M407586 五、新型說明： 【相關申請案交叉參考】 茲引用2009年3月2日提出申請且名稱為「一種用於電路修復 之方法及系統（A Method and System for Electrical Circuit Repair )」 之以色列專利申請案第197349號。 【新型所屬之技術領域】 本創作大體而言係關於電路修復。 【先前技術】 據信，以下出版物代表本領域之技術現狀： 美國專利 4,752,455、4,970，196、4,987,006、5，173,441 以及 5,292,559 ； 「自被支撐之金屬膜進行金屬沈積（Metal deposition from a supported metal film)」Bohandy、B.F. Kim 以及 F.J. Adrian，應用 物理學期刊（j. Appl. Phys.) 60 (1986) 1538 ;以及M407586 V. New Description: [Cross-Reference to Related Applications] I quote the Israeli patent entitled "A Method and System for Electrical Circuit Repair" filed on March 2, 2009. Application No. 19749. [Technical field to which the new type belongs] This creation is generally related to circuit repair. [Prior Art] The following publications are believed to represent the state of the art in the art: U.S. Patents 4,752,455, 4,970,196, 4,987,006, 5,173,441, and 5,292,559; "Metal deposition from a supported metal." Film)"Bohandy, BF Kim and FJ Adrian, J. Appl. Phys. 60 (1986) 1538;
「對藉由雷射引致正向轉移製程而進行金屬沈積之機制的研究 (A study of the mechanism of metal deposition by the laser-induced forward transfer process )」F. J. Adrian、J. Bohandy、B. F. Kim 以 及 A. N. Jette，真空科技期刊（Journal of Vacuum Science and Technology) B5, 1490 (1989)，第 1490-1494 頁。 【新型内容】 本創作旨在提供一種施體基板總成（donor substrate assembly) ’ 其用於進行電路修復之系統及方法中。 M407586 因此，根據本創作之一實施例，提供一種施體基板總成，該施 體基板總成適用於—種_雷射或至少—個雷射束傳遞路徑來修 復電路之方法及/或系統中。該施體基板總成包含—施體基板以及 包體土板支撐基座’该施體基板支稽基座用以使該施體基板保 持與電路基板上卿叙導體之至少—個導體純區域相距一預 定之垂直間距。 根據本創作之另-較佳實施例，亦提供一種適用於修復一電路 之施體基板總成，該施體基板總成包含—施體基板以及一施體基 板支撐基座，該施體基板支撐基座用以使該施體基板保持與一電 路上之至少一個導體修復區域相距一預定之垂直間距。 較佳地，該施體基板係由一板形成，該板在一側上塗覆有一導 體材料薄層。另外，該導體材料薄層係由G5微米至3微米厚之銅 形成。另外，該板係由丨毫米厚之玻璃形成，且該導體材料層係 為1微米厚之鋼。 根據本創作之一較佳實施例，該施體基板支撐基座係為大致U 形且包含一大致平面狀之中心部以及多個臂。另外，該大致平面 狀之中心部形成有一最内側凹槽，在最内側凹槽中設置有一黏人 劑層。另外，該大致平面狀之中心部形成有一最外側凹槽，在該 最外側凹槽中設置有一由順磁性材料形成之盤，該盤係藉由該黏 合劑層予以固定。 根據本創作之一較佳實施例，該施體基板支撐基座於其—頂面 上包含—對定位導向件（positioning guide )，該對定位導向件包含 傾斜表面’該等傾斜表面被設置成用以精確嚙合一接駁模組之對 M407586 應表面，藉以相對於該接駁模組對該施體基板提供精確且穩定之 定位。 較佳地，該施體基板支撐基座於其一大致平面狀之中心部及多 個臂的朝向底部之内邊緣上包含用於施體基板之支撐面。另外， 該等朝向底部之内邊緣設置有一黏合劑層，該黏合劑層嚙合該施 體基板之對應邊緣，藉此將該施體基板固定至該基座。 根據本創作之一較佳實施例，該導體材料層之一底面自基座之 底面凹陷達一精確之預定距離，該精確之預定距離對應於該預定 間距。另外，該精確之預定距離係介於50微米與300微米之間。 作為另外一種選擇，該精確之預定距離係為50微米。 根據本創作之又一較佳實施例，更提供一種適用於修復一電路 之施體基板總成。該施體基板總成包含一施體基板、一施體基板 支撐基座以及一可磁性嚙合之元件。該施體基板支撐基座用於支 稽'施體基板。該可磁性喷合之元件則安裝於該施體基板支稽'基座 上，以用於將該施體基板可移除地固定於一接驳模組上。 根據本創作之再一較佳實施例，亦提供一種適用於修復一電路 之施體基板總成。該施體基板總成包含一施體基板以及一施體基 板支樓基座 '該施體基板支撐基座用於支撐該施體基板。該施體 基板支撐基座於其一頂面上包含一對定位導向件，該對定位導向 件包含傾斜表面，該等傾斜表面被設置成精確嚙合一接驳模組之 對應表面，藉以相對於該接驳模組對該施體基板提供精確且穩定 之定位。 5 M407586 為讓上述目的、技術特徵、和優點能更明顯易懂，下文係以較 佳實施例配合所附圖式進行詳細説明。 【實施方式】 現在，請參見第1圖，其係為在一種用於修復電路之系統之環 境中，根據本創作一實施例進行構造及操作之一施體基板總成100 之簡化示意圖。"A study of the mechanism of metal deposition by the laser-induced forward transfer process" FJ Adrian, J. Bohandy, BF Kim and AN Jette Journal of Vacuum Science and Technology B5, 1490 (1989), pp. 1490-1494. [New Content] The present invention aims to provide a donor substrate assembly that is used in systems and methods for circuit repair. M407586 Thus, in accordance with an embodiment of the present invention, a donor substrate assembly is provided that is suitable for use in a method and/or system for repairing an electrical circuit or a laser beam delivery path . The donor substrate assembly includes a donor substrate and a inclusion soil support base. The donor substrate is mounted to maintain the donor substrate at least one conductor pure region of the conductor on the circuit substrate. The predetermined vertical spacing. According to another preferred embodiment of the present invention, there is also provided a donor substrate assembly suitable for repairing a circuit, the donor substrate assembly comprising: a donor substrate and a donor substrate support pedestal, the donor substrate support base The holder is adapted to maintain the donor substrate at a predetermined vertical distance from at least one of the conductor repair regions on a circuit. Preferably, the donor substrate is formed from a sheet coated on one side with a thin layer of a conductor material. Further, the thin layer of the conductor material is formed of copper of G5 micrometers to 3 micrometers thick. Further, the plate is formed of 丨 mm thick glass, and the conductor material layer is 1 μm thick steel. In accordance with a preferred embodiment of the present invention, the donor substrate support base is generally U-shaped and includes a generally planar central portion and a plurality of arms. Further, the substantially planar central portion is formed with an innermost groove, and an adhesive layer is disposed in the innermost groove. Further, the substantially planar central portion is formed with an outermost groove in which a disk formed of a paramagnetic material is provided, the disk being fixed by the adhesive layer. According to a preferred embodiment of the present invention, the donor substrate support base includes on its top surface a pair of positioning guides, the pair of positioning guides including inclined surfaces 'the inclined surfaces are configured to be used The surface of the M407586 should be precisely engaged with a docking module to provide accurate and stable positioning of the donor substrate relative to the docking module. Preferably, the donor substrate support base includes a support surface for the donor substrate on a substantially planar central portion thereof and an inner edge of the plurality of arms facing the bottom. Additionally, the inner edges toward the bottom are provided with an adhesive layer that engages corresponding edges of the donor substrate, thereby securing the donor substrate to the base. According to a preferred embodiment of the present invention, a bottom surface of the conductor material layer is recessed from the bottom surface of the base by a predetermined predetermined distance, the precise predetermined distance corresponding to the predetermined pitch. Additionally, the precise predetermined distance is between 50 microns and 300 microns. Alternatively, the precise predetermined distance is 50 microns. According to still another preferred embodiment of the present invention, a donor substrate assembly suitable for repairing a circuit is further provided. The donor substrate assembly includes a donor substrate, a donor substrate support pedestal, and a magnetically engageable component. The donor substrate support pedestal is used to support the donor