JP3285572B2 - Continuous plating method and apparatus using power supply roller having split electrode portion - Google Patents

Continuous plating method and apparatus using power supply roller having split electrode portion

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Publication number
JP3285572B2
JP3285572B2 JP2000173442A JP2000173442A JP3285572B2 JP 3285572 B2 JP3285572 B2 JP 3285572B2 JP 2000173442 A JP2000173442 A JP 2000173442A JP 2000173442 A JP2000173442 A JP 2000173442A JP 3285572 B2 JP3285572 B2 JP 3285572B2
Authority
JP
Japan
Prior art keywords
power supply
supply roller
plating
anode
cathode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2000173442A
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Japanese (ja)
Other versions
JP2001303299A (en
Inventor
和夫 大場
Original Assignee
栄電子工業株式会社
和夫 大場
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Publication date
Application filed by 栄電子工業株式会社, 和夫 大場 filed Critical 栄電子工業株式会社
Priority to JP2000173442A priority Critical patent/JP3285572B2/en
Priority to TW089126167A priority patent/TW522176B/en
Priority to KR10-2000-0083683A priority patent/KR100393085B1/en
Publication of JP2001303299A publication Critical patent/JP2001303299A/en
Application granted granted Critical
Publication of JP3285572B2 publication Critical patent/JP3285572B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/16—Apparatus for electrolytic coating of small objects in bulk
    • C25D17/28—Apparatus for electrolytic coating of small objects in bulk with means for moving the objects individually through the apparatus during treatment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C25D17/12—Shape or form
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating Methods And Accessories (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【発明の属する技術分野】本発明は、分割電極部分を有
する給電ローラを用いた連続めっき方法並びに装置に関
するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a continuous plating method and apparatus using a power supply roller having divided electrode portions.

【０００２】[0002]

【従来の技術】従来、板状の被めっき物にめっきを施す
には、陰極に接続される枠体に複数の被めっき物を固定
具で１個ずつ取付けてめっき槽に浸漬し、めっき完了後
に被めっき物を１個ずつ枠体から取外していたが、この
方法は手間のかかる作業であり、めっき作業の効率を阻
害する一因となっていた。2. Description of the Related Art Conventionally, in order to perform plating on a plate-shaped object to be plated, a plurality of objects to be plated are attached one by one to a frame connected to a cathode with a fixing tool, and immersed in a plating tank to complete plating. Later, the objects to be plated were removed one by one from the frame, but this method was a laborious operation, and was a factor that hindered the efficiency of the plating operation.

【０００３】そこで近年では、被めっき物の枠体への固
定作業を避けて、被めっき物を１個ずつ個別に連続的に
めっき槽中へ供給し、めっき槽内で被めっき物を縦にし
た状態で水平に移動させ、連続して効率よくめっきを行
う方法が提案されている。[0003] In recent years, in recent years, the work to be fixed to the frame has been avoided, and the objects to be plated have been individually and continuously supplied one by one into a plating tank. There has been proposed a method of moving horizontally in such a state that plating is continuously and efficiently performed.

【０００４】図６は、その一例の連続めっき装置の断面
図であって、めっき槽１内の中央底部近くに、紙面垂直
方向に延びるレール２に、プリント基板等の板状の被め
っき物３を縦にしてその下端を載せ、この被めっき物３
の両面を、縦方向の回転陰極棒４に固着してある給電ロ
ーラ５で挟持し、給電ローラ５の回転により、被めっき
物３をめっき液６に漬けた状態でレール２に沿い水平に
めっき槽１内を移動するようになっている。そしてめっ
き液６中には、シリンダ７で上下方向に移動できる陽極
８と電流の乱れをカバーする遮蔽板９が設けられてい
る。FIG. 6 is a cross-sectional view of an example of a continuous plating apparatus, in which a plate-like object 3 such as a printed circuit board is mounted on a rail 2 extending in the direction perpendicular to the paper near a central bottom in a plating tank 1. Is placed vertically and its lower end is placed.
Are sandwiched between power supply rollers 5 fixed to a rotating cathode rod 4 in the vertical direction, and the rotation of the power supply roller 5 causes the workpiece 3 to be immersed in the plating solution 6 and to be plated horizontally along the rail 2. It moves within the tank 1. The plating solution 6 is provided with an anode 8 that can be moved up and down by a cylinder 7 and a shielding plate 9 that covers disturbance of current.

