASER Light Source set information gg (step S708).Generation method about LASER Light Source set information gg will be narrated in the back.When the processing of step S708 finished, all processing finished.

On the other hand, in step S703, do not exist under the situation of defective part (denying), and under the situation of the graphics field that in step S705, contacts smaller or equal to 1 (denying), defect state detection unit 32 is judged as the position that does not meet in irradiation area, illuminate condition configuration part 33 is made as sky (NULL) (step S709) with defect shape view data ff and LASER Light Source set information gg, finishes all processing.

Figure 10 A～10D, Figure 11 A, 11B, Figure 12 A～12C represent the example based on the laser irradiating method of the illuminate condition that processing generated by step S707 and step S708.Figure 10 A～10D is that be not stripped from and the figure of residual state at the position of film outside figure of figure of expression inspected object, about the image based on defect image data aa shown in Figure 10 A, is judged as " film residual/short circuit " by the processing of step S706.Under the situation that defective part produces for the film by figure, even laser energy is not too big, also can remove defective part with less number of times, therefore in step S707 and step S708, for the irradiation object zone 1001 shown in Figure 10 B, the illuminate condition of generation laser energy=little, irradiation number of times=2 and oscillation period=2Hz.

Wherein, about shot shape (=defect shape view data ff), in the 1st irradiation, shown in Figure 10 C, shot shape zone 1002 is set to irradiation defective part integral body (not having the graphics field owing in the defective part, so even irradiation defective part integral body is also no problem), in the 2nd irradiation, shown in Figure 10 D, shot shape zone 1003 is set to the profile portion of only shining defective part, promptly causes the position with the graphics field electric short circuit.Like this, come the change setting shot shape according to the irradiation number of times, its reason is: can revise the position that causes electric short circuit reliably; No longer shine to suppress infringement as far as possible for the zone of removing defective inspected object; And because the periphery of laser spots is lower than the laser intensity of central part, so can remove consequent residue reliably.

Figure 11 A, 11B, Figure 12 A～12C are that the expression foreign matter is involved in and makes the figure that causes with the state of the electric short circuit of electrode pattern on horizontal bus, about the image shown in Figure 11 A, be judged as " foreign matter/short circuit " by the processing of step S706 based on defect image data aa.In defective part is under the situation of foreign matter, there is the little situation that then can't remove defective part of laser energy, in order to remove fully, need to increase the irradiation number of times, therefore in step S707 and step S708, for the irradiation object zone 1101 shown in Figure 11 B, the illuminate condition of generation laser energy=big, irradiation number of times=3 and oscillation period=3Hz.

Wherein, about shot shape (=defect shape view data ff), in the 1st irradiation, shown in Figure 12 A, irradiation area 1102 is set to the zone of the figure portion (being bus among Figure 12 A) of removing in up-to-date operation in the irradiation defective part integral body to be generated, in the 2nd irradiation, shown in Figure 12 B, shot shape zone 1103 is set to the profile portion of only shining defective part, promptly causes the position with the graphics field electric short circuit.Then, in the 3rd irradiation, shown in Figure 12 C, shot shape zone 1104 is set to the profile portion in the shot shape zone 1103 of irradiation Figure 12 B.The setting reason of the shot shape of Figure 11 A, 11B, Figure 12 A～12C also reason with Figure 10 A～10D is identical.

Shot shape in each time of laser shown in Figure 10 A～10D, Figure 11 A, 11B, Figure 12 A～12C irradiation can utilize morphology (Morphology) computing in the Flame Image Process and generates.For example for the 2nd shot shape, as long as the 1st shot shape represented with bianry image, and obtain it is carried out repeatedly the intermediate image of shrink process (Erosion), deducting intermediate image then from the bianry image of the 1st shot shape can generate.In addition, for the 3rd shot shape, as long as the 2nd shot shape represented with bianry image, and obtain it is carried out repeatedly the 2nd intermediate image of shrink process (Erosion), deducting the 2nd intermediate image then from the bianry image of the 2nd shot shape can generate.The number of times of shrink process can suitably be set, and represents that with thin outline line shot shape then can reduce number of times, represents that with the coarse contour line shot shape then can increase number of times.

