CN102143662A - Manufacturing method of multilayer printed circuit board and substrate holding piece and shield plate - Google Patents
Manufacturing method of multilayer printed circuit board and substrate holding piece and shield plate Download PDFInfo
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- CN102143662A CN102143662A CN2010105809315A CN201010580931A CN102143662A CN 102143662 A CN102143662 A CN 102143662A CN 2010105809315 A CN2010105809315 A CN 2010105809315A CN 201010580931 A CN201010580931 A CN 201010580931A CN 102143662 A CN102143662 A CN 102143662A
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Abstract
The invention relates to a manufacturing method of a multilayer printed circuit board, a substrate holding piece and a shield plate. A plating membrane is formed only at the opening face side of a via hole on single surface of the multilayer printed circuit board by a low-price and stable substrate manufacturing method. A double-sided copper-coated laminated plate and a single-sided copper-coated laminated plate are bonded by an adhesive to form a three-layer circuit substrate; in the double-sided copper-coated laminated plate, copper foil is formed on two surfaces of a flexible insulating basic member respectively; in the single-sided copper-coated laminated plate, copper foil is formed on a single surface of a flexible insulating member. Additionally, a non-through guiding hole is formed on one surface side of the circuit substrate for conductive treatment. The circuit substrate is mounted on the substrate holding piece, and the shield plate is disposed at the inner surface side of the circuit substrate for electroplating treatment. Therefore, the single-sided plating membrane is formed only on the copper foil at the guiding hole side (the opening face side of the via hole) and on the conductive treatment part of the guiding hole, and the copper foil at the inner surface side is not treated by plating.
Description
Technical field
The manufacture method and the substrate that the present invention relates to multilayer board keep tool and shutter, the manufacture method of the multi-layer flexible printed circuit board that in particular, the present invention relates to only on the via hole opening surface, carry out the single face plating of plating processing and form, keep tool with the substrate of the manufacturing that is used for this multi-layer flexible printed circuit board, and shutter.
Background technology
In recent years, for the installation base plate in the miniaturized electronics that is loaded into portable phone etc., become more meticulous and the requirement of densification further improves.As becoming more meticulous and a ring of the technology of densification of such installation base plate, disclose the installation base plate portion of will various electronic units be installed and flexible cable portion formation one, so-called technology with multi-layer flexible printed circuit board of flexible cable, the purposes of establishing with the miniature electric of portable phone etc. based on the multi-layer flexible printed circuit board of this technology be the center and extensively popularize (such as, with reference to patent documentation 1, patent documentation 2).
In the multi-layer flexible printed circuit board of this technology, by NC brill, mould etc., in circuit board, after the perforate, carry out through hole plating, then, the two-sided through hole of so-called substrate that forms the two-sided circuit of substrate is connected to become main flow.But, for miniaturization and the multifunction of following electronic equipment, on substrate, carry out the installation of parts with higher density, be installed on parts from the terminal of electronic unit is inserted form the through hole of usefulness is installed, carry out electronic unit directly is installed on mounted on surface on the substrate.Thus,, exist surface elements that the through hole of usefulness is installed, then have scolding tin and flow on the real estate of opposition side, can't normally carry out the situation that parts are installed if install on the pad at parts.
So, method by laser, plasma or resin etching etc., form the via hole at the bottom of the meticulous band, carrying out plating at this handles, thus, installing under the situation on the pad even be present in parts at this via hole, carry out installing the method that the blind via hole of electronic unit connects, still can be that the center is used in the substrate that the portable equipment of carrying out miniaturization uses etc. with the liquid crystal of portable phone.
But, because by this method, carrying out plating on two faces of substrate handles, even event is in the non-opening surface side of via hole, also increased the thickness of conductor, like this, by the etching and processing of photo-fabrication (etching method of exposure-processed) afterwards, it is difficult that the process of refinement of the circuit pattern of formation becomes.
So, in order to solve such defective, disclose on the multi-layer flexible printed circuit board that above-mentioned via hole, blind via hole connect and carry out the occasion that plating is handled, adopt the support rack type substrate to keep tool, carry out the technology that plating handles (such as, with reference to patent documentation 3, patent documentation 4).That is,, in the support rack type substrate keeps tool, will be used to make the uniform shutter of plating thickness of the inner face of substrate, be arranged at periphery up and down on the two sides of support body according to this technology.
In addition,, also disclose and replace adopting the support rack type substrate to keep tool for fear of the influence that the support rack type substrate keeps the deviation of the plating thickness that the individual difference of tool causes, and adopt the mounted model substrate keep tool technology (such as, with reference to patent documentation 5).According to this technology, influence for fear of the deviation of plating thickness, do not adopt the support rack type substrate to keep tool, and keeping on the tool in the mounted model substrate on the cathode rod with transversely movable mode suspension, the top of the circuit base material of handling with overhang clamping institute plating makes a plurality of circuit base material adjacency.And, adopt the plating apparatus of so-called non-support rack type, wherein, at the state that makes a plurality of circuit base material adjacency, from cathode rod, keep tool and when the goods top powers via the mounted model substrate, along cathode rod, in the plating solution in the plating treatment trough, laterally and flatly advance, carry out electroplating processes simultaneously.
But, in order to adopt these plating apparatus, only on a face of substrate, carrying out plating and handle, non-plating face must adopt the plating mask.Thus, the plating mask that must also require to be used to carry out mask process forms step, and is used for strip step that mask is peeled off, thereby becomes the reason of decline of increase, the job efficiency of plating work of treatment amount.
In addition, as an example that only carries out the method for plating processing at the via hole opening surface of double-side flexible printed circuit board, disclose the method for making double-side flexible printed circuit board, in the method, by two-sided little adhering film etc., according to the mode that the via hole opening surface is outside 2 double-sided copper-clad laminate plates are fitted, form conducting and use the hole, carry out the via hole plating at this state, then, little adhering film is peeled off, thus, only via hole opening surface side form the plating coverlay (such as, with reference to patent documentation 6).
According to this technology, though have the advantage of the via hole plating that carries out 2 double-side flexible printed circuit boards together,, the applying of little adhering film and its strip step etc. complicate.Particularly, in multi-layer flexible printed circuit board, be difficult to, carry out plating by reel-to-reel technology and handle as double-side flexible printed circuit board.That is, if be that the plating of reel-to-reel is handled, though also carry out the applying of little adhering film and its strip step etc. serially,, if at the sheet of each shorter size, fit and peel off, have the danger that cost increases.
In addition, even under the situation that adopts the heat foamable film, the processing of the film residue thing after still must carrying out the heat foamable film peeled off.Thus, the danger that has the cost increase of these auxiliary material.In addition, the danger that descends of the quality that has also that the residual etching that causes of pollution that the plating of this little adhering film or heat foamable film bathes, paste thing is bad, the terminal plating is bad etc.
So, in order to solve these defectives, disclose following method, wherein, at the state that the inner face that makes 2 circuit base materials is faced abreast, carry out electroplating processes (such as, with reference to patent documentation 7).According to this technology, in the inner face side of each circuit base material,, do not handle so do not carry out plating owing to block electric field by shutter, also can carry out the plating of required thickness and handle at the exterior side of each circuit base material.Yet, pars intermedia between anode, because being set, substrate do not keep tool, so factors such as individual difference because of plating apparatus, the occasion that has the range difference between anode and the circuit base material, because of bathing the difference of resistance, electroplating thickness produces difference, is difficult to carry out the process of refinement of the circuit pattern that the etching and processing of the photo-fabrication by after this forms.
