CN1847465A - Plating method for printing circuit board - Google Patents
Plating method for printing circuit board Download PDFInfo
- Publication number
- CN1847465A CN1847465A CN 200610058463 CN200610058463A CN1847465A CN 1847465 A CN1847465 A CN 1847465A CN 200610058463 CN200610058463 CN 200610058463 CN 200610058463 A CN200610058463 A CN 200610058463A CN 1847465 A CN1847465 A CN 1847465A
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- Prior art keywords
- tellite
- circuit board
- shield
- support
- printed circuit
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- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The present invention provides a method for plating a printed circuit board when performing through-hole plating of the printed circuit board used for an electronic component in a panel plating rack, whereby plating thickness inside a product is equalized and deposition onto edges of the printed circuit board is inhibited to prevent various defects caused by scattering of a plated copper powder from the edges of the printed circuit board. In the method for plating the printed circuit board using the panel plating rack 10, a pair of conductive vertical frames 11 and 11, which are fixed leaving a space between each other by horizontal frames 12 and 12, serves as cathodes when supplying electricity to the printed circuit board 13, and the printed circuit board 13 is held between the vertical frames 11 and 11 and soaked into a plating liquid. Shielding materials 15a and 15b made of an insulating material are installed at the top and bottom of the panel plating rack 10 to hold the printed circuit board 13 in a pinching manner. The shape of the cross-section of the shielding material is a combination of a V-shape and a rectangular.
Description
Technical field
The present invention relates to the electro-plating method of tellite, in particular, the present invention relates to the electro-plating method of following tellite, this method is used support electroplating by plate, when carrying out the through hole conducting plating of the tellite that electronics adopted, make the electrolytic coating thickness in the goods even on one side, on one side prevent from the printed base plate end, to adhere to electrolytic coating, prevent the various faults that the copper powder of tellite end disperses and caused.
Background technology
Electroplating the galvanized occasion of through hole conducting of carrying out the tellite that electronics adopted by plate, the substrate formation negative electrode that keeps having carried out in advance the conductionization processing by the support of electroconductibility, middle portion between the anode at the two ends in being arranged at the groove that is full of electroplate liquid, right with anode surface, with this substrate dipping, switch on.
For the support that adopts this moment, people know following scheme (such as, with reference to patent documentation 1), wherein, top ends with another straight-bar parts is installed the top connecting arm therein, and in the bottom bottom connecting arm is installed, and offers the slotted hole that length adjustment is used at corresponding connecting arm, form cradle portion by bolted, in corresponding straight-bar parts, form the groove of clamping printed circuit substrate.
Generally in the galvanized occasion of plate, the electrolytic coating thickness with tellite end periphery is greater than near the tendency the pars intermedia.This tendency refer to shown in the image pattern 7 like that, impregnated in the tellite 53 of the negative electrode in the plating tank 51 in conduct, near the pars intermedia from relative anode 52 received current substantially equably, relative this situation, periphery also receives from the electric current that changes on every side, thus, the periphery of tellite 53 has the electric current distribution height, adheres to the tendency of very thick electrolytic coating.
As counter-measure, provide will form by metal wire netted shielding slab insert between anode and the substrate, make electric current distribution evenly (such as, with reference to patent documentation 2).In addition, people know following device, and it adopts the box shielding slab of offering a plurality of through holes, thus, make the electrolytic coating thickness of tellite even (such as, with reference to patent documentation 3).
On the other hand, people know to be had according to the current density of the pars intermedia of tellite and the uniform mode of current density of periphery, the electro-plating method of the shielding slab in a plurality of zones that the aperture of employing setting hole portion is different with density is set (such as, with reference to patent documentation 4).In addition, people also know scheme that shielding slab is set on retainer (support) (such as, with reference to patent documentation 5).