Then, the generation method of description defect determination information ee and LASER Light Source set information gg.The content of employed table when Figure 13 A～Figure 13 D represents the characteristic quantity decision determining defects information ee of the defective part from image and LASER Light Source set information gg.Figure 13 A represents to be used to depend on colouring information and to set the table of the control coefrficient of irradiation number of times from defining about the colouring information (being represented by RGB) of defect image data aa and benchmark image data b b relevant.Herein, suppose and contrasted the position of figure and the brightness of image separately between defect image data aa and the benchmark image data b b.

Relevant coefficient about colouring information is made as Rc, Gc and Bc respectively, and defect state detection unit 32 is calculated coefficient according to each colour type.About the relevant coefficient of the colouring information shown in the present embodiment, by more not having defective and not having the difference of each image in the zone (non-graphics field: for example bottom zone) of figure and exist the difference of each image in the graphics field of defective to calculate.That is, observe the difference of the graphics field that has defective according to the difference between the zone that does not have figure.

For example, colouring information about R (red), the mean flow rate of the non-graphics field that does not have defective in establishing defect image data aa is Def_NP_ND (R), if having the mean flow rate of the graphics field of defective is Def_P_D (R), if it is Ref_NP (R) that removing among the benchmark image data b b is equivalent to the mean flow rate of non-graphics field at the defective part position of defect image data aa, if when being equivalent to the mean flow rate of graphics field at position of the defective part of defect image data aa and being Ref_P (R), the coefficients R c of the colouring information of R is calculated by formula (2).

Rc＝‖(Def_NP_ND(R)/Ref_NP(R))-(Def_P_D(R)/Ref_P(R))‖

…(2)

About other colouring information (G, B), also calculate coefficient Gc, Bc respectively with identical definition.According to formula (2), coefficients R c is more little, and the color of defective part and the color of graphics field be more near (relevant big), is that film formed such supposition by figure is associated with defective part promptly.Then, for the coefficients R c that is calculated, Gc and Bc, be suitable for and threshold value Th_Rc, Th_Gc and Th_Bc condition relatively.If coefficient is smaller or equal to threshold value, then defect state detection unit 32 control coefrficient α Rc, α Gc and the α Bc that will be used to set the irradiation number of times is set at 1 respectively, if coefficient is greater than threshold value, then defect state detection unit 32 is set at 0 respectively with control coefrficient α Rc, α Gc and α Bc.Threshold value Th_Rc, Th_Gc and Th_Bc are the numerical value more than or equal to 0, for example are set at about 0.1～0.2 respectively.

Figure 13 B is a kind of utilizing the control coefrficient α Rc, the α Gc that set according to Figure 13 A and α Bc to infer defective part, and as a result of, at definition employed table during about the gain factors d of the irradiation number of times that depends on defect kind.Condition is decided according to the logical operation of control coefrficient α Rc, α Gc and α Bc, if all control coefrficients are 1, then defect state detection unit 32 judges that defective is " film is residual " type, and d is made as 1.0 with gain factors.In addition, if one or more control coefrficient is 0, then defect state detection unit 32 judges that defective is " foreign matter " type, and gain factors d is made as 1.5.Result of determination to illuminate condition configuration part 33 output defect kinds.

The determining defects benchmark of Figure 13 B is whether to have relevant drawing according to the colouring information about all colours.If promptly defective is that " film " identical with the graphics field color produces, then diminish with Bc (color relevant greatly) about versicolor relevant coefficients R c, Gc, control coefrficient α Rc, α Gc and α Bc are 1.On the other hand, if defective is the color different with the graphics field, color such as for example black or white then becomes big (turning down mutually of color) about at least a color of versicolor relevant coefficients R c, Gc and Bc, thus control coefrficient α Rc, α Gc and α Bc at least one be 0.Gain factors d is the coefficient that is used for changing according to the kind of defective the irradiation number of times of laser, in Figure 13 B, for the defective irradiation number of times increase of " foreign matter " type.

