US20070144896A1 - Plating process enhanced by squeegee roller apparatus - Google Patents
Plating process enhanced by squeegee roller apparatus Download PDFInfo
- Publication number
- US20070144896A1 US20070144896A1 US11/606,629 US60662906A US2007144896A1 US 20070144896 A1 US20070144896 A1 US 20070144896A1 US 60662906 A US60662906 A US 60662906A US 2007144896 A1 US2007144896 A1 US 2007144896A1
- Authority
- US
- United States
- Prior art keywords
- cited
- roller
- work piece
- attached
- guide rail
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000000034 method Methods 0.000 title description 15
- 238000007747 plating Methods 0.000 title description 9
- 239000000126 substance Substances 0.000 claims abstract description 9
- 238000013019 agitation Methods 0.000 claims abstract description 5
- 230000005684 electric field Effects 0.000 claims description 4
- 239000000463 material Substances 0.000 abstract description 6
- 230000008878 coupling Effects 0.000 abstract 2
- 238000010168 coupling process Methods 0.000 abstract 2
- 238000005859 coupling reaction Methods 0.000 abstract 2
- 238000009713 electroplating Methods 0.000 description 9
- 239000003792 electrolyte Substances 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- 238000001465 metallisation Methods 0.000 description 5
- 238000000576 coating method Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910021645 metal ion Inorganic materials 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 238000002385 metal-ion deposition Methods 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000002195 soluble material Substances 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
- 210000003813 thumb Anatomy 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/02—Tanks; Installations therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1518—Vertically held PCB
Definitions
- the present invention relates to equipment for coating and electroplating objects. More particular, this invention relates to an apparatus for coating and electroplating objects such as printed circuit boards.
- PCBs printed circuit boards
- an initial step is required to provide a conductive electrical path on the whole surface.
- This metal deposition process often called “electroless plating”, does not rely on the typical electric fields associated with electroplating. Therefore, this metal deposition step is generally harder to control than a regular electroplating process.
- the object Since it is impossible to build up a desired level of metal with this process, the object is moved to an electroplating process for additional build up of conductive material to the surface and holes of the object.
- the object to be coated is immersed into various chemical solutions.
- the tanks, which hold these solutions, have open tops to allow work to be placed inside vertically (i.e., with their printed surfaces and direction of the axis of their holes facing sideward).
- electrolyte plating type process One of the most commonly used electroplating processes for adding conductive material to objects is an electrolyte plating type process. It involves an open tank filled with plating solution or electrolyte.
- These tanks sometimes include electrodes where a voltage is applied to set up an electric field in the tank.
- a power supply that has a variable voltage and amperage control is used to create the voltage between the electrodes
- the object to be plated is called the cathode. It is attached to the negative side of the power supply.
- the other electrode, called the anode, is attached to the positive terminal of a power supply.
- the electrolyte consists of chemicals, usually a metal dissolved and suspended in a liquid as a metal ion.
- the metal ions deposit on the cathode and increase its thickness over time until the process is halted or the solution is exhausted. If the liquid has no movement or agitation the rate of metal ion deposition will slow down by an order of magnitude unless the electrolyte is agitated or some other means is used to deliver fresh electrolyte.
- Agitation is also used to dislodge and sweep away hydrogen gas bubbles that form on plating objects. Also it is used as a means to move electrolyte into sideward holes.
- the present invention is generally directed to satisfying the needs set forth above and overcoming the limitations and problems identified with prior metal deposition and electroplating processes that utilize vertical tanks.
- the present invention takes the form of an apparatus for treating plate-like pieces with a designated chemical solution, including printed circuit boards.
- This apparatus includes: (1) a tank for holding the chemical solution, which is configured to receive a vertically oriented work piece, (2) a conductive plating rack configured to receive and mount the work piece so that the work piece may act as a cathode when the rack is immersed in the tray and surrounded by an electrolytic solution, (3) a sponge type material covering a roller assembly, with a frame to which the rollers are attached and able to move freely, (5) a guide rail attached to a roller assembly, (6) a disk with attachment pin that travels between slotted guide block that connects to guide rails for roller assembly movement, (7) a low rpm motor that is attached with a cam to a disk for guide block travel between disk pin.
- FIG. 1 provides a perspective view of the tank assembly used with a preferred embodiment of a plating apparatus of the present invention.
- FIG. 2 illustrates a roller assembly adjustment for use between objects to be plated.
