EP4006210A1 - Distribution system for a process fluid and an electric current for a chemical and/or electrolytic surface treatment of a substrate - Google Patents
Distribution system for a process fluid and an electric current for a chemical and/or electrolytic surface treatment of a substrate Download PDFInfo
- Publication number
- EP4006210A1 EP4006210A1 EP20210367.7A EP20210367A EP4006210A1 EP 4006210 A1 EP4006210 A1 EP 4006210A1 EP 20210367 A EP20210367 A EP 20210367A EP 4006210 A1 EP4006210 A1 EP 4006210A1
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- European Patent Office
- Prior art keywords
- cathode
- substrate
- distribution
- pixels
- electric current
- Prior art date
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Links
- 238000009826 distribution Methods 0.000 title claims abstract description 152
- 239000000758 substrate Substances 0.000 title claims abstract description 126
- 238000000034 method Methods 0.000 title claims abstract description 52
- 239000012530 fluid Substances 0.000 title claims abstract description 34
- 239000000126 substance Substances 0.000 title claims abstract description 20
- 238000004381 surface treatment Methods 0.000 title claims abstract description 20
- 238000007747 plating Methods 0.000 description 18
- 239000000463 material Substances 0.000 description 12
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- 230000001419 dependent effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000003792 electrolyte Substances 0.000 description 4
- 238000009713 electroplating Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000013019 agitation Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000000116 mitigating effect Effects 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 238000001311 chemical methods and process Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000011067 equilibration Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000009828 non-uniform distribution Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
- C25D17/12—Shape or form
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/007—Current directing devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/10—Agitating of electrolytes; Moving of racks
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
Definitions
- the disclosure relates to a distribution system for a process fluid and an electric current for a chemical and/or electrolytic surface treatment of a substrate, a distribution module for a process fluid and an electric current for a chemical and/or electrolytic surface treatment of a substrate and a distribution method for a process fluid and an electric current for a chemical and/or electrolytic surface treatment of a substrate.
- Electroplating e.g. of copper
- electroplating is a frequently used technology in many different industries, especially in the semiconductor related industries. Due to the simplicity and scalability of the process, electroplating is used to metallize surfaces or parts of surfaces of various types of substrates having various sizes.
- terminal effect The main challenge associated with the seed-layer and the uniformity of the electrical current distribution over the surface area is called "terminal effect".
- the terminal effect describes a potential drop across a surface area, which can occur due to a relatively high resistivity of such a seed-layer, which is usually required for the electroplating process of a substrate.
- a potential drop of several volts is likely to occur.
- Such potential drop from the substrate edge to the area to be plated results in a highly non-uniform current density distribution leading to an extremely non-uniform plating thickness distribution, primarily characterized by a thicker plating at the substrate edges.
- Additional challenges associated with the current distribution that need to be faced, especially with increasingly smaller structures, may be the equilibration of the current distribution between substrate areas with a very high-density of tiny structures and areas with a low density of rather larger structures to be electroplated.
- a distribution system for a process fluid and an electric current for a chemical and/or electrolytic surface treatment of a substrate comprises a distribution body, a primary cathode, and a secondary cathode.
- the distribution body comprises several openings for the process fluid and the electric current, wherein the several openings are arranged at a front face of the distribution body, the front face being directed to the primary cathode.
- the primary cathode and the secondary cathode are arranged to attract the electric current and to guide the electric current to the substrate, preferably to predefined areas of the substrate to be treated.
- the secondary cathode comprises several cathode pixels, wherein the several cathode pixels are distributed in an array to be aligned with at least an area of the substrate to be treated. Additionally, the several cathode pixels are individually controllable for adjusting a distribution of the electric current at the substrate.
- the secondary cathode may be spaced apart from the primary cathode and may comprise several cathode pixels being distributed in an array to be aligned with an area of the substrate to be treated. This arrangement may enable a localized control and tuning of the current density distribution, particularly with a tuning resolution down to the sub- ⁇ m range.
- the individually controllable cathode pixels may enable a very localized adjustment and tuning of the current density distribution all over a surface of the substrate to be treated, not only at the edge areas of the substrate. Therefore, the distribution system may allow effecting the edge-to-center/center-to-edge as well as the current density distribution within the substrate to be plated. Furthermore, the distribution system according to the disclosure may enable the plating of non-rotating substrates as well as of rotating substrates.
- the secondary cathode may be made from an electrically conducting material, preferably inert to the chemical environment of the electrolyte, e.g. inert metals, such as palladium, palladium-coated materials, platinum and/or platinized materials like tantalum, tungsten, and/or titanium, or may be made from the same material as a plating material to be used for the surface treatment of the substrate.
- inert metals such as palladium, palladium-coated materials, platinum and/or platinized materials like tantalum, tungsten, and/or titanium
- a Cu-comprising secondary cathode may be used when Cu is plated.
- the secondary cathode may have a circular, square, rectangular, C-shaped, wire-shaped and/or partially electrically insulated shape.
- the secondary cathode may work as a thief cathode mitigating the terminal effect by increasing the plating-uniformity. Additionally, or alternatively, the secondary cathode may be formed by several pixels, wherein the pixels may be separate from each other, wherein each pixel may be individually controllable. Therefore, the secondary cathode may be referred as pixelated cathode. Further, the secondary cathode may be directed towards the primary cathode.
- the distribution system may further comprise at least a power source configured to apply individual voltage potentials to the cathode pixels to individually control the cathode pixels.
- at least some of the cathode pixels may be each connected to a single power source.
- the cathode pixels may be each connected to the at least one power source by electrical connecting lines transmitting a potential from the at least one power source to the cathode pixels. Additionally or alternatively, the cathode pixels their selves can be at least partially formed as a wire. At least some of the cathode pixels may be together connected to a single power source. To sum it up, the cathode pixels may be each connected to the same power source, or the cathode pixels may be each connected to individual power sources, resulting in that the number of power sources corresponds to the number of cathode pixels. Alternatively, the power source may comprise several power outlets, each pixel being connected to an individual power outlet of the one power source. Additionally, or alternatively, the cathode pixels may be divided into several groups of pixels, wherein the pixels of each group may be connected to the same power source, but each group of pixels is connected to a separate power source.