Patent documentation 1:JP opens clear 61-182071 document in fact
Patent documentation 2:JP spy opens clear 50-50236 document
Patent documentation 3:JP opens clear 56-21485 document in fact
Patent documentation 4:JP spy opens the 2002-54000 document
Patent documentation 5:JP spy opens the 2002-161398 document
Summary of the invention
As described above, by the difference that shielding slab improves the electrolytic coating thickness on tellite surface is set.But, for the electrolytic coating thickness that is attached on the tellite end sides, even owing to be provided with under the situation of shielding slab, still from receiving the electric current that changes on every side, so can't realize improving.Such as, shown in the image pattern 8 like that, according to 3 layers tellite 60 is hung over occasion on the support, adhere to thicker electrolytic coating at the position (position of coating black) 61 that centers on by dotted line of the end sides of tellite 60 up and down.Fig. 9 is the cross sectional photograph of above-mentioned tellite end sides 61 parts, knows clearly that thus it also adheres to thicker electrolytic coating on every side.
Because the electrolytic coating thickness on tellite surface is not so inhomogeneous, so when forming pattern, the etching to goods itself does not counteract, but, around the end sides of tellite and its, shown in the photo of image pattern 10 like that, produce etch residue portion in the part of label 61a.Shown in the 61b of the photo of this etch residue portion image pattern 11 part like that, when peeling off, form the pollutent of electroconductibility, such as, sneak into if this pollutent forms step at thereafter welding protective layer, then produce variety of issues such as poor short circuit.In the past, only pay attention to the difference of the electrolytic coating thickness on tellite surface, still, the fault that is caused of dispersing of etch residues also can not be ignored like this.
In order to prevent that electrolytic coating is attached to the situation on the tellite end sides, people also consider mask process is carried out in the tellite end, still, for mask process is carried out in the tellite end, increase unnecessary step cost and rise.In addition, also have around the position of carrying out mask process, adhere to the disadvantage of thicker electrolytic coating.Therefore, necessarily require to the tellite end sides almost all carry out mask process, follow peripherad extension, current density increases such electro-plating method gradually.
Therefore, the object of the present invention is to provide a kind of electro-plating method of tellite, this method is used support electroplating by plate, when carrying out the through hole conducting plating of the tellite that electronics adopted, make the electrolytic coating thickness in the goods even on one side, on one side prevent from the tellite end, to adhere to electrolytic coating, prevent the various faults that the plating copper powder from the tellite end disperses and causes.
The present invention proposes to achieve these goals, the described invention of the 1st scheme relates to a kind of electro-plating method of tellite, this method adopts plate to electroplate and uses support, this plate is electroplated and is passed through horizontal support with support, according to the fixing pair of conductive longitudinal carrier of the mode that keeps spacing, above-mentioned longitudinal carrier is to the tellite power supply as negative electrode, tellite is kept in the mode that is held between the above-mentioned longitudinal carrier, simultaneously this tellite be impregnated in the electroplate liquid, it is characterized in that electroplating the shield of installation up and down of using support at above-mentioned plate, this shield is formed by megohmite, is the V font of the above-mentioned tellite of clamping and the cross-sectional shape that rectangle is combined into.
According to this scheme, be installed on plate and electroplate the electric current minimizing that prevents to make reception with the shield up and down of support, prevent adhering to of unnecessary electrolytic coating.Because this shield is the V font of the above-mentioned tellite of clamping and the cross-sectional shape that rectangle is combined into, thus do not receive from around the electric current that changes over to, even substantially with the end periphery current density near the pars intermedia of tellite.
The described invention of the 2nd scheme provides the electro-plating method of the described tellite of the 1st scheme, it is characterized in that electroplating with on the longitudinal carrier of support, have the tabular shield that is used to make the uniform peristome of electrolytic coating thickness and electroplate for the plate of installing according to mode to be opened/closed when the loading and unloading of tellite and use support at above-mentioned plate.
According to this scheme, be arranged at plate and electroplate with the tabular shield on the longitudinal carrier of support openly in both sides, tellite is inserted the slot part of V-shape of the shield of above-mentioned bottom side.In addition, with above-mentioned tabular shield sealing, the slot part of the V font of the shield of top side inserts in the tellite downwards, tellite is fixed in plate electroplates with on the support.
The present invention as described above, can be by having the tabular shield of peristome, make the electrolytic coating thickness of tellite even, the shield up and down that is combined into by V font and rectangle, tellite end sides and its periphery are carried out mask process, prevent to adhere to electrolytic coating, prevent the various faults that the plating copper powder of relative tellite end disperses and causes.
