CN102189332A - Laser processing method and laser processing device - Google Patents
Laser processing method and laser processing device Download PDFInfo
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- CN102189332A CN102189332A CN2011100598721A CN201110059872A CN102189332A CN 102189332 A CN102189332 A CN 102189332A CN 2011100598721 A CN2011100598721 A CN 2011100598721A CN 201110059872 A CN201110059872 A CN 201110059872A CN 102189332 A CN102189332 A CN 102189332A
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1306—Details
- G02F1/1309—Repairing; Testing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0869—Devices involving movement of the laser head in at least one axial direction
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- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Laser Beam Processing (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a laser processing method and a laser processing device, which can correct defects reliably. The laser processing method corrects defects on a substrate by using laser. Wherein the laser processing method comprises a defect position information obtaining step (S1) for obtaining position information of a defect, irradiation part relative moving steps (S2, S8) for enabling a laser irradiation part irradiating the laser and the substrate to move relatively according to the position information so that the defect is in a region which can be irradiated by the laser irradiation part, and laser irradiating steps (S9, S10) for utilizing the laser irradiation part to irradiate the laser in an irradiation region which has nothing to do with the defect position and is arranged in the non-pattern region of the substrate.
Description
Technical field
The present invention relates to the laser processing and the laser processing device that utilize laser that the defective that produces is proofreaied and correct on substrates such as the substrate that is used for LCD (LCD) and other flat-panel monitor (FPD), semiconductor crystal wafer, printed base plate.
Background technology
In the past, when forming patterns such as component, distribution on the glass substrate that is being used for flat-panel monitor (FPD), for example owing to particulate have or not and other manufacturing installations in deposition when forming of environment, film, reason such as ill-exposed, on glass substrate, produce defective sometimes.Therefore, after each pattern forms technology, utilize appearance inspection device to check successively whether to exist defectives such as distribution short circuit, bad connection, broken string, pattern be bad.
At by the defective on the detected glass substrate of this visual examination, carry out coming the Laser Processing (repair and handle) of defect correcting by irradiating laser.Method as Laser Processing, for example can adopt following method: to the Ultra-Violet Laser of variable rectangular opening irradiation from the output of Ultra-Violet Laser transmitter, mobility by each edge of a knife opens and closes the variable rectangular opening, the cross sectional shape of Ultra-Violet Laser is shaped as the rectangle of expectation size and defective is shone.
In addition, known have a following laser processing (for example with reference to patent documentation 1): adopt DMD spatial modulation elements such as (Digital Mirror Device) to carry out the shaping of laser, thereby carry out Laser Processing.So, come laser is carried out shaping, can carry out high-precision Laser Processing by utilizing the spatial modulation element.
In addition, it is also known for following laser processing (for example with reference to patent documentation 2): area of the pattern is being set on the basis of laser preparing prohibited area, to being positioned at defective irradiating laser except that the zone this laser preparing prohibited area.In this laser processing, from take the resulting image of substrate, extract 1 amount of pixels of 1 unit that constitutes repeat patterns out, the area of the pattern of this 1 amount of pixels is set at the laser preparing prohibited area.
Patent documentation 1: TOHKEMY 2007-29983 communique
Patent documentation 2: the international separate edition that discloses No. 2004/099866
But the above-mentioned defective that produces on substrate is attended by minute defects sometimes around it.Mostly this minute defects is to be difficult to detect with AOI such as scanner (Automatic Optical Inspection).
In addition, when utilizing the laser-adjusting defective, the residue of the defective of being brought by Laser Processing disperses towards periphery sometimes.Therefore, promptly allow to defect correcting, the residue that is brought by Laser Processing can become new defective sometimes.
Summary of the invention
In view of above-mentioned actual conditions in the past, the object of the present invention is to provide the laser processing and the laser processing device of defect correcting reliably.
Laser processing of the present invention utilizes the defective on the laser-adjusting substrate, and wherein, above-mentioned laser processing comprises: defective locations information is obtained operation, and it obtains the positional information of above-mentioned defective; The irradiation portion operation that relatively moves, it relatively moves laser irradiating part and the aforesaid substrate of the above-mentioned laser of irradiation according to above-mentioned positional information, so that above-mentioned defective is arranged in the energy irradiation area of this laser irradiating part; And the laser irradiation process, its utilize above-mentioned laser irradiating part to the location independent of above-mentioned defective the irradiation area that is set in the non-area of the pattern of aforesaid substrate shine above-mentioned laser.
Laser processing device of the present invention utilizes the defective on the laser-adjusting substrate, and wherein, above-mentioned laser processing device comprises: laser irradiating part, its irradiating laser; And the relative drive division of irradiation portion, it relatively moves above-mentioned laser irradiating part and aforesaid substrate; Above-mentioned laser irradiating part to the location independent of above-mentioned defective the irradiation area that is set in the non-area of the pattern shine above-mentioned laser.