Technical literature formerly
Patent documentation
Patent documentation 1: No. 3776304 communique of Japan's special permission
Patent documentation 2: No. 4236837 communique of Japan's special permission
Patent documentation 3: TOHKEMY 2006-291337 communique
Patent documentation 4: TOHKEMY 2008-138257 communique
Patent documentation 5: TOHKEMY 2006-316322 communique
Patent documentation 6: TOHKEMY 2006-086358 communique
Patent documentation 7: Japanese kokai publication hei 11-229196 communique
Summary of the invention
According to above-described such situation, wish to realize the manufacture method of following multilayer board, in the method, easier, as not have plating to bathe pollution, can be only at the opening surface of the via hole of multilayer board, according to homogeneous thickness, carry out plating and handle.
So, generation is in order to provide the manufacture method of following multilayer board, keep tool with the substrate of the manufacturing that is used for this multilayer board, and shutter and the technical task that should solve, the objective of the invention is to solve this problem, and the manufacture method of this multilayer board is easy method, but auxiliary material can not be adopted in low price and manufacturing stably, and the pollution that does not have plating to bathe, can form the multilayer board of plating coverlay only at the via hole opening surface of single face.
The present invention proposes to achieve these goals, the invention of scheme 1 provides a kind of manufacture method of multilayer board, it is characterized in that this method comprises the 1st step, wherein, make the circuit base material that the conductive layer have more than 3 layers and Jie are located at the insulating barrier between above-mentioned each conductive layer; The 2nd step, wherein, at the outermost conductive layer from a face of foregoing circuit base material, in the path of the outermost conductive layer of another face, the hole is used in the conducting that only forms the non-perforation with peristome on an above-mentioned face; The 3rd step, wherein, to the inwall of above-mentioned conducting with the hole, conduction processing; The 4th step wherein, is equipped with substrate and keeps tool, and it comprises the area with the single face that covers the foregoing circuit base material, and has the shutter of the length that prolongs from this circuit base material downwards; The 5th step wherein, makes the face side opposite with the above-mentioned face with above-mentioned peristome towards above-mentioned shutter, the foregoing circuit base material is installed on aforesaid substrate keeps on the tool; The 6th step wherein, keeps the foregoing circuit base material on the tool to impregnated in the plating solution with being installed on aforesaid substrate, carries out electroplating processes, only forms the via hole with peristome in a side.
According to this method, easy and do not adopt auxiliary material, the pollution that does not also have plating to bathe, but low price and only stably making at the via hole opening surface of single face form the multilayer board of plating coverlay.In addition, the interval of circuit base material and shutter is preferably below the 15mm, thus, is suitable for suppressing electric current towards separating out at the plating material that causes with the backflow of the opposite face side of hole opening with conducting.In addition, by the gap that makes circuit base material and shutter is more than the 5mm, even particularly to multi-layer flexible printed circuit board etc., the circuit base material of thin thing carries out under the situation of plating processing, the deflection of circuit base material contacts with shutter, thus, the drag-out that can suppress plating solution is many, or situation of difficult such as washing.
The invention of scheme 2 provides a kind of manufacture method of multilayer board, it is characterized in that this method comprises the 1st step, wherein, makes the circuit base material that the conductive layer have more than 3 layers and Jie are located at the insulating barrier between above-mentioned each conductive layer; The 2nd step, wherein, at the outermost conductive layer from a face of foregoing circuit base material, in the path of the outermost conductive layer of another face, the hole is used in the conducting that only forms the non-perforation with peristome on an above-mentioned face; The 3rd step, wherein, to the inwall of above-mentioned conducting with the hole, conduction processing; The 4th step, wherein, be equipped with the support rack type substrate and keep tool, it is provided with shutter, this shutter has support body, in this support body, have to the power supply of foregoing circuit base material power supply with a pair of vertical frame of terminal according to keeping the mode of spacing to fix by top side crossbearer and bottom side crossbearer, and between above-mentioned a pair of vertical frame, have by the top and admit the top substrate holder of foregoing circuit base material and pass through the bottom admittance seat that the foregoing circuit base material is admitted in the bottom, this shutter have with about above-mentioned a pair of vertical bridge joint touch, and extend to the length of the below of above-mentioned bottom substrate holder from above-mentioned top substrate holder; The 5th step wherein, makes the face side opposite with the above-mentioned face with above-mentioned peristome towards above-mentioned shutter, with two horizontal ends of foregoing circuit base material according to keeping the above-mentioned power supply of tool to install with the mode of termination contact with above-mentioned support rack type substrate; The 6th step wherein, keeps the foregoing circuit base material on the tool to impregnated in the plating solution with being installed on above-mentioned support rack type substrate, carries out electroplating processes, only forms the via hole with peristome in a side.
According to this method, the circuit base material is being installed on the support rack type substrate maintenance tool, carry out the occasion that plating is handled, be preferably below the 15mm according to spacing with the circuit base material, the mode that two horizontal ends contact with support rack type substrate maintenance tool, with the opposite face side of the peristome in hole shutter is being set with the conducting of non-perforation, thus, can suppressing the separating out of plating material of two horizontal ends.In addition, by the gap that makes circuit base material and shutter is more than the 5mm, even particularly to multi-layer flexible printed circuit board etc., the circuit base material of thin thing carries out under the situation of plating processing, the deflection of circuit base material contacts with shutter, thus, the drag-out that still can suppress plating solution is many, or situation of difficult such as washing.
The invention of scheme 3 provides a kind of manufacture method of multilayer board, it is characterized in that this method comprises the 1st step, wherein, makes the circuit base material that the conductive layer have more than 3 layers and Jie are located at the insulating barrier between above-mentioned each conductive layer; The 2nd step, wherein, only a mask at the foregoing circuit base material has peristome, at the outermost conductive layer from a face of foregoing circuit base material, in the path of the outermost conductive layer of another face, the hole is used in the conducting that only forms the non-perforation with peristome on an above-mentioned face; The 3rd step, wherein, to inwall the conduct electricity processing of above-mentioned conducting with the hole; The 4th step, wherein, on clip, hang down buckle and the foregoing circuit base material is installed, this clip carries out the power supply that the mounted model substrate keeps tool, and suspension has shutter on this mounted model substrate maintenance tool, this substrate keep tool with transversely movable mode suspension on cathode rod, this shutter has the width identical with the foregoing circuit base material, and has from the top of foregoing circuit base material, extends to the length of the below of bottom; The 5th step wherein, impregnated in the foregoing circuit base material in the plating solution, keeping the state of tool adjacency with another mounted model substrate, carries out electroplating processes, only forms the via hole with peristome in a side.