【０００５】回転陰極棒４の適宜箇所にはホイール１０
が取付けてあって、ばね１１で押圧される押圧体１２を
ホイール１０に当接させている。ばね１１の押圧力はホ
イール１０から回転陰極棒４を介して給電ローラ５に伝
わり、給電ローラ５と被めっき物３との接触を確実に
し、被めっき物３表面への電流の流れが均一になるよう
にしている。A wheel 10 is provided at an appropriate position on the rotating cathode bar 4.
The pressing body 12 pressed by the spring 11 is brought into contact with the wheel 10. The pressing force of the spring 11 is transmitted from the wheel 10 to the power supply roller 5 via the rotating cathode bar 4 to ensure the contact between the power supply roller 5 and the object 3 to be plated, so that the current flows uniformly to the surface of the object 3. I am trying to become.

【０００６】これによって、被めっき物３表面には、回
転陰極棒４から給電ローラ５を介してマイナス電位に加
圧され、陽極８との間に電流が流れてめっきが連続的に
施されるようになる。As a result, the surface of the object to be plated 3 is pressed to a negative potential from the rotating cathode rod 4 via the power supply roller 5, and a current flows between the surface and the anode 8, whereby plating is continuously performed. Become like

【０００７】給電ローラ５の被めっき物３と接触する周
面は、対象めっき被膜、例えば銅被膜よりも硬い被膜材
料、例えばニッケルめっき被膜の上に窒化チタンよりな
る保護被膜を形成する。そして給電ローラ５の周面には
ばね１３でブラシ１４を押圧し、給電ローラ５の周面に
生成するメッキ付着物を取り除くようにしている。On the peripheral surface of the power supply roller 5 which comes into contact with the object 3 to be plated, a protective coating made of titanium nitride is formed on a coating material harder than a target plating film, for example, a copper film, for example, a nickel plating film. Then, a brush 14 is pressed against the peripheral surface of the power supply roller 5 by a spring 13 so as to remove plating deposits generated on the peripheral surface of the power supply roller 5.

【０００８】しかしながら、ブラシ１４だけで給電ロー
ラ５の表面全体のめっき付着物を除去することはむずか
しく、堆積するメッキ付着物のために給電ローラ５が荒
損して耐用期間が短くなり、被めっき物３には均等に電
流が流れなくなって、均一なめっきを施すことができな
くなる問題があった。However, it is difficult to remove the plating deposits on the entire surface of the power supply roller 5 with only the brush 14, and the deposited power deposits damage the power supply roller 5 and shorten the service life. In No. 3, there was a problem that a current did not flow evenly, and it was impossible to apply uniform plating.

【０００９】そこでさきに、給電ローラを電気絶縁物で
周方向に複数区分に区分し、各区分が被めっき物に当接
するときに該区分にマイナス電位を加圧して通電するよ
うに、給電ローラ上部の給電部と各区分とを電気的に連
通せしめて、めっきする方法を提案した。このとき、被
めっき物と接触していない区分には、プラス電位を加圧
して該部分に余分に付着しためっき部分をプラス電位に
よって溶出除去する方法を開発した。In view of the above, the feed roller is divided into a plurality of sections in the circumferential direction with an electric insulator, and when each section comes into contact with the object to be plated, a negative potential is applied to the section so that the section is energized by applying a negative potential. A method was proposed in which the upper power supply unit and each section were electrically connected to perform plating. At this time, a method was developed in which a positive potential was applied to a section that was not in contact with the object to be plated, and a plating portion extraly attached to the portion was eluted and removed by the positive potential.

【００１０】[0010]

【発明が解決しようとする課題】本発明は上記開発方法
をさらに発展させ、給電ローラ表面へのめっき物の付着
を効率よく除去することにより、被めっき物に対して長
期に亘って美しいめっき表面を得るようにすることを目
的とするものである。SUMMARY OF THE INVENTION The present invention is a further development of the above-mentioned development method, in which the adherence of a plating substance to the surface of a power supply roller is efficiently removed, thereby providing a beautiful plating surface for a long time on the plating object. Is intended to be obtained.