In the present invention, with the irradiation area irradiating laser of location independent ground in the non-area of the pattern that is set in substrate of defective.Therefore, when correction is attended by the defective of trickle defective around, also can proofread and correct minute defects simultaneously.In addition, the residue that can prevent the defective brought by Laser Processing becomes new defective.Therefore, according to the present invention, defect correcting reliably.
Description of drawings
Fig. 1 be the expression one embodiment of the present invention laser processing device want portion's stereogram;
Fig. 2 is the vertical view of the laser processing device of expression one embodiment of the present invention;
Fig. 3 is the summary construction diagram of the laser processing device of expression one embodiment of the present invention;
Fig. 4 is the flow chart that is used to illustrate the laser processing of one embodiment of the present invention;
Fig. 5 is the key diagram (its 1) with reference to the generation of image that is used for illustrating one embodiment of the present invention;
Fig. 6 is the key diagram (its 2) with reference to the generation of image that is used for illustrating one embodiment of the present invention;
Fig. 7 is the key diagram (its 3) with reference to the generation of image that is used for illustrating one embodiment of the present invention;
Fig. 8 is the key diagram (its 4) with reference to the generation of image that is used for illustrating one embodiment of the present invention;
Fig. 9 is the key diagram (its 1) of setting that is used for illustrating the irradiation area of one embodiment of the present invention;
Figure 10 is the key diagram (its 2) of setting that is used for illustrating the irradiation area of one embodiment of the present invention;
Figure 11 is the key diagram (its 3) of setting that is used for illustrating the irradiation area of one embodiment of the present invention;
Figure 12 is the key diagram (its 4) of setting that is used for illustrating the irradiation area of one embodiment of the present invention;
Figure 13 is the key diagram (its 5) of setting that is used for illustrating the irradiation area of one embodiment of the present invention;
Figure 14 is the key diagram (its 6) of setting that is used for illustrating the irradiation area of one embodiment of the present invention;
Figure 15 is the key diagram (its 7) of setting that is used for illustrating the irradiation area of one embodiment of the present invention;
Figure 16 is the key diagram (its 8) of setting that is used for illustrating the irradiation area of one embodiment of the present invention;
Figure 17 is the key diagram (its 9) of setting that is used for illustrating the irradiation area of one embodiment of the present invention;
Figure 18 is the key diagram (its 10) of setting that is used for illustrating the irradiation area of one embodiment of the present invention;
Figure 19 is the key diagram (its 11) of setting that is used for illustrating the irradiation area of one embodiment of the present invention;
Figure 20 is the key diagram (its 12) of setting that is used for illustrating the irradiation area of one embodiment of the present invention;
Figure 21 is the key diagram (its 13) of setting that is used for illustrating the irradiation area of one embodiment of the present invention;
Figure 22 is the key diagram that is used for illustrating the judgement that the correction of one embodiment of the present invention need be denied;
Figure 23 is the key diagram (its 1) of control that is used for illustrating the spatial modulation element of one embodiment of the present invention;
Figure 24 is the key diagram (its 2) of control that is used for illustrating the spatial modulation element of one embodiment of the present invention;
Figure 25 is the key diagram (its 3) of control that is used for illustrating the spatial modulation element of one embodiment of the present invention;
Figure 26 is the key diagram (its 4) of control that is used for illustrating the spatial modulation element of one embodiment of the present invention;
Figure 27 is the key diagram (its 5) of control that is used for illustrating the spatial modulation element of one embodiment of the present invention.
The specific embodiment
Below, the laser processing and the laser processing device of one embodiment of the present invention are described with reference to accompanying drawing.
Fig. 1～Fig. 3 be the expression one embodiment of the present invention laser processing device 1 want portion's stereogram, vertical view and summary construction diagram.
As Fig. 1～shown in Figure 3, laser processing device 1 comprises that microscope unit 10, LASER Light Source unit 20, control part 30, objective table portion 40,50,2 frames of rack unit are with base portion 60,60, monitor 70, input part 80.In the present embodiment, laser processing device 1 is used to utilize laser to the repairing processing of proofreading and correct as the defective on the substrate 100 of the array base palte of LCD etc.
As shown in Figure 3, microscope unit 10 as laser irradiating part has spatial modulation element 11, object lens switching part 12, image pickup part 13, the dichronic mirror 14 that is shaped as the beam shaping parts of intended shape as the beam cross section with laser, wherein, spatial modulation element 11 for example is DMD (Digital Mirror Device).
11 pairs of laser that sent by LASER Light Source unit 20 of spatial modulation element carry out spatial modulation (shaping).In spatial modulation element 11, for example two-dimensional arrangements has and can shake a plurality of tiny mirror that are controlled to be open mode and closed condition independently in the modulation areas of rectangle.
In addition, in this structure, adopted spatial modulation element, but in addition, also can substitute and use with other element such as liquid crystal groove as DMD as the beam shaping parts.That is, the beam shaping parts are so long as the parts that the beam cross section of laser is shaped as intended shape just comprise any structure.
On object lens switching part 12, utilize object lens switching parts such as not shown nosepiece mechanism, slide mechanism to maintain to comprise correction not judge with switching and need not judge with the high laser of the multiplying power of object lens 12a and shine a plurality of object lens of using object lens (for example 20 times) 12b with object lens (for example 5 times) 12a and than this corrections.