- FIG. 3 illustrates a roller guide or block used to hold support rail in place.
- FIG. 4 illustrates a roller core fabricated from plastic or inert conductive material with bushings and a sponge like material covering for use with the present invention.
- FIG. 5 illustrates a tank assembly used for multiple objects to be plated.
- FIG. 1 is seen to provide a perspective view of a key aspect of a preferred embodiment of the plating method of the present invention for treating thin, porous, plate-like work pieces (e.g., PCB).
- thin, porous, plate-like work pieces e.g., PCB
- FIG. 1 illustrates a clamping device 3 , having thumb screws 3 a , which is suitable for this purpose.
- Roller assembly frame 4 is used to hold roller core 5 which is fabricated from plastic or conductive inert or soluble material held securely in place.
- roller assembly is then transported back and forth by means of a motor 6 attached to a disk 7 with an adjustable pin 8 on top is a slotted travel block 9 which connects to a guide bar 10 , attached to an additional top guide bar 11 that travels between guide block 12 .
- the guide bars are connected to the roller frame 4 .
- an adjustable roller gauge 13 to compensate for varying board thickness or roller material 14 thickness.
- a guide block will be used 15 with a free moving travel wheel. Additionally bushings 17 will be added into roller core at either end to allow spinning. Roller will be covered with PVA sponge like material or polypropylene that acts as a brush and squeegee to coat surface and interior of object.
- a large tank with a dual roller assembly 18 will be used for multiple object coating.
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
An improved apparatus for treating plate-like work pieces with a designated chemical solution, including printed circuit boards, including (1) a tank for holding the chemicals, agitation frame and roller assembly, (2) a frame that holds two rollers covered in brush or sponge like material, (3) a guide rail assembly attached to a roller frame, (4) a slotted block attached to a guide rail (5) a disk with a bottom shaft coupling and top pin to move slotted block, (6) a low rpm motor that attaches to disk coupling.
Description
- 1. Field of the Invention
- The present invention relates to equipment for coating and electroplating objects. More particular, this invention relates to an apparatus for coating and electroplating objects such as printed circuit boards.
- 2. Description of the Related Art
- The plating of objects such as printed circuit boards (PCBs), maybe accomplished by various processes. For PCBs having various holes, an initial step is required to provide a conductive electrical path on the whole surface.
- This metal deposition process often called “electroless plating”, does not rely on the typical electric fields associated with electroplating. Therefore, this metal deposition step is generally harder to control than a regular electroplating process.
- Since it is impossible to build up a desired level of metal with this process, the object is moved to an electroplating process for additional build up of conductive material to the surface and holes of the object.
- In a standard deposition process, the object to be coated is immersed into various chemical solutions. The tanks, which hold these solutions, have open tops to allow work to be placed inside vertically (i.e., with their printed surfaces and direction of the axis of their holes facing sideward).
- One of the most commonly used electroplating processes for adding conductive material to objects is an electrolyte plating type process. It involves an open tank filled with plating solution or electrolyte.
- These tanks sometimes include electrodes where a voltage is applied to set up an electric field in the tank. A power supply that has a variable voltage and amperage control is used to create the voltage between the electrodes
- The object to be plated is called the cathode. It is attached to the negative side of the power supply. The other electrode, called the anode, is attached to the positive terminal of a power supply.
- The electrolyte consists of chemicals, usually a metal dissolved and suspended in a liquid as a metal ion. When the electric field is applied, the metal ions deposit on the cathode and increase its thickness over time until the process is halted or the solution is exhausted. If the liquid has no movement or agitation the rate of metal ion deposition will slow down by an order of magnitude unless the electrolyte is agitated or some other means is used to deliver fresh electrolyte.
- Agitation is also used to dislodge and sweep away hydrogen gas bubbles that form on plating objects. Also it is used as a means to move electrolyte into sideward holes.
- Thus it often proves to be the case that such electroplating process have the same disadvantages as previously seen for the metal deposition process, i.e., their capabilities are limited when it comes to depositing conductive coatings on objects in a vertical tank, with sideward facing holes to be plated.
- Because off these disadvantages, there exists a continuing need for improved metal deposition and electroplating methods and apparatus.
- 3. Objects and Advantages
- There has been summarized above, rather broadly, the prior art that is related to the present invention in order that the context of the present invention may be better understood and appreciated. In this regard, it is instructive to also consider the objects and advantages of the present invention.
- It is an object of the present invention to provide an apparatus that yields more efficient plating of objects.
