TWI377104B - Laser repair apparatus - Google Patents
Laser repair apparatus Download PDFInfo
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- TWI377104B TWI377104B TW095125845A TW95125845A TWI377104B TW I377104 B TWI377104 B TW I377104B TW 095125845 A TW095125845 A TW 095125845A TW 95125845 A TW95125845 A TW 95125845A TW I377104 B TWI377104 B TW I377104B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
- H01S3/101—Lasers provided with means to change the location from which, or the direction in which, laser radiation is emitted
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/046—Automatically focusing the laser beam
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/71—Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors
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- Engineering & Computer Science (AREA)
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- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Signal Processing (AREA)
- General Physics & Mathematics (AREA)
- Multimedia (AREA)
- Laser Beam Processing (AREA)
- Liquid Crystal (AREA)
Description
1377104 九、發明說明: 【發明所屬技術領域3 技術領域 本發明係有關於一種雷射修補裝置,其係可將雷射光 5 照射於液晶顯示器(以下稱為LCD)之玻璃基板、或半導體晶 . 圓、印刷電路板等之被檢查對象物上所產生的缺陷部而進 行修補(修正)者。 I:先前技術3 • 背景技術 10 在LCD之製造步驟中,對於微影成像處理工程所處理 之玻璃基板進行各種檢查。若該檢查結果在形成於玻璃基 板上之抗蝕圖案或蝕刻圖案中檢測出摻雜異物或殘留圖案 臈等缺陷部,則對於該缺陷部進行照射雷射光而修正缺陷 部之修補處理。修補處理的方法一般係,例如,將由紫外 15雷射發振器所輸出之紫外雷射光射入可變矩形開口,藉由 % 可動之各刀口來開閉可變矩形開口,將紫外雷射光之截面 形狀整形為所需之大小而照射缺陷部的方法。 .對於缺陷進行修補處理的方法包括以下方法。記載於 特許文獻1之技術係藉由對於1個缺陷部進行雷射光之照射 20位置或照射面積'雷射功率等照射條件相異之2次修減理 步驟’可盡量減少照射區域的殘逢而進行高精確度之修補 處理。又,記載於特許文獻2之技術則係藉由—面相對地移 動作為照射雷射光之可變矩形開口的縫隙、與缺陷部等之 被檢查對象,-面進行修補處理,同樣地可減少照射區域 5 1377104 的殘渣而進行高精確度之修補處理。 除了以矩形調整雷射光截面形狀之方法,也有人提出 了將雷射光截面形狀調整為任意形狀之方法。例如,記載 於特許文獻3之技術係利用微小的鏡片作為空間調變裝 5 置,藉由切換該鏡片之角度,可切換雷射光之照射(ON)與 遮蔽(OFF),依各雷射片之單位進行雷射加工,以進行圖案 的轉印。 特許文獻1 :特開2000-347385號公報 特許文獻:特開2000-347387號公報 10 特許文獻:特開平8-174242號公報 【發明内容】 發明揭示 發明所欲解決之課題 在實際之LCD製造步驟中會產生各種缺陷,以雷射光 15 修補缺陷之處理方法也各異。例如,因為抗蝕圖案膜殘留 而引起電氣短路之缺陷部,若對於與正常抗蝕圖案無關之 照射區域,設定適當雷射功率,即可以1次或2次之雷射光 照射除去缺陷部。然而,在抗蝕圖案之曝光步驟中捲進異 物而產生的缺陷部上,有時即使對捲進之異物照射雷射 20 光,1次或2次的雷射光照射也無法去除缺陷部。如上所述, 推定缺陷之種類、或產生缺陷之狀況,例如,因異物缺陷 部與具有不同電位之複數正常抗蝕圖案接觸而引起電氣短 路等狀況,並因應推定結果有效率且正確地進行修補處理 係極重要之事。 6 此外,隨著製造LCD之玻璃基板大小(面積)擴大化、半 導體晶圓之圖案細微化與技術的進步,從作為被檢查對象 之基板的生產環境產生大幅變化,可預測若按照習知之修 補處理方法會使檢查時間(工作時間)增加,而如何減少工作 時間便成為重要的課題。 在記截於特許文獻1及特許文獻2之修補處理方法中, 將著眼點置於高精確度化,但令人擔心的是會因照射條件 變更(特別是矩形開口之開閉動作)、或被檢查對象與雷射光 光轴之相對移動等原因而增加處理時間。又,記載於特許 文獻3之修補處理方法雖然可高速進行鏡片控制,故可高速 進行圖案轉印處理,但由於關於轉印對象之形狀未記載具 體方法’故難以實現高精準度之轉印處理。 本發明係鑒於上述問題點而成者,目的在於提供一種 可進行高精準度且高速之雷射修補處理的雷射修補裝置。 解決課題之手段 本發明係為了解決上述課題而成者,本發明之雷射修 補裝置,係可將從雷射光源射出之雷射光照射於被檢查對 象上之修正對象區域者,包含有:拍攝機構,係可拍攝前 述被檢查對象而產生圖像資訊者;圖像處理機構,係可由 前述拍攝機構所生成之前述圖像資訊,產生缺陷判定資 訊,並根據前述缺陷判定資訊決定前述雷射光照射時之照 射條件者;雷射光整形機構’係可根據前述圖像處理機構 所決定之前述照射條件,調整前述雷射光形狀者;及照射 光學系統,係可將整形後之前述雷射光照射於前述修正對 1377104 象區域者。 又,本發明之雷射修補裝置中,前述雷射光整形機構 包含有:空間調變裝置,係照射有來自前述雷射光源之前 述雷射光,並具有排列於1次元方向或2次元方向之複數微 5 小裝置者;及空間調變裝置控制機構,係可根據前述照射 條件控制前述空間調變裝置之狀態者。 又,本發明之雷射修補裝置中,前述空間調變裝置控 制機構可根據前述修正對象區域之形狀,控制前述空間調 變裝置之狀態。 10 又,本發明之雷射修補裝置中,前述空間調變裝置控 制機構可使用前述被檢查對象之雷射光照射禁止區域作為 對於前述修正對象區域之光罩用資訊,控制前述空間調變 裝置之狀態。 又,本發明之雷射修補裝置中,前述空間調變裝置控 15 制機構可控制有無雷射光照射於構成前述空間調變裝置之 各前述微小裝置。 又,本發明之雷射修補裝置中,前述圖像處理機構具 有照射條件歷程記憶機構,其係可使決定前述照射條件時 所使用之資訊與前述照射條件相關聯而記憶者,且當決定 20 前述照射條件時,前述圖像處理機構可讀取前述照射條件 歷程記憶機構所記憶之過去的前述照射條件。 又,本發明之雷射修補裝置中,前述缺陷判定資訊係 從前述修正對象區域内之缺陷的顏色、面積、亮度、位置 及個數中1個以上之資訊所求得者。 8 1377104 為修補對象之處的狀況,根據推定之結果有效率、且正確 地進行修補處理》 第1圖顯示本發明第1實施型態之雷射修補裝置的構 成。在本實施型態中,利用數位微鏡裝置(以下稱為DMD) 5 作為進行整形雷射光之空間調變裝置,而該DMD係具有複 數微小鏡(微小裝置)排列於1次元或2次元方向之微小裝置 群者。又,關於雷射光照射時之DMD控制,係藉由變更構 成DMD之微小鏡的角度來控制照射的有無。 於XY工作台1上載置有作為被檢查對象之LCD玻璃基 10 板2(被檢查基板)。被檢查對象可為半導體晶圓、印刷電路 板、LCD用濾色片、圖案光罩等任何形成有細微圖案之基 板,在本實施型態中則以LCD之玻璃基板為例。χγ工作台 1可藉由移動驅動控制部3所進行之驅動控制移動於χγ方 向。 15 移動驅動控制部3上接續有基板檢查裝置4。基板檢查 裝置4係例如圖案檢查裝置,可對於玻璃基板2進行缺陷檢 查’並進行處理而作成包含玻璃基板2上之缺陷部的座標、 大小、缺陷種類等檢查結果資料,或將檢查上必須之資訊 傳送至檢查條件讀取部26等。移動驅動控制部3從基板檢查 〇裝置4接收檢查結果資料,依循該檢查結果資料中之各缺陷 部的座標資料,控制XY工作台1之χγ方向移動,自動地將 破璃基板2上之各缺陷部定位於修部位置!^,即,後述之從 修補用光源14射出之修補光r的照射位置。 照明光源5射出可照明玻璃基板2之照明光。在照明光 < S > 10 1377104 之光路徑上,透過中繼透鏡6設有分光鏡7。在分光鏡7之反 射光路徑上,透過分光鏡8設有對物透鏡9 ^在通過對物透 鏡9、分光鏡7、及分光鏡8之光軸p的延長線上,透過中繼 透鏡10設有CCD照相機11(拍攝機構)。cCD照相機11通過中 5繼透鏡10及對物透鏡9拍攝玻璃基板2,產生圖像資訊後輸 圖像處理部12(圖像處理機構)取得從CCD照相機^所 輸出之缺陷圖像資料作為圖像資訊,更從檢查條件讀取部 26取得檢查所需要的資訊。從檢查條件讀取部26所取得之 10資訊係例如來自於正常狀態之被檢查對象的基準圖像資料 等。基準圖像資料係藉由例如記载於特開2005·10042號公 報之方法而作成者。圖像處理部12從比較該缺陷圖像資料 與基準圖像資料所得之差異圖像資料,抽取出玻璃基板2上 之缺陷部,進行2值化處理,作成顯示缺陷形狀之缺陷抽取 15圖像資料。又,圖像處理部12也可從缺陷圖像資料或差異 圖像資料求出缺陷部的輪廓,而作成顯示缺陷形狀的資 料。從缺陷圖像資料、缺陷抽取圖像資料或該等中所求出、 可顯示雷射光照射領域形狀的缺陷形狀圖像資料,顯示於 顯示器13(圖像顯示機構)。 20 修補用光源14(雷射光源)射出可修補玻璃基板2缺陷部 之雷射光r。使用例如Τ射出i發波長為说·之雷射光峋 YAG雷射發振器作為修補用光源14β又,修補用光源_ 接收從圖像處理部12輪出之資訊(後述之顯示照射時雷射 光設定的雷射光源設定資訊)’進行控制而從設定為任意值 11 1377104 或事先決定之值中選擇出雷射光r之功率(一單位面積之能 源強度等),構成本發明雷射光整形機構之一部分。 在修補用光源14所射出之雷射光!·之光路徑上,透過鏡 部15設有DMD單元16(雷射光整形機構、空間調變裝置)。 5 DMD單元16之構造為將複數之如第2圖所示的DMdi7(微 小裝置),排列於如第3圖所示之2次元縱橫方向。如第2圖 所示,DMD17中,於驅動用儲存單元18上部,可數位控制 例如角度±10°與0°(水平)地設有微小鏡19。 DMD17係可藉由因作用於各微小鏡19與驅動用儲存 10單元18間之電壓差而引起的靜電引力,高速切換角度±1〇。 與0°者,已知例如特開2000-28937號公報所揭示者。微小 鏡19之方疋轉係由限制為角度土1〇。,且在驅動用儲存單元a 之〇N旋轉為角度±1〇。、“OFF”時回到水平角度〇。。 此外,微小鏡19係使用半導體製造技術而形成為數μιη〜數 15 +μη1級的微鏡,如第3圖所示,於驅動用儲存單元18上2次 元地排列有微小鏡19而構成DMD單元16。 DMD單元16之基準反射面16a(各微小鏡19之角度為〇β 時之反射面)設定相對入射光軸之雷射光r的出射角為〇i,且 當各微小鏡19因‘‘〇N’,傾斜為角度+1〇。時,對於χγ平面 2〇傾斜為傾斜角0a,以使雷射光r之出射角設定為此。基準反 射面16a為了從鏡部15、中繼透鏡2〇、分光鏡8等配置位置 之關係,將相對於雷射光r之入射角光轴的反射角設定為 θ〇,傾斜成傾斜角9a。且DMD單元16因應雷射光r之入射方 向或出射方向’安裂於可將基準反射面16a之傾斜角如調整 12 1377104 於χυθ方向的支持台16b上。 #射光r之出射角0〇係以例如將驅動用儲存單元以設 為ON時之各微小鏡19旋轉角度+ι〇β而決定。以出射 角〇射出之雷射光r透過中繼透鏡20射入分光鏡8。又若 將驅動用儲存設定為“〇ff”,雷射光犷會反射於h 方向,而*會透過中繼透鏡20射人分光鏡8 。此外,從修補 用光源14射出之雷射光Γ由鏡部15反射而以入射角崎入 DMD單元16 ’但也可除去鏡部15,將修補用光源14所射出 之雷射知直接射入DMD單_。透過可裝卸地設在修補用 10光源I4與鏡部I5之光路控中的鏡部24,設有修補位置禮認 用光源25,可照射可見光、並於事前確認照射範圍。 於上述構成之光學系統中,從玻璃基板2透過分光鏡8 配置有CCD照相機U,並且從玻璃基板2透過分光鏡8配置 有DMD單元16,該等CCD照相機與DMD單元16之配置位置 15為相對於玻璃基板2之共軛位置關係。雷射形狀控制部 21(空間調變裝置控制機構)可讀取由圖像處理部12所作成 之玻璃基板2上各缺陷部的.缺陷形狀圖像資料,並對應於該 缺陷形狀圖像資料,將控制資訊輸出至D M D驅動部2 2 (空間 調變裝置控制機構),該控制資訊係可將配置於照射雷射光 20之區域的DMD單元16之各微小鏡19的驅動用儲存單元18設 定為“ON” ,而將配置於其他區域之各微小鏡19之驅動用 儲存單元18設定為“OFF”者。 在藉由圖像處理部12所作成之缺陷形狀圖像資料中, 例如對缺陷部無法抽取出全缺陷區域、或將正常區域誤抽 < S) 13 1377104 取為缺陷部時’於雷射形狀控制部21接續之修整部23可以 手動修正該等已抽取之缺陷部區域。修整部23藉由使用描 繪工具之手動操作,將未抽取出之缺陷區域設定區域並登 錄為缺陷部、或將誤抽取為缺陷部之區域設定區域並登錄 5 為正常區域。為了藉由修整部23之操作而使雷射光r之截面 形狀一致於破璃基板2之缺陷部,也可控制支持台16b向 χυθ方向微動。DMD驅動部22依循雷射形狀控制部21所送 出之控制資訊’將DMD單元16之各驅動用儲存單元18驅動 為 “ON” 及 “off” 。 15 、,圖像處理和於雷射光成驗_基板2之缺陷部並 進行修補後,取得從CCD照相機11同樣位置之圖像資料, 從^圖像資料、與比較取得自檢查條件讀取部26之基準圖 八 > 料所得之差異圖像資料’判斷缺陷部之修補是否完 “丨斷、”。果為修補*完全時’圖像處理部12再度從 、後之差異圖像資料作成缺陷部之缺陷形狀圖像資料。 狀制邹21再度讀取由圖像處理部12作成之缺陷形 = = =,將龍於該缺陷形狀圖像資料之D·單元Μ 兄9的驅儲存單元18設定為“ON”。 20 相機==參物圖說日爾處理部12之《。將咖照 二 =r4aa、與檢査條件_26所輪 -開始料^ 缺陷抽出部31。缺陷抽出部31 圖荦的^日3卢用缺陷圖像資料讀基準圖像資料bb各自之 時=:_叫進行位置對照。位置可對應 、 P 31對照缺陷圖像資料a a與基準圖像資料b b 14 各自之明亮程度(亮度)。亮度可對應時,缺陷抽出部31比較 兩者,產生差異圖像資料(由各像素之亮度差絕對值所構成 之圖像)。 接著,缺陷抽出部31根據關於差異圖像資料,亮度差 5絕對值為臨限值Thl(例如,圖像資料由256灰度所構成時, 設定™=30等)以上之部分,根據基準圖像資料bb與缺陷圖 像資料aa相異 '即係缺陷圖像資料上缺陷部的判斷,顯示 輯是否為缺陷部,換言之,缺㈣出部31產生可顯示缺 α形狀之缺陷抽出圖像資料ee並輸出。例如,從顯示於第 圖之缺圖像資料aa、與顯示如第5β圖之基準圖像資料 的’產生如第5(:圖所示之缺陷抽出圖像資料⑶。 將缺陷圖像資料aa、基準圖像資料⑽及缺陷抽出部Μ1. The invention relates to a laser repairing device which can irradiate laser light 5 to a glass substrate of a liquid crystal display (hereinafter referred to as LCD) or a semiconductor crystal. Repair (correction) of the defective portion generated on the object to be inspected such as a circular or printed circuit board. I: Prior Art 3 • Background Art 10 In the manufacturing steps of the LCD, various inspections were performed on the glass substrate processed by the lithography imaging process. As a result of the inspection, if a defective portion such as a foreign matter or a residual pattern is detected in the resist pattern or the etching pattern formed on the glass substrate, the defective portion is irradiated with the laser light to correct the repair process of the defective portion. The repairing method is generally, for example, injecting ultraviolet laser light output by the ultraviolet 15 laser oscillator into a variable rectangular opening, and opening and closing the variable rectangular opening by the movable mouth of each %, and the cross section of the ultraviolet laser light A method of shaping a shape to a desired size and illuminating a defective portion. The method of repairing the defect includes the following methods. The technique described in Patent Document 1 is to reduce the irradiation area by minimizing the irradiation position of the laser beam for one defect portion and the irradiation area of the irradiation area, such as laser light. And high-precision repair processing. Further, in the technique disclosed in Patent Document 2, the slit which is a variable rectangular opening for irradiating the laser light and the object to be inspected such as the defective portion are moved relative to each other, and the surface is repaired, and the irradiation can be reduced in the same manner. The residue of zone 5 1377104 is repaired with high precision. In addition to the method of adjusting the cross-sectional shape of the laser light by a rectangle, a method of adjusting the cross-sectional shape of the laser light to an arbitrary shape has also been proposed. For example, the technique described in Patent Document 3 uses a minute lens as a spatial modulation device 5, and by switching the angle of the lens, it is possible to switch between laser irradiation (ON) and shielding (OFF), depending on each laser piece. The unit is laser processed to transfer the pattern. [Patent Document 1: JP-A-2000-347387] [Patent Document: JP-A-H08-174242] SUMMARY OF THE INVENTION PROBLEMS TO BE SOLVED BY THE INVENTION In actual LCD manufacturing steps There are various defects in the process, and the processing methods for repairing defects with laser light 15 are also different. For example, the defective portion which is electrically short-circuited due to the residual resist pattern remains, and the appropriate laser power is set for the irradiation region irrespective of the normal resist pattern, that is, the defective portion can be removed by laser irradiation once or twice. However, in the defective portion generated by the foreign matter being wound up in the exposure step of the resist pattern, even if the foreign matter that is wound up is irradiated with the laser beam 20, the defective portion cannot be removed by the laser irradiation of one or two times. As described above, the type of the defect or the state in which the defect is generated, for example, a situation in which the foreign matter defective portion is in contact with a plurality of normal resist patterns having different potentials, causing an electrical short circuit, and the like, is efficiently and accurately repaired in accordance with the estimation result. Processing is extremely important. In addition, as the size (area) of the glass substrate on which the LCD is manufactured is enlarged, the pattern of the semiconductor wafer is refined, and the technology is advanced, the production environment of the substrate to be inspected is greatly changed, and it can be predicted that it can be repaired according to the conventional method. The processing method will increase the inspection time (working time), and how to reduce the working time becomes an important issue. In the repair processing method described in Patent Document 1 and Patent Document 2, the