In addition, in the light path between spatial modulation element 11 and object lens switching part 12, dispose the dichronic mirror 14 of reflector laser below vertical towards object lens 12a, 12b.The illumination light that this dichronic mirror 14 sends the Lighting Division by not shown by substrate 100 reflection sees through to the vertical top.
Between spatial modulation element 11 and dichronic mirror 14, dispose not shown imaging len.By with the focal length of this imaging len focal length, the multiplying power of decision object lens 12a, 12b divided by object lens 12a, 12b.
As shown in Figure 3, LASER Light Source unit 20 has the LASER Light Source 21 that sends laser.The laser that is sent by this LASER Light Source 21 is directed to the spatial modulation element 11 of microscope unit 10 via imaging len 22, optical fiber 23 etc.In addition, LASER Light Source 21 sends laser according to predefined oscillating condition (luminous power, wavelength, oscillating impulse width etc.).
In addition, in the present embodiment, in Fig. 1 and Fig. 2, on rack unit 50, illustrate control part 30 as control part, but also can utilize the control part different with the control part 30 on the rack unit 50 carry out the irradiation area of laser described later setting, the image of the image taken by image pickup part 13 is handled, obtain the information of the control of being undertaken by this different control part by control part 30.
As control part 30, can use the information processing terminal, this information processing terminal comprises: have the computer of the extremely configuration of standard, promptly control the CPU of each inscape by executive control program; Storage part, it is made of ROM, RAM, magnetic recording media etc., and storage makes CPU control control program, the working region when being used as the CPU executive control program or the storage area of various data of each inscape; Efferent, it presents various data and notifies the user to monitor shown in Figure 3 (display part) 70; I/F portion, it is provided for carrying out with other equipment the interface function of the reception and the transmission of data.In addition, control part 30 is connected in input part 80 shown in Figure 3 and the above-mentioned monitor 70 that obtains the various data corresponding with the operation of being undertaken by the user.
In addition, making control part 30 carry out Laser Processing described later shown in Figure 4 handles, then for example generating makes control part 30 carry out the control program that process shown in Figure 4 is handled, utilize computer to be stored in advance in the storage medium that can read, make control part 30 from storage medium for example, read this control program and carry out and get final product.
In addition,, can utilize portable storage media etc., but storage medium also can be the storage device that is connected with control part 30 and plays a role as the procedure service device via circuit as utilizing control part 30 to read the storage medium of the control program of being stored.In this case, transmit the transmission signal that utilization represents that the data signal modulation of control program carries ripple to obtain from the procedure service device by circuit as transmission medium, demodulation received in control part 30 transmission signal and playback control program, thus can executive control program.
As shown in Figure 1, objective table portion 40 has: base portion 41, and it has except that shaking structure; Suspension board 42, it is configured on this base portion 41; Not shown substrate maintaining part, it keeps substrate 100; Not shown detent mechanism, it positions substrate 100.
The plate that suspension board 42 for example is the not shown rectangle sheet of rectangular arrangement forms, from the upper surface ejection gas of each plate.Substrate 100 is kept by the aforesaid substrate maintaining part with the state that the ejection because of gas suspends.About the substrate maintaining part, so long as the parts of fixing or supporting substrates 100, any structure can.For example, being made as the structure of fixing bases such as utilizing clamp mechanism, clamping device 100, structure of utilizing a plurality of pin supporting substrates 100 etc. gets final product.
In addition, also can in structure of the present invention, omit above-mentioned suspension board 42.In addition, also can be made as the objective table portion that replaces suspension board 42 and adopt roller mechanism.
As shown in Figure 2, rack unit 50 has frame 51, face side directions X guide portion 52, the upper face side directions X guide portion 53 that is across the door type shape of objective table portion 40.
As shown in Figure 1, frame 51 comprises totally 2 shank 51b (only illustrating 1 in Fig. 1) at the two ends of horizontal beam 51a and this horizontal beam of supporting 51a.In addition, frame 51 moves along Y direction (above-below direction in the paper of Fig. 2) with base portion 60,60 along frame, and the back describes in detail.
Face side directions X guide portion 52 comprise on the front of the horizontal beam 51a that is arranged on frame 51 2 promptly the 1 couple of guide rail 52a, along this guide rail 52a to the slide block 52b of the mobile rectangular plate shape of directions X (left and right directions in the paper of Fig. 2), be fixed on that this slide block 52b goes up and the microscope support 52c of supporting microscope unit 10.
In addition, in the present embodiment, can enough structures that microscope unit 10 is moved realize than the structure simple in structure that substrate 100 is moved, but as the relative drive division of irradiation portion, also can be made as to replace makes aforesaid frame 51 move and structure that substrate 100 is moved along the Y direction along the Y direction, perhaps be made as the structure that substrate 100 is moved along the X-Y direction, as long as microscope unit 10 is relatively moved with respect to the position of substrate 100, any structure can.