- It is an object of the present invention to provide an apparatus that electroplates tiny sideward facing holes, e.g., printed circuit boards.
- It is an object of the present invention to provide an apparatus for eliminating chemical air agitation units that are harmful to people and the environment.
- It is an object of the present invention to provide an apparatus that selectively plates more inside the hole than surface of the objects, e.g., PCBs.
- These and other objects and advantages of the present invention will become readily apparent as the invention is better understood by reference to the accompanying summary, drawings and the detailed description that follows.
- The present invention is generally directed to satisfying the needs set forth above and overcoming the limitations and problems identified with prior metal deposition and electroplating processes that utilize vertical tanks.
- In accordance with one preferred embodiment, the present invention takes the form of an apparatus for treating plate-like pieces with a designated chemical solution, including printed circuit boards.
- This apparatus includes: (1) a tank for holding the chemical solution, which is configured to receive a vertically oriented work piece, (2) a conductive plating rack configured to receive and mount the work piece so that the work piece may act as a cathode when the rack is immersed in the tray and surrounded by an electrolytic solution, (3) a sponge type material covering a roller assembly, with a frame to which the rollers are attached and able to move freely, (5) a guide rail attached to a roller assembly, (6) a disk with attachment pin that travels between slotted guide block that connects to guide rails for roller assembly movement, (7) a low rpm motor that is attached with a cam to a disk for guide block travel between disk pin.
- There has been summarized above, rather broadly, the present invention in order that the detailed description that follows may be better understood and appreciated.
-
FIG. 1 provides a perspective view of the tank assembly used with a preferred embodiment of a plating apparatus of the present invention. -
FIG. 2 illustrates a roller assembly adjustment for use between objects to be plated. -
FIG. 3 illustrates a roller guide or block used to hold support rail in place. -
FIG. 4 illustrates a roller core fabricated from plastic or inert conductive material with bushings and a sponge like material covering for use with the present invention. -
FIG. 5 illustrates a tank assembly used for multiple objects to be plated. - For the purpose of explanation and not limitation, specific details are set forth below in order to provide a thorough understanding of the present invention. However, it will be apparent to one skilled in the art the present invention may be practiced in other embodiments that depart from these specific details. In other instances, detailed descriptions of well known methods hardware, ect. are omitted so as not to obscure the description of the present invention with unnecessary detail.
- referring now to the drawing which show a preferred embodiment of the present invention and wherein like reference numerals designate like elements throughout.
-
FIG. 1 is seen to provide a perspective view of a key aspect of a preferred embodiment of the plating method of the present invention for treating thin, porous, plate-like work pieces (e.g., PCB). - The materials to be treated, which for illustrative purposes we take to be
PCBs 2, are positioned vertically.FIG. 1 illustrates aclamping device 3, having thumb screws 3 a, which is suitable for this purpose.Roller assembly frame 4 is used to holdroller core 5 which is fabricated from plastic or conductive inert or soluble material held securely in place. - The roller assembly is then transported back and forth by means of a
motor 6 attached to adisk 7 with anadjustable pin 8 on top is aslotted travel block 9 which connects to aguide bar 10, attached to an additionaltop guide bar 11 that travels betweenguide block 12. The guide bars are connected to theroller frame 4. - Because of the different types and thickness of objects to be plated there is an
adjustable roller gauge 13 to compensate for varying board thickness orroller material 14 thickness. - To further improve the travel of the guide rail assembly a guide block will be used 15 with a free moving travel wheel. Additionally
bushings 17 will be added into roller core at either end to allow spinning. Roller will be covered with PVA sponge like material or polypropylene that acts as a brush and squeegee to coat surface and interior of object. - In another preferred embodiment of the present invention, a large tank with a
dual roller assembly 18 will be used for multiple object coating.
Claims (7)
1. An apparatus for treating plate-like work pieces with a designated chemical solution. Including printed circuit boards, said apparatus comprising:
A tank for holding said chemicals, an agitation frame with roller assembly, said tank having an open top which is configured to receive said work piece when said work piece is oriented so that its largest-surface area is oriented vertically.
2. An apparatus as recited in claim 1 , further comprising:
A clamping device for electrical connection and aligning work piece surface.
3. An apparatus as cited in claim 1 further comprising a roller brush assembly configured to travel between said work piece.
4. An apparatus cited in claim 3 , that further includes a roller core that is conductive and acts as an anode for producing an electric field.