focus is placed on the high-precision, but it is feared that the irradiation condition is changed (especially, the opening and closing operation of the rectangular opening), or The processing time is increased by checking the relative movement of the object with the laser optical axis. Further, although the repairing method described in Patent Document 3 can perform lens control at a high speed, the pattern transfer processing can be performed at a high speed. However, since the specific method is not described regarding the shape of the transfer target, it is difficult to achieve high-accuracy transfer processing. . The present invention has been made in view of the above problems, and an object thereof is to provide a laser repairing apparatus capable of performing high-precision and high-speed laser repair processing. Means for Solving the Problems In order to solve the above problems, the laser repairing device of the present invention is capable of irradiating laser light emitted from a laser light source to a correction target region on an object to be inspected, including: photographing The mechanism is capable of capturing the object to be inspected to generate image information; the image processing mechanism is capable of generating defect determination information by the image information generated by the image capturing mechanism, and determining the laser light irradiation according to the defect determination information. The irradiation condition of the time; the laser light shaping mechanism' is adapted to adjust the shape of the laser light according to the irradiation condition determined by the image processing means; and the illumination optical system is capable of irradiating the shaped laser light to the foregoing Corrected to the 1377104 image area. Further, in the laser repairing apparatus of the present invention, the laser light shaping means includes: a spatial modulation device that irradiates the laser light from the laser light source and has a plurality of pixels arranged in a 1st order or a 2nd direction. The micro-5 small device; and the spatial modulation device control mechanism can control the state of the spatial modulation device according to the aforementioned irradiation condition. Moreover, in the laser repairing apparatus of the present invention, the space modulating device control means can control the state of the space modulating means in accordance with the shape of the correction target area. Further, in the laser repairing apparatus of the present invention, the space modulation device control means can control the space modulation device by using the laser light irradiation prohibition region of the object to be inspected as the mask information for the correction target region. status. Further, in the laser repairing apparatus of the present invention, the spatial modulation device control mechanism can control the presence or absence of laser light to be irradiated to each of the micro devices constituting the spatial modulation device. Further, in the laser repairing apparatus of the present invention, the image processing means includes an irradiation condition history memory means for storing information used in determining the irradiation condition in association with the irradiation condition, and determining 20 In the irradiation condition, the image processing means can read the past irradiation conditions memorized by the irradiation condition history memory means. Further, in the laser repairing apparatus of the present invention, the defect determination information is obtained from information of one or more of a color, an area, a brightness, a position, and a number of defects in the correction target region. 8 1377104 In order to repair the target, the repair process is performed efficiently and accurately according to the result of the estimation. Fig. 1 shows the configuration of the laser repairing apparatus according to the first embodiment of the present invention. In the present embodiment, a digital micromirror device (hereinafter referred to as DMD) 5 is used as a spatial modulation device for shaping laser light, and the DMD system has a plurality of micromirrors (micro devices) arranged in a 1-dimensional or 2-dimensional direction. The group of tiny devices. Further, regarding the DMD control at the time of laser light irradiation, the presence or absence of the irradiation is controlled by changing the angle of the micro mirror constituting the DMD. The LCD glass substrate 10 (inspected substrate) to be inspected is placed on the XY table 1. The object to be inspected may be any substrate on which a fine pattern is formed, such as a semiconductor wafer, a printed circuit board, a color filter for LCD, a pattern mask, etc. In the present embodiment, a glass substrate of an LCD is taken as an example. The χγ table 1 can be moved in the χγ direction by the drive control by the movement drive control unit 3. The substrate drive inspection unit 4 is connected to the movement drive control unit 3. The substrate inspection device 4 is, for example, a pattern inspection device, and can perform defect inspection on the glass substrate 2 and process the inspection result data including the coordinates, size, and defect type of the defect portion on the glass substrate 2, or the inspection result. The information is transmitted to the inspection condition reading unit 26 and the like. The movement drive control unit 3 receives the inspection result data from the substrate inspection cassette device 4, controls the movement of the XY table 1 in the χ γ direction according to the coordinate data of each defect portion in the inspection result data, and automatically controls each of the glass substrate 2 The defective portion is positioned at the repair portion position, that is, the irradiation position of the repair light r emitted from the repairing light source 14 to be described later. The illumination light source 5 emits illumination light that illuminates the glass substrate 2. A beam splitter 7 is provided through the relay lens 6 in the light path of the illumination light <S > 10 1377104. In the reflected light path of the beam splitter 7, the polarizing mirror 8 is provided with an objective lens 9 ^ on the extension line passing through the optical axis p of the objective lens 9, the beam splitter 7 and the beam splitter 8, and is disposed through the relay lens 10 There is a CCD camera 11 (photographing mechanism). The cCD camera 11 captures the glass substrate 2 by the intermediate lens 10 and the objective lens 9, and generates image information. The image processing unit 12 (image processing means) acquires the defective image data output from the CCD camera as a map. Like the information, the inspection condition reading unit 26 acquires information necessary for the inspection. The information acquired from the inspection condition reading unit 26 is, for example, reference image data from a subject to be inspected in a normal state. The reference image data is created by, for example, the method disclosed in Japanese Laid-Open Patent Publication No. 2005-10042. The image processing unit 12 extracts the defective portion on the glass substrate 2 from the difference image data obtained by comparing the defective image data with the reference image data, performs binarization processing, and creates a defect extraction 15 image for displaying the defect shape. data. Further, the image processing unit 12 can obtain the outline of the defective portion from the defective image data or the difference image data to create a material for displaying the defect shape. The defect shape image data which is obtained from the defective image data, the defect extracted image data, or the like, and which can display the shape of the field of the laser light irradiation is displayed on the display 13 (image display means). 20 The repairing light source 14 (laser light source) emits laser light r which can repair the defective portion of the glass substrate 2. For example, the laser light source YAG laser oscillator is used as the repairing light source 14β, and the repair light source _ receives the information that is rotated from the image processing unit 12 (the laser light is displayed at the time of illumination described later). The set laser light source setting information is 'controlled to select the power of the laser light r (the energy intensity per unit area, etc.) from the value set to an arbitrary value 11 1377104 or a predetermined value, and constitutes the laser light shaping mechanism of the present invention. portion. The DMD unit 16 (a laser beam shaping mechanism and a spatial modulation device) is provided in the transmission mirror 15 in the light path of the laser beam emitted from the repairing light source 14. The DMD unit 16 is constructed such that a plurality of DMdi 7 (microdevices) as shown in Fig. 2 are arranged in the two-dimensional vertical and horizontal directions as shown in Fig. 3. As shown in Fig. 2, in the DMD 17, a micromirror 19 is provided on the upper portion of the drive storage unit 18 in a digitally controllable manner, for example, at an angle of ±10° and 0° (horizontal). The DMD 17 can switch the angle ±1〇 at a high speed by the electrostatic attractive force caused by the voltage difference between the micro mirrors 19 and the driving storage unit 18. For example, those disclosed in Japanese Laid-Open Patent Publication No. 2000-28937 are known. The rotation of the micromirror 19 is limited to an angle of 1 〇. And 〇N in the drive storage unit a is rotated by an angle ±1〇. When it is "OFF", it returns to the horizontal angle 〇. . Further, the micromirror 19 is formed into a micromirror of several μm to 15 + μη1 using a semiconductor manufacturing technique, and as shown in FIG. 3, a micromirror 19 is arranged in two dimensions on the driving storage unit 18 to constitute a DMD unit. 16. The reference reflection surface 16a of the DMD unit 16 (the reflection surface when the angle of each micromirror 19 is 〇β) sets the exit angle of the laser light r with respect to the incident optical axis as 〇i, and when each micromirror 19 is due to ''N ', tilt to angle +1 〇. At this time, the χγ plane 2〇 is inclined at an inclination angle of 0a so that the exit angle of the laser light r is set to this. The reference reflecting surface 16a is set to a θ 〇 angle with respect to the optical axis of the incident angle of the laser light r from the arrangement position of the mirror portion 15, the relay lens 2 〇, the beam splitter 8 and the like, and is inclined at an inclination angle 9a. Further, the DMD unit 16 is ruptured in response to the incident direction or the outgoing direction of the laser light r to the tilting angle of the reference reflecting surface 16a as adjusted by 12 1377104 in the χυθ direction of the support table 16b. The exit angle 0 of the #光光 r is determined, for example, by the rotation angle + ιβ of each of the micromirrors 19 when the drive storage unit is turned ON. The laser light r emitted at the exit angle is