Upper face side directions X guide portion 53 comprises on the upper surface of the horizontal beam 51a that is arranged on frame 51 2 the i.e. slide block 53b of the 1 couple of guide rail 53a, the rectangular plate shape that moves along this guide rail 53a.
In addition, the LASER Light Source unit 20 that is configured on the face side directions X guide portion 52 is connected with microscope unit 10 on being configured in upper face side directions X guide portion 53 by optical fiber 23, so the same moved further of slide block 53b of the slide block 52b of face side directions X guide portion 52 and upper face side directions X guide portion 53.
As shown in Figure 2, frame is configured to across objective table portion 40 toward each other with base portion 60,60.Each frame has pedestal 61 and Y direction guide portion 62 with base portion 60.
Y direction guide portion 62 comprises that 2 on the upper surface that is arranged on pedestal 61 are 1 couple of guide rail 62a.This guide rail 62a for example utilizes linear motor and by rack unit 50 microscope unit 10 is moved along the Y direction.So, the relative drive division of irradiation portion that relatively moves as the position that makes microscope unit 10 with respect to substrate 100 in the same manner of Y direction guide portion 62 and above-mentioned face side directions X guide portion 52 and playing a role.
Below, after the setting that has illustrated with reference to the generation of image and irradiation area, the flow chart of Laser Processing shown in Figure 4 is described.
＜with reference to the generation of image 〉
Fig. 5～Fig. 8 is the key diagram with reference to the generation of image that is used for illustrating present embodiment.
The user can generate with reference to image in not shown setting picture while the image display window of confirming to be presented in monitor shown in Figure 3 70 grades shown in Figure 5 300.
At first, the user sets the size of the photographic images 311 in the image displaying part 310 that is presented at image display window 300.This photographic images 311 be used to select shown in Figure 7 with reference to pattern image image 312, substrate 100.In addition, with reference to reference to image 312, the back describes in detail in the setting of the irradiation area of laser, the judgement that defective need not proofreaied and correct etc.
The size of following setting photographic images 311 gets final product, that is: shown in Figure 7 with reference to image 312 when having periodic repeat patterns 200 (in Fig. 5, illustrating) with double dot dash line, the size of photographic images 311 is bigger than repeating pattern 200, and for example length and width (directions X Y direction) are respectively about 1.5 times of size of repeat patterns 200.In addition, repeat patterns 200 for example is made of RGB3 the pixel that is made of scan line 210, data wire 220 and component 230 respectively.
Then, the user for example will be presented at 1 periodic quantity that is adjusted into repeat patterns with reference to the big or small position of the thick frame C in the image 312 (, the frame of actual displayed on image display window 300 different with the double dot dash line of expression repeat patterns 200) as shown in Figure 6 with the mouse of input part shown in Figure 3 80 etc.Thus, the zone of selecting with thick frame C newly is registered as shown in Figure 7 with reference to image 312.
As shown in Figure 8, by bonding continuously and be generated as bond graph as 313 in length and breadth, the pattern match of operation (S4), the setting of irradiation area described later etc. need not be judged in the correction that can be used in the flow process of Laser Processing shown in Figure 4 with reference to image 312 (illustrating with double dot dash line).In addition, by showing that with need not judge the substrate 100 picture registrations ground of taking with the object lens of the low range of object lens 12a etc. with the correction of microscope unit 10 bond graph as 313, can confirm to have or not generation error.
＜irradiation area is set 〉
Fig. 9～Figure 21 is the key diagram of setting that is used for illustrating the irradiation area of present embodiment.
Irradiation area is the zone to substrate 100 irradiating lasers, irrespectively is set on all or part of of non-area of the pattern with defective locations, and the back describes in detail.Non-area of the pattern is the zone except that scan line 210, data wire 220 and the component 230 of the area of the pattern shown in waiting as Fig. 9.
The area of the pattern that is made of scan line 210, data wire 220 and component 230 can partition be the 1st region R 1 and the 2nd region R 2 for example, the 1st region R 1 is made of scan line 210 that is provided with in cross one another mode and data wire 220 as shown in Figure 9, and the 2nd region R 2 is made of component 230 as shown in Figure 10.This partition is in order with the swell increment of setting according to the zone area of the pattern to be expanded to prohibited area or to set important area.
At this, important area is meant the zone of having set importance degree, exists defective just such situation such as unconditionally to proofread and correct if importance degree for example is used to when carrying out the judgement of defect correction the zone more than certain value, and the back can illustrate.
In addition, about the 1st region R 1 and the 2nd region R 2 as area of the pattern, for example as Fig. 9 and shown in Figure 10, the user can by manually from the image displaying part 310 that is presented at image display window 300 with reference to the pattern of selecting to be set at the zone the image 312 with the mouse of the input part 80 of Fig. 3 etc., still also can utilize the difference etc. of the brightness value of area of the pattern and non-area of the pattern automatically to set.
The user can make as the 1st region R 1 expansion of area of the pattern as shown in Figure 11 and be set at prohibited area (the 1st region R 1 of expansion '), and, can make 2 expansions of the 2nd region R as shown in Figure 12 and be set at prohibited area (the 2nd region R 2 of expansion ').