- At least some cathode pixels being controlled by a single power source may have individual potentials.
- the cathode pixels may be configured to display a variety of different pixel potentials by providing variable resistances between the power source and the individual cathode pixel.
- the distribution system may further comprise at least a processing unit configured to control the at least one power source to apply the individual voltage potentials to the cathode pixels for individual durations.
- each cathode pixel may be fabricated in a way to permit individual controllability of the applied potential and/or the duration of the applied potential. At least some of the cathode pixels may be grouped to arrays and each array is connected to one of several power sources for being applied with the same potential and same duration.
- the power source(s) may have a cathodic potential or an anodic potential.
- the anodic potential may be used for achieving an improved pixelated reverse pulse plating or for cleaning the pixels from potentially deposited metal layers or particles.
- the cathode pixels may be arranged at a rear face of the distribution body, wherein the rear face is opposite to the front face of the distribution body.
- the control for adjusting the distribution of the electric current at the substrate may be a physical arrangement of cathode pixels.
- the pixels may be arranged according to a predefined pattern, e.g. a photolithographic mask, which is used to create the pattern distribution on the substrate to be treated.
- the cathode pixels can be electrically tuned according to the substrate pattern densities and substrate irregularities.
- the cathode pixels may be arranged at the distribution body.
- the cathode pixels may be arranged in or on a surface of the distribution body.
- the cathode pixels may be arranged at the front face of the distribution body directed to the first cathode.
- the cathode pixels may be mainly arranged around the openings at the front face.
- the cathode pixels may be integrated into the distribution body surface through common processes used in the semiconductor and/or flat panel industry, like one or more photolithographic process sequences.
- at least some of the cathode pixels and electrical connecting lines may be manufactured on the surface via printing. The electrical connecting lines may be fabricated in a similar way as the (individual) cathode pixels.
- the openings at the front face may be configured at least partially as jet holes directing the process fluid and/or the electric current towards the substrate to be treated and/or at least partially as connecting passages draining off the process fluid from the substrate to be treated.
- the front face and the rear face of the distribution body may be connected by the connecting passages through the distribution body, wherein the cathode pixels are arranged at least partially around the connecting passages.
- the connecting passages may be configured to permit a backflow and with this a circulation of the process fluid through the distribution body. Arranging the cathode pixels around the connecting passaged can be an easy way to integrate the cathode pixels into the distribution body.
- the secondary cathode may be separate to the distribution body and positioned adjacent to the distribution body in a direction towards the substrate.
- the secondary cathode may be implemented as a stand-alone system.
- the secondary cathode may correspond to a mostly electrically isolated wire with an electrically non-isolated tip.
- multiple cathode pixels may be physically connected together in a predefined specific geometric constellation, preferably defined by and aligned with the requirements of an "open area density" distribution on the substrate.
- This stand-alone system can be placed between the distribution body and the primary cathode to enable the tuning of the current density distribution all over the substrate to be treated, and in particular to enable the tuning of the current density distribution for individual areas and/or individual device structures of the substrate to be treated.
- the "open area density” may define the density degree of open areas and/or the size of those open areas in a predefined area of the substrate.
- the open areas may be configured to be the areas of the substrate to be treated or plated.
- the current distribution particularly the distribution of electrons, may depend on the density degree and/or the size of the open areas, wherein the distribution of the electrons may affect the current density and thereby the amount of the plating material being deposited in this area.
- Different current densities in different areas of the substrate may lead to different amount of deposited plating material in the different areas resulting in a non-uniform distribution of the plating material.
- providing the pixels with different potentials may allow controlling the current density distribution to achieve a uniform current density distribution and thus, a uniform distribution of the plating material.
- the cathode pixels may not be electrically connected with each other, but individually controllable through being individually electrically connected to individual power supplies, as described above, or to one power supply having adequate multiple power outlets.
- the cathode pixels may also be grouped as to enable electrical power control on various groups of cathode pixels.
- the secondary cathode may preferably be placed in a first predefined distance to the distribution body and in a second predefined distance to the substrate.
- the first predefined distance may be equal to the second predefined distance.
- the first predefined distance may be different to the second predefined distance.
- the predefined first and second distances may be dependent on the plating material and/or the size of the substrate and/or the process fluid and/or the open area density distribution of the device structures on the substrate to be plated.
- the first and the second predefined distances may be constant or correspond to a predefined range, within the distances may be adaptable during the treatment of the substrate. Adapting the distances of the secondary cathode, particularly the second distance to the substrate may influence the current density distribution. The smaller the second distance, the more accurately controllable the influence on the current density distribution.
- the secondary cathode may be aligned substantially parallel to the distribution body and/or may be configured to be aligned with the substrate in-line, flush and not outside the substrate.
- the secondary cathode may be configured to be aligned to a main area of substrate, e.g. a center of substrate, covering at least part of the substrate.
- the surface of the secondary cathode may preferably be substantially parallel or angled to the surface of the substrate to be treated, but not perpendicular.
- the secondary cathode may have approximately the same dimensions as the substrate, or the dimensions of the secondary cathode can be dynamically adjusted to the substrate dimensions through turning on and off predefined pixels.
- the secondary cathode may be arranged on an inert plate shield.
- the inert plate shield may be composed of a chemically inert material.
- a chemically inert material may be defined as not chemically reactive in the electrolyte. Therefore, the inert plate shield may not interfere with the chemical process for plating the surface of a substrate.
- the cathode pixels can also be integrated with the plate shield placed in-between the primary cathode and the distribution body and can be rotated in cooperation and/or coordinated with a substrate rotation.
- the plate shield may work as a carrier plate for the cathode pixels allowing a more flexible arrangement of the cathode pixels.
- the inert plate shield may be attachable to the substrate holder and movable with the substrate.
- this can enable the secondary cathode to be movable with the substrate, e.g. during loading and unloading into and from a plating chamber and/or during agitation movements, such as agitation movements with high as well as with low frequencies, introduced to the substrate.
- agitation movements such as agitation movements with high as well as with low frequencies
- the distribution module for a process fluid and an electric current for a chemical and/or electrolytic surface treatment of a substrate comprises a distribution body as described above, and a substrate holder.
- the substrate holder is configured to hold at least one substrate relative to the distribution body.
- This arrangement may enable a localized control and tuning of the current density distribution, particularly with a tuning resolution down to the sub- ⁇ m range.
- the individually controllable cathode pixels may enable a very localized adjustment and tuning of the current density distribution all over a surface of the substrate to be treated, not only at the edge areas of the substrate. Furthermore, this arrangement may enable the plating of non-rotating substrates as well as of rotating substrates.
- the distribution method comprises the following steps, not necessarily in this order:
- This distribution method may enable a localized control and tuning of the current density distribution, particularly with a tuning resolution down to the sub- ⁇ m range.
- the individually controllable cathode pixels may enable a very localized adjustment and tuning of the current density distribution all over a surface of the substrate to be treated, not only at the edge areas of the substrate.
- the distribution method according to the disclosure may enable the plating of non-rotating substrates as well as of rotating substrates.
- Figure 1 shows schematically and exemplarily an embodiment of a distribution system 1 comprising a distribution body 2, a primary cathode 30 (see Figure 3 ) and a secondary cathode 3.
- the distribution body 2 contains several openings 4, some of which being formed as jet holes 5 and other being formed as connecting passages 6.
- the jet holes 5 are smaller than the connecting passages 6 and are configured to direct flow 7 of a process fluid 18 towards a surface 8 of a substrate 9 to be treated.
- the connecting passages 6 are configured to direct a process fluid 18 (see Figure 3 ) between a front face 10 of the distribution body 2 and the substrate 9 to flow towards a rear face 11 of the distribution body 2, illustrated by arrows 12.
- the front face 10 faces the surface 8 of the substrate 9 to be treated.
- the primary cathode 30 may be coupled to the substrate 9 as shown in Figure 3 , such that the substrate 9 serves as the primary cathode 30 during a treatment process.
- Figure 1 shows a vertical mount of the distribution system 1 and the substrate 9, while a horizontal arrangement would be also possible.
- the secondary cathode 3 comprises several cathode pixels 13, the cathode pixels 13 being arranged on the front face 10 of the distribution body 2 between adjacent openings 4.
- the cathode pixels 13 are integrated into the front face 10.
- the integration of the cathode pixels 13 into the front face 10 of the distribution body 2 is made by common processes used in the semiconductor and/or flat-panel industry, e.g. photolithography, or printing.
- cathode pixels 13 The illustration of the cathode pixels 13 is simplified for visibility reasons and electrical contacts of the cathode pixels 13 as well as electrical connecting lines connecting the cathode pixels 13 to a power source (not illustrated) are not illustrated.
- the cathode pixels 13 are only illustrated as arranged at the front face 10 of the distribution body 2, the cathode pixels 13 can be arranged additionally or alternatively on the rear face 11 of the distribution body 2.
- Each cathode pixel 13 is configured to permit an individual controllability of an electric potential applied by the power source.
- a cathodic potential is usually applied, but also the application of an anodic potential is possible, preferably for achieving an improved pixelated reverse pulse plating or for cleaning the cathode pixels 13 from potentially deposited metal layers or particles.
- the distribution system 1 in combination with a substrate holder 17 (see Figure 3 ) holding the substrate 9 is referred as a distribution module 14.
- Figure 2 shows schematically and exemplarily another embodiment of the distribution system 1 comprising the distribution body 2, the primary cathode 30 being coupled to the substrate 9 and/or the substrate holder 17, and the secondary cathode 3.
- the distribution body 2 corresponds to the distribution body 2 in Figure 1 .
- the secondary cathode 3 is separate from the distribution body 2 and arranged on a plate 15.
- the plate 15 is positioned between the distribution body 2 and the substrate 9 in a predefined distance D to the distribution body 2 and in a predefined distance d to the substrate 9.
- the plate 15 is preferably formed as an inert shield plate 16.
- the cathode pixels 13 are arranged on the plate 15 in a predefined geometric constellation, which is defined by and aligned with the requirements of an "open area density" distribution on the substrate.
- the plate 15 comprising the cathode pixels 13 in a predefined constellation is placed between the distribution body 2 and the substrate 9 to enable the tuning of the current density distribution over the whole structured substrate 9.
- cathode pixels 13 are also simplified for visibility reasons and electrical contacts of the cathode pixels 13 as well as electrical connecting lines connecting the cathode pixels 13 to a power source (not illustrated) are not illustrated.
- FIG 3 schematically and exemplarily shows a cross-sectional view of the distribution system 1 and the distribution module 14 in a processing bath 50.
- the distribution body 2 and the substrate 9 being held by the substrate holder 17 are immersed in the process fluid 18 contained in the processing bath 50.
- the substrate holder 17 is coupled to the primary cathode 30 and the primary cathode 30 is coupled with an additional electrode being an anode 40, wherein the anode 40 is also immersed in the processing fluid 18 and arranged facing the rear face 11 of the distribution body 2.
- the processing fluid 18 is an electrolyte.
- FIG. 4 schematically and exemplarily shows a flow diagram of an embodiment of a distribution method 100 for a process fluid and an electric current for a chemical and/or electrolytic surface treatment of the substrate 9.
- the distribution method 100 comprises a step S1 of providing the distribution body 2 comprising the several openings 4 for the process fluid and the electric current, wherein the several openings 4 are arranged at the front face 10 of the distribution body 2.
- the primary cathode and the secondary cathode 3 are arranged to attract and guide the electric current to the substrate 9 to be treated, wherein the primary cathode is directed to the front face 10 of the distribution body 2 and wherein the secondary cathode 3 comprises the several cathode pixels 13 distributed in an array aligned with at least an area of the substrate 9 to be treated.
- the cathode pixels 13 are individually controlled for adjusting a distribution of the electric current at the substrate 9.
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Abstract
Description
- The disclosure relates to a distribution system for a process fluid and an electric current for a chemical and/or electrolytic surface treatment of a substrate, a distribution module for a process fluid and an electric current for a chemical and/or electrolytic surface treatment of a substrate and a distribution method for a process fluid and an electric current for a chemical and/or electrolytic surface treatment of a substrate.
- Electroplating, e.g. of copper, is a frequently used technology in many different industries, especially in the semiconductor related industries. Due to the simplicity and scalability of the process, electroplating is used to metallize surfaces or parts of surfaces of various types of substrates having various sizes.
- In order to achieve adequate film quality and uniformity during the electroplating process, it is necessary to guarantee a very well balanced electrical current distribution over the surface area as well as a uniform and adequate metal-ion supply through an electrolyte to the surface to be plated. As the substrate is covered with extremely small and sensitive device structures, no direct electrical contact can be made within the substrate area, except within narrow regions at substrate edges. Therefore, an electrically conductive seed-layer is required to distribute the current from the contacts of the substrate edges throughout the surface.
- The main challenge associated with the seed-layer and the uniformity of the electrical current distribution over the surface area is called "terminal effect". The terminal effect describes a potential drop across a surface area, which can occur due to a relatively high resistivity of such a seed-layer, which is usually required for the electroplating process of a substrate. Depending on the seed-layer material, its thickness and the distance between the plating area and the electrical contact at the edge of the substrate, a potential drop of several volts is likely to occur. Such potential drop from the substrate edge to the area to be plated results in a highly non-uniform current density distribution leading to an extremely non-uniform plating thickness distribution, primarily characterized by a thicker plating at the substrate edges.
- Additional challenges associated with the current distribution that need to be faced, especially with increasingly smaller structures, may be the equilibration of the current distribution between substrate areas with a very high-density of tiny structures and areas with a low density of rather larger structures to be electroplated.
- In the prior art, several technologies address the mitigation of the macroscopic terminal effect, which addresses the "center-to-edge" potential drop, by adding a thief cathode. However, the thief cathode as used in the prior art has only provided limited success. Therefore, the overall non-uniformity problem is not yet fundamentally solved.
- Hence, there may be a need to provide an improved distribution system for a process fluid and an electric current for chemical and/or electrolytic surface treatment of a substrate, which allows increasing the plating uniformity, particularly for applications in high performance devices, particularly with very small, device structures.
- This problem is solved by the subject-matters of the independent claims, wherein further embodiments are incorporated in the dependent claims. It should be noted that the aspects of the disclosure described in the following apply also to a distribution system for a process fluid and an electric current for a chemical and/or electrolytic surface treatment of a substrate, a distribution module for a process fluid and an electric current for a chemical and/or electrolytic surface treatment of a substrate, and a distribution method for a process fluid and an electric current for a chemical and/or electrolytic surface treatment of a substrate.
- According to the present disclosure, a distribution system for a process fluid and an electric current for a chemical and/or electrolytic surface treatment of a substrate is presented. The distribution system comprises a distribution body, a primary cathode, and a secondary cathode. The distribution body comprises several openings for the process fluid and the electric current, wherein the several openings are arranged at a front face of the distribution body, the front face being directed to the primary cathode. The primary cathode and the secondary cathode are arranged to attract the electric current and to guide the electric current to the substrate, preferably to predefined areas of the substrate to be treated. The secondary cathode comprises several cathode pixels, wherein the several cathode pixels are distributed in an array to be aligned with at least an area of the substrate to be treated. Additionally, the several cathode pixels are individually controllable for adjusting a distribution of the electric current at the substrate.
- The secondary cathode may be spaced apart from the primary cathode and may comprise several cathode pixels being distributed in an array to be aligned with an area of the substrate to be treated. This arrangement may enable a localized control and tuning of the current density distribution, particularly with a tuning resolution down to the sub-µm range. The individually controllable cathode pixels may enable a very localized adjustment and tuning of the current density distribution all over a surface of the substrate to be treated, not only at the edge areas of the substrate. Therefore, the distribution system may allow effecting the edge-to-center/center-to-edge as well as the current density distribution within the substrate to be plated. Furthermore, the distribution system according to the disclosure may enable the plating of non-rotating substrates as well as of rotating substrates.
- The secondary cathode may be made from an electrically conducting material, preferably inert to the chemical environment of the electrolyte, e.g. inert metals, such as palladium, palladium-coated materials, platinum and/or platinized materials like tantalum, tungsten, and/or titanium, or may be made from the same material as a plating material to be used for the surface treatment of the substrate. For example, a Cu-comprising secondary cathode may be used when Cu is plated. Further, the secondary cathode may have a circular, square, rectangular, C-shaped, wire-shaped and/or partially electrically insulated shape. The secondary cathode may work as a thief cathode mitigating the terminal effect by increasing the plating-uniformity. Additionally, or alternatively, the secondary cathode may be formed by several pixels, wherein the pixels may be separate from each other, wherein each pixel may be individually controllable. Therefore, the secondary cathode may be referred as pixelated cathode. Further, the secondary cathode may be directed towards the primary cathode.
- In an embodiment, the distribution system may further comprise at least a power source configured to apply individual voltage potentials to the cathode pixels to individually control the cathode pixels. In an embodiment, at least some of the cathode pixels may be each connected to a single power source.
- The cathode pixels may be each connected to the at least one power source by electrical connecting lines transmitting a potential from the at least one power source to the cathode pixels. Additionally or alternatively, the cathode pixels their selves can be at least partially formed as a wire. At least some of the cathode pixels may be together connected to a single power source. To sum it up, the cathode pixels may be each connected to the same power source, or the cathode pixels may be each connected to individual power sources, resulting in that the number of power sources corresponds to the number of cathode pixels. Alternatively, the power source may comprise several power outlets, each pixel being connected to an individual power outlet of the one power source. Additionally, or alternatively, the cathode pixels may be divided into several groups of pixels, wherein the pixels of each group may be connected to the same power source, but each group of pixels is connected to a separate power source.
- In an embodiment, at least some cathode pixels being controlled by a single power source may have individual potentials. In this case, the cathode pixels may be configured to display a variety of different pixel potentials by providing variable resistances between the power source and the individual cathode pixel.
- In an embodiment, the distribution system may further comprise at least a processing unit configured to control the at least one power source to apply the individual voltage potentials to the cathode pixels for individual durations.
- In principle, each cathode pixel may be fabricated in a way to permit individual controllability of the applied potential and/or the duration of the applied potential. At least some of the cathode pixels may be grouped to arrays and each array is connected to one of several power sources for being applied with the same potential and same duration.
- The power source(s) may have a cathodic potential or an anodic potential. In particular, the anodic potential may be used for achieving an improved pixelated reverse pulse plating or for cleaning the pixels from potentially deposited metal layers or particles. Additionally, or alternatively, the cathode pixels may be arranged at a rear face of the distribution body, wherein the rear face is opposite to the front face of the distribution body.
- In an embodiment, the control for adjusting the distribution of the electric current at the substrate may be a physical arrangement of cathode pixels. Thus, the pixels may be arranged according to a predefined pattern, e.g. a photolithographic mask, which is used to create the pattern distribution on the substrate to be treated. Additionally, or alternatively, the cathode pixels can be electrically tuned according to the substrate pattern densities and substrate irregularities.
- In an embodiment, the cathode pixels may be arranged at the distribution body. The cathode pixels may be arranged in or on a surface of the distribution body. In an embodiment, the cathode pixels may be arranged at the front face of the distribution body directed to the first cathode. For example, the cathode pixels may be mainly arranged around the openings at the front face. Thereby, the cathode pixels may be integrated into the distribution body surface through common processes used in the semiconductor and/or flat panel industry, like one or more photolithographic process sequences. Alternatively, at least some of the cathode pixels and electrical connecting lines may be manufactured on the surface via printing. The electrical connecting lines may be fabricated in a similar way as the (individual) cathode pixels.
- The openings at the front face may be configured at least partially as jet holes directing the process fluid and/or the electric current towards the substrate to be treated and/or at least partially as connecting passages draining off the process fluid from the substrate to be treated. In an embodiment, the front face and the rear face of the distribution body may be connected by the connecting passages through the distribution body, wherein the cathode pixels are arranged at least partially around the connecting passages. The connecting passages may be configured to permit a backflow and with this a circulation of the process fluid through the distribution body. Arranging the cathode pixels around the connecting passaged can be an easy way to integrate the cathode pixels into the distribution body.
- In an embodiment, the secondary cathode may be separate to the distribution body and positioned adjacent to the distribution body in a direction towards the substrate.
- Thus, the secondary cathode may be implemented as a stand-alone system. As the simplest example of such a stand-alone system, the secondary cathode may correspond to a mostly electrically isolated wire with an electrically non-isolated tip. In a more typical example, multiple cathode pixels may be physically connected together in a predefined specific geometric constellation, preferably defined by and aligned with the requirements of an "open area density" distribution on the substrate. This stand-alone system can be placed between the distribution body and the primary cathode to enable the tuning of the current density distribution all over the substrate to be treated, and in particular to enable the tuning of the current density distribution for individual areas and/or individual device structures of the substrate to be treated.
- The "open area density" may define the density degree of open areas and/or the size of those open areas in a predefined area of the substrate. The open areas may be configured to be the areas of the substrate to be treated or plated. When a constant potential may be applied on the whole substrate, the current distribution, particularly the distribution of electrons, may depend on the density degree and/or the size of the open areas, wherein the distribution of the electrons may affect the current density and thereby the amount of the plating material being deposited in this area. Different current densities in different areas of the substrate may lead to different amount of deposited plating material in the different areas resulting in a non-uniform distribution of the plating material. Thus, providing the pixels with different potentials may allow controlling the current density distribution to achieve a uniform current density distribution and thus, a uniform distribution of the plating material.
- In an electrical sense, the cathode pixels may not be electrically connected with each other, but individually controllable through being individually electrically connected to individual power supplies, as described above, or to one power supply having adequate multiple power outlets. In specific cases, the cathode pixels may also be grouped as to enable electrical power control on various groups of cathode pixels.
- Furthermore, the secondary cathode may preferably be placed in a first predefined distance to the distribution body and in a second predefined distance to the substrate. The first predefined distance may be equal to the second predefined distance. Alternatively, the first predefined distance may be different to the second predefined distance. The predefined first and second distances may be dependent on the plating material and/or the size of the substrate and/or the process fluid and/or the open area density distribution of the device structures on the substrate to be plated. Further, the first and the second predefined distances may be constant or correspond to a predefined range, within the distances may be adaptable during the treatment of the substrate. Adapting the distances of the secondary cathode, particularly the second distance to the substrate may influence the current density distribution. The smaller the second distance, the more accurately controllable the influence on the current density distribution. The secondary cathode may be aligned substantially parallel to the distribution body and/or may be configured to be aligned with the substrate in-line, flush and not outside the substrate.
- Preferably, the secondary cathode may be configured to be aligned to a main area of substrate, e.g. a center of substrate, covering at least part of the substrate. The surface of the secondary cathode may preferably be substantially parallel or angled to the surface of the substrate to be treated, but not perpendicular.
- The secondary cathode may have approximately the same dimensions as the substrate, or the dimensions of the secondary cathode can be dynamically adjusted to the substrate dimensions through turning on and off predefined pixels.
- In a further embodiment, the secondary cathode may be arranged on an inert plate shield. The inert plate shield may be composed of a chemically inert material. A chemically inert material may be defined as not chemically reactive in the electrolyte. Therefore, the inert plate shield may not interfere with the chemical process for plating the surface of a substrate. When the secondary cathode is arranged on the inert plate shield, the cathode pixels can also be integrated with the plate shield placed in-between the primary cathode and the distribution body and can be rotated in cooperation and/or coordinated with a substrate rotation. Thus, the plate shield may work as a carrier plate for the cathode pixels allowing a more flexible arrangement of the cathode pixels.
- In an embodiment, the inert plate shield may be attachable to the substrate holder and movable with the substrate. In particular, this can enable the secondary cathode to be movable with the substrate, e.g. during loading and unloading into and from a plating chamber and/or during agitation movements, such as agitation movements with high as well as with low frequencies, introduced to the substrate. In cases where the pixels are arranged on or within plate shields, specific arrangements have to be made for warranting electrical connections to the individual pixels.
- According to the present disclosure, also a distribution module for a process fluid and an electric current for a chemical and/or electrolytic surface treatment of a substrate is presented. The distribution module for a process fluid and an electric current for a chemical and/or electrolytic surface treatment of a substrate comprises a distribution body as described above, and a substrate holder. The substrate holder is configured to hold at least one substrate relative to the distribution body.
- This arrangement may enable a localized control and tuning of the current density distribution, particularly with a tuning resolution down to the sub-µm range. The individually controllable cathode pixels may enable a very localized adjustment and tuning of the current density distribution all over a surface of the substrate to be treated, not only at the edge areas of the substrate. Furthermore, this arrangement may enable the plating of non-rotating substrates as well as of rotating substrates.
- According to the present disclosure, also a distribution method for a process fluid and an electric current for a chemical and/or electrolytic surface treatment of a substrate is presented. The distribution method comprises the following steps, not necessarily in this order:
- providing a distribution body comprising several openings for the process fluid and the electric current, wherein the several openings are arranged at a front face of the distribution body,
- arranging a primary cathode and a secondary cathode to attract and guide the electric current to the substrate to be treated, wherein the primary cathode is directed to the front face of the distribution body and wherein the secondary cathode comprises several cathode pixels distributed in an array aligned with at least an area of the substrate to be treated, and
- individually controlling the cathode pixels for adjusting a distribution of the electric current at the substrate.
- This distribution method may enable a localized control and tuning of the current density distribution, particularly with a tuning resolution down to the sub-µm range. The individually controllable cathode pixels may enable a very localized adjustment and tuning of the current density distribution all over a surface of the substrate to be treated, not only at the edge areas of the substrate. Thus, the distribution method according to the disclosure may enable the plating of non-rotating substrates as well as of rotating substrates.
- Exemplary embodiments of the disclosure will be described in the following with reference to the accompanying drawings:
- Figure 1
- shows schematically and exemplarily a cross-sectional view of a distribution system and a distribution module for a process fluid and an electric current for a chemical and/or electrolytic surface treatment of a substrate, and a substrate according to an exemplary embodiment.
- Figure 2
- shows schematically and exemplarily a cross-sectional view of a distribution system and a distribution module for a process fluid and an electric current for a chemical and/or electrolytic surface treatment of a substrate, and a substrate according to another exemplary embodiment.
- Figure 3
- shows schematically and exemplarily a cross-sectional view of a distribution system and a distribution module in a processing bath.
- Figure 4
- shows schematically and exemplarily a flow diagram of a distribution method according to an exemplary embodiment.
-
Figure 1 shows schematically and exemplarily an embodiment of adistribution system 1 comprising adistribution body 2, a primary cathode 30 (seeFigure 3 ) and asecondary cathode 3. Thedistribution body 2 contains several openings 4, some of which being formed asjet holes 5 and other being formed as connectingpassages 6. The jet holes 5 are smaller than the connectingpassages 6 and are configured to directflow 7 of aprocess fluid 18 towards asurface 8 of asubstrate 9 to be treated. - The connecting
passages 6 are configured to direct a process fluid 18 (seeFigure 3 ) between afront face 10 of thedistribution body 2 and thesubstrate 9 to flow towards arear face 11 of thedistribution body 2, illustrated byarrows 12. Thus, thefront face 10 faces thesurface 8 of thesubstrate 9 to be treated. Theprimary cathode 30 may be coupled to thesubstrate 9 as shown inFigure 3 , such that thesubstrate 9 serves as theprimary cathode 30 during a treatment process.Figure 1 shows a vertical mount of thedistribution system 1 and thesubstrate 9, while a horizontal arrangement would be also possible. - The
secondary cathode 3 comprisesseveral cathode pixels 13, thecathode pixels 13 being arranged on thefront face 10 of thedistribution body 2 between adjacent openings 4. Thecathode pixels 13 are integrated into thefront face 10. The integration of thecathode pixels 13 into thefront face 10 of thedistribution body 2 is made by common processes used in the semiconductor and/or flat-panel industry, e.g. photolithography, or printing. - The illustration of the
cathode pixels 13 is simplified for visibility reasons and electrical contacts of thecathode pixels 13 as well as electrical connecting lines connecting thecathode pixels 13 to a power source (not illustrated) are not illustrated. - Although, the
cathode pixels 13 are only illustrated as arranged at thefront face 10 of thedistribution body 2, thecathode pixels 13 can be arranged additionally or alternatively on therear face 11 of thedistribution body 2. - Each
cathode pixel 13 is configured to permit an individual controllability of an electric potential applied by the power source. During the plating process, a cathodic potential is usually applied, but also the application of an anodic potential is possible, preferably for achieving an improved pixelated reverse pulse plating or for cleaning thecathode pixels 13 from potentially deposited metal layers or particles. - The
distribution system 1 in combination with a substrate holder 17 (seeFigure 3 ) holding thesubstrate 9 is referred as a distribution module 14. -
Figure 2 shows schematically and exemplarily another embodiment of thedistribution system 1 comprising thedistribution body 2, theprimary cathode 30 being coupled to thesubstrate 9 and/or thesubstrate holder 17, and thesecondary cathode 3. Thedistribution body 2 corresponds to thedistribution body 2 inFigure 1 . Thesecondary cathode 3 is separate from thedistribution body 2 and arranged on a plate 15. The plate 15 is positioned between thedistribution body 2 and thesubstrate 9 in a predefined distance D to thedistribution body 2 and in a predefined distance d to thesubstrate 9. The plate 15 is preferably formed as an inert shield plate 16. - The
cathode pixels 13 are arranged on the plate 15 in a predefined geometric constellation, which is defined by and aligned with the requirements of an "open area density" distribution on the substrate. The plate 15 comprising thecathode pixels 13 in a predefined constellation is placed between thedistribution body 2 and thesubstrate 9 to enable the tuning of the current density distribution over the wholestructured substrate 9. - The illustration of the
cathode pixels 13 is also simplified for visibility reasons and electrical contacts of thecathode pixels 13 as well as electrical connecting lines connecting thecathode pixels 13 to a power source (not illustrated) are not illustrated. -
Figure 3 schematically and exemplarily shows a cross-sectional view of thedistribution system 1 and the distribution module 14 in aprocessing bath 50. Thedistribution body 2 and thesubstrate 9 being held by thesubstrate holder 17 are immersed in theprocess fluid 18 contained in theprocessing bath 50. Thesubstrate holder 17 is coupled to theprimary cathode 30 and theprimary cathode 30 is coupled with an additional electrode being ananode 40, wherein theanode 40 is also immersed in theprocessing fluid 18 and arranged facing therear face 11 of thedistribution body 2. Theprocessing fluid 18 is an electrolyte. -
Figure 4 schematically and exemplarily shows a flow diagram of an embodiment of adistribution method 100 for a process fluid and an electric current for a chemical and/or electrolytic surface treatment of thesubstrate 9. Thedistribution method 100 comprises a step S1 of providing thedistribution body 2 comprising the several openings 4 for the process fluid and the electric current, wherein the several openings 4 are arranged at thefront face 10 of thedistribution body 2. In a step S2, the primary cathode and thesecondary cathode 3 are arranged to attract and guide the electric current to thesubstrate 9 to be treated, wherein the primary cathode is directed to thefront face 10 of thedistribution body 2 and wherein thesecondary cathode 3 comprises theseveral cathode pixels 13 distributed in an array aligned with at least an area of thesubstrate 9 to be treated. In a step S3, thecathode pixels 13 are individually controlled for adjusting a distribution of the electric current at thesubstrate 9. - It has to be noted that embodiments of the invention are described with reference to different subject matters. In particular, some embodiments are described with reference to method type claims whereas other embodiments are described with reference to the device type claims. However, a person skilled in the art will gather from the above and the following description that, unless otherwise notified, in addition to any combination of features belonging to one type of subject matter also any combination between features relating to different subject matters is considered to be disclosed with this application. However, all features can be combined providing synergetic effects that are more than the simple summation of the features.
- While the invention has been illustrated and described in detail in the drawings and foregoing description, such illustration and description are to be considered illustrative or exemplary and not restrictive. The invention is not limited to the disclosed embodiments. Other variations to the disclosed embodiments can be understood and effected by those skilled in the art in practicing a claimed invention, from a study of the drawings, the disclosure, and the dependent claims.
- In the claims, the word "comprising" does not exclude other elements or steps, and the indefinite article "a" or "an" does not exclude a plurality. A single unit may fulfil the functions of several items re-cited in the claims. The mere fact that certain measures are re-cited in mutually different dependent claims does not indicate that a combination of these measures cannot be used to advantage. Any reference signs in the claims should not be construed as limiting the scope.
Claims (15)
- A distribution system (1) for a process fluid (18) and an electric current for a chemical and/or electrolytic surface treatment of a substrate (9), comprising:- a distribution body (2),- a primary cathode (30), and- a secondary cathode (3),wherein the distribution body (2) comprises several openings (4) for the process fluid (18) and the electric current, wherein the several openings (4) are arranged at a front face (10) of the distribution body (2), wherein the front face (10) is directed to the primary cathode (30),
wherein the primary cathode (30) and the secondary cathode (3) are arranged to attract the electric current and to guide the electric current to the substrate (9) to be treated, wherein the secondary cathode (3) comprises several cathode pixels (13), wherein the several cathode pixels (13) are distributed in an array to be aligned with at least an area of the substrate (9) to be treated, and
wherein the several cathode pixels (13) are individually controllable for adjusting a distribution of the electric current at the substrate (9). - The distribution system (1) according to claim 1, further comprising at least a power source configured to apply individual voltage potentials to the cathode pixels (13) to individually control the cathode pixels (13).
- The distribution system (1) according to claim 1 or 2, wherein at least some of the cathode pixels (13) are each connected to a single power source.
- The distribution system (1) according to claim 3, wherein at least some cathode pixels (13) being controlled by the single power source.
- The distribution system (1) according to any of the claims 2 to 4, further comprising at least a processing unit configured to control the at least one power source to apply the individual voltage potentials to the cathode pixels (13) for individual durations.
- The distribution system (1) according to any of the preceding claims, wherein the control for adjusting the distribution of the electric current at the substrate (9) is a physical arrangement of cathode pixels (13).
- The distribution system (1) according to any of the preceding claims, wherein the cathode pixels (13) are arranged at the distribution body (2).
- The distribution system (1) according to any of the claims 1 to 7, wherein the cathode pixels (13) are arranged at the front face (10) of the distribution body (1) directed to the primary cathode (30).
- The distribution system (1) according to any of the claims 1 to 7, wherein the cathode pixels (13) are arranged at a rear face (11) of the distribution body (1), wherein the rear face (11) is opposite to the front face (10) of the distribution body (1).
- The distribution system (1) according to claim 9, wherein the front face (10) and the rear face (11) of the distribution body (1) are connected by connecting passages (6) through the distribution body (1), and wherein the cathode pixels (13) are arranged at least partially around the connecting passages (6).
- The distribution system (1) according to any of claims 1 to 6, wherein the secondary cathode (3) is separate to the distribution body (1) and positioned adjacent to the distribution body (1) in a direction towards the substrate (9).