incident on the beam splitter 8 through the relay lens 20. Also, if the drive storage is set to "〇ff", the laser diaphragm will be reflected in the h direction, and * will pass through the relay lens 20 to shoot the beam splitter 8. Further, the laser beam emitted from the repairing light source 14 is reflected by the mirror portion 15 and enters the DMD unit 16' at an incident angle. However, the mirror portion 15 can be removed, and the laser beam emitted from the repairing light source 14 can be directly incident on the DMD. single_. The mirror portion 24, which is detachably provided in the optical path of the repairing 10 light source I4 and the mirror portion I5, is provided with a repair position light source 25 for illuminating visible light and confirming the irradiation range beforehand. In the optical system having the above configuration, the CCD camera U is disposed from the glass substrate 2 through the beam splitter 8, and the DMD unit 16 is disposed from the glass substrate 2 through the beam splitter 8. The arrangement position 15 of the CCD camera and the DMD unit 16 is The conjugate positional relationship with respect to the glass substrate 2. The laser shape control unit 21 (spatial modulation device control unit) can read the defect shape image data of each defective portion on the glass substrate 2 formed by the image processing unit 12, and corresponds to the defect shape image data. The control information is output to the DMD driving unit 2 2 (spatial modulation device control unit), and the control information can be set by the driving storage unit 18 of each of the micro mirrors 19 of the DMD unit 16 disposed in the region irradiated with the laser light 20. When it is "ON", the drive storage unit 18 of each of the micro mirrors 19 disposed in another area is set to "OFF". In the defect shape image data created by the image processing unit 12, for example, when the defective portion cannot extract the full defect region, or the normal region is erroneously smoked <S) 13 1377104 as the defective portion, The subsequent trimming portion 23 of the shape control portion 21 can manually correct the extracted defective portion regions. The trimming unit 23 registers the unextracted defective area setting area by the manual operation using the drawing tool, and registers it as a defective part or an area setting area which is erroneously extracted as a defective part, and registers 5 as a normal area. In order to match the cross-sectional shape of the laser light r to the defective portion of the glass substrate 2 by the operation of the trimming portion 23, the support table 16b can be controlled to be slightly moved in the χυθ direction. The DMD drive unit 22 drives the drive storage units 18 of the DMD unit 16 to "ON" and "off" in accordance with the control information "delivered by the laser shape control unit 21." After the image processing and the laser light inspection _ the defect portion of the substrate 2 is repaired, the image data of the same position from the CCD camera 11 is obtained, and the self-check condition reading unit is obtained from the image data and the comparison. The reference image of Fig. 26 is the difference between the image data and the material that is judged to be "completed". If the patching is completed*, the image processing unit 12 creates the defective shape image data of the defective portion again from the difference image data. The pattern 21 reads the defective shape created by the image processing unit 12 again = = =, and sets the drive storage unit 18 of the D·unit 兄 brother 9 of the defective shape image data to "ON". 20 Camera == Reference Chart says "Ir. Processing Unit 12". The coffee photo 2 = r4aa, and the inspection condition _26 round - start material ^ defect extraction portion 31. The defect extracting unit 31 is used to perform positional comparison when the reference image data bb is read by the defect image data of the map. The position can correspond to the brightness (brightness) of each of the P 31 control defect image data a a and the reference image data b b 14 . When the brightness is compatible, the defect extracting unit 31 compares the two, and generates difference image data (an image composed of absolute values of luminance differences of the respective pixels). Next, the defect extracting unit 31 determines, based on the difference image data, that the absolute value of the luminance difference 5 is a threshold value Th1 (for example, when the image data is composed of 256 gradations, TM=30 or the like is set), and the reference map is used. The image bb is different from the defect image data aa, that is, the determination of the defective portion on the defective image data, and whether the display is a defective portion, in other words, the missing (four) output portion 31 generates a defect-extracting image data that can display the shape of the missing alpha shape. Ee and output. For example, from the missing image data aa displayed in the figure and the reference image data displayed as the 5th map, the image data generated as the fifth (: the defect shown in the figure is extracted (3). The defective image data aa , reference image data (10) and defect extraction departmentΜ
所輸出线陷抽出圖像資料_入至缺陷狀態判定部I 15 2陷狀射彳定部32從該等圖像f料進行關於可顯示缺陷特 f之項目的判斷,顯示特徵之項目例如:缺陷為哪種種類 J如為捲進異物、或為抗餘圖案膜殘留等广缺陷為何種 ^ ;缺陷㈣什麼位置(例如’在不同電位間引起短路、 ^未接觸任何電位而孤立等);及是否需要進行修補處理 2〇 =結果’缺陷狀態判定部32可輸出顯示包含缺陷之照射 =區域之特徵及狀態的照射縣輯資料dcm及缺陷判 昭如訊e e照射對象圖像資料d d係以圖像顯示缺陷圖像之 :,對象區域者’缺陷判定資訊從係以非圖像之資訊顯示 缺陷狀態者。 例如,由第5A〜5C圖可如下而產生如第6八圖所示之照 15 1377104 光設疋之雷射光源設定資訊gg。缺陷形狀圖像資料ff發送至 雷射形狀控购21、雷射紐設定資訊gg則送至修補用光 源14 〇 例如’第6A圖所示之照射對象圖像資料dd設定照射次 5數為2次時之缺陷形狀圖像資料ff分別以第6B圖所示之圖 像貝料表不第1次照射、以第6C圖所示之圖像資料表示第2 人之照射。在此,相對於第68圖,使雷射光照射為照射對The output line trap image data_into the defect state determination unit I 15 2 determines from the image f material that the item of the display defect f can be displayed, and the item of the display feature is, for example: What kind of defect is the type of J, such as a foreign object, or a residual defect such as a residual pattern film; what position of the defect (4) (for example, 'short circuit between different potentials, ^ not exposed to any potential, etc.); And whether or not the repair process is required. 2 〇 = result 'The defect state determination unit 32 can output the irradiation county data dcm indicating the characteristics and state of the irradiation including the defect and the defect judgment image. The image displays the defect image: the object area's defect determination information is displayed by the non-image information. For example, the laser light source setting information gg of the 15 1377104 light setting as shown in Fig. 6 can be generated as shown in Figs. 5A to 5C. The defect shape image data ff is sent to the laser shape control purchase 21, and the laser beam setting information gg is sent to the repairing light source 14 〇 For example, the illumination target image data dd shown in Fig. 6A is set to the number of illumination times 5 The defective shape image data ff at the next time indicates that the image of the second person is not irradiated with the first image of the image shown in Fig. 6B and the image of the second person with the image data shown in Fig. 6C. Here, with respect to Fig. 68, the laser light is irradiated as an illumination pair
象之區域全體,第6C圖則使雷射光照射引起電氣短路之 處’即抗钱圖案或匯流排線之周邊部,並且不照射離開抗 10蝕圖案或匯流排線的位置。第6(:圖係期望能達到確實修補 電氣短路的效果。 诼恩理部12所處理之_外…ΓΓΤ ,财陷圖像貢 时、缺陷抽出圖像資料cc、及缺陷形狀圖像資料奸透過遥 15In the entire area of the image, the 6Cth diagram causes the laser light to cause an electrical short-circuit, i.e., the peripheral portion of the anti-money pattern or the bus bar, and does not illuminate the position away from the anti-corrosion pattern or the bus bar. The sixth (: the picture is expected to achieve the effect of indeed repairing the electrical short circuit. 诼En 部 12 processing _ outside ... ΓΓΤ, the financial trap image gong time, the defect extraction image data cc, and the defect shape image information Through the distance 15
20 器34,作為顯示器顯示資訊hh輸出至顯示器13,而使相 該等圖像資料之圖像可顯示於顯示器13。選擇器Μ藉由 圖不之手動開關,進行選擇欲顯示之圖像資料、或輪Λ 產生之圖像資料時自動於顯示器13顯示圖像等動作。 外,選擇器34所選擇之圖像資料不一定必須為丨個,例士 對於缺陷圖像資料aa,也可產生可重疊缺陷抽出圖像實 CC或缺陷形狀圖像資料ff而重疊顯示之顯示器顯示資訊匕 接著,參照第7圖,說明圖像處理部12的動作。從c 照相機11將缺陷圖像資料a a、從檢查條件讀取部2 6將其 圖像資料b b輸入缺陷抽出部31及缺陷狀態判定部3 2 土 抽出部31—開始對照缺陷圖像資料aa與基準 、 y 1豕頁料bt 17 1377104 畫面上位置及亮度,產Μ異圖像(由各像素之亮 值所構成之圖像)(步锁S701)。接著,缺陷 以、. 旦圖傻眘祖欠、丨ΰ抽出部31比較差 J像貝科各像素之亮度差、與缺陷抽出部Μ之說明 顯示之可抽取出缺陷的臨限值Thl,產生2值 像資料ce ’輸出至缺陷狀態判定部32(步驟=出圖 即 圖所示’缺陷抽出圖像資料ccJl,缺陷部、即差異:第5C 像素值為臨限值Thm上之像素為白像素,缺陷部^像之 差異圖像之像素值較臨限值Thl小之像素為黑像素。夕、 然後’缺陷狀態判定部3 2根據缺陷抽出圖像資 ίο 判斷缺陷部是轉在(步·7G3)。步购〇3之_基W ’ 僅只有是轉在有㈣缺畴之白像素,還包含準不 結處之面積是否為預定值以上。當判斷缺陷部不存在^'連 前進至步驟S·;當判斷為存在有缺陷部時寺’ S704 芝步驟 15 步驟S703中,判斷存在有缺陷部(YES)時,缺陷狀雄、, 定部32比較缺陷抽出圖像資料ee、與附加於基判像= bb之圖案區域資料,鼻出接觸缺陷部之圖案區域數(步; S704)。圖案區域資料係以2值圖像顯示作為修正對象卜騍 新之製造步驟所產生)之圖案區域者,例如基準圖像資 20 若為第8A圖時,設定如第8B圖。 第8B圖所示之圖案所構成之區域(黑區域)係為修正對 象之圖案區域。設定該圖案區域為具有不同電位處相異之 區域。亦即,缺陷部跨越不同圖案區域而存在時,相同 電流會流至本來應有電位差之處,而產生電氣短路。因此 18 1377104 根據已進行位置對照之缺陷圖像資料aa與基準圖像資料 bb利用缺心部與圖案區域的位置關係此點,判斷是 否引起電氣短路而進行步驟87〇4之處理。 例如’如第9A圖所示,對於如第8C圖般之缺陷圖像資 5料重且缺部9〇1與圖案區域,由於缺陷部州未接觸到 任何圖案區域,故此時,接觸之圖案區域數為0。又,如第 9C圖所示’相對於如第9B圖般之缺陷圖像資料,重疊缺陷 部902與圖案區域,缺陷部9〇2接觸到存在於晝面中央之_ 電極圖案㈣及’、位於各電極圖案間之匯流排線9〇4, 10 故此時所接觸之圖案區域為3。 缺陷狀態判定部32可如以下方式算出圖案區域數。缺 陷狀態判定部32分別從缺陷求出圖像f料“求出缺陷部個 數“Ncl” 、又從圖案區域資料求出圖案區域個數 Npl 。接著,缺陷狀態判定部32取得將缺陷抽出圖像資 15料“黑白顛倒之資料(=使缺陷部為黑像素者)與圖案區域之 邏輯積,對於該結果求出黑區域個數“Nbl”。然後,缺陷 狀態判定部32使用第(1)式舁出接觸之圖案區域數“Nti”。 Ntl=(Ncl+Npl)-Nbl ...(1) 例如,第8A〜8C圖及第9A〜9C圖中,第83之圖案區 2〇域個數“NP1”為16。又,缺陷圖像資料為第8C圖及第9B 圖時,皆為1個缺陷,則兩者缺陷部個數“Ncl,,皆為1。根 據上述算出圖案區域數“Ntl” 》 缺陷圖像為第8C圖時,以第9A圖之白以外的區域顯示 缺陷抽出圖像資料cc之黑白相反、與第83圖所示之圖案區 19 1377104 域資料的邏輯積結果,則白以外之區域(=相當於黑區域)個 數“Nbl”為17。因此,圖案區域數“Ntl,,為(Ncl+Npl)_ Nbl=(l + 16)-17=0 〇 另一方面’缺陷圖像資料為第9B圖時,以第9C圖之白 5以外的Q域顯不缺陷抽出圖像資料cc之黑白相反、與第8B 圖所示之圖案區域資料的邏輯積結果,則白以外之區域(= 相當於黑區域)個數“ Nbl ”為14。因此,圖案區域數 “Ntl” 為(Ncl+Npl)-Nbl=(l + 16)-14=3。 步驟S704之處理結束後,缺陷狀態判定部32判定接觸 10之圖案區域數是否大於1(步驟S705)。接觸之圖案區域數大 於1時,前進至步驟S706,1以下時前進至步驟S7〇9。 例如,第8A〜8C圖及第9A〜9C圖中,缺陷圖像資料為 第8C圖時,圖案區域數“ Ntl ”為〇,則步驟S7〇5為 NO ,下一個處理為步驟S709。又,缺陷圖像資料為第 15 9B圖時,圖案區域數“Ntl”為3,則步驟S705為 “YES”, 下一處理步驟為步驟S706。 接觸之圖案區域數大於1係指會引起電氣短路。 在本貫施型態中,對於被檢查對象之機能將發生異常 之處作為修正區域,因而進行如步驟S7〇5之判斷,但,若 2〇以維持圖案形狀的目的設定修正區域,則也可將步驟S705 之判斷基準設為「接觸之圖案區域數是否為丨以上」、即缺 陷部是否有接觸圖案區域,以作為更嚴格之條件。 