The 1st region R 1 ' and the 2nd region R 2 ' along the comprehensive expansion up and down of image display window 300, but for example also can expand along 1 direction in 4 directions up and down, and, also can only make the demi-inflation of selecting by the user.
In addition, also can use the swell increment different (width that for example expands, before expanding to be the expansion rate etc. of benchmark) that area of the pattern is expanded and be set at prohibited area according to the specified scope of the 1st region R the 1, the 2nd region R 2 etc.In Figure 11 and example shown in Figure 12, the swell increment of the 1st region R 1 and the 2nd region R 2 is constant expansion width.
In example shown in Figure 13, the 2nd region R 2 expands with the swell increment bigger than the swell increment of the 1st region R 1 and is set to prohibited area (the 2nd region R 2 ").In addition, can be that benchmark is determined swell increment automatically also with above-mentioned importance degree.
If the 2nd region R 2 as shown in figure 14 is such, area of the pattern with respect to reality exists disappearance part R2a, ledge R2b etc., then append frame R2c, zone deletion frame R2d etc. and be configured in image display window 300 first-class, can suitably change the zone by the zone that is chosen in the reservation shape that dots among Figure 15 by the user.
As shown in figure 16, irradiation area R3 is set at as except that as on all or part of of the non-area of the pattern of the part scan line 210, data wire 220 and the component 230 of area of the pattern.Irradiation area R3 shown in Figure 16 is the zone beyond above-mentioned the 1st region R 1 and the 2nd region R 2.
In addition, about the setting of irradiation area, also can utilize the difference of the brightness value that in area of the pattern R1, R2 and non-area of the pattern in addition, produces automatically to set.For example, can utilize the binaryzation that produces by gray scale difference, morphology (morphology) etc.
When the 1st region R 1 and the 2nd region R 2 are expanded (R1 ', R2 ', R2 "); as shown in figure 17, irradiation area R3 ' can be set in the 1st region R 1 removed as the correction prohibition zone of expanding ' reach the 2nd region R 2 ', R2 " part.
When having 1 irregular pattern 240 different in a plurality of cycles (being 3 cycles) in the repeat patterns 200 of substrate 100 as shown in Figure 18 in Figure 18 with other repeat patterns 200, be considered as in all repeat patterns 200, existing irregular pattern 240 (dummy pattern 240 ') as shown in Figure 19, determine as shown in Figure 20 except that dummy pattern 240 ' irradiation area R3 ' get final product.
Setting dummy pattern 240 like this ', thus the setting of irradiation area is simplified.
As shown in figure 21, irradiation area R3 ' can change illuminate condition according to region R 3 '-1, R3 '-2, the R3 '-3 that are contained in wherein.As illuminate condition, for example can enumerate irradiation number of times, luminous power, wavelength, oscillating impulse width of laser etc.
In addition, change about illuminate condition, for example also can followingly change, that is: will not be arranged in the tiny mirror that is arranged in irradiation area R3 ' in the tiny mirror on the spatial modulation element 11 shown in Figure 3 and all be made as open mode, but in the scope that can guarantee optical resolution, the part of irradiation area is made as closed condition, dredging.
＜Laser Processing 〉
Shown in the flow chart of Fig. 4, the control part 30 shown in Fig. 3 etc. is from for example with the independent testing fixture that is provided with of laser processing device 1 obtaining the positional information (S1: defective locations information is obtained operation) of the defective of the substrate of being extracted out 100.This testing fixture for example is the device of upstream side that is positioned at the transport path of substrate 100.In addition, testing fixture and laser processing device needn't be separate, also can constitute the set composite that has the function of carrying out defect inspection concurrently and carry out the function of Laser Processing.
Then, control part 30 is according to the positional information of above-mentioned defective, utilize the face side directions X guide portion 52 and the Y direction guide portion 62 of Figure 1 and Figure 2 that microscope unit 10 is moved, so that defective is arranged in multiplying power for example is 5 times the correction viewing area (with reference to the viewing area F1 of Figure 23) need not judge installation with object lens 12a the time, thereby makes it move (S2: the 1st irradiation portion relatively move operation) with respect to substrate 100.
In the judgement (S4) of this defect correction, control part 30 carry out bonding shown in Figure 8 with reference to image 312 and the bond graph that forms as 313 with the pattern match (with reference to relatively) of above-mentioned observation image or from the comparison (adjacent comparison) between the adjacent repeat patterns of observing the image extraction and carry out the detection of defective.
Then, for example as shown in figure 22 like that because the importance degree of the 2nd region R 2 is more than the certain value, therefore the defective 401 that leap is positioned on data wire 220 (the 1st region R 1) and the component 230 (the 2nd region R 2) is judged as " correction " as the situation that causes short circuit to control part 30.
In addition, control part 30 is more than the certain value owing to the importance degree of the 2nd region R 2 that is made of component 230 for example, therefore unconditionally will be judged as " correction " with component 230 contacted defectives 402.