Figure 13 C is the table that defines the irradiation number of times Ta of laser according to the area of the defective part that obtains from defect image data aa.In Figure 13 C, be the ratio A Ap of the pixel of defective part with respect to the size (pixel count) of view data with the cartographic represenation of area of defective part.About the ratio A Ap of area, as condition, defect state detection unit 32 is categorized as three kinds of " Small ", " Medium " and " Large " with the area of defective part with the magnitude relationship of threshold value Th_As and threshold value Th_Al.Threshold value Th_As, Th_Al be about the ratio of area more than or equal to 0 and smaller or equal to 1 numerical value, and Th_As＜Th_Al.Defect state detection unit 32 for example is set at about Th_As=0.1, Th_Al=0.25.

About condition, if the ratio A Ap of area is less than threshold value Th_As, then defect state detection unit 32 is categorized as " Small " with the area of defective part, if the ratio A Ap of area is more than or equal to threshold value Th_As and less than threshold value Th_Al, then defect state detection unit 32 is categorized as " Medium " with the area of defective part, if the ratio A Ap of area is more than or equal to threshold value Th_Al, then defect state detection unit 32 is categorized as " Large " with the area of defective part.Classification results to illuminate condition configuration part 33 output areas.Illuminate condition configuration part 33 is according to the area irradiation number of times Ta of the classification results setting laser of area.In Figure 13 C, if the area of defective part is " Small ", then shining number of times Ta is 1, if the area of defective part is " Medium ", then shining number of times Ta is 2, if the area of defective part is " Large ", then shining number of times Ta is 3.Promptly proportional with the area of defective part, the irradiation number of times of laser increases.

Illuminate condition configuration part 33 is shone number of times Ta based on what set according to Figure 13 B about the gain factors d of irradiation number of times and the area that Figure 13 C sets, the irradiation number of times ST of the laser during the actual repairing of through type (3) decision is handled.

ST＝βd×Ta …(3)

Like this, about the laser radiation number of times ST of reality, even area is identical, if the kind difference of defective is then shone number of times and also changed.For example, when the area of defective part is classified as " Medium ", if the kind of defective is " film is residual " type, then according to Figure 13 B, 13C and formula (3), obtain ST=1.0 * 2=2 time,, then obtain ST=1.5 * 2=3 time equally if the kind of defective is " foreign matter " type.

Figure 13 D is the table of the frequency L_Fr of the classification results (kind, area) from defective part when to define illuminate condition about laser be the shooting vibration of laser energy L_Pw and laser.Because Figure 13 B and 13C are categorized as 3 kinds with the area of defective part, the kind of defective is categorized as 2 kinds, so corresponding to 3 * 2=6 kind, illuminate condition configuration part 33 decision laser energy L_Pw and frequency L_Fr.In Figure 13 D, carry out following definition: about laser energy L_Pw, the area of defective part is big more then to be set greatly more, " foreign matter " type is set greatly than " film is residual " type, about frequency L_Fr, " foreign matter " is set at identical value though the situation of type is set greatly than " film is residual " type, and the area according to defective part does not change.

In addition, determining defects information ee is equivalent to the kind (the gain factors d that also comprises the laser radiation number of times) and the area of the defective part in each information shown in Figure 13 A～13D, and LASER Light Source set information gg is equivalent to actual laser radiation number of times ST, laser energy L_Pw and oscillation frequency L_Fr.The table of the area classification of the table of defect state detection unit 32 use Figure 13 A, 13B and the defective part of Figure 13 C, the sorted table of the irradiation number of times Ta of illuminate condition configuration part 33 use Figure 13 C and the table of Figure 13 D.