5. An apparatus as cited in claim 3 , wherein said roller brush assembly is attached to a guide rail that is moveable and allows travel back and forth.
6. An apparatus as cited in claim 5 , wherein a guide rail is attached to a slotted block that rides between a pin.
7. An apparatus as cited in claim 6 , wherein a circular disk with a pivot pin is mounted on top coupled to a low rpm adjustable motor to drive slotted block and rail assembly.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/606,629 US20070144896A1 (en) | 2004-06-01 | 2006-11-30 | Plating process enhanced by squeegee roller apparatus |
US11/804,566 US20070215457A1 (en) | 2004-06-01 | 2007-05-18 | Apparatus for electroplating an article |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/856,505 US20050274603A1 (en) | 2004-06-01 | 2004-06-01 | Plating process enhanced by squeegee roller apparatus |
US11/606,629 US20070144896A1 (en) | 2004-06-01 | 2006-11-30 | Plating process enhanced by squeegee roller apparatus |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/856,505 Continuation US20050274603A1 (en) | 2004-06-01 | 2004-06-01 | Plating process enhanced by squeegee roller apparatus |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/804,566 Continuation-In-Part US20070215457A1 (en) | 2004-06-01 | 2007-05-18 | Apparatus for electroplating an article |
Publications (1)
Publication Number | Publication Date |
---|---|
US20070144896A1 true US20070144896A1 (en) | 2007-06-28 |
Family
ID=35459351
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/856,505 Abandoned US20050274603A1 (en) | 2004-06-01 | 2004-06-01 | Plating process enhanced by squeegee roller apparatus |
US11/606,629 Abandoned US20070144896A1 (en) | 2004-06-01 | 2006-11-30 | Plating process enhanced by squeegee roller apparatus |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/856,505 Abandoned US20050274603A1 (en) | 2004-06-01 | 2004-06-01 | Plating process enhanced by squeegee roller apparatus |
Country Status (1)
Country | Link |
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US (2) | US20050274603A1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103114318A (en) * | 2013-03-06 | 2013-05-22 | 中国人民解放军装甲兵工程学院 | Electric brush plating device of flat plate type metal component |
CN106381518A (en) * | 2016-10-18 | 2017-02-08 | 东莞宇宙电路板设备有限公司 | Water retaining device |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105019005A (en) * | 2015-06-30 | 2015-11-04 | 苏州华日金菱机械有限公司 | Multi-functional plating tank |
JP6723889B2 (en) * | 2016-09-28 | 2020-07-15 | 株式会社荏原製作所 | Plating equipment |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3619384A (en) * | 1968-04-03 | 1971-11-09 | Norton Co | Electrodeposition |
USRE28909E (en) * | 1970-08-13 | 1976-07-20 | Standard Alliance Industries, Inc. | Conveyor |
US5167779A (en) * | 1990-08-17 | 1992-12-01 | Henig Hans J | Process and apparatus for electrolyte exchange |
US6342138B1 (en) * | 2000-09-01 | 2002-01-29 | M & B Plating Racks Inc. | Clamp for electroplating articles |
-
2004
- 2004-06-01 US US10/856,505 patent/US20050274603A1/en not_active Abandoned
-
2006
- 2006-11-30 US US11/606,629 patent/US20070144896A1/en not_active Abandoned
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3619384A (en) * | 1968-04-03 | 1971-11-09 | Norton Co | Electrodeposition |
USRE28909E (en) * | 1970-08-13 | 1976-07-20 | Standard Alliance Industries, Inc. | Conveyor |
US5167779A (en) * | 1990-08-17 | 1992-12-01 | Henig Hans J | Process and apparatus for electrolyte exchange |
US6342138B1 (en) * | 2000-09-01 | 2002-01-29 | M & B Plating Racks Inc. | Clamp for electroplating articles |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103114318A (en) * | 2013-03-06 | 2013-05-22 | 中国人民解放军装甲兵工程学院 | Electric brush plating device of flat plate type metal component |
CN106381518A (en) * | 2016-10-18 | 2017-02-08 | 东莞宇宙电路板设备有限公司 | Water retaining device |
Also Published As
Publication number | Publication date |
---|---|
US20050274603A1 (en) | 2005-12-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: PROCESS AUTOMATION INTERNATIONAL LTD, CHINA Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:GLASSMAN, STEVEN P.;REEL/FRAME:019141/0611 Effective date: 20070324 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |