CN102477576A - Electroplating device and electrode plate structure in electroplating bath thereof - Google Patents
Electroplating device and electrode plate structure in electroplating bath thereof Download PDFInfo
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- CN102477576A CN102477576A CN2010105756055A CN201010575605A CN102477576A CN 102477576 A CN102477576 A CN 102477576A CN 2010105756055 A CN2010105756055 A CN 2010105756055A CN 201010575605 A CN201010575605 A CN 201010575605A CN 102477576 A CN102477576 A CN 102477576A
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Abstract
The invention provides an electrode plate structure in an electroplating bath and a roll-to-roll electroplating device capable of controlling homogeneity of current. The electrode plate structure in the electroplating bath comprises at least an anode and at least one frame-shaped shield, wherein the at least one anode comprises a first region and a second region; the first region is located at the periphery of the at least one anode; the second region is located in the center within the periphery of the at least one anode relative to the first region; the speed of electroplating a soft base plate in the first region is higher than that in the second region; and the at least one frame-shaped shield is arranged corresponding to the first region of the at least one anode so that the first region is shielded by the frame-shaped shield relative to the soft base plate.
Description
Technical field
The invention relates to a kind of electroplanting device, and particularly relevant for the electrode plate structure in a kind of plating tank.
Background technology
(Printed Circuit Board PCB) is the printing distributing board that on substrate, forms conductor according to the circuit layout of the mutual distribution of electronic package to printed substrate.Generally speaking, printed substrate is on the surface of insulcrete, and corresponding Wiring pattern forms necessary circuit wiring, thus, just can be on printed substrate various electronic packages such as collocating integrate circuit, electrical condenser, resistance thick and fast.
In order on insulcrete, to form wiring, need carry out metallide for several times repeatedly.At this moment, on the substrate electroplating thickness evenly whether, represented the quality of quality of printed circuits, wherein the uniform quality of printed circuits of electroplating thickness is preferable.
Yet, can produce a kind of phenomenon on the anode in plating tank, just the periphery branch at positive plate forms high Current Zone; And the part of the low current outside peripheral part can form the low current district; Thus, because the difference of rate of deposition will cause the electroplating thickness on the substrate inhomogeneous.
Therefore, in the configuration of electroplanting device, still have the space of further improvement.
Summary of the invention
One purpose of content of the present invention is electrode plate structure and the volume to volume electroplanting device of controllable current homogeneity in a kind of plating tank is provided; Uneven so as to improving on the positive plate in the plating tank distribution of current, thus cause electroplating on the flexible base plate problem in uneven thickness based on the difference of rate of deposition.
For reaching above-mentioned purpose, a technical scheme of content of the present invention is about the electrode plate structure in a kind of plating tank, and it comprises at least one anode and the shielding of at least one shaped as frame.At least one anode comprises first district and second district.First fauna is positioned at least one anodic peripheral part.Second district be positioned at respect to first district at least one anodic peripheral part with middle body.First district carries out galvanized speed to flexible base plate and is higher than second district flexible base plate is carried out galvanized speed.At least one shaped as frame shielding and the corresponding configuration at least one anodic first district make the district that wins shield by shaped as frame with respect to flexible base plate and are covered.
According to one embodiment of the invention, the width-adjustable of shaped as frame shielding is whole.
According to another embodiment of the present invention, at least one anodic second district is in order to flexible base plate is electroplated.
According to yet another embodiment of the invention, when flexible base plate was electroplated, electroplated flexible base plate at least one anodic second district, and does not electroplate flexible base plate at least one anodic first district.
According to further embodiment of this invention, the shaped as frame shielding comprises plastics.
For reaching above-mentioned purpose, another technical scheme of content of the present invention is the volume to volume electroplanting device about a kind of controllable current homogeneity, and it comprises first drum apparatus, second tin roller device and plating tank.Form a transport path between first drum apparatus and the second tin roller device.Plating tank is disposed between first drum apparatus and the second tin roller device and is positioned on the transport path.