The configuration of the tiny mirror 19 that constitutes DMD 17 then, is described.The size of the tiny mirror 19 of the pixel of Figure 14 A～14C presentation video data, formation DMD 17 and the relation between the configuration.In each figure of Figure 14 A～14C, the pixel of top presentation video data, the arrangement of tiny mirror 19 is represented in the bottom.In the present embodiment, pixel and tiny mirror 19 dispose respectively in corresponding mode.Situation when the multiplying power when for example Figure 14 A represents to observe during with laser radiation is identical.At this moment, the area ratio of Pixel Dimensions and tiny mirror 19 is 1: 1 a relation (the two is measure-alike), corresponding 1 tiny mirror 19 of promptly per 1 pixel.Therefore can with 1 pixel the irradiation of unit control laser.

Multiplying power when Figure 14 B represents laser radiation when observing during 2 times of multiplying power, i.e. the situation of area when being 4 times.At this moment, the area ratio of Pixel Dimensions and tiny mirror is 1: 4 a relation, corresponding 1 tiny mirror 19 of promptly per 2 * 2 pixels.Though therefore the density of tiny mirror 19 is lower than the situation of Figure 14 A, the structure of DMD unit 16 becomes simply, can further realize the high speed of handling.

Actual DMD has the gap between catoptron, Figure 14 C illustrates this situation.In Figure 14 C, Pixel Dimensions is for example 1: 0.8 relation with the area ratio of tiny mirror 19, and the size of promptly representing tiny mirror 19 is than the configuration relation under the little situation of the size of 1 pixel.Under this situation, be not reflected at the peripheral laser of tiny mirror 19, if but in fact make it have the very little setting that defocuses to irradiated inspected object, then can shine the zone of 1 pixel from 1 tiny mirror laser light reflected.In other words, even gapped,, also can fill up the gap and shine by defocusing.Even measure-alike in tiny mirror 19 and 1 pixel shown in Figure 14 A, also have under the situation of characteristic (it is even that irregular colour takes place) that can not 1 pixel integral body of clear irradiation, in the such configuration of periphery reflection, the irregular colour that can suppress irradiation area integral body is even by never.Specifically, can consider to reduce periphery reflectivity, periphery is applied curvature or changes reflection direction etc.

In Figure 14 A～14C, for the tiny mirror corresponding 19 with the pixel that becomes irradiation object, make its reflector laser as prerequisite to be controlled to, but the method for control is not limited thereto, for example can carry out and to remove the control of 1 pixel between tiny mirror, promptly in the 1st irradiation, make odd number tiny mirror reflector laser of each row, in the 2nd irradiation, make the control of even number tiny mirror reflector laser etc. of each row.Can prolong the permanance of DMD unit 16 thus.

In addition, used the DMD of reflection-type in the present embodiment as the spatial modulation device, but small shutter array that use other spatial modulation device, for example forms as the liquid crystal shutter of infiltration type device or with small shutter two-dimensional arrangements etc. also can obtain same effect.

As mentioned above, the image information that the laser repairing device of present embodiment generates from taking inspected object, generate the defect characteristic information (kind of defective or area etc.) of the feature of expression defective, according to state by the represented correction subject area of defect characteristic information, the illuminate condition of decision laser, the shaping of carrying out laser comes irradiating laser.Thus, can carry out high-precision repairing automatically handles.Particularly, the feature of the correction subject area that the laser repairing device utilization of present embodiment is extracted out from image information (pixel count (defect area) of the relevant or defective part of the colouring information of defect image data aa and benchmark image data b b is with respect to the ratio of all pixel counts of defect image data aa), (kind of defective part is residual type of film or foreign-body-type to the state of revising subject area, and, among " Small ", " Medium ", " Large " which area of defective part be) classify, from classification results decision illuminate condition.Thus, the suitable illuminate condition corresponding can be realized, processing can be repaired efficiently reliably with the state of revising object.