In addition, control part 30 for example when the importance degree of above-mentioned the 1st region R 1 that is made of scan line 210 is discontented with certain value or is not set importance degree, will only be judged as " not proofreading and correct " with scan line 210 contacted defectives 403.
In addition, control part 30 for example will be judged as " not proofreading and correct " with all discontiguous defective 404 of any pattern.Control part 30 utilizes predetermined conditions to carry out this judgement automatically.
If defective does not need to proofread and correct, then control part 30 just judges whether to exist other uncorrected defectives (S13), and when not having uncorrected defective, the Laser Processing processing finishes.In addition, when having uncorrected defective, control part 30 begins to handle from above-mentioned the 1st irradiation portion operation (S2) that relatively moves as shown in Figure 4 once more.
In addition, though not shown in the flow process of Fig. 4, when not needing microscope unit 10 is moved or when not needing to focus automatically (S3), can omit these operations (S2, S3).
When defect correcting, control part 30 is caught the image (S5) of the defective of being taken by the image pickup part 13 of microscope unit 10, is stored in the storage part.By the defect image (S11) after relatively this image and the correction described later, can be used in and judge that defective need deny among the step S12 of timing.
Then, control part 30 utilizes not shown autofocus mechanism focus automatically once more (S7).Then, control part 30 utilizes the face side directions X guide portion 52 of Figure 1 and Figure 2 and Y direction guide portion 62 that microscope unit 10 is moved, so that defective when being arranged in laser irradiation with the installation of object lens 12b can irradiation area F3, thereby it is moved with respect to substrate 100 and in can irradiation area F3 to defective 401 feel relieved (S8: the 2nd irradiation portion relatively move operation).
In addition, when having carried out above-mentioned microscope accurately when not needing to feel relieved (S8: the 2nd irradiation portion relatively move operation) when moving (S2: the 1st irradiation portion relatively move operation) etc., also can omit centering (S8: the 2nd irradiation portion relatively move operation).
Specifically, as shown in figure 24, the tiny mirror of control part 30 control spatial modulation elements 11, so that with microscope unit 10 can irradiation area the tiny mirror of the corresponding spatial modulation element 11 of irradiation area R3 among the F3 become open mode, become closed condition with the tiny mirror of the corresponding spatial modulation element 11 of area of the pattern R1, R2, thereby spatial modulation laser (S9).
In addition, corresponding about how making irradiation area R3 with energy irradiation area F3, for example the position with the microscope unit 10 that obtains from the image (S5) of above-mentioned seizure etc. (can irradiation area F3) is a benchmark, from bond graph with reference to image 312 shown in Figure 8 as cutting 313 grades can irradiation area F3 irradiation area R3 get final product.
Then, control part 30 utilizes LASER Light Source unit 20 irradiating lasers at the spatial modulation element 11 that like that tiny mirror has been carried out control as mentioned above, and the processing (correction) of carrying out defective 401 (S10).
In addition, as mentioned above, control part 30 also can change illuminate condition and irradiating laser repeatedly according to region R 3 '-1, R3 '-2, the R3 '-3 of irradiation area R3 ' shown in Figure 21.
After the processing of carrying out defective 401, control part 30 is caught the image (S11) of the defective of taking in the image pickup part 13 of microscope unit 10.Control part 30 is by the defect image (S5) before this image and the above-mentioned correction or with pattern match with reference to image 312 shown in Figure 7 etc., and the judgement defective need not proofreaied and correct (S12).
If do not finish defect correction, then control part 30 begins to handle from Laser Processing (S10) once more.
In addition, if finished defect correction, then control part 30 judges whether to exist other uncorrected defectives (S12), when not having uncorrected defective, finishes Laser Processing and handles.
When having uncorrected defective, control part 30 begins to handle from above-mentioned the 1st irradiation portion operation (S2) that relatively moves as shown in Figure 4 once more, but this moment, though not shown in the flow process of Fig. 4, laser irradiation need be switched to correction with object lens 12b and need not judge and use object lens 12a.In addition, when not needing microscope unit 10 is moved, can omit the operation (S2) that microscope moves.
Like this, finishing the correction of defective handles, but for example when the defective 405 of wire is not incorporated among the energy irradiation area F3 like that as shown in figure 25, Yi Bian control part 30 suitably carries out above-mentioned centering (S8), Yi Bian repeatedly repeat laser irradiation process (S9, S10).
In this case, as shown in figure 26,, therefore can produce repeating part F3-O (illustrating) between the irradiation area F3 with oblique line adjacent one another are owing to can irradiation area F3 be circular.Therefore, control part 30 can irradiation area R3 be made as can irradiation area the Zone Full of non-area of the pattern of F3, and eliminate repeating part F3-O by half of irradiation area R3 adjacent one another are for example being dwindled repeating part F3-O respectively.In addition, as shown in figure 27, also irradiation area R3 can be reduced into rectangle etc. and eliminate can irradiation area F3 repeating part F3-O.