Description of drawings
Fig. 1 electroplates the front view of using support for the plate that electro-plating method of the present invention adopted;
Fig. 2 is the photo of shield that is arranged at the bottom of support shown in Figure 1;
Fig. 3 is the lateral photo of shield shown in Figure 1;
Fig. 4 is the explanatory view of the section shape of expression shield shown in Figure 1;
Fig. 5 is the cross sectional photograph of carrying out the tellite end of electro-plating method of the present invention;
Fig. 6 (1), the figure that (2) compare for the electrolytic coating thickness distribution to electro-plating method of the present invention and electro-plating method in the past;
Fig. 7 is the explanatory view of the fault of expression plating direction in the past;
Fig. 8 is the explanatory view of the fault of expression plating direction in the past;
Fig. 9 is the cross sectional photograph of carrying out the printed base plate end of electro-plating method in the past;
Figure 10 is the explanation photo of the fault of expression electro-plating method in the past;
Figure 11 is the explanation photo of the fault of expression electro-plating method in the past.
Embodiment
Enumerate preferred embodiment below and the electro-plating method of tellite of the present invention is described.Use support electroplating by plate, when carrying out the through hole conducting plating of the tellite that electronics adopted, electrolytic coating thickness in the goods being carried out homogenizing on one side handles, prevent from the tellite end, to adhere to electrolytic coating on one side, the purpose of the various faults that cause of dispersing the plating copper powder that prevents relative tellite end realizes by following manner, this mode is: about plate is electroplated with support, the shield that installation is formed by megohmite, this shield is the V font of the above-mentioned tellite of clamping and square combination and the cross-sectional shape that forms, on plate is electroplated with the longitudinal carrier in the support, have the tabular shield that is used for electrolytic coating thickness is carried out the peristome that homogenizing handles and when tellite dismantle, install, implement plating in mode to be opened/closed.
Embodiment 1
Fig. 1 electroplates the front view of using support for the plate that circuit substrate of the present invention adopted, this plate is electroplated the longitudinal carrier 11 that the master unit with support (abbreviating " support " below as) 10 is formed by the electroconductive component that passes through pair of right and left, 11, according to be installed on this longitudinal carrier 11, about in the of 11, the horizontal support 12 of the spacing about maintenance, 12 constitute, above-mentioned longitudinal carrier 11,11 at clamping printed circuit substrate 13,13... the mode of both sides keep, simultaneously this tellite be impregnated in the electroplate liquid, to tellite 13 as negative electrode, 13... the mode of power supply forms.
On above-mentioned longitudinal carrier 11, according to tabular shield 14 being installed along left and right directions mode to be opened/closed, in this tabular shield 14, form extension 14a, the 14b that the upper and lower end parts of tellite 13 is covered middle portion at top and bottom, peristome 14c is set in the centre of this tabular shield 14.In addition, should offer hole 14d, 14d... in the tabular shield 14 mutually.In addition, this tabular shield 14 is respectively according to the front-back (nearside of drawing and inboard) that can be installed on support 10 along the mode that left and right directions opens and closes.
In addition, in the inboard of above-mentioned tabular shield 14, shield 15a, 15b are set respectively at the upper-lower position of above-mentioned support 10.Fig. 2 is the photo of shield 15b that is arranged at the bottom of support 10, and Fig. 3 is the lateral photo of shield 15b, and Fig. 4 is the explanatory view of the cross-sectional shape of expression shield.
In order according to homogeneous thickness more integral body to be electroplated, the size of the each several part of shield 15a, 15b is preferably a:20mm, b:50mm, c:20mm, d:40mm.But, allow ± 10% dimensional change.In addition, the size of e portion can at random be set by the size of tellite 13.In addition, the shield 15a at top can be provided with up or down according to the downward mode of groove, and the shield 15b of bottom is provided with according to the mode that groove makes progress.