And, use the spatial modulation device that constitutes by micro devices, by corresponding irradiation area the cross sectional shape of laser is carried out shaping, comprise fine position even revise object, the repairing that also can carry out being fit to is therewith handled.And, by from illuminate condition control spatial modulation device, change also correspondence at a high speed even revise the state of object, therefore can realize repairing reduction in processing time, also can not repair processing lavishly at a high speed for the modification region at 1 position.

And, because contrast is revised the shape of subject area and is controlled the state of micro devices (being the angle of tiny mirror 19 in the present embodiment), even so revise subject area is complicated shape, also can set the irradiation area that is fit to shape, can repair processing reliably.Further, as utilize Fig. 5 A～5C and Fig. 6 A～6C explanation, with normal figure in the inspected object etc. as the laser radiation prohibited area, by being controlled to, micro devices covers (mask) to revising subject area, to having removed the correction subject area irradiating laser in the zone that should not shine originally, so can there not be the repairing of wrong irradiation to handle.

And, by having or not of the laser radiation in each micro devices of control formation spatial modulation device, can be the irradiation of unit control laser with the micro devices, even comprise fine position or complicated shape, also can not damage normal position and repair processing reliably so revise subject area.

And, deciding illuminate condition by the defect characteristic information of utilizing expression to revise the feature of the defective that is comprised in the subject area, the state of contrast defective decides illuminate condition.Therefore, can repair processing reliably with the illuminate condition that is fit to the correction object.In the defect characteristic information of present embodiment, except that the kind and area of defective, comprise that also defect shape (defective is extracted view data cc out), brightness, the position revised in the subject area (cause short circuit between different potentials, still all do not contact with any current potential and independent exist etc.) and number (employed when counting in the graphics field of calculating the defective part contact, extract the number of the defective part that view data cc obtains out from defective) etc.

And, by irradiation number of times, and then when each irradiation, change the environment of shot shape and laser according to the image information setting laser, can repair processing efficiently with the illuminate condition of having considered defect shape.

And, by utilizing benchmark image information (benchmark image data b b), compare with becoming the image information (defect image data aa) of checking object, can be with the two difference (defective part) as revising subject area.And, owing to utilize benchmark image information, can from revise subject area, remove normal position, so can not carry out the mistake irradiation and repair processing reliably to revising subject area.

And, in the time of by the demonstration inspected object, superposition shows about repairing the information handled (in the present embodiment, the defective of expression defect shape is extracted the defect shape view data ff of the view data cc and the shape of the irradiation area of expression laser out), when being arranged, the operating personnel can accurately hold the situation of handling of repairing.

Then, the 2nd embodiment of the present invention is described.In the present embodiment, in image processing part 12, be provided with the illuminate condition resume storage part of storage illuminate condition in the past, as required, read the illuminate condition of being stored.After, only the position different with the 1st embodiment narrated.Figure 15 represents the structure of the image processing part 12 in the present embodiment.Be to be provided with illuminate condition resume handling part 41 and illuminate condition resume storage part 42 with the 1st embodiment difference, relative therewith, the illuminate condition configuration part 33 in the 1st embodiment changes to illuminate condition configuration part 43.

Import the determining defects information ee that is exported from defect state detection unit 32 to illuminate condition resume handling part 41.Afterwards, as the information relevant that the determining defects information ee that is utilized identical content by illuminate condition configuration part 43 is generated, import the illuminate condition record information jj that is exported from illuminate condition configuration part 43 to illuminate condition resume handling part 41 with illuminate condition.Here, illuminate condition record information jj has the form that is easy to reference when the later resume of retrieval, generates based on defect shape view data ff and LASER Light Source set information gg.This form for example has form as shown in figure 16, by the index LS_Cx of expression illuminate condition, the variable tabular form of the frequency Cx_n_F formation of laser energy Cx_n_P, the change of shape amount Cx_n_S of when shining (the n time) and Laser emission when following thereafter irradiation number of times X1, each time irradiation.Illuminate condition resume handling part 41 is stored in the illuminate condition record information jj that is imported in the illuminate condition resume storage part 42 with above-mentioned form.