步驟S705中,當接觸之圖案區域數大於ryes)時,缺 陷狀態判定部32從缺陷圖像資料⑽、基準圖像資料他、及 20 c, 5 > 1377104The device 34 outputs the information hh to the display 13 as a display, so that an image of the image data can be displayed on the display 13. The selector 自动 automatically displays an image on the display 13 when the image data to be displayed or the image data generated by the rim is selected by the manual switch. In addition, the image data selected by the selector 34 does not necessarily have to be one. For the defective image data aa, the display may also generate a display with overlapped defect extraction image real CC or defect shape image data ff and overlapping display. Display Information Next, the operation of the image processing unit 12 will be described with reference to Fig. 7 . The defective image data aa from the c camera 11 and the image data bb from the inspection condition reading unit 26 are input to the defect extracting unit 31 and the defect state determining unit 3 2 the soil extracting unit 31 to start the comparison of the defective image data aa and Reference, y 1 豕 page material bt 17 1377104 Position and brightness on the screen, producing a different image (an image composed of the bright values of each pixel) (step lock S701). Then, the defect is, and the singularity of the singularity of the singularity of the singularity of the singularity of the singularity of the singularity of the singularity of the singularity of the pixel The binary image data ce ' is output to the defect state determination unit 32 (step = the figure shown in the figure is 'the defect extraction image data ccJl, the defect portion, that is, the difference: the pixel at the 5th pixel value is the threshold value Thm is white The pixel, the pixel whose difference value of the defect image is smaller than the threshold value Th1, is a black pixel. Then, the 'defective state determination unit 3 2 judges that the defective portion is turned according to the defect extraction image. · 7G3). Step by step 之 3 _ base W ' only only in the white pixel with (4) missing domain, but also contains the area of the quasi-non-junction is above the predetermined value. When judging the defect does not exist ^ ' even forward To step S·; when it is determined that there is a defective portion, in the case of step S703, when it is determined that there is a defective portion (YES), the defect is male, and the fixed portion 32 compares the defective extracted image data ee, and Attached to the pattern area of the base judgment image = bb, the map of the nose contact defect The number of regions (step S704). The pattern region data is displayed in the pattern region of the new manufacturing step as the correction target in the binary image. For example, if the reference image asset 20 is the 8A image, the setting is as follows. Figure 8B. The area (black area) formed by the pattern shown in Fig. 8B is the pattern area of the corrected object. The pattern area is set to have different regions at different potentials. That is, when the defective portion exists across different pattern regions, the same current flows to the place where the potential difference should be present, and an electrical short circuit occurs. Therefore, according to the positional relationship between the defective portion and the pattern region, the defect image data aa and the reference image data bb which have been subjected to the positional comparison are judged whether or not an electrical short circuit has occurred, and the processing of the step 87〇4 is performed. For example, as shown in Fig. 9A, for the defect image as shown in Fig. 8C, the material is heavy and the missing portion 9〇1 and the pattern area, since the defect state does not touch any pattern area, at this time, the contact pattern The number of regions is 0. Further, as shown in Fig. 9C, with respect to the defective image data as shown in Fig. 9B, the defective portion 902 and the pattern region are overlapped, and the defective portion 9〇2 is in contact with the _ electrode pattern (4) and ', which exists in the center of the facet. The bus line 9 is located between the electrode patterns, and the pattern area that is in contact with this time is 3. The defect state determination unit 32 can calculate the number of pattern regions as follows. Each of the defect state determination units 32 obtains the number of pattern regions Npl from the pattern region data from the defect determination image f. Then, the defect state determination unit 32 acquires the defect extraction map. The logical product of the black and white inverted data (= the black portion of the defective portion) and the pattern area is obtained, and the number of black regions "Nbl" is obtained for the result. Then, the defect state determining unit 32 extracts the number of pattern regions "Nti" of the contact using the formula (1). Ntl = (Ncl + Npl) - Nbl (1) For example, in the 8A to 8C and 9A to 9C, the number of the pattern area 2 NP1 of the 83th is 16. In addition, when the defect image data is the 8C and 9B, both are defective, and the number of defective portions is "Ncl, and both are 1. According to the above, the number of pattern regions is calculated as "Ntl"". In the case of Fig. 8C, the logical product of the black-and-white reverse of the image data cc of the defective extracted image data cc and the data of the pattern area 19 1377104 shown in Fig. 83 is displayed in an area other than the white color of the ninth image, and the area other than white is = is equivalent to the black area) The number "Nbl" is 17. Therefore, the number of pattern regions "Ntl, is (Ncl+Npl)_Nbl=(l + 16)-17=0 〇On the other hand, the defect image data In the case of FIG. 9B, the logical product result of the black-and-white reverse of the image data cc and the pattern area data shown in FIG. 8B is extracted from the Q-domain defect other than the white image 5 of the ninth figure, and the area other than white is = equivalent to black area) The number "Nbl" is 14. Therefore, the number of pattern regions "Ntl" is (Ncl + Npl) - Nbl = (l + 16) - 14 = 3. After the processing of step S704 is completed, the defect state determining unit 32 determines whether or not the number of pattern regions of the contact 10 is greater than 1 (step S705). When the number of contact pattern areas is larger than 1, the process proceeds to step S706, and when it is 1 or less, the process proceeds to step S7〇9. For example, in Figs. 8A to 8C and Figs. 9A to 9C, when the defect image data is the 8C picture, the number of pattern regions "Ntl" is 〇, then step S7〇5 is NO, and the next process is step S709. Further, when the defective image data is the 15th 9th, the number of pattern regions "Ntl" is 3, the step S705 is "YES", and the next processing step is the step S706. If the number of pattern areas in contact is greater than 1 means that an electrical short circuit will occur. In the present embodiment, the abnormality of the function of the object to be inspected is used as the correction area, and thus the determination in step S7〇5 is performed. However, if the correction area is set for the purpose of maintaining the shape of the pattern, The criterion for the determination in step S705 can be set as "whether or not the number of pattern regions in contact is 丨 or more", that is, whether or not the defective portion has a contact pattern region as a more stringent condition. In step S705, when the number of contact pattern regions is larger than ryes, the defect state determination portion 32 reads from the defect image data (10), the reference image data, and 20 c, 5 > 1377104
若以細輪廓線表示照射形狀,If the shape of the illumination is indicated by a thin outline,
定照射次數之控制係數的表格。 部全體中以最新步驟產生之圖案部(第12A圖中為匯流排線) 的區域,第2次的照射如第12B圖所示,設定照射形狀區域 1103以照射缺陷部之輪廓,即僅照射圖案區域與引起電氣 短路之處。此外,第3次的照射如第12C圖所示,設定照射 形狀區域1104以照射第12B圖之照射形狀區域1103的輪 廓。設定第11A圖、第11B圖、第12A〜12C圖之照射形狀的 理由也等同於第10A〜10D圖的理由。 如第10A〜10D圖、第11A〜11B圖、第12A〜12C圖所 示之雷射光之各次照射的照射形狀,可利用圖像處理之形 態學(Morphology)演算而生成。例如,關於第2次的照射形 狀,可藉由以2值圖像表示第1次的照射形狀,得到相對於 此進行複數次收縮處理(Erosion)之中間圖像,從第1次照射 形狀之2值圖像減去中間圖像而產生。此外,對於第3次的 照射形狀,可藉由以2值圖像表示第2次的照射形狀,得到 相對於此進行複數次收縮處理之第2次之中間圖像,從第2 次照射形狀之2值圖像減去第2次之中間圖像而產生。可適 當地設定收縮處理的次數,若以 則次數可較少’以較粗輪廓線表 定義可依照色彩資訊而設 在此,缺陷圖像資料aa與 23 1377104 基準圖像育料bb之間’設定為圖案位置與各圖像亮度已經 相合者。 將關於色彩資訊之相關的係數分別作為Re、Gc、Bc, 缺陷狀態判定部32依各色別算出係數。關於本實施形態所 5顯不之色彩貢訊之相關的係數,係藉由比較不存在有缺陷 且不存在有圖案之區域(非圖案區域,例如基底區域等)中各 圖像的不同、與存在有缺陷之圖案區域中各圖像的不同。 亦即,藉由不存在有圖案之區域的不同,可看出存在有缺 陷之圖案區域中的不同。 10 例如,關於R(紅)的色彩資訊,將缺陷圖像資料aa中, 未存在有缺陷之非圖案區域的平均亮度設定為 Def—NP_ND(R)、存在有缺陷之圖案區域的平均亮度設定為 Def_P_D(R) ’基準圖像資料bb中,除去相當於缺陷圖像資 料aa之缺陷部之處的非平均圖案區域平均亮度設定為 15 Ref-NP(R)、相^於缺陷圖像資料aa之缺陷部之處的圖案區 域平均亮度設定為Ref—P(R),則R之色彩資訊的係數Rc可由 第(2)式算出。A table of control coefficients for the number of exposures. In the entire portion of the whole portion, the pattern portion (the bus line in FIG. 12A) is generated in the latest step, and the second irradiation is as shown in FIG. 12B, and the irradiation shape region 1103 is set to illuminate the contour of the defect portion, that is, only the irradiation. The pattern area is where electrical shorts are caused. Further, as shown in Fig. 12C, the third irradiation is performed to set the irradiation shape region 1104 to illuminate the outline of the irradiation shape region 1103 of Fig. 12B. The reason for setting the irradiation shapes of Figs. 11A, 11B, and 12A to 12C is also equivalent to the reason of Figs. 10A to 10D. The irradiation shape of each of the laser beams as shown in Figs. 10A to 10D, 11A to 11B, and 12A to 12C can be generated by Morphology calculation of image processing. For example, regarding the second irradiation shape, the first irradiation shape can be represented by a binary image, and an intermediate image in which a plurality of contraction processes (Erosion) are performed in this manner can be obtained from the first irradiation shape. The 2-value image is generated by subtracting the intermediate image. Further, in the third irradiation shape, the second irradiation shape can be represented by a binary image, and the second intermediate image which is subjected to the plurality of contraction processing in this manner can be obtained, and the second irradiation shape is obtained from the second irradiation shape. The binary image is generated by subtracting the second intermediate image. The number of times of shrinkage processing can be appropriately set, and if so, the number of times of shrinkage can be less. 'The definition of the thicker outline table can be set according to the color information, and the defect image data aa and 23 1377104 between the reference image breeding bb' Set to match the position of the pattern and the brightness of each image. The coefficients relating to the color information are referred to as Re, Gc, and Bc, respectively, and the defect state determining unit 32 calculates coefficients for each color. The coefficient relating to the color information displayed in the fifth embodiment is based on the difference between the images in the region where there is no defect and the absence of the pattern (non-pattern region, for example, the base region, etc.) There is a difference in each image in the defective pattern area. That is, by the difference in the area where the pattern is not present, it can be seen that there is a difference in the pattern area where the defect is present. 10 For example, regarding the color information of R (red), the average brightness of the defective non-pattern area in the defect image data aa is set to Def_NP_ND(R), and the average brightness setting of the defective pattern area is set. In the Def_P_D(R)' reference image data bb, the average brightness of the non-average pattern area where the defect portion corresponding to the defect image data aa is removed is set to 15 Ref-NP(R), and the defect image data is The average brightness of the pattern area at the defect portion of aa is set to Ref_P(R), and the coefficient Rc of the color information of R can be calculated by the equation (2).