【００１１】[0011]

【課題を解決するための手段】本発明は、下記の構成よ
りなる。 （１）周面を複数の電極部分に分割してなる給電ローラ
をめっき槽中に随所に配置し、該給電ローラを用いて被
めっき物を連続的に移送しながらめっきする方法におい
て、２個の整流器を用い、一方の整流器によって、給電
ローラの被めっき物に接する負極部分と、これに対向し
てめっき槽内に配置した陽極との間に電圧を印加し、他
方の整流器によって給電ローラの被めっき物に接してい
ない陽極部分と、対向してめっき槽内に金属イオンを消
耗しないように形成した陰極との間に電圧を印加してめ
っきすることを特徴とする分割電極部分を有する給電ロ
ーラを用いた連続めっき方法。The present invention has the following constitution. (1) In a method in which a power supply roller formed by dividing a peripheral surface into a plurality of electrode portions is disposed in a plating tank at various positions and plating is performed while continuously transferring an object to be plated using the power supply roller, Using a rectifier, a voltage is applied between the negative electrode portion in contact with the object to be plated of the power supply roller and the anode disposed in the plating tank opposite thereto by one rectifier, and the other rectifier controls the power supply roller. A power supply having a divided electrode portion characterized in that plating is performed by applying a voltage between an anode portion that is not in contact with the object to be plated and a cathode formed so as not to consume metal ions in the plating bath facing the plating portion. Continuous plating method using a roller.

【００１２】（２）周面を複数の電極部分に分割してな
る給電ローラをめっき槽中に随所に配置し、該給電ロー
ラを用いて被めっき物を連続的に移送しながらめっきす
る装置において、給電ローラの分割電極が被めっき物に
接するときは負極となり、又、被めっき物から離れると
きは陽極となるように構成し、めっき槽内には給電ロー
ラの負極に対向する陽極と、給電ローラの陽極に対向す
る陰極とを配置し、該給電ローラの陽極に対向する陰極
は金属イオンを消耗しないように形成し、かつ、２個の
整流器を有し、一方の整流器は給電ローラと陰極とこれ
に対向する陽極との間に電圧を印加するようになし、他
方の整流器は給電ローラの陽極とこれに対向する陰極と
の間に電圧を印加するようにしたことを特徴とする分割
電極部分を有する給電ローラを用いた連続めっき装置。 （３）上記（１）又は（２）において、給電ローラの陽
極と、これに対向する陰極との間に印加する電圧をパル
スとすること。(2) A power supply roller having a peripheral surface divided into a plurality of electrode portions is disposed in a plating tank at any position, and the plating object is continuously transferred using the power supply roller. When the divided electrode of the power supply roller contacts the object to be plated, it becomes a negative electrode, and when it separates from the object to be plated, it becomes an anode. A cathode facing the anode of the roller is arranged, the cathode facing the anode of the feeding roller is formed so as not to consume metal ions, and has two rectifiers, one of which is a feeding roller and a cathode. Wherein a voltage is applied between the anode and the opposite anode, and the other rectifier is adapted to apply a voltage between the anode of the feeding roller and the cathode facing the same. Having parts Continuous plating apparatus using a conductive roller. (3) In the above (1) or (2), the voltage applied between the anode of the power supply roller and the cathode opposed thereto is a pulse.

【００１３】すなわち、本発明は２個の整流器を用い
て、被めっき物に接触する回転ローラ区分と陽極との間
と、被めっき物に接触しない回転ローラ区分と金属イオ
ンを通さないように形成した陰極との間とに電圧を印加
することによって、前者では被めっき物へめっきを施
し、後者では、回転ローラ表面に付着しためっきを溶出
させ、常に清浄な回転ローラの表面が被めっき物に当接
することとなり、長期に亘って美しいめっき表面を得る
ことができる。後者ではＤＣに代えてパルス電圧にする
とよい。パルス電圧を印加するのは陰極ローラ部で強電
流によってめっきが部分的に厚くつくところがあり、そ
の部分をその他の部分と同じように均等に剥離すること
ができる。That is, the present invention uses two rectifiers to form between the anode and the rotating roller section which comes into contact with the object to be plated, and between the rotating roller section which does not come into contact with the object to be plated and metal ions. In the former, plating is applied to the object to be plated, and in the latter, the plating adhered to the rotating roller surface is eluted by applying a voltage between the rotating cathode and the surface of the rotating roller. As a result, a beautiful plated surface can be obtained for a long period of time. In the latter case, a pulse voltage may be used instead of DC. When a pulse voltage is applied, the plating is partially thickened by a strong current in the cathode roller portion, and the portion can be peeled off uniformly as in the other portions.