For example as for represented irradiation area among the original irradiation object view data dd, utilize Figure 10 A～10D, Figure 11 A, 11B and Figure 12 A～12C explanation morphology operations shrink process (Erosion) the number of occurrence etc. like that, change of shape amount Cx_n_S use when representing to change shape (for last time result for relative or from initial state then for absolute) information.Illuminate condition resume storage part 42 is stored determining defects information ee and the illuminate condition record information jj that is imported explicitly.Specifically, be in the space of axle at each characteristic quantity with formation determining defects information ee, form the trooping of a certain size that have for " center of gravity " with determining defects information ee, troop connection index LS_Cx as shown in figure 16 for 1.

Thus, during repairing is afterwards handled, when new irradiation object is determined illuminate condition, to the illuminate condition resume handling part 41 inputs determining defects information ee corresponding with the irradiation object image, calculate determining defects information ee and current till in the feature space of determining defects information ee Euclidean distance between the formed center of gravity of respectively trooping or mahalanobis distance (Maharanobis distance, the distance of having considered to troop and having disperseed), from illuminate condition resume storage part 42, read illuminate condition with the minimum associated index LS_Cx that troops of distance, send to illuminate condition configuration part 43 as illuminate condition record information jj, can repair processing efficiently thus.Determining defects information ee when at this moment is not included in minimum the trooping when middle of distance, if enlarge the renewal of trooping etc., so that in determining defects information ee is included in, then can obtain better effect.

On the other hand, in the processing of reality, because there is the reason of the characteristic quantity can not fully take out image information etc., so exist the illuminate condition that determined and operator to want the different situation of correction of carrying out, under this situation, carry out the correction of illuminate condition by correction portion 23 as required.At this moment, if also have the inspected object that needs correction, then the operating personnel must revise at every turn, labor intensive.Therefore, in the present embodiment, the operating personnel passes through the information of correction portion 23 corrections via laser shape control unit 21, be input in the illuminate condition resume handling part 41 as update information kk, operating personnel's the correction content and the image information of inspected object can be stored in the illuminate condition resume storage part 42 explicitly.

Specifically, among the illuminate condition record information jjs corresponding, from update information kk, take out information, rewrite the information that meets illuminate condition record information jj about illuminate condition with the determining defects information ee that obtains from current images information.Thus, in the inspection afterwards, even similar inspected object occurs, the operating personnel also can repair processing by revised illuminate condition, so the operating personnel need not to revise once more, can check efficiently.

Below, the processing that illuminate condition resume handling part 41 carries out is described.Figure 17 A represents about the storage of the record information of common illuminate condition and the situation of reading.In Figure 17 A, Figure 17 B, determining defects information ee comprise defective part brightness, comprise the image information of defective part and as the area of and the defective part relevant of benchmark image information with reference to the color between the image information, with them is 3 dimension spaces of axle, and promptly the feature space of image information is represented by Figure 17 A, Figure 17 B.On the other hand, illuminate condition record information jj represents the illuminate condition based on form shown in Figure 16.

Determining defects information ee is not corresponding one by one with the relation of illuminate condition record information jj, for 1 illuminate condition record information jj (being illuminate condition), is distributed with determining defects information ee (being the characteristic quantity of image information), i.e. 1 of illuminate condition formation is trooped.Therefore, can not find in illuminate condition resume storage part 42 with about the resume of the corresponding illuminate condition of the determining defects information ee of current inspected object the time, illuminate condition resume handling part 41 is calculated and the distance that constitutes the center of gravity of trooping of each illuminate condition.If with the distance of nearest center of gravity threshold value smaller or equal to regulation, then illuminate condition resume handling part 41 is read from illuminate condition resume storage part 42 and this corresponding illuminate condition of trooping, send to illuminate condition configuration part 43 as illuminate condition record information jj, and upgrade trooping of (expansion) corresponding illuminate condition, make to comprise determining defects information ee.