According to this method, the circuit base material is being installed on the mounted model substrate maintenance tool that is assembled with on the shutter, carry out the occasion that plating is handled, with the conducting of non-perforation the opposite face side of opening with the hole, spacing between circuit base material and the shutter is preferably below the 15mm, when electroplating, does not have the mode of spacing to make each substrate keep the shutter adjacency of tool according to two adjacent shutters, thus, the plating material that can suppress two horizontal ends is separated out.In addition, by the gap that makes circuit base material and shutter is more than the 5mm, particularly the circuit base material of the thin thing of multi-layer flexible printed circuit board etc. is carried out under the situation that plating handles, the deflection of circuit base material, contact with shutter, thus, the drag-out that still can suppress plating solution is many, perhaps situation of difficult such as washing.
The invention of scheme 4 provides a kind of support rack type substrate maintenance tool that multilayer board is made that is used for, it is characterized in that it is provided with shutter, this shutter has support body, in this support body, have to foregoing circuit base material power supply with a pair of vertical frame of terminal according to keeping the mode of spacing to fix by top side crossbearer and bottom side crossbearer, and between above-mentioned a pair of vertical frame, have by the top and admit the top substrate holder of foregoing circuit base material and pass through the bottom admittance seat that the foregoing circuit base material is admitted in the bottom, this shutter have with about a pair of vertical bridge joint touch, and extend to the length of the below of above-mentioned bottom substrate holder from above-mentioned top substrate holder;
According to this scheme, adopting the support rack type substrate to keep the occasion of tool, preferably shutter is processed according to the mode that contacts with the top substrate holder, prolong more than the 30mm downwards from its bottom, preferably prolong more than the 60mm, auxiliary shutter also is set on the substrate holder of bottom.In addition, keep tool with the support rack type substrate of the opposite face side of hole opening, can suppress the separating out of plating material of bottom by when electroplating, adopting to be arranged at the conduction of non-perforation.But, even under the long situation in the bottom of shutter, how many occlusion effects do not have yet and improves, thus, if consider the shortcoming that the drag-out of obstruction, plating solution to the bottom side crossbearer increases, then the prolongation amount of shutter is that the following this point of 120mm is appropriate.
According to this scheme,, keep being fixed with the shutter of top ends substrate holder on the tool in the mounted model substrate on the cathode rod at suspension in the occasion of the plating apparatus that adopts non-support rack type.The circuit base material is installed on substrate according to the mode that contacts with the top ends substrate holder and keeps on the tool.In addition, when electroplating, adopt shutter below the bottom of circuit base material, prolong more than the 30mm, preferably more than the 60mm, the structure of auxiliary shutter is set in the bottom of shutter also, thus, can suppress the separating out of plating material of bottom.But even under the long situation in the bottom of shutter, how many occlusion effects do not have yet and improves, and thus, if consider the shortcoming that the drag-out of increase, the plating solution of weight increases, then the prolongation amount of shutter is that the following this point of 120mm is appropriate.
According to technical scheme 1 described invention, can not adopt auxiliary material easily, there is not plating to bathe impurely, low price and only stably making at the via hole opening surface of a side forms the multilayer board of plating coverlay.In addition, under the situation of the step of not carrying out complicated resist formation etc.,, carry out the single face plating with good productivity.
According to technical scheme 2 described inventions, the circuit base material is being installed on the support rack type substrate maintenance tool, carry out the occasion that plating is handled, suitable with the spacing of circuit base material, the mode that keeps tool to contact according to two horizontal ends and substrate, with the opposite face side of hole opening shutter is being set with the conducting of non-perforation, thus, can suppressing the separating out of plating material of two horizontal ends.In addition, the processing of the film residue thing after also needn't requiring to peel off also needn't require the cost of these auxiliary material.In addition, this worry of the pollution of the plating bath of adhering film, heat foamable film slightly also needn't be arranged fully.
According to technical scheme 3 described inventions, the circuit base material is being installed on the mounted model substrate maintenance tool that is assembled on the shutter, carry out the occasion that plating is handled, with the conducting of non-perforation with the opposite face side of hole opening, the suitably spacing between holding circuit base material and the shutter, thus, when electroplating, there is not the mode of spacing according to two adjacent shutters, make each substrate keep the shutter adjacency of tool, thus, the separating out of plating material that can suppress two horizontal ends.In addition, even in individual difference because of plating apparatus, exist under the situation of range difference between anode and the circuit base material, still do not produce the poor of electroplating thickness, realize easily the process of refinement of the circuit pattern that the etching and processing of the photo-fabrication by after this forms.Owing to these reasons, but low price and only stably make in a side and have the multilayer board that the blind via hole of the opening of via hole connects.
According to technical scheme 4 described inventions, adopting the support rack type substrate to keep the occasion of tool, when electroplating, adopt to be arranged to keep tool with the substrate of the opposite face side of the opening in hole with the conducting of non-perforation, thus, can suppress the separating out of plating material of bottom.So, can provide the support rack type substrate of the manufacturing that is suitable for multilayer board to keep tool.
According to technical scheme 5 described inventions,, can keep being fixed with the shutter of the suitable size of top ends substrate holder on the tool in the mounted model substrate on the cathode rod at suspension in the occasion of the plating apparatus that adopts non-support rack type.Thus, can provide the support rack type substrate of the manufacturing that is suitable for multilayer board to keep tool and the shutter that is assembled on the mounted model substrate maintenance tool.
Description of drawings
Fig. 1 (a)～Fig. 1 (e) is the edge of substrate view of the manufacturing step of the multi-layer flexible printed circuit board of the 3-tier architecture of expression common embodiment of the present invention;
Fig. 2 is the end face structure figure that the substrate that is illustrated in embodiments of the invention keeps installing on the tool state of 3 layers of circuit substrate;
Fig. 3 is the structure chart that the support rack type substrate of embodiments of the invention 1 keeps tool, and Fig. 3 (a) is a front view, and Fig. 3 (b) is a bottom view, and Fig. 3 (c) is the end-view along A-A ' line;
Fig. 4 is the structure chart that the support rack type substrate of embodiments of the invention 2 keeps tool, and Fig. 4 (a) is a front view, and Fig. 4 (b) is a bottom view, and Fig. 4 (c) is the end-view along A-A ' line;
Fig. 5 is the structure chart that the support rack type substrate of embodiments of the invention 3 keeps tool, and Fig. 5 (a) is a front view, and Fig. 5 (b) is a bottom view, and Fig. 5 (c) is the end-view along A-A ' line, and Fig. 5 (d) is the part enlarged drawing;
Fig. 6 is the structure chart that the mounted model substrate of embodiments of the invention 4 keeps tool, and Fig. 6 (a) is a front view, and Fig. 6 (b) is a bottom view, and Fig. 6 (c) is the end-view along A-A ' line, and Fig. 6 (d) is the end-view along B-B ' line;
Fig. 7 is the structure chart that the mounted model substrate of embodiments of the invention 5 keeps tool, and Fig. 7 (a) is a front view, and Fig. 7 (b) is a bottom view, and Fig. 7 (c) is the end-view along A-A ' line, and Fig. 7 (d) is the end-view along B-B ' line;
Fig. 8 is the structure chart that the mounted model substrate of embodiments of the invention 6 keeps tool, and Fig. 8 (a) is a front view, and Fig. 8 (b) is a bottom view, and Fig. 8 (c) is the end-view along A-A ' line, and Fig. 8 (d) is the end-view along B-B ' line, and Fig. 8 (e) is the part enlarged drawing;
Fig. 9 is the structure chart that the mounted model substrate of embodiments of the invention 7 keeps tool, and Fig. 9 (a) is a front view, and Fig. 9 (b) is a bottom view, and Fig. 9 (c) is the end-view along A-A ' line, and Fig. 9 (d) is the end-view along B-B ' line.