【００１４】この際、剥離側の陰極は金属イオンを通さ
ない隔膜や素焼きの筒状体でめっき槽中の電解液と隔離
するとよい。この陰極としてはステンレス板、ニッケル
板、銅板など希硫酸溶液にて溶解しない材質のものであ
ればよい。隔膜等を利用するのは、金属イオンを通さな
いため、硫酸銅イオン等の無駄な塩類が陰極に析出する
ことがないので陰極板が半永久板として使用することが
できるからである。又、隔膜等の内部の陰極周辺には希
硫酸溶液を充填して通電を確保し、無駄な硫酸銅イオン
の消費をなくす。セラミック電極、フェライト電極など
を使えば金属イオンの消耗がないので隔膜の必要はな
い。At this time, it is preferable that the cathode on the peeling side is separated from the electrolyte in the plating tank by a membrane or an unfired cylindrical body that does not allow metal ions to pass through. The cathode may be made of a material that does not dissolve in a dilute sulfuric acid solution, such as a stainless plate, a nickel plate, and a copper plate. The reason for using a diaphragm or the like is that since the metal ions do not pass through, unnecessary salts such as copper sulfate ions do not precipitate on the cathode, and the cathode plate can be used as a semi-permanent plate. Also, a dilute sulfuric acid solution is filled around the inside of the cathode, such as the diaphragm, to secure the current supply and eliminate unnecessary consumption of copper sulfate ions. If a ceramic electrode, a ferrite electrode, or the like is used, there is no need for a diaphragm because there is no consumption of metal ions.

【００１５】[0015]

【発明の実施の形態】以下、本発明の実施の形態を図面
に基づいて説明する。図１は、本発明の概要を説明する
ための平面図である。図中２０はめっき槽で、被めっき
物２１が槽壁に設けた液密スリット２２を通って槽内に
送入され、反対側の槽壁に設けた液密スリット２３より
槽外に送出される。被めっき物２１はめっき槽２０内で
は回転ローラで送られる。回転ローラは槽内の被めっき
物２１の両側に適宜本数設けられるが、送りのみの回転
ローラと電極を兼ねた給電ローラ２４を適宜混ぜて設置
することができる。図１では便宜上電極を兼ねた給電ロ
ーラ２４のみを示している。給電ローラ２４は後に詳述
するが、電気絶縁体２５をもって、軸方向に例えば４分
割し、回転により被めっき物２１に接する位置に来た分
割区分２６にはマイナス電圧を印加し、被めっき物２１
から離れた区分にはプラス電圧を印加するようになって
いる。２８は陽極で前記給電ローラ２４においてマイナ
ス電圧を印加されて陰極となった分割区分２６との間に
電流が流れ、陰極に接する被めっき物２１の表面に化学
めっきを施す。この電圧の印加は整流器２９をもって行
う。Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a plan view for explaining the outline of the present invention. In the figure, reference numeral 20 denotes a plating tank, in which an object to be plated 21 is fed into the tank through a liquid-tight slit 22 provided in the tank wall, and is sent out of the tank through a liquid-tight slit 23 provided in the opposite tank wall. You. The object to be plated 21 is sent by a rotating roller in the plating tank 20. The number of rotating rollers is appropriately provided on both sides of the object to be plated 21 in the tank. However, a rotating roller for feeding only and a feeding roller 24 also serving as an electrode can be appropriately mixed and installed. FIG. 1 shows only the power supply roller 24 also serving as an electrode for convenience. As will be described in detail later, the power supply roller 24 is divided into, for example, four in the axial direction by an electric insulator 25, and a negative voltage is applied to a divided section 26 that comes into contact with the object to be plated 21 by rotation. 21
A positive voltage is applied to a section away from the section. Numeral 28 denotes an anode, to which a negative voltage is applied in the power supply roller 24, a current flows between the divided section 26 which has become a cathode, and the surface of the plating object 21 in contact with the cathode is subjected to chemical plating. This voltage is applied by the rectifier 29.

【００１６】一方、給電ローラ２４の回転により被めっ
き物２１から離れた位置に来た分割区分２７にはプラス
電圧を印加し、その対極としての陰極３０は隔膜３１に
て囲み、金属イオンを通さないようにしてある。陽極と
しての分割区分２７と陰極３０との間には整流器３２を
もってパルス電圧を印加する。このことによって分割区
分２７表面の付着した余分なめっきを溶出させる。又、
陰極３０には金属イオンが届かないようにしてあるの
で、陰極表面の汚損はない。On the other hand, a positive voltage is applied to the divided section 27 which has come to a position distant from the workpiece 21 by the rotation of the power supply roller 24, and a cathode 30 as a counter electrode thereof is surrounded by a diaphragm 31 so that metal ions can pass therethrough. I do not have it. A rectifier 32 applies a pulse voltage between the divided section 27 as an anode and the cathode 30. As a result, excess plating adhered to the surface of the divided section 27 is eluted. or,
Since the metal ions are prevented from reaching the cathode 30, the cathode surface is not stained.