substrate. The magnetically sprayable component is mounted on the donor substrate support base for removably securing the donor substrate to a docking module. According to still another preferred embodiment of the present invention, a donor substrate assembly suitable for repairing a circuit is also provided. The donor substrate assembly includes a donor substrate and a donor substrate support base. The donor substrate support base supports the donor substrate. The donor substrate support base includes a pair of positioning guides on a top surface thereof, the pair of positioning guides include inclined surfaces that are configured to accurately engage corresponding surfaces of a docking module, thereby The docking module provides accurate and stable positioning of the donor substrate. 5 M407586 To make the above objects, technical features, and advantages more apparent, the following detailed description will be made in conjunction with the preferred embodiments. [Embodiment] Referring now to Figure 1, a simplified schematic diagram of a donor substrate assembly 100 constructed and operative in accordance with an embodiment of the present invention in the context of a system for repairing circuitry.
如第1圖所示，該系統較值包含一框架101 ’樞架101較佳安裝 於一傳統光學平台102上。框架101界定一電路檢查/修復位置 1〇4，可將所欲檢查/修復之一電路（例如一印刷電路板（printed circuit board ; PCB) 106)放置於電路檢查/修復位置1〇4上。pCB 通常具有例如導體過量缺陷以及導體缺失缺陷等各種類型之 缺陷其中之一或多種，例如切口 110。 -橋接器(bddge)l 12被設置成沿-第-檢查/修復軸線i 14而相 ^於檢查/修復位置HM進行線性運動，其中第—檢查/修復轴線 14係相對於框架ΠΗ予以界定…光學頭總心16妓置成沿一 =檢查/修復減118相對於橋接器U2進行線性運動，其中第 一檢查/修復軸線118係垂直於第一檢查/修復軸線ιΐ4 '、 根據本創作之一實施例，光學頭總成U6 子總成12〇。 佳包含—檢查/修復 較佳亦 估w 較佳包, 阳者介面（user interface) 128之一電腦1 檢查/修復子總成12〇之軟件模組。控制：匕3用； 峡丨24較佳自一丨 M407586 學檢查系統（圖未示出）接收一缺陷位置輸入，該自動光學檢查 糸統例如為可自位於以色列Yavne之Orbotech有限公司購得之 Discovery 8000 系統等。As shown in Fig. 1, the system comparison includes a frame 101' pivot 101 preferably mounted on a conventional optical table 102. The frame 101 defines a circuit inspection/repair position 1〇4, and one of the circuits to be inspected/repaired (e.g., a printed circuit board (PCB) 106) can be placed in the circuit inspection/repair position 1〇4. The pCB typically has one or more of various types of defects such as excess conductor defects and conductor missing defects, such as the slits 110. a bridge (bddge) 12 is arranged to perform a linear motion along the -th-check/repair axis i 14 in relation to the inspection/repair position HM, wherein the first inspection/repair axis 14 is defined relative to the frame ΠΗ The optical head center 16 is placed in linear motion relative to the bridge U2 along an = check/repair minus 118, wherein the first inspection/repair axis 118 is perpendicular to the first inspection/repair axis ι 4 ', according to the present creation In one embodiment, the optical head assembly U6 subassembly is 12 turns. Good inclusion - check / repair better also estimate w better package, user interface 128 (computer interface) one computer 1 check / repair sub-assembly 12 〇 software module. Control: 匕3; The gorge 24 preferably receives a defect position input from a M407586 inspection system (not shown), such as that available from Orbotech Ltd. of Yavne, Israel. Discovery 8000 system, etc.