Rc=||(Def_NP_ND(R)/Ref_NP⑻_(Def—p—D(R)/Refp( R)|| ...(2) 20 關於其他色彩資訊(G、B)也以同樣定義算出各係數Rc=||(Def_NP_ND(R)/Ref_NP(8)_(Def_p_D(R)/Refp( R)|| (2) 20 For other color information (G, B), the coefficients are also calculated by the same definition.
Gc、Be。根據第(2)式,可推定:係數以越小,缺陷部顏色 越接近圖案區域的顏色(相關較大),即,缺陷部係因圖案膜 而產生者。而,相對於所算出之RC、Gc、Be,可使用比較 臨限值Th_Rc、Th—Gc、Th_Bc之條件。若係數為臨限值以 < S ) 24 1377104 下,則缺陷狀態判定部32分別將可設定照射次數之控制係 數aRc、ctGc、aBc設定為卜若係數大於臨限值,則缺陷狀 態判定部32分別將aRc、aGc、aBc設定為0。臨限值Th 、 Th_Gc、Th一Be為0以上之數值,例如可分別設定為〇丨〜〇 2 5 左右。 第13Β圖係使用根據第13Α圖而設定之控制係數aRc、 aGe、aBc來推定缺陷部種類,作為結果,定義關於依照缺 陷種類而不同之照射次數的增益係數β d時所使用的表格。 條件係依aRc、aGc、aBc之邏輯演算而得者,若全部控制 1〇係數皆為1’則缺陷狀態判定部32判定缺陷為「膜殘留」型, 設定增益係數βίΐ為1.0。又,若有1個以上之控制係數為〇, 則缺陷狀態判定部32判定缺陷為「異物」型,設定増益係 數βίΐ為1.5。將缺陷種類之判定結果輸出至照射條件設定部 33 ° 15 第圖之缺陷判定基準係根據是否具有關於全部色 彩之色彩資訊的相關而得者。亦即,若缺陷係因與圖案區 域同樣的「膜」而產生者,關於各色相關之係數Rc、GC、Gc, Be. According to the formula (2), it can be presumed that the smaller the coefficient is, the closer the color of the defect portion is to the color of the pattern region (the correlation is large), that is, the defect portion is generated by the pattern film. Further, the conditions for comparing the threshold values Th_Rc, Th_Gc, and Th_Bc can be used with respect to the calculated RC, Gc, and Be. When the coefficient is a threshold value of <S) 24 1377104, the defect state determination unit 32 sets the control coefficients aRc, ctGc, and aBc that can set the number of irradiations to be greater than the threshold value, and the defect state determination unit 32 sets aRc, aGc, and aBc to 0, respectively. The threshold values Th, Th_Gc, and Th-Be are values equal to or greater than 0, and can be set, for example, to about 〇丨~〇 2 5 . In the thirteenth aspect, the types of defective portions are estimated using the control coefficients aRc, aGe, and aBc set according to Fig. 13 and, as a result, a table for using the gain coefficient β d for the number of times of irradiation different depending on the type of defect is defined. The condition is calculated based on the logical calculations of aRc, aGc, and aBc. If all the control coefficients are 1', the defect state determination unit 32 determines that the defect is "film residual" type, and sets the gain coefficient ?ίΐ to 1.0. When one or more control coefficients are 〇, the defect state determining unit 32 determines that the defect is a "foreign matter" type, and sets the profit factor βίΐ to 1.5. The determination result of the defect type is output to the irradiation condition setting unit. 33 ° 15 The defect determination criterion in the figure is based on whether or not there is correlation of color information on all colors. That is, if the defect is caused by the same "film" as the pattern area, the correlation coefficient Rc, GC,
Bc會變小(色相關會變大),控制係數aRc、aGc、aBc全部變 成1 °另一方面,若缺陷與圖案區域顏色不同,例如黑或白 20 等色’關於各色相關之係數Re、Gc、Be至少有1個顏色會 ^大(色相關變小),故控制係數aRc、aGc、aBc至少1個會 變成〇。增益係數β(1係可因應缺陷種類變更雷射光照射次數 的係數,在第13Β圖中,可增加對「異物」型缺陷的照射次 數。 25 1377104 第13C圖係根據由缺陷圖像資料时所得之缺陷部面 積’定義雷射光照射次數Ta的表格。在第13C圖中,將缺陷 部面積表示為相對於圖像資料之大小(像素數)之缺陷部像 素比率AAp。關於面積比率AAp,以臨限值Th_As及臨限值 5 Th-A1之大小關係作為條件,缺陷狀態判定部32將缺陷部面 積分類為「Small」、「Medium」、1" Large」3種。臨限值Th_As、 Th一A1係關於面積比率之〇以上、1以下的數值,Th_As< Th一Ah缺陷狀態判定部32設定為例如Th_As=〇 j、 Th_Al=〇.25左右。 10 關於條件’若面積比率AAp小於臨限值Th_As,則缺陷 狀態判定部32將缺陷部面積分類為「Small」;若面積比率 AAp為臨限值Th_As以上、小於臨限值Th_A卜將缺陷部面 積分類為「Medium」;若面積比率AAp為臨限值Th_Al以 上’則將缺陷部面積分類為「Large」^面積分類結果輸出 15 至照射條件設定部33。照射條件設定部33根據面積分類結 果而設定雷射光之面積照射次數Ta。在第13C圖中,缺陷部 面積若為「Small」,則照射次數Ta為1 ;缺陷部面積為 「Medium」時,照射次數Ta為2 ;缺陷部面積為「Large」 時’照射次數Ta為3。亦即,以缺陷部面積成比例地增加雷 20 射光照射次數。 照射條件設定部3 3根據依第13 B圖設定之關於照射次 數的增益係數Pd、與在第13C圖所設定之面積照射次數Ta, 藉由第(3)式決定實際修補處理之雷射光照射次數ST。 ST=pdxTa ...(3) 26 1377104 資料之像素、下部顯示微小鏡19的排列。在本實施形態中, 分別配置使像.素與微小鏡可互相對應。例如,第ΐ4Α圖顯示 雷射光照射時倍率與觀察時相同之情況。此時,像素大小 與微小鏡19之面積比為丨:!的_(兩相尺寸),亦即㈠象 5素對應有1個微小鏡19。藉此,可以1像素單位控制雷射光 之照射。 第14B圖顯示雷射光照射時之倍率為相對於觀察時倍 率的2倍時,即面積比為4倍時之情況。此時,像素大小與 微小鏡之面積比為1 : 4的關係,亦即每2X2像素對應有1個 微小鏡19。藉此’雖較第14A圖時微小鏡19的密度變大,但 可使DMD單元16之構造變簡單,可更使處理高速化。 實際之DMD在微小鏡間有間隙,而第丨4匚圖顯示該情 形。在第14C圖中,顯示像素大小與微小鏡的面積比為例如 1 : 0.8的關係,亦即微小鏡19之大小較1像素之大小較小時 15 的配置關係。此時,在微小鏡19的周邊不會反射雷射光, 只要僅對於實際照射之被檢查物進行散焦的設定,從丨個微 小鏡反射之雷射光便可照射1像素之區域。亦即,即使有間 隙,藉由散焦,也可填補間隙而照射。即使微小鏡19如第 14A圖般與1像素之大小一樣,當1像素全體無法被完好的照 20 射(產生不均)時,藉由至少使配置在周邊部不反射,可控制 照射區域全體之不均。具體而言,有降低周邊部的反射率、 使周邊部產生曲率、改變反射方向等方法。 在第14A〜14C圖中,對於對應於作為照射對象之像素 的微小鏡19,雖以控制其能反射雷射光為前提,但控制方 28 < S ) 5 制,^限於此,例如也可進行將微小鏡分配於1像素間之控 第㈣各行之奇錢—小似射雷射光, 制。二照射時以各行之偶數號的微小鏡反射雷射光等控 >此’可延長DMD單元16的耐久性β 置,^外m形態使用反射型DMD作為空間調變裝 過^印使使用其他空間調變裝置,例如2次元地排列為透 刮同;J置之液晶快門、或微小快門的快n配置等,也可得 像的效果。 l〇 15 對象而上所述’本實施形態之雷射修補裝輩從拍攝被檢查 訊(離產像貞訊,生賴示缺㈣徵之缺陷特徵資 象區^_或面積等)’因應由缺陷特崎輯示之修正對 形而阳^狀態’決定雷射光的照射條件,進行雷射光的整 特別地、光。藉此’可自動進行高精確度之修補處理。 出 <依丨實^形权雷射修觀置使用從®像資訊所抽 bb^ . 正對象區域的特徵(缺關像資料aa與基準圖像資料 訊相關、或對於缺_像資料⑽之全像素數的 二象素數(缺陷面積)比率),分類修正對象區域的狀態 「^了種類為膜殘留型或異物型,或缺陷部面積為 20 .¾^ g」中何者),依分類結果決定 件^。藉此’可實現因應修正對象狀態之適當照射條 而有效率地確實進行修補處理。 藉由使用由微小裝置所構成之空間調變裝置,對 應於照㈣域調整雷射域㈣狀,即使修正时包含細 微處’也可進行適合該細微處之修補處理。此外,藉由依 29 1377104 照射條件控制空間調變裝置,即使修正對象狀態產生變化 也可高速地對應,因此可縮短修補處理時間,並可不浪費 地對於一處修正區域進行高速的修補處理。Bc will become smaller (color correlation will become larger), control coefficients aRc, aGc, aBc all become 1 °. On the other hand, if the defect is different from the pattern area color, for example, black or white 20 colors, the coefficient Re related to each color At least one color of Gc and Be will be large (the color correlation becomes small), so at least one of the control coefficients aRc, aGc, and aBc will become 〇. Gain coefficient β (1 is a factor that changes the number of times of laser light irradiation depending on the type of defect. In the 13th frame, the number of exposures to the "foreign matter" type defect can be increased. 25 1377104 Fig. 13C is based on the image data of the defect. The defect portion area ' defines a table of the number of times of laser light irradiation Ta. In Fig. 13C, the area of the defect portion is expressed as the defect portion pixel ratio AAp with respect to the size (number of pixels) of the image data. Regarding the area ratio AAp, The size relationship between the threshold value Th_As and the threshold value 5 Th-A1 is used as a condition, and the defect state determination unit 32 classifies the defect portion area into three types: "Small", "Medium", and 1" Large. The threshold values Th_As, Th In the case of the A1, the value of the area ratio is not less than 1 and the value of 1 or less, and the Th_As < Th-Ah defect state determination unit 32 is set to, for example, Th_As=〇j and Th_Al=〇.25. 10 Regarding the condition 'If the area ratio AAp is smaller than The limit state determination unit 32 classifies the defect portion area as "Small", and the area ratio AAp is equal to or greater than the threshold value Th_As and less than the threshold value Th_A to classify the defect portion area as "Medium"; When the area ratio AAp is equal to or greater than the threshold value Th_Al, the area of the defect portion is classified into "Large", the area classification result output 15 to the irradiation condition setting unit 33. The irradiation condition setting unit 33 sets the area irradiation amount of the laser light based on the area classification result. In Fig. 13C, if the area of the defective portion is "Small", the number of times of irradiation Ta is 1; when the area of the defective portion is "Medium", the number of times of irradiation Ta is 2; and when the area of the defective portion is "Large", the number of times of irradiation Ta is 3. That is, the number of times of radiation of the light beam 20 is increased in proportion to the area of the defect portion. The irradiation condition setting unit 3 3 sets the gain coefficient Pd for the number of times of irradiation set according to Fig. 13B and the setting of Fig. 13C. The number of irradiations Ta of the area is determined by the formula (3), and the number of times of the laser light irradiation ST of the actual repair process is determined. ST = pdxTa (3) 26 1377104 The pixel of the data and the arrangement of the lower portion of the micro mirror 19 are displayed. In the form, the image element and the micro mirror are respectively arranged to correspond to each other. For example, the fourth image shows the case where the magnification is the same as that of the observation when the laser light is irradiated. At this time, the pixel size is larger than the area of the micro mirror 19 _: _ (two-phase size), that is, one (i) corresponds to one micro-mirror 19. Thus, the irradiation of the laser light can be controlled in one pixel unit. Figure 14B shows that the magnification of the laser light is relatively When the magnification is doubled at the time of observation, that is, when the area ratio is 4 times, the ratio of the pixel size to the area of the micromirror is 1:4, that is, there is one micromirror 19 per 2×2 pixels. Therefore, although the density of the micromirrors 19 is larger than that of the 14A, the structure of the DMD unit 16 can be simplified, and the processing can be speeded up. The actual DMD has a gap between the tiny mirrors, and the fourth panel shows the situation. In Fig. 14C, the area ratio of the pixel size to the micromirror is, for example, a relationship of 1: 0.8, that is, the arrangement relationship of the size of the micromirror 19 when the size of the pixel is smaller than 15 pixels. At this time, the laser light is not reflected around the micromirror 19, and the laser light reflected from the micromirrors can be irradiated to a region of one pixel only by setting the defocusing of the actually irradiated object. That is, even if there is a gap, the gap can be filled and irradiated by defocusing. Even if the micromirror 19 is the same size as one pixel as shown in FIG. 14A, when the entire one pixel cannot be photographed (uneven), the entire irradiation area can be controlled by at least not reflecting the peripheral portion. Uneven. Specifically, there is a method of reducing the reflectance of the peripheral portion, causing curvature in the peripheral portion, and changing the direction of reflection. In the 14th to 14th Cth, the micromirror 19 corresponding to the pixel to be irradiated is premised on controlling the reflection of the laser light, but the controller 28 is limited to this, and for example, It is used to distribute the micromirror between the 1st pixel and the control of the (4th) line of small money-small-like laser light. In the case of the second irradiation, the laser beam is reflected by the even-numbered micromirrors of each row. This can extend the durability of the DMD unit 16 and use the reflective DMD as a spatial modulation to make use of the other. The spatial