【００１７】このようにすることによって、めっき槽２
０中を連続的に移動する被めっき物２１に連続的にめっ
きを施すと共に、給電ローラ２４の表面を均質に保つ。
なお、図１では陽極２８と陰極３０とを並列に示してあ
るが、両者は交互に直線上に配列し、それぞれの間を仕
切り板で仕切るなどしてもよい。By doing so, the plating tank 2
While the plating is continuously performed on the object to be plated 21 that continuously moves through the inside of the feeding roller 24, the surface of the power supply roller 24 is kept uniform.
In FIG. 1, the anode 28 and the cathode 30 are shown in parallel, but they may be alternately arranged on a straight line, and a partition may be used to separate the two.

【００１８】図２は、給電ローラ２４の一例を示す。縦
方向の回転陰極棒３２ａの上端にはベベルギヤ３３を取
付け、回転駆動軸３４に取付けてあるベベルギヤ３５と
噛合せて回転陰極棒３２ａを回転させるようになってい
る。FIG. 2 shows an example of the power supply roller 24. Install the bevel gear 33 on the upper end of the longitudinal direction of the rotating cathode rod 32a, and is adapted to rotate the rotating cathode rod 32 a and bevel gear 35 meshes so that is attached to a rotary drive shaft 34.

【００１９】回転陰極棒３２ａの下部のめっき槽２０内
に入る部分には給電ローラ２４、２４が間隔をあけて取
付けられている。さらに回転陰極棒３２ａのベベルギア
３３の直下には、給電ローラ２４の数に対応する給電円
盤３６が設けられている。この例では給電ローラ２４が
上下に２個取付けてあり、それぞれは被めっき物２１の
上下端近くに位置するように配置されている。被めっき
物２１は高さがいろいろとあるので、上方の給電ローラ
２４は上下摺動可能にしておくとよい。給電ローラ２４
は下端部の１つだけでもよい。あるいは中間部にさらに
取付けて１本の回転陰極棒３２ａに３個以上の給電ロー
ラ２４としてもよい。Power supply rollers 24 are mounted at intervals below the rotating cathode bar 32a in the plating bath 20. Furthermore, the bevel gear of the rotating cathode bar 32a
Directly below 33 , power supply disks 36 corresponding to the number of power supply rollers 24 are provided. In this example, two power supply rollers 24 are mounted on the upper and lower sides, each of which is disposed near the upper and lower ends of the object 21 to be plated. Since the object to be plated 21 has various heights, the upper power supply roller 24 may be slidable up and down. Power supply roller 24
May be only one of the lower ends. Alternatively, three or more power supply rollers 24 may be provided on one rotating cathode bar 32a by being further attached to the intermediate portion.

【００２０】給電円盤３６と給電ローラ２４は共に絶縁
体３７をもって軸方向に４分割されている。その給電円
盤３６と給電ローラ２４の各々の分割区分は、回転陰極
棒３２ａの内部の導電部を通って電気的に接続されてい
る。回転陰極棒３２ａの内部の導電部は導電体を軸方向
に分割した形式でも良く、又、導電線で連結した形式で
も良い。いずれにしても給電円盤３６の分割区分２６’
と給電ローラ２４の分割区分２６、給電円盤３６の分割
区分２７’と給電ローラ２４の分割区分２７とは電気的
につながっている。The power supply disk 36 and the power supply roller 24 are both axially divided by an insulator 37 into four parts. Each of the divided sections of the feeding disc 36 and the feed roller 24 is electrically connected through the inside of the conductive portion of the rotating cathode rod 32 a. A conductive portion in the rotating cathode rod 32 a may be a form obtained by dividing the conductor in the axial direction, or may be in a form linked with conductive lines. In any case, the division section 26 'of the power supply disk 36
The division 26 of the power supply roller 24, the division 27 'of the power supply disk 36, and the division 27 of the power supply roller 24 are electrically connected.