Embodiment
In order to reach following purpose, promptly realize with simple method, do not adopt auxiliary material, and the pollution that does not have plating to bathe, can low price and stably make the purpose of manufacture method of the multilayer board of the multilayer board that can only on the via hole opening surface of a face, form the plating coverlay, the present invention realizes by the manufacture method that a kind of multilayer board is provided, it is characterized in that this method comprises the 1st step, wherein, make the circuit base material that the conductive layer have more than 3 layers and Jie are located at the insulating barrier between above-mentioned each conductive layer; The 2nd step, wherein, at the outermost conductive layer from a face of foregoing circuit base material, in the path of the outermost conductive layer of another face, the hole is used in the conducting that only forms the non-perforation with peristome on an above-mentioned face; The 3rd step, wherein, to inwall the conduct electricity processing of this conducting with the hole; The 4th step wherein, is equipped with substrate and keeps tool, and it comprises the area with the single face that covers the foregoing circuit base material, and has the shutter of the length that prolongs from this circuit base material downwards; The 5th step wherein, makes the face side opposite with the above-mentioned face with above-mentioned peristome towards above-mentioned shutter, the foregoing circuit base material is installed on aforesaid substrate keeps on the tool; The 6th step wherein, keeps foregoing circuit base material on the tool impregnated in carrying out electroplating processes in the plating solution, only form the via hole with peristome in a side with being installed on aforesaid substrate.
According to Fig. 1～Fig. 9, the preferred several embodiment of the present invention are described below.In addition, in each embodiment, at common content, the embodiment of Miao Shuing describes in front, and among the embodiment afterwards, the repetitive description thereof will be omitted.
Fig. 1 (a)～Fig. 1 (e) is the edge of substrate view of expression as the manufacturing step of the multi-layer flexible printed circuit board of the 3-tier architecture of common embodiment of the present invention.At first, shown in this Fig. 1 (a) like that, relatively on two faces of the flexible insulation bare bones 1 (thickness is the polyimides of 25 μ m herein) of polyimides etc., being formed with thickness is the Copper Foil 2 of 12 μ m and the double-sided copper-clad laminate plate 4 of Copper Foil 3, a series of step that formation, exposure, development, etching, the resist layer that is used to form the resist layer of two-sided circuit pattern by the photofabrication manufacture peeled off etc.Then, on the Copper Foil 2 and Copper Foil 3 in double-sided copper-clad laminate plate 4, conformal mask 2a, 3a when forming laser processing, and on Copper Foil 3, form internal layer circuit pattern 3b.
Because the contraposition on the two sides of this moment is carried out at whole baseplate materials, thus be not subjected to the influence of the flexible grade of this baseplate material, so the positional precision on two sides can be guaranteed easily.In addition, also can be as required, employing can be carried out the exposure machine of high-precision two sides contraposition.In addition, also can carry out roughened as required, so that the closely connected property of raising and bonding agent 5 to surperficial roughened.
Then, be equipped with single face copper-coated laminated board 8, wherein, on the single face (being inner face herein) of the flexible insulation bare bones 6 (thickness is the polyimides of 25 μ m herein) of polyimides etc., forming thickness is the Copper Foil 7 of 12 μ m.Then, relative this single face copper-coated laminated board 8, the opening that is used to be provided with flexible cable portion is carried out the demoulding handle, be used for that the single face copper-coated laminated board 8 of the demoulding and the double-sided copper-clad laminate plate 4 stacked bonding agents 5 that are formed with above-mentioned internal layer circuit carry out contraposition with this.In addition, as required, also can carry out the single face copper-coated laminated board 8 that the demoulding handles and the double-sided copper-clad laminate plate 4 stacked bonding agents 5 that are formed with above-mentioned internal layer circuit carry out contraposition to the guide that is used for contraposition is used etc.
Then, shown in the image pattern 1 (b) like that, via bonding agent 5,, that double-sided copper-clad laminate plate 4 and single face copper-coated laminated board 8 is stacked by modes such as vacuum pressed.In above step, form the circuit substrate 9 of 3-tier architecture.In addition, preferably, bonding agent 5 adopts adhesive sheet such few bonding agents of discharge such as (bonding sheet) of lazy flow type (type that is difficult to flow).In addition, in subsequent step, needn't be as the occasion of the bonding agent of flexible cable portion, because flexible optional condition,,, preferably there is not glass cloth if still consider factor such as laser processing so bonding agent 5 also can adopt the preimpregnation material that comprises glass cloth.In addition, the thickness of bonding agent 5 can be selected the interior value of scope of 10～15 μ m.
Then, shown in the image pattern 1 (c) like that, adopt conformal mask 2a and 3a, carry out laser processing, the conducting that is formed for the non-perforation that 3 layers Copper Foil 2, Copper Foil 3, Copper Foil 7 with circuit base material 9 connect is with hole 10.In addition, as the kind that is used to form the laser that conducting uses with the laser processing in hole 10, can select UV-YAG laser, carbonic acid gas laser or excimer laser etc.
Afterwards, shown in the image pattern 1 (d) like that, have 3 layer the circuit base material 9 of conducting relatively with hole 10, the electroplating processes of 10～20 μ m is carried out in the conduction processing, obtains 3 layers Copper Foil 2, Copper Foil 3, the interlayer conduction of Copper Foil 7.At this moment, do not have the face side of opening (that is, the bottom surface side of the Copper Foil 7 of Fig. 1 (d)), do not having the so-called single face plating of plating to handle.
Here, the method that the single face plating is handled describes.Fig. 2 is the end face structure figure that the substrate that is illustrated in embodiments of the invention keeps installing on the tool state of 3 layers of circuit substrate.Promptly, the method of handling as the single face plating, shown in the image pattern 2 like that, will have conducting and be fixed in (not shown) on the substrate maintenance tool with the circuit base material 9 in hole 10, according to the spacing with circuit base material 9 is below the 15mm, and the mode that covers the single face of this circuit base material 9 is provided with shutter 13.When the substrate of this shutter 13 when circuit base material 9 being fixed in plating keeps on the tool (not shown), cover and peristome (that is, conducting use hole 10) the opposite face (that is, the inner face side of circuit base material 9) of top by the fixing circuit base material 9 of substrate holder.In addition, though particular content narrate in the back, but shutter 13 prolongs the above degree of 60mm below the bottom of circuit base material 9.
Like this, the bottom being set in substrate by the fixing circuit base material 9 of substrate holder keeps being impregnated in the plating coating groove on the tool, carry out electroplating processes, thus, shown in the image pattern 1 (d) like that, can plating coverlay 11 be separated out only from the opening surface side of conducting with hole 10.
In addition, in Fig. 2, the spacing of ifs circuit base material 9 and shutter 13 is less than 5mm, then circuit base material 9 has flexibility, thus, has circuit base material 9 and contacts with shutter 13, or conducting is difficult with the liquid renewal of the opposing face of the opening surface in hole 10, can't wash the danger of processing fully.On the other hand, in the spacing of circuit base material 9 and shutter 13 occasion greater than 15mm, a little less than the occlusion effect of top substrate holder part, at the opposing face of conducting with the opening surface in hole 10, the top ends of circuit base material 9 particularly, electric current when backflow has electroplating processes thus, has the danger of separating out of unnecessary plating material.
Get back to Fig. 1 once more, the method for handling by single face plating shown in Figure 2 shown in Fig. 1 (d), only on the 1st layer of 3 layers circuit base material 9, is carried out plating and is handled, and handle by plating, in conducting with forming step via hole 12 in the hole 10.
Then, shown in the image pattern 1 (e) like that, in the 1st layer the outside of having carried out the plating processing (promptly, the surface of Copper Foil 2), with do not carry out the 3rd layer inner face that plating handles (promptly, the surface of Copper Foil 7) on, by the etch processes of photo-fabrication, forms circuit pattern 2b and circuit pattern 7b simultaneously.At this moment, in order on the 1st aspect, to guarantee sheltering (that is, the breakage of etched resist periphery prevents), preferably, adopt dry film photoresist with the above thickness of 20 μ m as the opening surface of step via hole 12.
In addition, can consider sheltering, and on the 3rd thin aspect of Copper Foil 7, adopt the following meticulous Butut of 10 μ m to form the dry film photoresist of usefulness.In addition, owing to, needn't consider the sheltering of step via hole 12, so the 1st aspect that is formed at can be identical thickness with resist layer on the 3rd aspect adopting occasion such as liquid resist.
Then, on the 1st layer and the 3rd aspect, form scolding tin resist layer, coverlay, as required, also form the screen of the paste film etc. of the opening that is provided with regulation.Front and back in this step, as required, on substrate surface, carry out zinc-plated, nickel plating, gold-plated etc. surface treatment, carry out sharp processing, thus, can obtain 3 layers the multi-layer flexible printed circuit substrate that the step via hole at the bottom of a side has the band of opening only connects and composes.In addition, by aforesaid method, when forming 3 layers multi-layer flexible printed circuit substrate, can on the 3rd aspect, form the circuit that highdensity wire distribution distance is 60 μ m.
Afterwards, the support rack type substrate to the embodiment 1 of the manufacture method that is applicable to multi-layer flexible printed circuit board of the present invention keeps the scheme of tool to describe.Fig. 3 is the structure chart that the support rack type substrate of embodiments of the invention 1 keeps tool, and Fig. 3 (a) is a front view, and Fig. 3 (b) is a bottom view, and Fig. 3 (c) is an end-view.Below with reference to all figure of Fig. 3, keep the structure of tool to describe to the support rack type substrate of embodiment 1.
In Fig. 3, keep being formed in the vertical frame 21 that the top has the pair of right and left of the hook 22 that is used to switch in the tool 20 at the support rack type substrate, keep spacing and fixing support body by the top side crossbearer 23 of top side and the bottom side crossbearer 24 of bottom side.The crossbearer up and down of this support body (that is) inboard, top side crossbearer 23 and bottom side crossbearer 24, top substrate holder 25 and bottom substrate holder 26 respectively according to across about vertical frame 21 between mode be provided with.In addition, on a face (that is, the rear side of front view) of the support body 21 of pair of right and left, shutter 27 is installed on the top substrate holder 25, this shutter 27 with about vertical frame 21 contact, and constitute according to the length of the below that extends to bottom substrate holder 26.In addition, on bottom substrate holder 26, auxiliary shutter 28 is installed along the direction parallel with shutter 27.
If Fig. 3 is more specifically described, then a pair of vertical frame 21 shown in the front view respectively shown in bottom view like that, constitute by pillar 21a and substrate pressing plate 21b.In addition, substrate pressing plate 21b can install by pillar 21a and hinge 21c with opening and closing.So,, circuit base material 29 is installed according to mode by this pillar 21a and substrate pressing plate 21b clamping.
In addition, the part of the clamping circuit base material 29 in pillar 21a and substrate pressing plate 21b is provided for the power supply terminal to 29 power supplies of this circuit base material, though do not illustrate especially in the drawings about this point.This power supply via lead-in wire etc., keeps the hook 22 at the top of tool 20 to be electrically connected with the support rack type substrate with the splicing ear of terminal.That is, this hook 22 contacts and conducting with the cathode rod at the top of plating apparatus (not shown), thus, to the power supply terminal of support rack type substrate maintenance tool 20, powers.In addition, for the plating thickness adjustment in the face that carries out circuit base material 29, also can on aforesaid substrate pressing plate 21b, the tabular shelter of putting down in writing in same applicant's the patent documentation 3 be installed further.
In addition, on the vertical frame 21 about the bottom side crossbearer 24 of bottom substrate holder 26 usefulness of the top side crossbearer 23 of the top of top side substrate holder 25 usefulness and bottom side is installed on respectively, play and keep the vertical frame 21 about this and the effect of the substrate holder up and down of supporting circuit base material 29 with the spacing of regulation.
In addition, keep on the tool 20 at the support rack type substrate, shutter 27 is arranged at the position of the single face that covers circuit base material 29.In this form of implementation, the single face of circuit base material 29 is the inboard (that is the inboard of the front view of Fig. 3) of the circuit base material 29 installed.In addition, this shutter 27 is arranged at the position of distance in the scope of 5～15mm with the surface of circuit base material 29.
Also have, shown in bottom view, about this shutter 27 with very close to each other the contacting of pillar 21a.In addition, between the top and top substrate holder 25 of shutter 27, small gap is set, but, shown in the end-view of A-A ' line like that, the occasion of contact very close to each other between the top of shutter 27 and top substrate holder 25 must be provided for the path of air-out in top substrate holder 25.
In addition, shown in the end-view of A-A ' line like that, the bottom of shutter 27 extends to the below more longways than bottom substrate holder 26.The length of this prolongation is about 90mm.In addition, at shutter 27 below circuit base material 29, less than the occasion of 30mm, have a little less than the occlusion effect, in the bottom of conducting with the particularly circuit base material 29 in the opposing face of hole opening surface, the backflow of the electric current during because of plating, the danger that unwanted plating material is separated out.On the other hand, shutter 27 than circuit base material 29 below be longer than occasion more than the 120mm, have the bottom side of obstruction crossbearer 24, by being attached to the liquid on the shutter 27, the shortcoming of the drag-out increase of plating bath etc.
So, in order to improve occlusion effect, in the bottom of shutter 27, towards inclination being set near own side at the backflow of the electric current of bottom side.But,, only be used for carrying out apace the gap that discharge opeing uses and must be arranged between shutter 27 and the bottom substrate holder 26 and when lifting from plating liquid bath, rinsing bowl.
In addition, auxiliary shutter 28 is installed on bottom substrate holder 26.Should assist the height of shutter 28 is 20mm.In addition, be stranded in the plating solution between circuit base material 29 and the auxiliary shutter 28, the mode of washing water, on bottom substrate holder 26, the path that discharge opeing is used be set, though do not provide about the diagram of this point according to suitable discharge.
Fig. 4 is the structure chart that the support rack type substrate of embodiments of the invention 2 keeps tool, and Fig. 4 (a) is a front view, and Fig. 4 (b) is a bottom view, and Fig. 4 (c) is an end-view.In addition, with reference to all figure of Fig. 4, keep the structure of tool to be described to the support rack type substrate of embodiment 2.Identical with aforesaid Fig. 3, in the support rack type substrate keeps tool 30, constitute and having power supply and keep spacings and fixing support body by top side crossbearer 33 and bottom side crossbearer 34 with the vertical frame of the pair of right and left of terminal 31,31 '.
The difference of Fig. 4 and Fig. 3 is to have the mechanism that top side crossbearer 33 and bottom side crossbearer 34 slide according to the mode that can change spacing.Thus, shutter 37,37 ' about cut apart, on the vertical frame about being installed on respectively 31,31 '.In addition, shutter 37,37 ' with about vertical frame 31,31 ' contact, and constitute according to the length of the below that extends to bottom substrate holder 36.
That is, these shutters 37, the 37 ' mode of sliding according to overlapping constitute, and top substrate holder 35 between, produce gap slightly.Thus, in order to improve occlusion effect, the length that shutter 37,37 ' top side also prolong according to crossing top substrate holder 35 constitutes, and the part that prolongs in the top side is oblique near own inclination.In addition, on bottom substrate holder 36, auxiliary shutter 38,38 ' is installed similarly.
Fig. 5 is the structure chart that the support rack type substrate of embodiments of the invention 3 keeps tool, and Fig. 5 (a) is a front view, and Fig. 5 (b) is a bottom view, and Fig. 5 (c) is an end-view, and Fig. 5 (d) is the part enlarged drawing.Below with reference to all figure of Fig. 5, keep the structure of tool to be described to the support rack type substrate of embodiment 3.Identical with aforesaid Fig. 3, keep in the tool 40 at the support rack type substrate, constitute the pair of right and left that having powers uses terminal and indulge frame 41 by top side crossbearer 43 and bottom side crossbearer 44, keep spacing and fixing support body.On a face of this support body, shutter 47 is installed on the top substrate holder 45, this shutter 47 according to about vertical frame 41 contact, and the length that extends to the below of bottom substrate holder 46 constitutes.In addition, auxiliary shutter 48 is set on bottom substrate holder 46.
The difference of Fig. 5 and Fig. 3 is that shutter 47 not under the situation oblique near own inclination, extends as the crow flies; Auxiliary shutter 48 is arranged at the bottom of bottom substrate holder 46 in mode to be opened/closed.In addition, this auxiliary shutter 48 is formed by the material of proportion less than plating solution.So, shown in the part enlarged drawing like that, if auxiliary shutter 48 impregnated in the plating solution,, be the shape in the gap of closed bottom end substrate holder 46 and shutter 47 then by buoyancy, prevent that plating solution from getting back to the situation of the shutter side of circuit base material 49.In addition,, then can pass through gravity, will assist shutter 48 releases naturally, the plating solution that is immersed between circuit base material 49 and the shutter 47 is successfully discharged if substrate keeps tool 40 to lift from liquid level.Thus, by auxiliary shutter 48, plating solution can not be stranded on the bottom substrate holder 46 yet, needn't make shutter 47, produces the inclination that is used to improve occlusion effect, thus, can further reduce the drag-out of plating solution.
Below with reference to Fig. 6～Fig. 9, the mounted model substrate is kept the structure of several embodiment of the shutter of tool describe.
Fig. 6 is the structure chart that the mounted model substrate of embodiments of the invention 4 keeps tool, and Fig. 6 (a) is a front view, and Fig. 6 (b) is a bottom view, and Fig. 6 (c) is the end-view along A-A ' line, and Fig. 6 (d) is the end-view along B-B ' line.Below with reference to all figure of Fig. 6, keep the structure of tool to be described to the mounted model substrate of embodiment 4.That is, Fig. 6 is assembled in the structure chart that mounted model substrate of the present invention keeps the embodiment of the shutter on the tool for expression.In Fig. 6, keep tool 50 with the mounted model substrate of transversely movable mode suspension on the cathode rod (not shown), constitute by clip 51, hook 52 and shoulder 53, this clip 51 buckle circuit base material 59 that is used to hang down, and power, this hook 52 is used for keeping tool 50 suspensions in the cathode rod (not shown) mounted model substrate, and this shoulder 53 is connected clip 51 with hook 52.
This shutter 57 is installed on the position of distance in the scope of 5～15mm with the surface of circuit base material 59.The bottom of shutter 57 is from the bottom of circuit base material 59, below more length extends to.The length of this extension is about 90mm.In addition, shutter 57 extend to circuit base material 59 below length less than the occasion of 30mm, have a little less than the occlusion effect, in the bottom of conducting with the particularly circuit base material 59 in the opposing face of the opening surface of hole 10 (with reference to Fig. 1 (c)), the backflow of the electric current during because of plating, the danger that unwanted plating material is separated out.On the other hand, shutter 57 is longer than the above occasion of 120mm from the below of circuit base material 59, and the weight with shutter 57 increases, and integral inclination is to the load increase of holding part 57a, the shortcoming of the drag-out increase of the plating solution of the liquid that perhaps adheres to etc.
In addition, on the bottom of circuit base material 59, bottom substrate holder 56 is installed, this bottom substrate holder 56 has auxiliary shutter 58.Should assist the bottom of shutter 58 from circuit base material 59, upright upward establishing works to block the backflow from the electric current of bottom side.In addition, the mode according to the plating solution that will be detained between circuit base material 59 and auxiliary shutter 58, washing water are suitably discharged is provided with the path that discharge opeing is used on bottom substrate holder 56.
Fig. 7 is the structure chart that the mounted model substrate of embodiments of the invention 5 keeps tool, and Fig. 7 (a) is a front view, and Fig. 7 (b) is a bottom view, and Fig. 7 (c) is the end-view along A-A ' line, and Fig. 7 (d) is the end-view along B-B ' line.Below with reference to all figure of Fig. 7, keep the structure of tool to be described to the mounted model substrate of embodiment 5.In Fig. 7, identical with Fig. 6, shutter 67 comprises holding part 67a and extension 67b, and this holding part 67a embeds the mounted model substrate and keeps in the shoulder 63 of tool 60, the top of this extension 67b holding circuit base material 69, and block backflow from the electric current of top side.
The difference of Fig. 7 and Fig. 6 is that shutter 67 extends towards the below of the bottom of circuit base material 69, but does not have rake; Be arranged at auxiliary shutter 68 on the bottom substrate holder 66 from bottom substrate holder 66, outstanding along the shutter direction, crooked downwards.