On the other hand, if with the distance of the nearest center of gravity of trooping threshold value greater than regulation, then illuminate condition resume handling part 41 is judged as and need resets illuminate condition, and 43 outputs comprise the instruction content of new illuminate condition of information set to(for) illuminate condition record information jj to the illuminate condition configuration part.

Then, determined after the illuminate condition by illuminate condition configuration part 43, illuminate condition resume handling part 41 is accepted the illuminate condition record information jj of the new illuminate condition of expression from illuminate condition configuration part 43, form new trooping (trooping is not point, but be the having a certain size form of center of gravity with determining defects information ee) from the determining defects information ee of correspondence.By carrying out such processing repeatedly, the decision of the illuminate condition among the determining defects information ee becomes from the experience in past " study ", can realize intelligentized repairing processing.

And the renewal of the illuminate condition record information jj that carries out owing to operating personnel's correction is carried out according to following.The more news of the record information when Figure 17 B has represented to import update information kk.Behind illuminate condition resume handling part 41 input update information kk, illuminate condition resume handling part 41 is from comprising troop (the illuminate condition LS_C2) of current determining defects information ee, again form the trooping of illuminate condition LS_Cp (characteristic quantity of trooping with the image information that constitutes determining defects information ee is a center of gravity, has certain size) of expression reflection update information kk.

During repairing is afterwards handled, when having imported the determining defects information ee that represents to be comprised in the trooping of this illuminate condition LS_Cp, even for example determining defects information ee belongs under the situation of trooping of expression illuminate condition LS_C2, illuminate condition resume handling part 41 is also read illuminate condition LS_Cp from illuminate condition resume storage part 42, send to illuminate condition configuration part 43 as illuminate condition record information jj.Like this, the priority height of trooping of the expression illuminate condition that the priority ratio of trooping of the expression illuminate condition that generates based on operating personnel's correction generated in the past, often " study " operating personnel's indication thus further realizes intelligentized repairing processing.

Figure 17 A, 17B have illustrated that the operating personnel changes to new illuminate condition with existing illuminate condition, promptly cut apart existing trooping and form new group's situation, be replaced into other existing illuminate condition (cut apart and troop also and other the merging of trooping) etc. but also current repairing can be handled the illuminate condition that is determined.In the present embodiment, as long as the operating personnel revises once, just can reflect later the repairing processing of revising content, so can significantly alleviate operating personnel's work.

Figure 18 A～18D is the figure that use-case and view data are contrasted with the record information of the illuminate condition in the present embodiment, and the change according to the illuminate condition of operating personnel's correction particularly is shown.Shown in Figure 18 A, when the defect image data comprise foreign matter 1801, and around foreign matter 1801, exist under the situation of hyaline membrane, even from the benchmark image data, extract defective part out, also be difficult to extract out hyaline membrane.Therefore, have only foreign matter 1801 to be regarded as defective part like this, if be judged as not short circuit between different potentials, what for to might not being set to irradiation area.Therefore, shown in Figure 18 B, the irradiation area during to the 1st laser radiation is revised by operating personnel's correction.At this moment, the operating personnel also revises other illuminate condition of irradiation number of times or laser energy etc. as required.This correction result is as the new illuminate condition for current determining defects information, to be stored in the illuminate condition resume storage part 42.

Afterwards, if the defect image data shown in Figure 18 C, then because these defect image data have the defective part with the defect image data similar characteristics of Figure 18 A, so the determining defects information of new defect image data generates the close information of determining defects information with former defect image data.

After the determining defects information of the new defect image data of illuminate condition resume handling part 41 inputs, illuminate condition resume handling part 41 judges that the illuminate condition that upgrades when the operating personnel revises among Figure 18 B also meets current illuminate condition.Defect shape view data during under this situation the 1st time irradiation is shown in Figure 18 D.Like this, even similar inspected object when occurring revising with the operating personnel, also the illuminate condition that can upgrade when revising is realized correcting process.Even it is a plurality of that similar inspected object occurs, as long as carrying out 1 time, the operating personnel revises, remaining with regard to repairing processing according to the content of correction automatically, can realize checking the efficient activity of self.

As mentioned above, the information of utilizing when the laser repairing device of present embodiment determines illuminate condition (information that obtains from image information) is stored explicitly with illuminate condition, to current correction object decision illuminate condition the time, from before the resume of illuminate condition read illuminate condition.Thus, learn the relation between illuminate condition and the image information, can realize the efficient activity of the decision processing of illuminate condition.Particularly, when carrying out the correction of illuminate condition by the operating personnel, information by the condition that will be corrected and illuminate condition decision is stored explicitly, under for the situation that after this similarly inspected object is handled, the operating personnel need not to carry out correction once more, from the illuminate condition resume, read illuminate condition and get final product, so can realize according to operating personnel's purpose repairing automatically handling.

More than, with reference to accompanying drawing embodiments of the present invention are had been described in detail, but concrete structure is not limited to these embodiments, also comprise the design alteration etc. in the scope that does not break away from aim of the present invention.

Claims (10)

1. a laser repairing device shines from LASER Light Source institute emitting laser the correction subject area on the inspected object, it is characterized in that having:

Image unit, it takes described inspected object to generate image information;

Graphics processing unit, it is from the described image information that described image unit generated, and generates determining defects information, according to described determining defects information, the illuminate condition during the described laser of decision irradiation;

The laser shaping unit, it carries out shaping according to the described illuminate condition that described graphics processing unit determined to described laser; And

Illuminating optical system, its described laser after to described correction subject area irradiation shaping.

2. laser repairing device according to claim 1 is characterized in that,

Described laser shaping unit has:

The spatial modulation device, it is had a plurality of micro devices in one dimension direction or two-dimensional directional arrangement by the described laser radiation from described LASER Light Source; And

Spatial modulation device control module, it controls the state of described spatial modulation device according to described illuminate condition.

3. laser repairing device according to claim 2 is characterized in that, described spatial modulation device control module is controlled the state of described spatial modulation device according to the shape of described correction subject area.

4. according to claim 2 or the described laser repairing device of claim 3, it is characterized in that, described spatial modulation device control module is used information with the laser radiation prohibited area of described inspected object with the covering of described correction subject area of opposing, and controls the state of described spatial modulation device.

5. according to claim 2 each described laser repairing device to the claim 3, it is characterized in that described spatial modulation device control module was controlled the having or not of described laser radiation in each the described micro devices that constitutes described spatial modulation device.

6. according to claim 1 each described laser repairing device to claim 3, it is characterized in that, the information that described graphics processing unit uses when having explicitly the described illuminate condition of storage decision and the illuminate condition resume storage unit of described illuminate condition, when the described illuminate condition of decision, read described illuminate condition by the past of described illuminate condition resume cell stores.

7. according to claim 1 each described laser repairing device to claim 3, it is characterized in that described determining defects information is that one or more information is obtained color, area, brightness, position and the number of the defective in described correction subject area.

8. according to claim 1 each described laser repairing device to claim 3, it is characterized in that, by the described illuminate condition that described graphics processing unit determined comprise the irradiation number of times of described laser, with the corresponding shot shape of each irradiation, shine the energy of corresponding described laser and shine in oscillation period of corresponding described laser one or more with each with each.

9. according to claim 1 each described laser repairing device to claim 3, it is characterized in that described graphics processing unit comparison decides described correction subject area about the benchmark image information of described inspected object and the described image information that is generated by described image unit.

10. according to claim 1 each described laser repairing device to claim 3, it is characterized in that, has image-display units, it shows the image of described inspected object, and superposition show the expression defective shape image and represent in the image of shape of irradiation area of described laser one or more.

Images