When carrying out the electroplating processes of above-mentioned tellite 13 by above-mentioned support 10, shown in the image pattern 1 like that, the tabular shield 14,14 that is installed on the support 10 is opened to both sides, on the longitudinal carrier 11,11 about the two ends of 1 tellite 13 are held on, and the bottom of this tellite 13 is inserted in the groove of shield 15b of the bottom that is arranged at support 10, fix by not shown locating mechanism.Then, at the top of the tellite 13 of above-mentioned bottom, overlapping successively remaining 2 tellites 13,13, by about longitudinal carrier 11,11 clampings, fix by locating mechanism.
In addition, behind the tabular shield 14,14 about sealing, the shield 15a that is arranged on the top of support 10 is sealed downwards, the groove of this shield 15a is inserted top layer tellite 13 the top and fix.
Like this, on above-mentioned support 10, keep a plurality of tellites 13, shield by tabular shield 14, and up and down shield 15a, the 15b of the inboard by being arranged at this tabular shield 14, the end sides of shielded printed circuit substrate 13, thus, even substantially with the end periphery current density near the pars intermedia of tellite.
Fig. 5 carries out the cross sectional photograph of galvanized tellite end for adopting shield 15a, 15b, the cross sectional photograph of the tellite that carries out existing electro-plating method shown in Figure 9 is compared and known the electrolytic coating thickness attenuation of tellite end.
The figure that Fig. 6 compares for the electrolytic coating thickness distribution to the electrolytic coating thickness distribution of the occasion that do not have shield and the occasion that adopts shield of the present invention, compare with the electro-plating method in the past shown in Fig. 6 (1) and know, occasion at the electro-plating method of the present invention shown in Fig. 6 (2), the electrolytic coating thickness attenuation of printed base plate end, and whole electrolytic coating thickness distribution is further even.Like this, can confirm validity at the electro-plating method of the present invention of the upper and lower settings shield of support.
In addition, only otherwise break away from spirit of the present invention, the present invention can carry out various changes, in addition, obviously the present invention includes the scheme of this change.
Claims (2)
1. the electro-plating method of a tellite, this method adopts plate to electroplate and uses support, this plate is electroplated and is passed through horizontal support with support, according to the fixing pair of conductive longitudinal carrier of the mode that keeps spacing, above-mentioned longitudinal carrier is to the tellite power supply as negative electrode, tellite is kept in the mode that is held between the above-mentioned longitudinal carrier, simultaneously the plate tellite be impregnated in the electroplate liquid, it is characterized in that:
Electroplate the shield of installation up and down of using support at above-mentioned plate, this shield is formed by megohmite, is the V font of the above-mentioned tellite of clamping and the cross-sectional shape that rectangle is combined into.
2. the electro-plating method of tellite according to claim 1, it is characterized in that electroplating with on the longitudinal carrier of support, have the tabular shield that is used to make the uniform peristome of electrolytic coating thickness and electroplate for the plate of installing according to mode to be opened/closed when the loading and unloading of tellite and use support at above-mentioned plate.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005117242A JP4700396B2 (en) | 2005-04-14 | 2005-04-14 | Printed circuit board plating method |
| JP2005117242 | 2005-04-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1847465A true CN1847465A (en) | 2006-10-18 |
Family
ID=37077198
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200610058463 Pending CN1847465A (en) | 2005-04-14 | 2006-03-28 | Plating method for printing circuit board |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP4700396B2 (en) |