Should auxiliary shutter 68 play the surface that is used to prevent plating solution right circuit base material 69 and situation about refluxing from direction and shutter 67 sides down, and with the effect of prescribed distance maintenance with the distance of shutter 67, even have in plating solution, circuit base material 69 bears under the situation of pressure of liquid stream, still prevents the effect that circuit base material 69 contacts with shutter 67.In addition, if keep tool 60 to lift the mounted model substrate, because auxiliary shutter 68 is crooked downwards, so follow the mobile of plating solution, the pitch enlargement between this auxiliary shutter 68 and the shutter 67, discharge opeing successfully from liquid level.In addition, by the auxiliary shutter 68 of bending, can on bottom substrate holder 66, not be detained plating solution yet.Thus, shutter 67 needn't be provided for improving the rake of occlusion effect, like this, can further reduce the drag-out of plating solution.
Fig. 8 is the structure chart that the mounted model substrate of embodiments of the invention 6 keeps tool, and Fig. 8 (a) is a front view, and Fig. 8 (b) is a bottom view, and Fig. 8 (c) is the end-view along A-A ' line, and Fig. 8 (d) is the end-view along B-B ' line; Fig. 8 (e) is the part enlarged drawing.Below with reference to all figure of Fig. 8, keep the structure of tool to be described to the mounted model substrate of embodiment 6.
In Fig. 8, identical with Fig. 7, shutter 77 comprises holding part 77a and extension 77b, this holding part 77a embeds the mounted model substrate and keeps in the shoulder 73 of tool 70, the top of this extension 77b holding circuit base material 79, and block the backflow from the electric current of top side, the part that prolongs below the bottom of the circuit base material 79 of this shutter 77 does not tilt.
The auxiliary shutter 78 that the difference of Fig. 8 and Fig. 7 is to be arranged on the bottom substrate holder 76 is provided with in mode to be opened/closed.That is, identical with aforesaid Fig. 5, auxiliary shutter 78 is formed by the material of proportion less than plating solution.So, shown in the image pattern 8 (e) like that, if auxiliary shutter 78 impregnated in the plating solution,, be the shape in the gap of closed bottom end substrate holder 66 and shutter 67 then by buoyancy, can prevent that plating solution is back to the situation of shutter 77 sides of circuit base material 79.
In addition, if keep tool 70 to lift substrate from liquid level, then can be by the gravity of auxiliary shutter 78, the gap of bottom substrate holder 66 and shutter 67 is discharged naturally, like this, the plating solution that is immersed between circuit base material 79 and the shutter 77 is successfully discharged.Have, by the gap between shutter 77 and the auxiliary shutter 78, open with the degree greater than the occasion of Fig. 7, like this, the discharge of plating solution is more successfully carried out, so, also can reduce the drag-out of plating solution.
Embodiment 7
Fig. 9 is the structure chart that the mounted model substrate of embodiments of the invention 7 keeps tool, and Fig. 9 (a) is a front view, and Fig. 9 (b) is a bottom view, and Fig. 9 (c) is the end-view along A-A ' line, and Fig. 9 (d) is the end-view along B-B ' line.Below with reference to all figure of Fig. 9, keep the structure of tool to be described to the mounted model substrate of embodiment 7.In Fig. 9, identical with Fig. 6, shutter 87 comprises holding part 87a and extension 87b, this holding part 87a embeds the mounted model substrate and keeps in the shoulder 83 of tool 80, the top of this extension 87b holding circuit base material 89, and block backflow from the electric current of top side, the part that below the bottom of the circuit base material 89 of this shutter 87, prolongs, not oblique towards 89 inclinations of circuit base material, and vertically extend.
The difference of Fig. 9 and Fig. 6 is not install the bottom substrate holder, and auxiliary shutter 88 is installed between the bottom position of shutter 87 and circuit base material 89, gives prominence to and is provided with agley downwards along the direction of circuit base material 89.Should assist shutter 88 to play and prevent the situation of plating solution from the backflow on the surface of shutter 87 sides of following direction circuit base material 89, and the effect of the spacing between holding circuit base material 89 and the shutter 87.
In addition, if keep tool 80 to lift the mounted model substrate from liquid level, owing to flowing of plating solution, 89 deflections of circuit base material, the pitch enlargement between this circuit base material 89 and the auxiliary shutter 88 is so discharge opeing successfully.By like this, will assist shutter 88 to be installed on the shutter 87, do not spend the bottom substrate holder is installed on time on the circuit base material 89, can make multilayer board more efficiently.
As mentioned above, if adopt the manufacture method of multilayer board of the present invention, then can under the situation of the step of not carrying out complicated resist formation etc., carry out the single face plating with good productivity.In addition, the processing of the film residue thing after also needn't requiring to peel off also needn't require the cost of these auxiliary material.In addition, this worry of the pollution of the plating bath of adhering film, heat foamable film slightly needn't be arranged fully.And, even in individual difference because of plating apparatus, exist under the situation of the range difference between anode and the circuit block, still do not produce the poor of electroplating thickness, the process of refinement of the circuit pattern that the etching and processing of the photo-fabrication by after this forms is easy.Owing to these reasons, so low price can be provided and only stably make the method that has the multilayer board that the blind via hole of the opening of via hole connects in a side, and the support rack type substrate that is suitable for the manufacturing of above-mentioned multilayer board keeps tool and is assembled in the mounted model substrate keeping shutter on the tool.
As described above, several embodiments of the present invention are illustrated, still, the present invention is not limited to the above embodiments, only otherwise break away from spirit of the present invention, can carry out various changes, and in addition, the present invention relates to the scheme of this change certainly.
Utilize possibility on the industry
Manufacture method and substrate holding according to multilayer board of the present invention, and shutter, because can be at the good state of productivity, carry out the single face plating at substrate and process, so also can effectively be used for the occasion of the manufacturing installation etc. of semiconductor mounting substrate.
Label declaration
Claims (5)
1. the manufacture method of a multilayer board is characterized in that this method comprises:
The 1st step wherein, is made the circuit base material that the conductive layer have more than 3 layers and Jie are located at the insulating barrier between above-mentioned each conductive layer;
The 2nd step, wherein, at the outermost conductive layer from a face of foregoing circuit base material, in the path of the outermost conductive layer of another face, the hole is used in the conducting that only forms the non-perforation with peristome on an above-mentioned face;
The 3rd step, wherein, to inwall the conduct electricity processing of above-mentioned conducting with the hole;
The 4th step wherein, is equipped with substrate and keeps tool, and it comprises the area with the single face that covers the foregoing circuit base material, and has the shutter of the length that prolongs from this circuit base material downwards;
The 5th step wherein, makes the face side opposite with the above-mentioned face with above-mentioned peristome towards above-mentioned shutter, the foregoing circuit base material is installed on aforesaid substrate keeps on the tool;
The 6th step wherein, keeps the foregoing circuit base material on the tool to impregnated in the plating solution with being installed on aforesaid substrate, carries out electroplating processes, only forms the via hole with peristome in a side.