【００２１】給電円盤３６には図３に示すように、給電
端子３８（マイナス）、３９（プラス）を接触させて給
電するが、図３（イ）に示すように、マイナスの給電端
子３８の幅が狭いと給電円盤３６における絶縁体３７の
部分に合致したときに電流の供給が一次的に切断され
て、めっき層に筋が入ってしまう。品質的にはさしたる
問題はないとしても外観が多少見劣りするようになる恐
れがあるので、図３（ロ）に示すように給電端子３８の
幅を広くして、隣接する２つの分割区分にまたがるよう
に給電する。このことによって、電流の途切れがなくな
り、美麗なめっき表面が得られるようになる。As shown in FIG. 3, power is supplied to the power supply disk 36 by bringing the power supply terminals 38 (minus) and 39 (plus) into contact with each other. As shown in FIG. If the width is small, the supply of current is temporarily cut off when it matches the portion of the insulator 37 in the power supply disk 36, and a streak occurs in the plating layer. Even if there is no problem in terms of quality, there is a possibility that the appearance may be slightly inferior. Therefore, as shown in FIG. 3B, the width of the power supply terminal 38 is increased so as to extend over two adjacent divided sections. Power supply. As a result, the current is not interrupted, and a beautiful plating surface can be obtained.

【００２２】図４は陰極３０周辺の説明図で、陰極３０
はめっき液例えば硫酸銅溶液中に隔膜３１によって隔離
されて浸漬されている。隔膜３１は金属イオンを通さな
いもので、めっき液中の銅イオンを通さない。陰極３０
の隔膜内の周囲は希硫酸によって通電を確保されてい
る。したがって、陰極３０の周辺には金属イオンが存在
しないので陰極が汚損することがない。陰極３０の材質
としてはステンレス、銅、チタン、フェライトなど酸に
溶解しない金属ならすべて使用できる。隔膜３１として
は素焼でも良い。もし隔膜を使用しないと、陰極に給電
ローラから剥離した銅イオン以外にめっき液中の銅イオ
ンまでが析出するために、陰極が太って無駄な銅イオン
を消費してしまう。又、陰極の重量が重くなって陰極用
ハンガーの支えが壊れるおそれもある。FIG. 4 is an explanatory view around the cathode 30.
Is immersed in a plating solution, for example, a copper sulfate solution, separated by a diaphragm 31. The diaphragm 31 is impervious to metal ions and does not pass copper ions in the plating solution. Cathode 30
Electricity is secured around the inside of the diaphragm by dilute sulfuric acid. Therefore, since no metal ions exist around the cathode 30, the cathode is not polluted. As the material of the cathode 30, any metal such as stainless steel, copper, titanium, and ferrite that does not dissolve in an acid can be used. The diaphragm 31 may be unfired. If a diaphragm is not used, not only the copper ions separated from the power supply roller but also the copper ions in the plating solution are deposited on the cathode, so that the cathode becomes fat and wasteful copper ions are consumed. In addition, the weight of the cathode may increase, and the support of the hanger for the cathode may be broken.

【００２３】図５は、以上の実施例における各部材の配
置関係を概念的に示す斜視図である。黒矢印がめっき電
流の流れを示し、白矢印が剥離電流の流れを示す。FIG. 5 is a perspective view conceptually showing an arrangement relationship of each member in the above embodiment. Black arrows indicate the flow of plating current, and white arrows indicate the flow of peeling current.

【００２４】以上の実施例では給電ローラ２４を４分割
した例を示しているが、２分割、３分割、５分割、６分
割等の態様もあり得る。In the above embodiment, the power supply roller 24 is divided into four parts. However, the power supply roller 24 may be divided into two parts, three parts, five parts, and six parts.

【００２５】[0025]

【発明の効果】本発明では、２つの整流器を用いて、一
方はめっき作業のための電圧負荷に用い、他方は給電ロ
ーラの表面に付着する余分なめっき膜の除去のための電
圧負荷に用い、被めっき物に連続めっきを施しながら、
給電ローラに余分なめっき被膜が付着するのを防ぎ、こ
の余分なめっき膜の付着によって生じる被めっき物に対
するめっき面の荒れを防止し、長期に亘って美しいめっ
き面を形成することが可能となる。又、余分なめっきの
剥離のための陰極は、隔膜で隔離したり、電極材料を選
択して金属イオンを消耗しないようにされているので、
金属イオンの付着に伴う弊害がなくなり、長期に亘って
損耗することなく有効に使用可能である。さらに、余分
なめっき膜の除去に用いる整流器にはパルス電圧を印加
すると、余分なめっき膜の除去を一層有効にすることが
できる。According to the present invention, two rectifiers are used, one is used for a voltage load for a plating operation, and the other is used for a voltage load for removing an excessive plating film adhered to the surface of a power supply roller. , While applying continuous plating to the workpiece
It is possible to prevent an extra plating film from adhering to the power supply roller, prevent the plating surface from being roughened with respect to an object to be plated caused by the extra plating film, and form a beautiful plating surface over a long period of time. . In addition, since the cathode for peeling off excess plating is isolated by a diaphragm and the electrode material is selected so that metal ions are not consumed,
The adverse effects associated with the attachment of metal ions are eliminated, and the metal ions can be effectively used without being worn over a long period of time. Further, when a pulse voltage is applied to the rectifier used for removing the extra plating film, the removal of the extra plating film can be made more effective.