| CN (1) | CN1847465A (en) |
| TW (1) | TW200636093A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101343771B (en) * | 2007-07-13 | 2010-10-06 | 富葵精密组件(深圳)有限公司 | Electroplating apparatus |
| CN101466206B (en) * | 2007-12-19 | 2010-11-17 | 比亚迪股份有限公司 | Method for electroplating conductive hole of printed circuit board |
| CN101437365B (en) * | 2007-11-15 | 2011-05-11 | 富葵精密组件(深圳)有限公司 | Holding apparatus and holding method |
| CN102143662A (en) * | 2010-02-03 | 2011-08-03 | 日本梅克特隆株式会社 | Manufacturing method of multilayer printed circuit board and substrate holding piece and shield plate |
| CN102560609A (en) * | 2010-12-24 | 2012-07-11 | 北大方正集团有限公司 | Electroplating hanging tool and manufacturing method thereof |
| CN102839411A (en) * | 2012-09-17 | 2012-12-26 | 高德（无锡）电子有限公司 | Ultrathin sheet electroplating hanger for electroplating vertical line in PCB (Printed Circuit Board) industry |
| CN110328624A (en) * | 2019-07-26 | 2019-10-15 | 郑州磨料磨具磨削研究所有限公司 | A kind of deposition fixture and its application method for special-shaped electroplating abrasion wheel |
| TWI720798B (en) * | 2019-01-31 | 2021-03-01 | 日商Ａｌｍｅｘ Ｐｅ股份有限公司 | Workpiece holding jig and surface treatment device |
| TWI723755B (en) * | 2019-01-31 | 2021-04-01 | 日商Ａｌｍｅｘ Ｐｅ股份有限公司 | Workpiece holding jig and surface treatment device |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI728668B (en) * | 2019-01-31 | 2021-05-21 | 日商Ａｌｍｅｘ Ｐｅ股份有限公司 | Workpiece holding jig and surface treatment device |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2682878B2 (en) * | 1989-11-27 | 1997-11-26 | 上村工業株式会社 | Electroplating equipment with shield |
| JPH08296092A (en) * | 1995-04-28 | 1996-11-12 | Hitachi Cable Ltd | Hanger for plating printed circuit board |
| JP3285572B2 (en) * | 2000-06-09 | 2002-05-27 | 栄電子工業株式会社 | Continuous plating method and apparatus using power supply roller having split electrode portion |
| JP4765207B2 (en) * | 2001-06-26 | 2011-09-07 | パナソニック株式会社 | Full-surface electroplating apparatus and method for manufacturing full-plated lead frame thereby |
-
2005
- 2005-04-14 JP JP2005117242A patent/JP4700396B2/en active Active
- 2005-12-29 TW TW094147353A patent/TW200636093A/en not_active IP Right Cessation
-
2006
- 2006-03-28 CN CN 200610058463 patent/CN1847465A/en active Pending
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101343771B (en) * | 2007-07-13 | 2010-10-06 | 富葵精密组件(深圳)有限公司 | Electroplating apparatus |
| US8141512B2 (en) | 2007-07-13 | 2012-03-27 | Zhen Ding Technology Co., Ltd. | Plating apparatus |
| CN101437365B (en) * | 2007-11-15 | 2011-05-11 | 富葵精密组件(深圳)有限公司 | Holding apparatus and holding method |
| CN101466206B (en) * | 2007-12-19 | 2010-11-17 | 比亚迪股份有限公司 | Method for electroplating conductive hole of printed circuit board |
| CN102143662A (en) * | 2010-02-03 | 2011-08-03 | 日本梅克特隆株式会社 | Manufacturing method of multilayer printed circuit board and substrate holding piece and shield plate |
| CN102143662B (en) * | 2010-02-03 | 2015-03-18 | 日本梅克特隆株式会社 | Manufacturing method of multilayer printed circuit board and substrate holding piece and shield plate |
| CN102560609A (en) * | 2010-12-24 | 2012-07-11 | 北大方正集团有限公司 | Electroplating hanging tool and manufacturing method thereof |
| CN102839411A (en) * | 2012-09-17 | 2012-12-26 | 高德（无锡）电子有限公司 | Ultrathin sheet electroplating hanger for electroplating vertical line in PCB (Printed Circuit Board) industry |
| TWI720798B (en) * | 2019-01-31 | 2021-03-01 | 日商Ａｌｍｅｘ Ｐｅ股份有限公司 | Workpiece holding jig and surface treatment device |
| TWI723755B (en) * | 2019-01-31 | 2021-04-01 | 日商Ａｌｍｅｘ Ｐｅ股份有限公司 | Workpiece holding jig and surface treatment device |
| CN110328624A (en) * | 2019-07-26 | 2019-10-15 | 郑州磨料磨具磨削研究所有限公司 | A kind of deposition fixture and its application method for special-shaped electroplating abrasion wheel |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200636093A (en) | 2006-10-16 |
| TWI307371B (en) | 2009-03-11 |
| JP4700396B2 (en) | 2011-06-15 |
| JP2006291337A (en) | 2006-10-26 |
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| PB01 | Publication | ||
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
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Open date: 20061018 |