modulation device, for example, is arranged in a two-dimensional manner to have the same effect; the liquid crystal shutter of J or the fast n configuration of the micro shutter can also obtain an image effect. L〇15 The object above is described in the laser repairing and pre-installation of this embodiment from the shooting of the inspection (from the production of the image, the reliance on the lack of (four) levy of the defect characteristics of the image area ^_ or area, etc.] The correction of the shape of the target is determined by the correction of the defect, and the state of the laser is determined. This can automatically perform high-precision repair processing. The <br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br> The ratio of the number of two pixels (defect area) of the total number of pixels to the state of the classification correction target region "Which type is the film residual type or the foreign matter type, or the area of the defect portion is 20 .3⁄4^ g") The classification result determines the piece ^. By this, it is possible to efficiently perform the repair process in response to the appropriate irradiation strip for correcting the state of the object. By using a spatial modulation device composed of a micro device, the laser field (four) is adjusted in accordance with the (four) domain, and the repair process suitable for the fine portion can be performed even if the correction includes the fine portion. Further, by controlling the spatial modulation device according to the irradiation condition of 29 1377104, the correction processing state can be changed at a high speed even if the correction target state changes, so that the repair processing time can be shortened, and high-speed repair processing for one correction region can be performed without waste.
又,由於配合修正對象區域之形狀控制微小裝置(本實 5施形態中為微小鏡19的角度)的狀態,故即使修正對象區域 為複雜的形狀,也可設定適合形狀的照射區域,而進行確 - 實的修補處理。此外,如同使用第5A〜5C圖及第6A〜6C ^ 圖所進行之說明,由於藉由控制微小裝置以於修正對象區 域中加上光罩’將被檢查對象巾正案作為#射光照射 1〇禁止區域,使雷射光照射於除去本來不應照射之區域的修 正對象區域,故可進行無錯誤照射之修補處理。 又,由於藉由控制構成空間調變裝置之各微小裝置中 有無雷射光照射,可以微小裝置單位控制雷射光之照射, 故即使修正對象區域含有細微處或複雜形狀的地方,也可 15不損傷正常處而確實地進行修補處理。 • 且’藉由使用包含於修正對象區域表示祕特徵之缺 陷特徵資訊而決定照射條件,可配合缺陷狀態來決定照射 条件因此’可以適合修正對象之照射條件射地進行修 _處理。本實施形慼之缺陷特徵資訊中,除了缺陷種類或 面積外,還包含:修JP m & r ^ y止對象區域内之缺陷形狀(缺陷抽出圖 貝料CC)、冗度、位置(是否在不同電位間引起短路、或為 =接觸任何電位而孤立者等)、以及健(算出接觸缺陷部之 、案區域數時所使^、從缺陷抽出圖像資料所求得之缺 陷部個數)等。 30 #由_圖像資賴定雷射㈣射錄,更在昭 昭m軸狀_光_,w慮缺陷狀紅 、、射條件有效率地進行修補處理。 撿杳二藉由使用基準圖像資訊(基準圖像資料bb),比較為 -’ t圖像錢(缺陷圖像資料岭可將兩者相異之處 ^陷^)作為修正對象區域。此外,由於利用基準圖像資 ®祕可從修正對象區域中除去正常處,故可不對修正對象 域錯誤照射而可確實地進行修補處理。 10 又 ^,藉由-面顯示被檢查對象,—面重疊顯示關係於 :補處理之資訊(本實施形態中,為顯示缺陷形狀之缺陷抽 圖像資料e e、及顯示雷射光照射區域形狀之缺陷形狀圖 ^資_ ’结作業者之情況下可確實地把握修補處理的 狀^兄〇 、接著,說明本發明之第2實施形態。在本實施形態中, 於圖像處理部12财可記憶過去騎條件之照射條件歷程 5己憶部’可因應必要’讀取所記憶之照射條件。以下僅說 =不同於第1實施形態之處115圖顯示本實施形態之圖像 &理部12的構成。與第❻施形態不同之處在於:設有照射 條件歷程處理料及照射條件歸記憶部42,並對應於 此’將第1實麵態之_條件設定部珊更絲射條件設 定部43。 將從缺陷狀態判定部32所輸出之缺陷判定資訊ee輸入 =照射條件歷程處理料。然後,彻同樣内容之缺陷判 疋資訊ee,作為有關於藉由照射條件設定部所產生之照 31 1377104 射條件有關的資訊,將照射條件設定部43所產生之照射歷 程資訊jj輸入至照射條件歷程處理部4b在此,照射條件歷 程資訊jj具有檢索以後歷程時容易參照之格式,並根據缺陷 形狀圖像資料ff及雷射光源設定資訊gg而產生。該格式係例 5如第16圖所示者,具有表示照射條件之索引Ls—Cx,可變 之串列形式係由附加於LS—Cx之照射次數χ卜各次照射時 (第η次照射時)之雷射功率Cx—nJ>、形狀變化量Cx—η』、雷 射光束之解Cx_n_;F所構成。騎條件歷域理部4ι將所 輸入之照射條件歷程資訊jj依上述形式收納於照射條件歷 10 程記憶部42中。 ’ 貝机你祁對於例如原本之照 射對象圖像資料如所顯示之照射區域,使用第1〇Α〜_ 15 20 圖、第UA〜卿、識〜12C圖制之形態學演算之收 縮處理(Erosion)的反覆次數等般變化形狀時所使 前次結果為⑽的、錢最初狀態來看為絕對的射= 件歷程記憶部42相對應而記憶於所輸人之缺陷判定= 與照射條件朗訊jj。具體而言,在以構成缺陷判定資^ 沈之各特徵*^的空^,形成讀_定資訊㈣「重 〜」具有-疋大小之群集,對於1個群集,連結有如 圖所示之索引LS__Cx。 第16 藉此’在叫之修補處理巾,對於 決定照射條件時,藉以 、射f象圖像 #由將對應於照射對象 “ee輸入至照射條件歷程處理部41 ee與至現時點為止在 資訊 缺心判疋資訊e e之特徵空間所形成之 32 1377104 各群集重心的歐幾里得距離或馬哈朗諾比斯距離(考虎群 集之分散的距離),從照射條件歷程記憶部42讀取出連結至 距離為最小之群集的索引LS—Cx之照射條件,作為照射條 件歷裎資訊jj傳送至照射條件設定部43,可進行有效率的修 5補處理。此時之缺陷判定資訊ee未包含於距離為最小之群 集時,可進行擴大群集以含有缺陷判定資訊ee等更新,則 可更顯現出效果。 另一方面,於實際處理中,由於無法完全取出圖像資 訊之特徵量等理由,決定之照射條件有時會和作業者所須 10之修正不同,此時,可因應必要進行修整部23之照射條件 修正。此時,作業者必須對需要再次修正之被檢查對象物 不各地進行修正,而有損勞力。因此,在本實施形態中, 作業者將修整部23所修正之資訊經由#射形狀控制部21, 作為修整資訊kk輸入至照射條件歷程處理部41,可使作業 15者之修正内容與被檢查對象之圖像資訊相關聯而記憶於照 射條件歷程記憶部42。 具體而言,與從現在的圖像資訊所求得之缺陷判定資 訊e e相對應之照射條件歷程資訊力·中,從修整資訊吐取出關 〇於照射條件之資訊,重新寫人照射條件歷程之該資 馮。藉此,即使以後的檢查再出現類似的被檢查對象由 於作業者也可藉由已修整之照射條件進行修補處理,故作 業者無須再進行修整’而可有效率地進行檢查。 以下’說明照射條件歷程處理部41進行之處理。第17八 圖表示關於一般照射條件之歷程資訊的記憶及讀取的樣 33 1377104 子。第17A、17B圖中,缺陷判定資訊ee包含:缺陷部亮度、 包含缺陷部之圖像資訊與為基準圖像資訊之參照圖像資訊 間的色相關、及缺陷部面積,以該等為轴之3次元空間、即 圖像資訊之特徵空間表示如第17A、17B圖。另一方面,照 射條件歷程資訊jj表示根據於第16圖所示之格式的照射條 件。 ' 缺陷判定資訊ee與照射條件歷程資訊jj之關係非1對 g 1 ’對於1個照射條件歷程資訊jj(即照射條件),分布有缺陷 判定資訊ee(即圖像資訊之特徵量),即照射條件形成1個群 1〇 集。由上,在照射條件歷程記憶部42未發現關於對應於現 在被檢查對象之缺陷判定資訊ee的照射條件歷程時,照射 條件歷程處理部41算出離構成各照射條件之群集重心的距 離若離最近之群集重心的距離為預定之臨限值以下,則 照射條件歷程處理部41從照射條件歷程記憶部42讀出該群 15集之照射條件。作為照射條件歷程資訊jj傳送至照射條件設 • 定部43,並且更新(擴大)該照射條件之群集,以包含缺陷判 定資訊ee。 20 另一方面,若離最近之群集重心的距離較預定之臨限 值大,則照射條件歷程處理部41判斷必須重新設定照射條 示内 包含對於照射條件歷程資叫j設定新照射條件之指 容資訊而輸出至照射條件設定部43。 而,照射條件設定部43決定照射條件後,照射條件歷 程處理部4丨㈣射條件設以卩43接收絲㈣射條件之照 射條件歷«訊jj,從對應之缺關定資⑽形成新的群集、 34 (群集之形成非點之形成’而係以缺陷判定資訊ee為重心具 有疋大小而形成)。藉由反覆進行上述處理,可從過去經 驗學習」決定缺陷判定資訊ee之照射條件,而可達到有 智慧的修補處理。 又’作業者修補之照射條件歷程資訊jj係如下而進行更 新第17B圖表示輪入修整資訊時之歷程資訊更新的樣子。 修整資訊kk輸人照射條件歷程處理部辦,照射條件歷程 处口M1會從含有現在缺陷判定資訊ee之群集(照射條件 LS:C2) ’重新形成表示反映修整資訊kk之照射條件LS_Cp 的群集(群集仙構錢關Π訊α之⑽資訊特徵 重心,具有一定的大小卜 " , ^ T备鞠入包含表示該照射條件 15 20 屬;】之群集的缺陷判定資訊沈時,即使缺陷判定資訊ee 屬於表不照射條件LS—C2之群集時 =照射條件歷程記‘_2讀取照射條二: Π:!歷程資·送至照射條件設定·如上所 由其優先度較表亍二 = 射條件的群集,藉 為高,可「學f作^ /照射條件之群集的優先度 修補處理。」者之指不’而可達成更高智慧化的 17B圖說明作業者將既 照射條件,即分_存之群集而射條件變更為新 也可進行例如將以現在之修補處理所^群集’但作業者 綱既存條件者_群集合併其他::'= 35 < S ) f中,由於作㈣若進行—次修整,以後便可進行反映修 正内容之修補處理’故可大幅減輕作業者之勞力。 10 15 第18A〜18D圖係照射本實施形態中照射條件之歷程 育訊之使用例為圖像資料者,特別地顯示出因作業者之 修補而變更之照射條件。如第lu圖所示,當缺陷圖像資料 包含異物麵,且異物刪料錢明断較從基準 圖像資料抽出祕部,也難叫㈣明膜。因此,若僅將 異物麵看做缺陷部,_在相異電㈣未短路,則可能 連照射區域都無法設定。因此,如第1_所示,藉由作業 者之修整來修正第1次照射雷射光時之照㈣域。此時,作 業者也因應需要來修正照射錢或雷射功料其他照射條 件。該修正結果作為對於現在缺關定資訊之新照射條 件,收納於照射條件歷程記憶部42〇 然後’當出現如第18C圖般之缺陷圖像資料時,由於該 缺陷圖像育料具有與第18 A圖類似特徵之缺陷部,故新缺陷 圖像資料之缺陷判定資訊會產生與以前之缺陷圖像資料的 缺陷判定資訊相近者。 將新缺陷圖像資料之缺㈣定資訊輸人至照射條件歷 矛i處理部41後’照射條件歷程處理部4丨判斷在第18B圖作業 20者修整時所更新之照射條件也適用於這次的照射條件。如 上所述,即使出現與作業者修整時類似之被檢查對象,也 可根據修整時更新之照射條件實現修補處理。即使出現多 數類似之被檢查對象,作業者也僅需進行丨次修整,剩下的 即可自動根據修整内容進行修補處理,而可使檢查本身有 36 效率化。 如上所述’本實施形態之雷射修補裝置將照射條件決 疋時利用之資訊(從®像資訊所得之資訊)與照射條件相關 而5己憶’於對於現在之修正對象決定照射條件時,從以前 之照射條件歷程讀取照射体#Further, since the shape of the correction target region is controlled in accordance with the shape of the correction target region (the angle of the micromirror 19 in the present embodiment), even if the correction target region has a complicated shape, an irradiation region of a suitable shape can be set and performed. Indeed - the actual patching process. In addition, as described with reference to FIGS. 5A to 5C and FIGS. 6A to 6C, the object to be inspected is irradiated as #光光光1 by controlling the micro device to apply a mask to the correction target region. In the forbidden area, the laser beam is irradiated to the correction target area where the area that should not be irradiated is removed, so that the repair process without error irradiation can be performed. Further, since it is possible to control the irradiation of the laser light by the micro device unit by controlling the presence or absence of the laser light irradiation in each of the minute devices constituting the spatial modulation device, even if the correction target region contains a minute or a complicated shape, it can be prevented from being damaged. The repair process is performed normally and normally. • The irradiation condition is determined by using the defect feature information included in the correction target region to indicate the secret feature, and the irradiation condition can be determined in accordance with the defect state, so that the irradiation condition can be corrected for the irradiation condition of the correction target. In addition to the defect type or area, the defect feature information of the present embodiment includes: repairing the defect shape in the object area of the JP m & r ^ y (defect extraction drawing material CC), redundancy, position (whether or not The number of defective parts obtained by extracting image data from the defect by calculating the number of cases in the contact defect part, etc., and causing a short circuit between different potentials, or being in contact with any potential) )Wait. 30 # _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ By using the reference image information (reference image data bb), the comparison is made as -'t image money (the defect image data ridge can distinguish the two differences) as the correction target area. Further, since the normal position can be removed from the correction target area by using the reference image, the correction processing can be surely performed without erroneously irradiating the correction target area. 10 and ^, the object to be inspected is displayed by the - surface, and the superimposed display is related to the information of the complement processing (in the present embodiment, the defect image information ee is displayed for displaying the defect shape, and the shape of the laser light irradiation region is displayed. In the case of the operator, the second embodiment of the present invention can be clearly described. In the present embodiment, the image processing unit 12 The illumination condition of the past riding condition is memorized. 5 The memory section of the memory can be read as needed. The following is only a description of the image of the embodiment and the image of the embodiment. The configuration of the second embodiment is different from the configuration of the first embodiment in that the irradiation condition processing material and the irradiation condition are provided in the memory unit 42, and the condition of the first real surface state is set. The part 43 is input from the defect determination information ee outputted from the defect state determination unit 32 to the irradiation condition history processing material. Then, the information ee is judged by the defect of the same content as the irradiation condition setting unit. The illumination history information jj generated by the irradiation condition setting unit 43 is input to the irradiation condition history processing unit 4b, and the irradiation condition history information jj has a format that can be easily referred to when searching for a later history, the information on the shooting condition 31 1377104 is generated. And generating according to the defect shape image data ff and the laser light source setting information gg. The format example 5 has an index Ls_Cx indicating an irradiation condition as shown in Fig. 16, and the variable serial form is attached. The number of irradiations of LS-Cx is composed of the laser power Cx-nJ>, the shape change amount Cx-η, and the laser beam solution Cx_n_;F at each irradiation (at the time of the nth irradiation). The calendar management unit 4i stores the input irradiation condition history information jj in the irradiation condition calendar 10 in the above-described form. 