2. the manufacture method of a multilayer board is characterized in that this method comprises:
The 1st step wherein, is made the circuit base material that the conductive layer have more than 3 layers and Jie are located at the insulating barrier between above-mentioned each conductive layer;
The 2nd step, wherein, at the outermost conductive layer from a face of foregoing circuit base material, in the path of the outermost conductive layer of another face, the hole is used in the conducting that only forms the non-perforation with peristome on a face;
The 3rd step, wherein, to the inwall of above-mentioned conducting with the hole, conduction processing;
The 4th step, wherein, be equipped with the support rack type substrate and keep tool, it is provided with shutter, this shutter has support body, in this support body, have to the power supply of foregoing circuit base material power supply with a pair of vertical frame of terminal according to keeping the mode of spacing to fix by top side crossbearer and bottom side crossbearer, and between above-mentioned a pair of vertical frame, have by the top and admit the top substrate holder of foregoing circuit base material and pass through the bottom admittance seat that the foregoing circuit base material is admitted in the bottom, this shutter have with about above-mentioned a pair of vertical bridge joint touch, and extend to the length of the below of above-mentioned bottom substrate holder from above-mentioned top substrate holder;
The 5th step wherein, makes the face side opposite with the above-mentioned face with above-mentioned peristome towards above-mentioned shutter, with two horizontal ends of foregoing circuit base material according to keeping the above-mentioned power supply of tool to install with the mode of termination contact with above-mentioned support rack type substrate;
The 6th step wherein, keeps the foregoing circuit base material on the tool to impregnated in the plating solution with being installed on above-mentioned support rack type substrate, carries out electroplating processes, only forms the via hole with peristome in a side.
3. the manufacture method of a multilayer board is characterized in that this method comprises:
The 1st step wherein, is made the circuit base material that the conductive layer have more than 3 layers and Jie are located at the insulating barrier between above-mentioned each conductive layer;
The 2nd step, wherein, only a mask at the foregoing circuit base material has peristome, at the outermost conductive layer from a face of foregoing circuit base material, in the path of the outermost conductive layer of another face, the hole is used in the conducting that only forms the non-perforation with peristome on a face;
The 3rd step, wherein, to the inwall of above-mentioned conducting with the hole, conduction processing;
The 4th step, wherein, on clip, hang down buckle and the foregoing circuit base material is installed, this clip carries out the power supply that the mounted model substrate keeps tool, suspension has shutter on this mounted model substrate maintenance tool, and on cathode rod, this shutter has the width identical with the foregoing circuit base material to this substrate maintenance tool with transversely movable mode suspension, and have from the top of foregoing circuit base material, extend to the length of the below of bottom;
The 5th step wherein, impregnated in the foregoing circuit base material in the plating solution, keeping the state of tool adjacency to carry out electroplating processes with another mounted model substrate, only forms the via hole with peristome in a side.
4. a support rack type substrate keeps tool, it is used for the multilayer board manufacturing, it is characterized in that it is provided with shutter, this shutter has support body, in this support body, have to foregoing circuit base material power supply with a pair of vertical frame of terminal according to keeping the mode of spacing to fix by top side crossbearer and bottom side crossbearer, and between above-mentioned a pair of vertical frame, have by the top and admit the top substrate holder of foregoing circuit base material and pass through the bottom admittance seat that the foregoing circuit base material is admitted in the bottom, this shutter have with about a pair of vertical bridge joint touch, and, extend to the length of the below of above-mentioned bottom substrate holder from above-mentioned top substrate holder.
5. shutter, it is installed on the mounted model substrate and keeps on the tool, this mounted model substrate keep tool with transversely movable mode suspension on cathode rod, buckle circuit base material hangs down, and power, it is characterized in that this shutter has holding part, this holding part is installed on above-mentioned mounted model substrate and keeps on the shoulder of tool; Extension, this extension keeps the top of foregoing circuit base material, and it is blocked, and this shutter has the width identical with the foregoing circuit base material, and has the length that extends to the below of bottom from the top of foregoing circuit base material.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010022420A JP5406065B2 (en) | 2010-02-03 | 2010-02-03 | Multilayer printed wiring board manufacturing method, substrate holder, and shielding plate |
| JP2010-022420 | 2010-02-03 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102143662A true CN102143662A (en) | 2011-08-03 |
| CN102143662B CN102143662B (en) | 2015-03-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010580931.5A Active CN102143662B (en) | 2010-02-03 | 2010-12-06 | Manufacturing method of multilayer printed circuit board and substrate holding piece and shield plate |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5406065B2 (en) |
| CN (1) | CN102143662B (en) |
| TW (1) | TWI399151B (en) |
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| CN103594265A (en) * | 2013-11-28 | 2014-02-19 | 江苏省如高高压电器有限公司 | Electroplating tool of J-shaped touch finger of disconnecting switch |
| CN108617110A (en) * | 2016-12-13 | 2018-10-02 | Si弗莱克斯有限公司 | Use flexible printed circuit board manufacturing method and flexible printed circuit board of the internal layer without masking mode |
| TWI712350B (en) * | 2018-11-06 | 2020-12-01 | 德商先進裝配系統有限責任兩合公司 | Method of manufacturing printed circuit board assembly, method of clamping electronics boards for processing and carrier |
| CN113329556A (en) * | 2021-05-19 | 2021-08-31 | 景旺电子科技(龙川)有限公司 | Flexible circuit board and manufacturing method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103379750B (en) * | 2012-04-27 | 2016-06-01 | 富葵精密组件(深圳)有限公司 | Multilayer circuit board and preparation method thereof |
| TWI776655B (en) * | 2021-08-25 | 2022-09-01 | 美商全球連接器科技有限公司 | circuit device |
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| JP5198105B2 (en) * | 2008-03-25 | 2013-05-15 | 日本メクトロン株式会社 | Manufacturing method of multilayer flexible printed wiring board |
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- 2010-02-03 JP JP2010022420A patent/JP5406065B2/en active Active
- 2010-09-13 TW TW99130928A patent/TWI399151B/en active
- 2010-12-06 CN CN201010580931.5A patent/CN102143662B/en active Active
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| JPH07147477A (en) * | 1993-09-30 | 1995-06-06 | Ibiden Co Ltd | Manufacture of printed wiring board of continuous length, plating shielding device, and plating device of printed wiring board material |
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| CN103594265A (en) * | 2013-11-28 | 2014-02-19 | 江苏省如高高压电器有限公司 | Electroplating tool of J-shaped touch finger of disconnecting switch |
| CN108617110A (en) * | 2016-12-13 | 2018-10-02 | Si弗莱克斯有限公司 | Use flexible printed circuit board manufacturing method and flexible printed circuit board of the internal layer without masking mode |
| CN108617110B (en) * | 2016-12-13 | 2020-12-15 | Si弗莱克斯有限公司 | Flexible printed circuit board manufacturing method using inner layer non-shielding mode and flexible printed circuit board |
| TWI712350B (en) * | 2018-11-06 | 2020-12-01 | 德商先進裝配系統有限責任兩合公司 | Method of manufacturing printed circuit board assembly, method of clamping electronics boards for processing and carrier |
| CN113329556A (en) * | 2021-05-19 | 2021-08-31 | 景旺电子科技(龙川)有限公司 | Flexible circuit board and manufacturing method thereof |
| CN113329556B (en) * | 2021-05-19 | 2022-06-07 | 景旺电子科技(龙川)有限公司 | Flexible circuit board and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI399151B (en) | 2013-06-11 |
| CN102143662B (en) | 2015-03-18 |
| TW201129275A (en) | 2011-08-16 |
| JP5406065B2 (en) | 2014-02-05 |
| JP2011159921A (en) | 2011-08-18 |
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