檢查/修復子總成120較佳包含一基座13〇，基座13〇上支撐有 一照相機132 ’例如可自位於美國賓夕法尼亞州Ext〇n之jgasier 公司獲得之Basler CMOS照相機。照相機132透過一聚焦物鏡 139、一局部反射鏡142以及一物鏡模組144沿一光軸136觀察PCB 1 〇6上之一成像位置134’其中聚焦物鏡139具有一 100 mm至150 mm之典型焦距，物鏡模組144則例如係為可自曰本之Mitutoyo 有限公司購得之5x/0.14物鏡模組。 基座130之底面上安裝有一三維電動致動器（three-dimensional motorized actuator) 140,例如可自位於美國加利福尼亞州SantaThe inspection/repair subassembly 120 preferably includes a base 13 that supports a camera 132' such as a Basler CMOS camera available from Jgasier, Inc. of Extn, PA. The camera 132 observes an imaging position 134' on the PCB 1 〇 6 along an optical axis 136 through a focusing objective 139, a partial mirror 142, and an objective lens module 144. The focusing objective 139 has a typical focal length of 100 mm to 150 mm. The objective lens module 144 is, for example, a 5x/0.14 objective lens module commercially available from Mitutoyo Co., Ltd. of Sakamoto. A three-dimensional motorized actuator 140 is mounted on the bottom surface of the base 130, for example, from Santa, California, USA.
Clara 之 New Focus 公司或自 Newport 公司 (http://www.newport.com/)購得之 New Focus Model 9064 或 9065。一接驳模組（docking module) 150安裝於致動器140上， • 並適以在其上面可移除地安裝施體基板總成100。電動致動器140 在至少一個維上且較佳在二或三個維上，相對於基座130對接駁 模組150並因此對施體基板總成1〇〇提供可選擇之定位。 檢查/修復子總成120較佳包含一用於產生一脈衝雷射束154之 一脈衝雷射源152 ’例如可自位於法國Grenoble之Teem Photonics 公司獲得之被動式Q開關顯微雷射（passive Q-switch micro laser )。視應用而定，適合之顯微雷射可選自例如用於以532 nm 之一波長或以1064 nm之一波長輸出光束之雷射頭。 M407586 脈衝束154穿過準直光學器件158,準直光學器件158用於使雷 射束154準直至為0.5 mm至3.0 mm之一較佳光點大小（spot size)，準直光學器件158可包含焦距分另1J為80 mm及-150 mm之 二透鏡160及162。然後，雷射束154被一反射鏡174反射並被一 擴束器176調整至一特定直徑，擴束器176包含多個透鏡178,該 等透鏡178被放置及調整成使準直之輸出光束具有所需之大小。 透鏡178可分別包含例如一 28 mm平凸透鏡（plano-convex )、一 -10 mm雙凹透鏡（biconcave lens)以及一 129 mm平凸透鏡 (plano-convex )等透鏡。 接著，一透鏡180對雷射束154進行定向，以照射於一可自 Newport公司購得之雙車由式快速控制反射鏡（fast steering mirror ; FSM) 182，並然後經過透鏡184 (例如一 108 mm彎月形透鏡 (meniscus lens ))、一反射鏡186以及一透鏡188(例如一平凸338 mm透鏡）。透鏡180、184及188用於保持光束於FSM 182上之 位置。接著，光束154照射於一分束器（beam splitter ) 190上， 分束器190引導光束154沿一軸線136穿過物鏡模組144並穿過 安裝於接駁模組150上之施體基板總成100,藉此執行修復功能。 現在，請參見第2圖及第3圖，其例示將施體基板總成100安 裝於接駁模組150上之情形。第2圖係為施體基板總成100在嚙 合接駁模組150之前之簡化示意圖，第3圖則為施體基板總成100 嚙合接驳模組150之簡化示意圖。如第2圖所示，接驳模組150 較佳包含一外殼192,具有一安裝銷196之一安裝托架194附裝至 外殼192上，安裝托架194則可安裝至致動器140上。 M407586 外殼192較佳包含一對傾斜側面197，該對傾斜側面197用於使 施體基板總成100相對於外殼192精確地放置，如下文所述。 一電磁鐵198安裝於外殼192中，並於其下側上界定一磁性嚙 合表面199,以於接驳模組150與施體基板總成100之間提供可移 除之嚙合，如下文所進一步說明。 現在’請參見第4A圖及第4B圖’其分別係為顯示施體基板總 . 成丨〇〇之頂部及底部之簡化示意圖，並參見第5圖，其係為第4A • 圖及第4B圖之施體基板總成沿第4A圖中之線V-V截取之剖面簡 化示意圖。 如第4A圖、第4B圖及第5圖所示，施體基板總成1〇〇較佳包 含一施體基板200及一施體基板支撐基座202,施體基板支撐基座 2〇2用以使施體基板2〇〇保持與Pcb 1〇6 (第1圖）上所形成之導 體之一導體修復區域相距一預定之垂直間距。 化體基板200較佳係為平面狀，具有〇.5 mm至3 mm之一厚度， φ 並且通常係由板2〇4形成，板204具有對雷射束154 (第1圖）之 波長透明之材質（例如玻璃或塑膠），板2〇4於其下側表面上塗覆 有至少一個導體材料薄層2〇6，例如〇 5微米至3微米厚之銅。在 所例示之實施例中’板2〇4係由1毫米（mm)厚之玻璃形成，且 導體材料層206係為1微米厚之銅。 尤其如第5圖所示，施體基板支撐基座2〇2較佳係為大致u形， 且包含一大致平面狀之中心部210以及多個臂212。大致平面狀之 中心部210較佳形成有一最内側凹槽214，於最内側凹槽214之至 9 M407586 少一部分中設置有一黏合劑218，例如可自位於阿根廷vula Ballester Buenos Aires 之 Akapol SA.公 司New Focus from Clara or New Focus Model 9064 or 9065 from Newport (http://www.newport.com/). A docking module 150 is mounted to the actuator 140 and is adapted to removably mount the donor substrate assembly 100 thereon. The electric actuator 140 provides selectable positioning relative to the base 130 to the docking module 150 and thus to the donor substrate assembly 1 至少 in at least one dimension and preferably in two or three dimensions. The inspection/repair subassembly 120 preferably includes a pulsed laser source 152 for generating a pulsed laser beam 154', such as a passive Q-switched microscopic laser obtained from Teem Photonics, Inc. of Grenoble, France (passive Q) -switch micro laser ). Depending on the application, suitable micro-lasers may be selected, for example, from a laser head for outputting a beam of light at one of 532 nm or one of 1064 nm. The M407586 pulsed beam 154 passes through the collimating optics 158, and the collimating optics 158 are used to align the laser beam 154 up to a preferred spot size of 0.5 mm to 3.0 mm. The collimating optics 158 can Two lenses 160 and 162 having a focal length of 1 J of 80 mm and -150 mm are included. The laser beam 154 is then reflected by a mirror 174 and adjusted to a particular diameter by a beam expander 176. The beam expander 176 includes a plurality of lenses 178 that are placed and adjusted such that the collimated output beam has The size required. Lens 178 may each comprise a lens such as a 28 mm plano-convex, a -10 mm biconcave lens, and a 129 mm plano-convex. Next, a lens 180 orients the laser beam 154 to illuminate a two-vehicle fast steering mirror (FSM) 182, available from Newport Corporation, and then through a lens 184 (e.g., a 108). A mm meniscus lens, a mirror 186, and a lens 188 (eg, a plano-convex 338 mm lens). Lenses 180, 184 and 188 are used to maintain the position of the beam on FSM 182. Next, the beam 154 is incident on a beam splitter 190 that directs the beam 154 through the objective lens module 144 along an axis 136 and through the donor substrate mounted on the docking module 150. Into 100, to perform the repair function. Referring now to Figures 2 and 3, the application of the donor substrate assembly 100 to the docking module 150 is illustrated. 2 is a simplified schematic view of the donor substrate assembly 100 prior to engagement with the docking module 150, and FIG. 3 is a simplified schematic view of the donor substrate assembly 100 mating receptacle module 150. As shown in FIG. 2, the docking module 150 preferably includes a housing 192 having a mounting pin 196 to which the mounting bracket 194 is attached to the housing 192, and the mounting bracket 194 is mountable to the actuator 140. . The M407586 housing 192 preferably includes a pair of angled sides 197 for accurately placing the body substrate assembly 100 relative to the housing 192, as described below. An electromagnet 198 is mounted in the housing 192 and defines a magnetic engagement surface 199 on the underside thereof to provide removable engagement between the docking module 150 and the donor substrate assembly 100, as further described below Description. Now, please refer to Figure 4A and Figure 4B for a simplified schematic diagram showing the top and bottom of the donor substrate. See Figure 5 for the 4A and Figure 4B. A simplified schematic cross-sectional view of the donor substrate assembly taken along line VV in FIG. 4A. As shown in FIG. 4A, FIG. 4B and FIG. 5, the donor substrate assembly 1 〇〇 preferably includes a donor substrate 200 and a donor substrate support pedestal 202, and the donor substrate support pedestal 2 〇 2 The donor substrate 2 is held at a predetermined vertical distance from one of the conductor repair regions of the conductor formed on Pcb 1〇6 (Fig. 1). The chemical substrate 200 is preferably planar, having a thickness of one of 55 mm to 3 mm, φ and usually formed by a plate 2〇4 having a wavelength transparent to the laser beam 154 (Fig. 1). The material (for example, glass or plastic), the plate 2〇4 is coated on its underside surface with at least one thin layer 2 of conductor material, for example, 5 to 3 micrometers thick copper. In the illustrated embodiment, the 'plate 2〇4 is formed of 1 mm thick glass, and the conductive material layer 206 is 1 μm thick copper. In particular, as shown in FIG. 5, the donor substrate support base 2〇2 is preferably substantially U-shaped and includes a substantially planar central portion 210 and a plurality of arms 212. The substantially planar central portion 210 is preferably formed with an innermost recess 214, and an adhesive 218 is disposed in a portion of the innermost recess 214 to 9 M407586, for example, from Akapol SA., located in Vula Ballester Buenos Aires, Argentina.
(http://www.akapol.com/)購得之 P〇xip〇L® !〇 MINUTE cLEAR EPOXY ( http://www.poxipol.com/)。一由順磁性材料形成之盤 22〇 位於一最外側凹槽222中，並藉由一黏合劑218固定於最外側凹 槽222中。電磁鐵丨98與盤220間之磁性吸引能夠達成施體基板 總成100於接驳模組150上之可移除地安裝喃合。 尤其如第4A圖所示，基座202之一頂面上形成有一對定位導向 件230,該對定位導向件230包含傾斜表面232,該等傾斜表面232 被设置成用以精確喃合接駁模組150之對應傾斜表面197，以相對 於接驳模組150對施體基板200提供精確定位。本創作之—具體 特點在於’傾斜表面232與接駁模組150之對應傾斜表面197進 行精確之接觸。齒合’尤其如第3圖所示。此種精確之接觸啼合能 夠使施體基板總成100相對於接駁模組150達成所期望的精確且 穩定之定位。 尤其如第4B圖所示，大致平面狀之中心部21〇及臂212之朝向 底部之内邊緣240界定用於施體基板200之支撐面。邊緣240較 佳設置有一黏合劑層242，黏合劑層242包含黏合劑，例如可自位 於阿根廷 Villa Ballester Buenos Aires 之 Akapol S.A.公司 (http://www.akapol.com/)購得之 POXIPOL® 10 MINUTE CLEAR EPOXY (http://www.poxipol.com/)。黏合劑層 242 嚙合板 204 之 朝向頂部之對應邊緣，藉此將施體基板200固定至基座202。尤其 如第5圖所示，可以看出’導體材料層206之外表面自基座202 财07586 之底面凹陷達一精確之預定距離D，該精確之預定距離D介於刈 微米與300微米之間且較佳為5〇微米。 上述之實施例僅用來例舉本創作之實施態樣，以及闡釋本創作 之技術特徵，並非用來限制本創作之保護範疇。任何熟悉此技術 者可I易凡成之改變或均等性之安排均屬於本創作所主張之範 圍，本創作之權利保護範圍應以申請專利範圍為準。 【圖式簡單說明】 Φ 結合附圖閱讀以下詳細說明，將能更全面地理解和領會本創 作，附圖中： 第1圖係為在一種用於修復電路之系統的環境中根據本創作之 一實施例進行構造和操作之施體基板總成之簡化示意圖； 第2圖係為根據本創作之一實施例進行構造和操作之施體基板 總成在嚙合一接驳模組之前之簡化示意圖，形成第丨圖所示之用 於修復電路之系統之一部分； Ψ 第3圖係為根據本創作之一實施例進行構造和操作之施體基板 總成嚙合接驳模組之簡化示意圖，形成第丨圖所示之用於修復電 路之系統之一部分： 第4 A圖及第4B圖分別係為顯示在第1圖至第3圖之環境中根 據本創作之一實施例進行構造和操作之施體基板總成的頂部及底 部之簡化示意圖；以及 第5圖係為第4A圖及第4B圖之施體基板總成沿第4A圖中之 線V-V截取之一剖面簡化示意圖。 M407586 【主要元件符號說明】 100 :施體基板總成 102 :光學平台 106 :印刷電路板 112 :橋接器 116 :光學頭總成 120 :檢查/修復子總成 126 :電腦 130 :基座 134 :成像位置 139 :聚焦物鏡 142 :部分反射鏡 150 :接駁模組 154 :脈衝雷射束 160 :透鏡 101 :框架 104 :電路檢查/修復位置 110 :切口 114 :第一檢查/修復軸線 118 :第二檢查/修復軸線 124 :控制總成 128 :使用者介面 132 :照相機 136 :光軸 140 :三維電動致動器 144 :物鏡模組 152 :脈衝雷射源 158 :準直光學器件 162 :透鏡 174 :反射鏡 176 :擴東器 178 :透鏡 180 :透鏡 182 :雙軸式快速控制反射鏡 184 :透鏡 186 :反射鏡 188 :透鏡 12 M407586(http://www.akapol.com/) purchased P〇xip〇L® !〇 MINUTE cLEAR EPOXY ( http://www.poxipol.com/). A disk 22 formed of a paramagnetic material is located in an outermost groove 222 and is fixed in the outermost groove 222 by an adhesive 218. The magnetic attraction between the electromagnet 丨 98 and the disc 220 enables removably mounting of the donor substrate assembly 100 on the docking module 150. In particular, as shown in FIG. 4A, a pair of positioning guides 230 are formed on one of the top surfaces of the base 202. The pair of positioning guides 230 include inclined surfaces 232 that are configured to accurately align the connections. The corresponding inclined surface 197 of the module 150 provides precise positioning of the donor substrate 200 relative to the docking module 150. The present invention is characterized in that the 'sloping surface 232 is in precise contact with the corresponding inclined surface 197 of the docking module 150. The toothed joints are particularly as shown in Fig. 3. Such precise contact bonding enables the donor substrate assembly 100 to achieve the desired precise and stable positioning relative to the docking module 150. In particular, as shown in Fig. 4B, the substantially planar central portion 21 and the inner edge 240 of the arm 212 facing the bottom define a support surface for the donor substrate 200. The edge 240 is preferably provided with an adhesive layer 242, and the adhesive layer 242 comprises an adhesive such as POXIPOL® 10 available from Akapol SA (http://www.akapol.com/), Villa Ballester Buenos Aires, Argentina. MINUTE CLEAR EPOXY (http://www.poxipol.com/). Adhesive layer 242 engages the corresponding edge of the top plate 204 toward the top, thereby securing the donor substrate 200 to the base 202. In particular, as shown in FIG. 5, it can be seen that the outer surface of the conductor material layer 206 is recessed from the bottom surface of the pedestal 202 065 to a precise predetermined distance D, which is between 刈 micrometers and 300 micrometers. It is preferably 5 μm. The above embodiments are only used to exemplify the implementation of the present invention, and to explain the technical features of the present invention, and are not intended to limit the scope of protection of the present invention. Any change or equivalence of the person who is familiar with the technology is subject to the scope of this creation. The scope of protection of this creation shall be subject to the scope of the patent application. BRIEF DESCRIPTION OF THE DRAWINGS The present invention will be more fully understood and appreciated by reading the following detailed description in conjunction with the accompanying drawings in which: FIG. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 2 is a simplified schematic view of a donor substrate assembly constructed and operative; FIG. 2 is a simplified schematic view of a donor substrate assembly constructed and operative in accordance with an embodiment of the present invention prior to engaging a docking module Forming a portion of the system for repairing the circuit shown in the first diagram; Ψ Figure 3 is a simplified schematic diagram of the body substrate assembly engagement module constructed and operated in accordance with an embodiment of the present invention, forming Part of the system for repairing the circuit shown in the figure: Figures 4A and 4B are respectively constructed and operated according to an embodiment of the present invention in the environment of Figures 1 to 3, respectively. A simplified schematic view of the top and bottom of the donor substrate assembly; and FIG. 5 is a simplified cross-sectional view of the donor substrate assembly of FIGS. 4A and 4B taken along line VV of FIG. 4A. M407586 [Main component symbol description] 100: donor substrate assembly 102: optical table 106: printed circuit board 112: bridge 116: optical head assembly 120: inspection/repair sub-assembly 126: computer 130: pedestal 134: Imaging position 139: Focusing objective 142: Partial mirror 150: Connection module 154: Pulsed laser beam 160: Lens 101: Frame 104: Circuit inspection/repair position 110: Notch 114: First inspection/repair axis 118: Second inspection/repair axis 124: Control assembly 128: User interface 132: Camera 136: Optical axis 140: Three-dimensional electric actuator 144: Objective lens module 152: Pulsed laser source 158: Collimation optics 162: Lens 174 : Mirror 176 : Expander 178 : Lens 180 : Lens 182 : Two-axis Quick Control Mirror 184 : Lens 186 : Mirror 188 : Lens 12 M407586
218 ： 222 232 ： 242 分束器 - 192 :外殼 安裝托架 196 :安裝銷 傾斜側面 198 :電磁鐵 磁性喷合表面 200 :施體基板 施體基板支樓基座 204 :板 薄層 210 :大致平面狀之中心部 臂 214 :最内側凹槽 黏合劑 220 :盤 最外側凹槽 230 :定位導向件 傾斜表面 240 :朝向底部之内邊緣 黏合劑層 190 : 194 : 197 ： 199 ： 202 ： 206 ： 212 ：218 : 222 232 : 242 beam splitter - 192 : housing mounting bracket 196 : mounting pin inclined side 198 : electromagnet magnetic spray surface 200 : donor substrate donor substrate branch base 204 : plate thin layer 210 : approximate Planar central arm 214: innermost groove adhesive 220: disk outermost groove 230: positioning guide inclined surface 240: inner edge adhesive layer 190 facing the bottom: 194: 197: 199: 202: 206: 212 :
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