- The distribution system (1) according to any of claims 1 to 6 and 11, wherein the secondary cathode (3) is arranged on an inert plate shield (16).
- The distribution system (1) according to the preceding claim, wherein the inert plate shield (16) is attachable to a substrate holder (17) and movable with the substrate (9).
- A distribution module (14) for a process fluid (18) and an electric current for a chemical and/or electrolytic surface treatment of a substrate (9), comprising:- a distribution system (1) according to one of the preceding claims, and- a substrate holder (17),wherein the substrate holder (17) is configured to hold at least one substrate (9) relative to the distribution body (2).
- A distribution method (100) for a process fluid (18) and an electric current for a chemical and/or electrolytic surface treatment of a substrate (9), comprising:- providing a distribution body (2) comprising several openings (4) for the process fluid (18) and the electric current, wherein the several openings (4) are arranged at a front face (10) of the distribution body (2),- arranging a primary cathode (30) and a secondary cathode (3) to attract and guide the electric current to the substrate (9) to be treated, wherein the primary cathode (30) is directed to the front face (10) of the distribution body (2), and wherein the secondary cathode (3) comprises several cathode pixels (13) distributed in an array aligned with at least an area of the substrate (9) to be treated, and- individually controlling the cathode pixels (13) for adjusting a distribution of the electric current at the substrate (9).
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP20210367.7A EP4006210B1 (en) | 2020-11-27 | 2020-11-27 | Distribution system for a process fluid and an electric current for electrolytic surface treatment of a substrate |
CN202180078257.7A CN116472367A (en) | 2020-11-27 | 2021-11-11 | Distribution system for process fluids and currents for electrolytic surface treatment of substrates |
KR1020237021387A KR20230113352A (en) | 2020-11-27 | 2021-11-11 | Distribution system for process fluid and current for electrolytic surface treatment of substrates |
PCT/EP2021/081410 WO2022112015A1 (en) | 2020-11-27 | 2021-11-11 | Distribution system for a process fluid and an electric current for a chemical and/or electrolytic surface treatment of a substrate |
US18/038,495 US20240011180A1 (en) | 2020-11-27 | 2021-11-11 | Distribution system for a process fluid and an electric current for a chemical and/or electrolytic surface treatment of a substrate |
TW110143936A TW202235691A (en) | 2020-11-27 | 2021-11-25 | Distribution system for a process fluid and an electric current for an electrolytic surface treatment of a substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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EP20210367.7A EP4006210B1 (en) | 2020-11-27 | 2020-11-27 | Distribution system for a process fluid and an electric current for electrolytic surface treatment of a substrate |
Publications (2)
Publication Number | Publication Date |
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EP4006210A1 true EP4006210A1 (en) | 2022-06-01 |
EP4006210B1 EP4006210B1 (en) | 2023-07-12 |
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EP20210367.7A Active EP4006210B1 (en) | 2020-11-27 | 2020-11-27 | Distribution system for a process fluid and an electric current for electrolytic surface treatment of a substrate |
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US (1) | US20240011180A1 (en) |
EP (1) | EP4006210B1 (en) |
KR (1) | KR20230113352A (en) |
CN (1) | CN116472367A (en) |
TW (1) | TW202235691A (en) |
WO (1) | WO2022112015A1 (en) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH10140393A (en) * | 1996-11-08 | 1998-05-26 | Hitachi Cable Ltd | Electroplating device |
US6001235A (en) * | 1997-06-23 | 1999-12-14 | International Business Machines Corporation | Rotary plater with radially distributed plating solution |
US20030168340A1 (en) * | 2000-10-30 | 2003-09-11 | Suryanarayana Kaja | Process and apparatus for electroplating microscopic features uniformly across a large substrate |
US20130186852A1 (en) * | 2010-07-29 | 2013-07-25 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Device and method for producing targeted flow and current density patterns in a chemical and/or electrolytic surface treatment |
FR3048704A1 (en) * | 2016-03-09 | 2017-09-15 | Snecma | IMPROVED GALVANOPLASTY METAL DEPOSITION DEVICE AND METHOD FOR THE TREATMENT OF AIRCRAFT TURBOMACHINE PARTS |
-
2020
- 2020-11-27 EP EP20210367.7A patent/EP4006210B1/en active Active
-
2021
- 2021-11-11 CN CN202180078257.7A patent/CN116472367A/en active Pending
- 2021-11-11 KR KR1020237021387A patent/KR20230113352A/en unknown
- 2021-11-11 US US18/038,495 patent/US20240011180A1/en active Pending
- 2021-11-11 WO PCT/EP2021/081410 patent/WO2022112015A1/en active Application Filing
- 2021-11-25 TW TW110143936A patent/TW202235691A/en unknown
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10140393A (en) * | 1996-11-08 | 1998-05-26 | Hitachi Cable Ltd | Electroplating device |
US6001235A (en) * | 1997-06-23 | 1999-12-14 | International Business Machines Corporation | Rotary plater with radially distributed plating solution |
US20030168340A1 (en) * | 2000-10-30 | 2003-09-11 | Suryanarayana Kaja | Process and apparatus for electroplating microscopic features uniformly across a large substrate |
US20130186852A1 (en) * | 2010-07-29 | 2013-07-25 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Device and method for producing targeted flow and current density patterns in a chemical and/or electrolytic surface treatment |
FR3048704A1 (en) * | 2016-03-09 | 2017-09-15 | Snecma | IMPROVED GALVANOPLASTY METAL DEPOSITION DEVICE AND METHOD FOR THE TREATMENT OF AIRCRAFT TURBOMACHINE PARTS |
Also Published As
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US20240011180A1 (en) | 2024-01-11 |
EP4006210B1 (en) | 2023-07-12 |
TW202235691A (en) | 2022-09-16 |
KR20230113352A (en) | 2023-07-28 |
CN116472367A (en) | 2023-07-21 |
WO2022112015A1 (en) | 2022-06-02 |
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