【図面の簡単な説明】[Brief description of the drawings]

【図１】本発明の実施例を説明する平面図である。FIG. 1 is a plan view illustrating an embodiment of the present invention.

【図２】本発明に用いる給電ローラの実施例の斜視図で
ある。FIG. 2 is a perspective view of an embodiment of a power supply roller used in the present invention.

【図３】給電円盤に対する給電端子の形状を示し、
（イ）はマイナス給電端子の幅が狭い例、（ロ）は同じ
くマイナス給電端子の幅が広い場合を示す。FIG. 3 shows the shape of a power supply terminal with respect to a power supply disk;
(A) shows an example in which the width of the negative power supply terminal is narrow, and (b) shows a case in which the width of the negative power supply terminal is also wide.

【図４】剥離用陰極の説明図である。FIG. 4 is an explanatory view of a peeling cathode.

【図５】本発明の装置の配置の概念を説明するための斜
視図である。FIG. 5 is a perspective view for explaining the concept of the arrangement of the device of the present invention.

【図６】先行技術の説明図である。FIG. 6 is an explanatory diagram of the prior art.

【符号の説明】[Explanation of symbols]

２０ めっき槽 ２１ 被めっき物 ２２、２３ 液密スリット ２４ 給電ローラ ２５ 電気絶縁体 ２６、２７ 分割区分 ２８ 陽極 ２９、３２ 整流器 ３０ 陰極 ３１ 隔膜 ３２ａ 回転陰極棒 ３３ ベベルギヤ ３４ 回転駆動軸 ３５ ベベルギヤ ３６ 給電円盤 ３７ 絶縁体 ３８ 給電端子REFERENCE SIGNS LIST 20 plating tank 21 plated object 22, 23 liquid-tight slit 24 power supply roller 25 electrical insulator 26, 27 divided section 28 anode 29, 32 rectifier 30 cathode 31 diaphragm 32 a rotating cathode rod 33 bevel gear 34 rotating drive shaft 35 bevel gear 36 power supply Disk 37 Insulator 38 Power supply terminal

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ Ｃ２５Ｄ 17/08 Ｃ２５Ｄ 17/08 Ｒ 17/28 17/28 (58)調査した分野(Int.Cl.7，ＤＢ名) C25D 21/00 C25D 7/00 C25D 7/06 C25D 17/00 C25D 17/08 C25D 17/28 ────────────────────────────────────────────────── ─── Continued on the front page (51) Int.Cl. 7 identification code FI C25D 17/08 C25D 17/08 R 17/28 17/28 (58) Investigated field (Int.Cl. 7 , DB name) C25D 21/00 C25D 7/00 C25D 7/06 C25D 17/00 C25D 17/08 C25D 17/28

Claims (3)