'Beiji 祁 For example, the original irradiation target image data such as the displayed irradiation area, The first result is (10), the first money is used when the shape is changed by the number of times of the morphological calculus (Erosion) of the first 〇Α~_ 15 20 figure, the UA~qing, and the 12C chart. status It is assumed that the absolute shot = part history memory unit 42 corresponds to the defect judgment of the input person = the illumination condition and the illumination condition Lu Xj. Specifically, in the space constituting the defect judgment attribute *^ Forming a read-and-fix information (4) "Heavy ~" has a cluster of -疋 size, for one cluster, the link has the index LS__Cx as shown in the figure. The 16th is used to fix the irradiation condition, By means of the image, the image of the cluster is formed by the eigenspace of the cluster, which is formed by the illumination object "ee" to the illumination condition history processing unit 41ee and the feature space of the information eccentricity information ee. The Euclidean distance or the Mahalanobis distance (the distance of the dispersion of the test tiger cluster) is read from the illumination condition history storage unit 42 to the illumination condition of the index LS_Cx connected to the cluster having the smallest distance. The irradiation condition history information jj is transmitted to the irradiation condition setting unit 43, and an efficient repair processing can be performed. When the defect determination information ee at this time is not included in the cluster having the smallest distance, the cluster can be expanded to include the defect determination information ee or the like, and the effect can be further exhibited. On the other hand, in the actual processing, the reason for the fact that the image information cannot be completely taken out may be different from the correction of the operator's requirement 10 in the actual processing. In this case, the trimming unit 23 may be necessary. The irradiation conditions are corrected. At this time, the operator must correct the object to be inspected that needs to be corrected again, and it is harmful to the labor. Therefore, in the present embodiment, the operator corrects the information corrected by the trimming unit 23 via the shot shape control unit 21 as the trimming information kk to the irradiation condition history processing unit 41, and the correction content of the job 15 can be checked. The image information of the object is associated with and stored in the illumination condition history storage unit 42. Specifically, in the illumination condition history information corresponding to the defect determination information ee obtained from the current image information, the information about the irradiation condition is extracted from the trimming information, and the history of the irradiation condition is rewritten. The capital Feng. Thereby, even if a similar object to be inspected appears in the subsequent inspection, the operator can perform the repairing process by the trimmed irradiation condition, so that the operator can perform the inspection efficiently without performing the trimming. The processing performed by the irradiation condition history processing unit 41 will be described below. Figure 17 shows the memory and reading of the information on the general illumination conditions. 33 1377104 Sub. In FIGS. 17A and 17B, the defect determination information ee includes: brightness of the defective portion, color information between the image information including the defective portion, and reference image information for the reference image information, and the area of the defective portion, which are the axes The feature space of the 3 dimensional space, that is, the image information is represented as shown in Figs. 17A and 17B. On the other hand, the irradiation condition history information jj indicates the irradiation condition according to the format shown in Fig. 16. The relationship between the defect determination information ee and the irradiation condition history information jj is not one pair g 1 'for one irradiation condition history information jj (ie, irradiation condition), the defect determination information ee (ie, the feature amount of the image information) is distributed, that is, The irradiation conditions form one cluster of 1 group. When the irradiation condition history of the defect determination information ee corresponding to the current inspection target is not found in the irradiation condition history storage unit 42, the irradiation condition history processing unit 41 calculates the distance from the center of gravity of the cluster constituting each irradiation condition. When the distance of the center of gravity of the cluster is equal to or less than the predetermined threshold value, the irradiation condition history processing unit 41 reads the irradiation conditions of the group 15 from the irradiation condition history storage unit 42. The irradiation condition history information jj is sent to the irradiation condition setting unit 43, and the cluster of the irradiation conditions is updated (enlarged) to include the defect determination information ee. On the other hand, if the distance from the center of gravity of the nearest cluster is larger than the predetermined threshold, the irradiation condition history processing unit 41 determines that it is necessary to reset the indication that the irradiation condition is set to include the new irradiation condition for the irradiation condition history. The information is output to the irradiation condition setting unit 43. On the other hand, after the irradiation condition setting unit 43 determines the irradiation condition, the irradiation condition history processing unit 4 sets the irradiation condition of the silk (four) shooting condition to the irradiation condition, and forms a new one from the corresponding shortage capital (10). The cluster, 34 (the formation of the cluster is formed by non-points) is formed by the defect determination information ee having a size of the center of gravity. By repeating the above-described processing, it is possible to determine the irradiation condition of the defect determination information ee from the past experience, and to achieve intelligent repair processing. Further, the operator's repaired irradiation condition history information jj is updated as follows. Fig. 17B shows how the history information is updated when the rounding correction information is entered. The trimming information kk is subjected to the irradiation condition processing unit, and the irradiation condition history port M1 reforms the cluster indicating the irradiation condition LS_Cp reflecting the trimming information kk from the cluster (irradiation condition LS: C2) containing the current defect determination information ee. The cluster of Xianjian Qian Guanxun α (10) information feature center of gravity, with a certain size and size, "T 鞠 鞠 包含 包含 包含 包含 包含 包含 包含 包含 包含 群集 群集 群集 群集 群集 群集 群集 群集 群集 群集 群集 群集 群集 群集 群集 群集 群集 群集 群集Ee belongs to the cluster of the non-irradiation condition LS-C2 = Irradiation condition history record '_2 Read irradiation strip 2: Π: ! History capital · Send to the irradiation condition setting · As above, the priority is compared with the table 2 = shooting condition The cluster is borrowed to be high, and it can be "study for the priority of the cluster of irradiation conditions / irradiation conditions." The person's finger does not 'can achieve a more intelligent 17B diagram indicating that the operator will not only illuminate the conditions, ie If the clustering condition is changed to a new one, for example, the cluster will be clustered with the current patching process, but the operator has the existing condition_cluster merged with other::== 35 < S ) f, because (4) If done - times After trimming, it is possible to carry out the repair processing to reflect the correction content, so that the labor of the operator can be greatly reduced. 10 15 The 18A to 18D drawings illuminate the course of the irradiation conditions in the present embodiment. The use case of the information is the image data, and particularly the irradiation conditions changed by the operator's repair are displayed. As shown in the figure lu, when the defect image data contains the foreign object surface, and the foreign matter is deleted, the secret part is extracted from the reference image data, and it is difficult to call it (4) the film. Therefore, if only the foreign object surface is regarded as a defective part, _ in the case where the phase difference (4) is not short-circuited, the irradiation area may not be set. Therefore, as shown in Fig. 1, the illumination (4) field when the first irradiation of the laser light is corrected is corrected by the operator's trimming. At this point, the operator also corrects the exposure or other exposure conditions of the laser material as needed. The correction result is stored in the irradiation condition history memory unit 42 as a new irradiation condition for the current lack of information, and then when the defect image data as shown in FIG. 18C appears, the defect image has the same 18 A is similar to the defect part of the feature, so the defect determination information of the new defect image data is similar to the defect determination information of the previous defect image data. After the new defect image data is missing (4), the information is input to the irradiation condition of the processing unit 41, and the irradiation condition history processing unit 4 determines that the irradiation condition updated when the worker in the 18th operation is trimmed is also applied to this time. Irradiation conditions. As described above, even if an object to be inspected similar to that of the operator's trimming occurs, the repairing process can be realized according to the irradiation condition updated at the time of trimming. Even if there are many similar objects to be inspected, the operator only needs to perform the trimming, and the rest can be automatically repaired according to the trimming content, which can make the inspection itself 36 efficient. As described above, the laser repairing apparatus according to the present embodiment relates the information used in the irradiation condition (information obtained from the image information) to the irradiation condition, and when the irradiation condition is determined for the current correction target, Reading the illuminating body from the previous irradiation condition history#