In as above illustrated present embodiment, with the defective locations irradiation area R3 irradiating laser in the non-area of the pattern that is set in substrate 100 irrespectively.Therefore, when correction is attended by the defective of trickle defective around, can also proofread and correct minute defects simultaneously.In addition, comprise the wider range irradiating laser of defective, can prevent that the irradiation of laser from omitting (residual defects) by leap.And, can prevent that the residue that can produce, disperse from becoming the problem of new defective only to the defective irradiating laser time.Therefore, according to present embodiment, defect correcting reliably.And, owing to can omit control corresponding with defect shape etc., spatial modulation element 11, the control of Laser Processing is simplified.
In addition, in the present embodiment, control part 30 as shown in figure 21, changes illuminate condition and irradiating laser among a plurality of region R 3 '-1 in being contained in irradiation area R3 ', R3 '-2, the R3 '-3 in laser irradiation process (S9, S10).The condition that therefore, can be enough be suitable for substrate 100 is defect correcting reliably.
In addition, in the present embodiment, control part 30 in laser irradiation process (S9, S10), to shown in Figure 24 waits can irradiation area F3 Zone Full (perhaps roughly Zone Full) in irradiation area R3 in the lump during irradiating laser, defect correcting promptly.
In addition, in the present embodiment, control part 30 in the laser irradiation process, as shown in figure 21, the conduct in non-area of the pattern except that the region R 1 of the correction prohibition that area of the pattern (210,220,230) is expanded ', the irradiation area R3 ' irradiating laser of part the R2 '.Therefore, even in area of the pattern, have manufacture deviation or in laser processing device 1, produce vibration, also can prevent influences such as destruction to normal pattern.In addition, can reduce the influence of heat to normal pattern.
In addition, in the present embodiment, control part 30 is in the laser irradiation process, as shown in figure 13, in non-area of the pattern, divided by the swell increment of setting according to specified scope make the correction prohibition that area of the pattern expands the zone (region R 1 that swell increment is little ', region R 2 ") irradiation area irradiating laser in addition that swell increment is big.Therefore, can more effectively prevent the destruction to normal pattern, the influence that heat brings.
In addition, in the present embodiment, control part 30 the 1st irradiation portion that carries out operation (S2) and the 2nd irradiation portion operation (S8) that relatively moves that relatively moves.In the 1st irradiation portion relatively moved operation (S2), control part 30 made the microscope unit 10 as laser irradiating part move with respect to substrate 100, so that the viewing area F1 that defective is arranged in correction need not judge installation with object lens 12a the time.In the 2nd irradiation portion relatively moved operation (S8), control part 30 made microscope unit 10 move with respect to substrate 100 so that defective when being centered on laser irradiation with the installation of object lens 12b can irradiation area F3 in.Therefore, can proofread and correct the minute defects that is positioned at around the defective in the broader context, thereby, defect correcting more reliably.
In addition, in the present embodiment, control part 30 judges that the correction that defective need not proofreaied and correct need not judge operation (S4), need not judge in the operation in this correction, as shown in figure 22, according to the importance degree of setting according to a plurality of zones in the area of the pattern that is included in substrate (R1, R2), judge that defective need not proofread and correct, for example being arranged in to be judged as when importance degree is a region R 2 more than the certain value in defective 402 needs to proofread and correct etc.Therefore, defect correcting more reliably.
In addition, in the present embodiment, control part 30 judges that the correction that defective need not proofreaied and correct need not judge operation (S4), need not judge in the operation in this correction, need not proofread and correct by the image of captured defective and the more resulting pattern match with reference to image 312 of the image of usefulness as a comparison being judged defective, in laser irradiation process (S9, S10), to according to the above-mentioned irradiation area R3 irradiating laser of setting with reference to image 312.Therefore, can enough simple control set irradiation area R3.
In addition, in the present embodiment, as Figure 25～shown in Figure 27, control part 30 repeats laser irradiation process (S9, S10) for more than 405 time at the defective that is not accommodated among the energy irradiation area F3, by dwindling the repeating part F3-O that irradiation area R3 eliminates repeatedly the energy irradiation area F3 of laser irradiation process.Therefore, can suppress unwanted laser irradiation.
In addition, in the present embodiment, be illustrated with the array base palte of substrate 100 as LCD (LCD), but except that LCD (LCD), also can in the substrate that is used for substrate that PDP (Plasma Display Panel), organic EL (ElectroLuminescence) display, surface conductive type electronic emission element display (SED:Surface-conduction Electro-emitter Display) wait other flat-panel monitors (FPD), semiconductor crystal wafer, printed base plate etc., use present embodiment.
In addition, above-mentioned embodiment and variation thereof only are used to implement an example of the present invention, and the present invention is not limited entirely by the record content of these embodiments.For example, to those skilled in the art, each structure in the detailed description of the invention replaced with the structure that can replace and carry out various distortion belong within the scope of the present invention.