(57)【特許請求の範囲】(57) [Claims] 【請求項１】 周面を複数の電極部分に分割してなる給
電ローラをめっき槽中に随所に配置し、該給電ローラを
用いて被めっき物を連続的に移送しながらめっきする方
法において、２個の整流器を用い、一方の整流器によっ
て、給電ローラの被めっき物に接する負極部分と、これ
に対向してめっき槽内に配置した陽極との間に電圧を印
加し、他方の整流器によって給電ローラの被めっき物に
接していない陽極部分と、対向してめっき槽内に金属イ
オンを消耗しないように形成した陰極との間に電圧を印
加してめっきすることを特徴とする分割電極部分を有す
る給電ローラを用いた連続めっき方法。1. A method of plating a power supply roller having a peripheral surface divided into a plurality of electrode portions and arranging the power supply roller anywhere in a plating tank, and continuously transferring an object to be plated using the power supply roller. Using two rectifiers, one rectifier applies a voltage between the negative electrode portion of the power supply roller that is in contact with the object to be plated and the anode disposed in the plating tank opposite thereto, and the other rectifier supplies power. Applying a voltage between the anode portion of the roller that is not in contact with the object to be plated and the cathode formed so as not to consume metal ions in the plating tank in opposition to the divided electrode portion characterized by plating. Continuous plating method using a power supply roller having the same. 【請求項２】 周面を複数の電極部分に分割してなる給
電ローラをめっき槽中に随所に配置し、該給電ローラを
用いて被めっき物を連続的に移送しながらめっきする装
置において、給電ローラの分割電極が被めっき物に接す
るときは負極となり、又、被めっき物から離れるときは
陽極となるように構成し、めっき槽内には給電ローラの
負極に対向する陽極と、給電ローラの陽極に対向する陰
極とを配置し、該給電ローラの陽極に対向する陰極は金
属イオンを消耗しないように形成し、かつ、２個の整流
器を有し、一方の整流器は給電ローラの陰極とこれに対
向する陽極との間に電圧を印加するようになし、他方の
整流器は給電ローラの陽極とこれに対向する陰極との間
に電圧を印加するようにしたことを特徴とする分割電極
部分を有する給電ローラを用いた連続めっき装置。2. A plating apparatus in which a power supply roller formed by dividing a peripheral surface into a plurality of electrode portions is disposed in a plating tank at various positions, and a plating object is continuously transferred using the power supply roller. When the split electrode of the power supply roller is in contact with the object to be plated, it becomes a negative electrode, and when it separates from the object to be plated, it becomes an anode.In the plating tank, an anode facing the negative electrode of the power supply roller, and a power supply roller A cathode facing the anode of the power supply roller, the cathode facing the anode of the power supply roller is formed so as not to consume metal ions, and has two rectifiers. A divided electrode portion characterized in that a voltage is applied between the anode and the opposite anode, and a voltage is applied between the anode of the feeding roller and the cathode opposite to the other rectifier. Feeder with Continuous plating equipment using a roller. 【請求項３】 請求項１又は請求項２において、給電ロ
ーラの陽極と、これに対向する陰極との間に印加する電
圧をパルスとすること。3. A pulse according to claim 1, wherein a voltage applied between an anode of the power supply roller and a cathode opposed thereto is a pulse.
JP2000173442A 2000-06-09 2000-06-09 Continuous plating method and apparatus using power supply roller having split electrode portion Expired - Fee Related JP3285572B2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2000173442A JP3285572B2 (en) 2000-06-09 2000-06-09 Continuous plating method and apparatus using power supply roller having split electrode portion
TW089126167A TW522176B (en) 2000-06-09 2000-12-08 Method and apparatus for continuous plating using power supplying roller having split electrode
KR10-2000-0083683A KR100393085B1 (en) 2000-06-09 2000-12-28 Continuous plating method using electric supply rollers each constituted of divided electrodes and apparatus therefor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000173442A JP3285572B2 (en) 2000-06-09 2000-06-09 Continuous plating method and apparatus using power supply roller having split electrode portion

Publications (2)

Publication Number Publication Date
JP2001303299A JP2001303299A (en) 2001-10-31
JP3285572B2 true JP3285572B2 (en) 2002-05-27

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ID=18675671

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Application Number Title Priority Date Filing Date
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Country Link
JP (1) JP3285572B2 (en)
KR (1) KR100393085B1 (en)
TW (1) TW522176B (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL1025446C2 (en) * 2004-02-09 2005-08-10 Besi Plating B V Method and device for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric support as well as dielectric support.
JP4700396B2 (en) * 2005-04-14 2011-06-15 日本メクトロン株式会社 Printed circuit board plating method
JP5336948B2 (en) * 2009-06-30 2013-11-06 株式会社フジクラ Plating apparatus and plating method
JP5174082B2 (en) * 2010-04-23 2013-04-03 株式会社フジクラ Printed wiring board manufacturing method and printed wiring board manufacturing apparatus
JP5795514B2 (en) * 2011-09-29 2015-10-14 アルメックスＰｅ株式会社 Continuous plating equipment
KR20140092707A (en) * 2013-01-16 2014-07-24 주식회사 잉크테크 Plating apparatus and plating method

Also Published As

Publication number Publication date
TW522176B (en) 2003-03-01
JP2001303299A (en) 2001-10-31
KR100393085B1 (en) 2003-07-31
KR20010110973A (en) 2001-12-15

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