1余件。藉此,可學習照射條件與 圖像資訊之關係,而達到沐A 、又處理照射條件之效率化。特 別地’由作業者進行照射侔 求件之修正時,由於藉由關聯記More than 1 piece. In this way, the relationship between the irradiation conditions and the image information can be learned, and the efficiency of the irradiation conditions can be achieved. In particular, when the operator corrects the illumination, the correction is made by
憶已修正之條件與照射條侔、、土 A T决疋之資訊,此後對於類似之 被檢查對象進行處理時,作φ1 4莱者可無須再度進行修正,直 接從照射條件歷程讀取照射條件即可,故可實現根據作業 者之需要的自動修補處理。 以上’參照圖示詳述木 <不發明之實施形態,但具體之構 成非限定於該等實施形態者 也可包含不脫離本發明要旨 之範圍的設計變更等。 15 【圖式簡單^ 〕 第1圖係顯示本發明第1墙^ t , 丨貫施型態之雷射修補裝置之構 成的方塊圖。 第2圖係本發明第i實施型態之的概略立體圖。 第3圖係本發明第丨實施型態之單元上各微小鏡 20 排列的排列圖。 第4圖係本發明第1實施型態之雷射修補裝置所具有之 圖像處理部之構成的方塊圖。 第5Α、5Β、5C圖係本發明第α施型態之雷射修補裝 置所具有之圖像處理部所處理之圖像資料例的參考圖。 37 1377104 第6A、6B、6C圖係本發明第1實施型態之雷射修補裝 置所具有之圖像處理部所處理之圖像資料例的參考圖。。 第7圖係顯示本發明第1實施型態之雷射修補裝置所具 有之圖像處理部所進行之處理步驟的流程圖。 5 第8A、8B、8C圖係可說明本發明第1實施型態之雷射 修補裝置所具有之缺陷狀態判定部所進行之處理的參考 圖。 第9A、9B、9C圖係可說明本發明第1實施型態之雷射 修補裝置所具有之缺陷狀態判定部所進行之處理的參考 10 圖。 第10A、10B、10C、10D圖係可說明本發明第1實施型 態之雷射光照射方法的參考圖。 第11A、11B圖係可說明本發明第1實施型態之雷射光 照射方法的參考圖。 15 第12A、12B、12C圖係可說明本發明第1實施型態之雷 射光照射方法的參考圖。 第13A、13B、13C、13D圖係顯示本發明第1實施型態 中,由缺陷特徵決定缺陷判定資訊及雷射光源設定資訊時 所用之表格内容的參考圖。 20 第14A、14B、14C圖係顯示本發明第1實施型態之圖像 資料之像素、與構成DMD之微小鏡之尺寸及配置間關係的 參考圖。 第15圖係顯示本發明第2實施型態之雷射修補裝置所 具有之圖像處理部之構成的方塊圖。 < S ) 38 1377104 第16圖係顯示本發明第2實施型態之照射條件歷程資 訊之構成的參考圖。 第17A、17B圖係可說明本發明第2實施型態之雷射修 補裝置所具有之照射條件歷程處理部所進行之處理的方塊 5 圖。 第18A、18B、18C、18D圖係可說明本發明第2實施型 態之照射條件歷程資訊之使用例的參考圖。 【主要元件符號說明】 1...XY工作台 17...DMD 2…玻璃 18...驅動用儲存單元 3...移動驅動控制部 19...微小鏡 4...基板檢查裝置 20...中繼透鏡 5...照明光源 21...雷射形狀控制部 6、10...中繼透鏡 22...DMD驅動部 7、8…分光鏡 23...修整部 9…對物透鏡 24...鏡部 11...CCD照相機 25…修補位置確認用光源 12...圖像處理部 26…檢查條件讀取部 13...顯示器 31...缺陷抽出部 14...修補用光源 32...缺陷狀態判定部 15...鏡部 33…照射條件設定部 16...DMD 單元 34...選擇器 16a...基準反射面 41...照射條件歷程處理部 16b...支持台 42…照射條件歷程記憶部 39 1377104Recalling the conditions of the revised conditions and the information of the illuminating strips and the earth AT, and then processing the similar objects to be inspected, the φ1 4 lai can be corrected without further correction, and the irradiation conditions are directly read from the irradiation condition history. Yes, it is possible to implement automatic repair processing according to the needs of the operator. In the above, the embodiment of the invention is not described in detail with reference to the drawings. However, the specific configuration is not limited to the embodiments, and design changes and the like without departing from the scope of the invention may be included. 15 [Simplified drawing ^] Fig. 1 is a block diagram showing the construction of a laser repairing device of the first wall of the present invention. Fig. 2 is a schematic perspective view showing an i-th embodiment of the present invention. Fig. 3 is a view showing the arrangement of the micromirrors 20 in the unit of the third embodiment of the present invention. Fig. 4 is a block diagram showing the configuration of an image processing unit included in the laser repairing apparatus of the first embodiment of the present invention. Figs. 5, 5, and 5C are reference diagrams of examples of image data processed by the image processing unit included in the laser repairing apparatus of the α-th aspect of the present invention. 37 1377104 FIGS. 6A, 6B, and 6C are reference diagrams of an example of image data processed by an image processing unit included in the laser repairing apparatus of the first embodiment of the present invention. . Fig. 7 is a flow chart showing the processing procedure performed by the image processing unit included in the laser repairing apparatus of the first embodiment of the present invention. 5A, 8B, and 8C are diagrams for explaining the processing performed by the defect state determining unit of the laser repairing apparatus according to the first embodiment of the present invention. Figs. 9A, 9B, and 9C are diagrams for explaining the processing performed by the defect state determining unit included in the laser repairing apparatus according to the first embodiment of the present invention. 10A, 10B, 10C, and 10D are diagrams for explaining a laser light irradiation method according to the first embodiment of the present invention. 11A and 11B are views showing a reference of a laser light irradiation method according to the first embodiment of the present invention. 15A, 12B, and 12C are diagrams for explaining a laser light irradiation method according to the first embodiment of the present invention. Figs. 13A, 13B, 13C, and 13D are diagrams showing the contents of the table used for determining the defect determination information and the laser light source setting information by the defect characteristics in the first embodiment of the present invention. 20A, 14B, and 14C are diagrams showing the relationship between the pixels of the image data of the first embodiment of the present invention and the size and arrangement of the micro mirrors constituting the DMD. Fig. 15 is a block diagram showing the configuration of an image processing unit included in the laser repairing apparatus of the second embodiment of the present invention. <S) 38 1377104 Fig. 16 is a reference diagram showing the constitution of the irradiation condition history information of the second embodiment of the present invention. 17A and 17B are block diagrams showing the processing performed by the irradiation condition history processing unit included in the laser repairing apparatus of the second embodiment of the present invention. Figs. 18A, 18B, 18C, and 18D are diagrams for explaining an example of use of the irradiation condition history information of the second embodiment of the present invention. [Description of main component symbols] 1...XY table 17...DMD 2...glass 18...drive storage unit 3...moving drive control unit 19...micro mirror 4...substrate inspection device 20...relay lens 5...illumination light source 21...laser shape control unit 6,10...relay lens 22...DMD drive unit 7,8...beam splitter 23...dressing unit 9...object lens 24...mirror unit 11...CCD camera 25...repairing position confirmation light source 12...image processing unit 26...inspection condition reading unit 13...display 31...defect extraction Part 14...repairing light source 32...defective state determining unit 15...mirror unit 33...irradiation condition setting unit 16...DMD unit 34...selector 16a...reference reflecting surface 41.. Irradiation condition history processing unit 16b... support table 42... illumination condition history memory unit 39 1377104
1001、1002、1003…照射形狀區 域 1101、1102、1103、1104...照射 43…照射條件設定部 901.. .缺陷部 902.. .缺陷部 903a、903b...電極圖案 904…匯流排線 形狀區域 1801...異物 aa..缺陷圖像資料 bb...基準圖像資料 cc...缺陷抽出圖像資料 dd...照射對象圖像資料 ee...缺陷判定資訊 ff...缺陷形狀圖像資料 gg…雷射光源設定資訊 hh...顯示器顯示資訊 jj...照射條件歷程資訊 kk…修補資訊 h...方向 L...修補位置 p…光車由 r…修補光 S...步驟 Θ...角度 401001, 1002, 1003... illuminating shape regions 1101, 1102, 1103, 1104... illuminating 43... illuminating condition setting unit 901.. defective portion 902.. defective portion 903a, 903b... electrode pattern 904... bus bar Line shape area 1801... foreign object aa.. defect image data bb... reference image data cc... defect extraction image data dd... illumination target image data ee... defect determination information ff. .. defect shape image data gg... laser light source setting information hh... display display information jj... illumination condition history information kk... patch information h... direction L... patch position p... light car by r ...repair light S...step Θ...angle 40
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JP2007196275A (en) * | 2006-01-27 | 2007-08-09 | V Technology Co Ltd | Laser machining apparatus |
JP4955425B2 (en) * | 2007-03-08 | 2012-06-20 | オリンパス株式会社 | Laser processing equipment |
JP5086687B2 (en) * | 2007-05-01 | 2012-11-28 | オリンパス株式会社 | Laser processing equipment |
JP2009095876A (en) * | 2007-10-18 | 2009-05-07 | Olympus Corp | Laser machining apparatus, laser machining method, and laser machining program |
JP5481715B2 (en) * | 2007-10-22 | 2014-04-23 | 株式会社ブイ・テクノロジー | Laser processing apparatus and laser processing method |
CN101471272B (en) * | 2007-12-29 | 2010-08-11 | 财团法人工业技术研究院 | Automatic flaw detection device and method for substrate laser repairing device |
JP5100419B2 (en) * | 2008-01-30 | 2012-12-19 | オリンパス株式会社 | Inspection system |
JP5199734B2 (en) * | 2008-06-04 | 2013-05-15 | オリンパス株式会社 | Laser processing equipment |
JP5207890B2 (en) * | 2008-09-10 | 2013-06-12 | トリニティ工業株式会社 | Surface decoration system for automotive decorative parts |
JP5331421B2 (en) * | 2008-09-12 | 2013-10-30 | オリンパス株式会社 | Laser repair device and laser repair method |
JP2010128325A (en) * | 2008-11-28 | 2010-06-10 | Hamamatsu Photonics Kk | Optical modulation apparatus and laser beam machining apparatus |
US9285579B2 (en) * | 2008-11-28 | 2016-03-15 | Hamamatsu Photonics K.K. | Light modulating device and laser processing device |
JP5474340B2 (en) * | 2008-11-28 | 2014-04-16 | 浜松ホトニクス株式会社 | Light modulator |
TWI567381B (en) * | 2009-11-16 | 2017-01-21 | 魯道夫科技股份有限公司 | Infrared inspection of bonded substrates |
TWM407586U (en) | 2010-01-17 | 2011-07-11 | Orbotech Ltd | Donor substrate assembly useful in repairing an electrical circuit |
JP5495875B2 (en) * | 2010-03-18 | 2014-05-21 | オリンパス株式会社 | Laser processing method and laser processing apparatus |
CN101968556B (en) * | 2010-09-15 | 2012-09-05 | 广州创维平面显示科技有限公司 | Repair method for incomplete dots of light guide plate |
DE102012201194A1 (en) * | 2012-01-20 | 2013-07-25 | Rofin-Baasel Lasertech Gmbh & Co. Kg | Device for laser machining a workpiece |
CN109848545B (en) * | 2019-01-08 | 2021-06-22 | 北京科迈启元科技有限公司 | Laser processing method integrating object abnormal region identification and thermal action |
CN109814286A (en) * | 2019-01-23 | 2019-05-28 | 深圳市华星光电半导体显示技术有限公司 | Laser repair device |
CN109738983B (en) * | 2019-02-26 | 2020-11-27 | 京东方科技集团股份有限公司 | Light guide plate, display device, method and equipment for repairing white spots of display device |
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JP2002066771A (en) * | 2000-08-16 | 2002-03-05 | Toshiba Corp | Laser system |
JP2005103581A (en) * | 2003-09-29 | 2005-04-21 | Olympus Corp | Repair method and device therefor |
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TW200714397A (en) | 2007-04-16 |
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