Claims (10)
1. a laser processing utilizes the defective on the laser-adjusting substrate, it is characterized in that, above-mentioned laser processing comprises:
Defective locations information is obtained operation, and it obtains the positional information of above-mentioned defective;
The irradiation portion operation that relatively moves, it relatively moves laser irradiating part and the aforesaid substrate of the above-mentioned laser of irradiation according to above-mentioned positional information, so that above-mentioned defective is arranged in the energy irradiation area of this laser irradiating part; And
The laser irradiation process, its utilize above-mentioned laser irradiating part to the location independent of above-mentioned defective the irradiation area that is set in the non-area of the pattern of aforesaid substrate shine above-mentioned laser.
2. laser processing according to claim 1 is characterized in that,
In above-mentioned laser irradiation process, a plurality of zones in being contained in above-mentioned irradiation area change illuminate condition and shine above-mentioned laser.
3. laser processing according to claim 1 is characterized in that,
In above-mentioned laser irradiation process, to above-mentioned can irradiation area Zone Full or roughly the above-mentioned irradiation area in the Zone Full shine above-mentioned laser in the lump.
4. laser processing according to claim 1 is characterized in that,
In above-mentioned laser irradiation process, the above-mentioned irradiation area of the part the correction prohibition zone that the conduct in above-mentioned non-area of the pattern forms after above-mentioned area of the pattern is expanded shines above-mentioned laser.
5. laser processing according to claim 4 is characterized in that,
In above-mentioned laser irradiation process, the above-mentioned irradiation area of the part beyond the above-mentioned correction prohibition zone in above-mentioned non-area of the pattern, that conduct forms after divided by the swell increment of setting according to specified scope above-mentioned area of the pattern being expanded shines above-mentioned laser.
6. according to each described laser processing in the claim 1 to 5, it is characterized in that,
The above-mentioned irradiation portion operation that relatively moves comprises:
The 1st irradiation portion operation that relatively moves, it relatively moves above-mentioned laser irradiating part and aforesaid substrate according to above-mentioned positional information, so that the viewing area that above-mentioned defective is arranged in correction need not judge installation with object lens the time; And
The 2nd irradiation portion operation that relatively moves, it relatively moves above-mentioned laser irradiating part and aforesaid substrate so that above-mentioned defective above-mentioned when being centered on the laser irradiation with the installation of object lens can irradiation area in;
Above-mentioned laser processing comprises also that after above-mentioned the 1st irradiation portion relatively moves operation correction need not judge operation, and this correction need judge not that operation judges that the above-mentioned defective that is arranged in above-mentioned viewing area need not proofread and correct.
7. according to each described laser processing in the claim 1 to 5, it is characterized in that,
Above-mentioned laser processing comprises that also correction need not judge operation, and this correction need judge not that operation judges that above-mentioned defective need not proofread and correct,
Need not judge in the operation in above-mentioned correction,, judge that above-mentioned defective need not proofread and correct according to the importance degree of setting according to a plurality of zone in the area of the pattern that is contained in aforesaid substrate.
8. according to each described laser processing in the claim 1 to 5, it is characterized in that,
Above-mentioned laser processing comprises that also correction need not judge operation, and this correction need judge not that operation judges that above-mentioned defective need not proofread and correct,
Need not judge in the operation in above-mentioned correction, utilize pattern match to judge that above-mentioned defective need not proofread and correct, the image of this pattern match by more captured defective with carry out with reference to image, this is the image that is used for comparison with reference to image,
In above-mentioned laser irradiation process, to shining above-mentioned laser according to above-mentioned irradiation area with reference to image setting.
9. according to each described laser processing in the claim 1 to 5, it is characterized in that,
Carry out repeatedly above-mentioned laser irradiation process at the above-mentioned defective that is not accommodated in the above-mentioned energy irradiation area,
Eliminate the repeating part of the above-mentioned energy irradiation area of this laser irradiation process repeatedly by dwindling above-mentioned irradiation area.
10. a laser processing device utilizes the defective on the laser-adjusting substrate, it is characterized in that, above-mentioned laser processing device comprises:
Laser irradiating part, its irradiating laser; And
The relative drive division of irradiation portion, it relatively moves above-mentioned laser irradiating part and aforesaid substrate;
Above-mentioned laser irradiating part to the location independent of above-mentioned defective the irradiation area that is set in the non-area of the pattern shine above-mentioned laser.
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| JP2010-063312 | 2010-03-18 | ||
| JP2010063312A JP5495875B2 (en) | 2010-03-18 | 2010-03-18 | Laser processing method and laser processing apparatus |
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| JP (1) | JP5495875B2 (en) |
| KR (1) | KR20110105339A (en) |
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| CN108139664A (en) * | 2015-09-04 | 2018-06-08 | Eo科技股份有限公司 | Remove the method and apparatus of solid |
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| JP5818721B2 (en) * | 2012-03-06 | 2015-11-18 | 住友重機械工業株式会社 | Laser processing apparatus and laser processing method |
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| JP5495875B2 (en) | 2014-05-21 |
| JP2011194432A (en) | 2011-10-06 |
| KR20110105339A (en) | 2011-09-26 |
| TW201134590A (en) | 2011-10-16 |
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Application publication date: 20110921 |