In addition, plating tank comprises at least one anode and the shielding of at least one shaped as frame.At least one anode comprises first district and second district; Wherein first district is positioned at least one anodic peripheral part; Second district with respect to first district be positioned at least one anodic peripheral part with middle body, first district carries out galvanized speed to flexible base plate and is higher than second district flexible base plate is carried out galvanized speed.At least one shaped as frame shielding makes the district that wins covered by shaped as frame shields with the corresponding configuration at least one anodic first district.
According to one embodiment of the invention, the width-adjustable of shaped as frame shielding is whole, so that the thickness of flexible base plate is identical.
According to another embodiment of the present invention, at least one anodic second district is in order to flexible base plate is electroplated.
According to yet another embodiment of the invention, electroplanting device is vertical type electroplanting device or horizontal electroplanting device.
According to further embodiment of this invention, at least one anode is soluble anode or insoluble anode.
The embodiment more in addition according to the present invention, at least one anode is titanium plate or titanium net.
The another embodiment in addition according to the present invention, the shaped as frame shielding comprises plastics.
Therefore; According to technology contents of the present invention; The embodiment of the invention is through providing the electrode plate structure in a kind of plating tank, and is uneven so as to improving on the positive plate in the plating tank distribution of current, thereby causes electroplating on the flexible base plate problem in uneven thickness based on the difference of rate of deposition.
Description of drawings
For letting above and other objects of the present invention, characteristic, advantage and the embodiment can be more obviously understandable, the explanation of appended accompanying drawing be following:
Fig. 1 is the schematic appearance that illustrates according to the volume to volume electroplanting device of a kind of controllable current homogeneity of one embodiment of the invention;
Fig. 2 is the electrode plate structure synoptic diagram that illustrates according in a kind of plating tank of another embodiment of the present invention.
[primary clustering nomenclature]
100: the volume to volume electroplanting device of controllable current homogeneity
110: the first drum apparatus
120: the second tin roller device
130: plating tank
132: anode
134: the shaped as frame shielding
200: flexible base plate
Embodiment
Hereinafter is to lift embodiment to cooperate appended accompanying drawing to elaborate; But the embodiment that is provided not is the scope that contains in order to restriction the present invention; And the description of structure running is non-in order to limit the order of its execution; Any structure that is reconfigured by assembly, the device with impartial effect that produces is all the scope that the present invention is contained.Wherein accompanying drawing is not mapped according to life size only for the purpose of description.
Fig. 1 is the schematic appearance that illustrates a kind of volume to volume electroplanting device 100 of controllable current homogeneity according to one embodiment of the invention.The volume to volume electroplanting device 100 of controllable current homogeneity comprises first drum apparatus 110, second tin roller device 120 and plating tank 130.Wherein, the volume to volume electroplanting device 100 visual actual demands of controllable current homogeneity and be vertical type electroplanting device or horizontal electroplanting device.In the present embodiment, the volume to volume electroplanting device 100 of controllable current homogeneity is the vertical type electroplanting device, and right the present invention is not as limit.
In operation, the volume to volume electroplanting device 100 of controllable current homogeneity mainly is used for carrying out the electroplating technology of flexible base plate 200.Volume to volume electroplanting device 100 through the controllable current homogeneity plates one deck Copper Foil at flexible substrate; Just can form flexible copper foil substrate (Flexible Copper Clad Laminate; FCCL); Yet the present invention is as limit, and the volume to volume electroplanting device 100 of controllable current homogeneity also can be used in the application of various base materials and different plated materials.In addition, flexible base plate also can be flexible printed wiring board, and the volume to volume electroplanting device 100 of controllable current homogeneity can form specific electrolytic coating or plated pattern (like metallic circuit etc.) on printed substrate.
In the present embodiment, first drum apparatus 110 is the material feeding end of flexible base plate 200, and second tin roller device 120 is the rewinding end of flexible base plate 200, forms the transport path of flexible base plate 200 between first drum apparatus 110 and the second tin roller device 120.In operation, the two ends of flexible base plate 200 are drawn by two drum apparatus respectively, and are moved to second tin roller device 120 directions by first drum apparatus 110, but the present invention is not exceeded with this specific direction.
As shown in Figure 1; Plating tank 130 is disposed between first drum apparatus 110 and the second tin roller device 120 and is positioned on the transport path; Flexible base plate 200 is the process transport path by the traction of two drum apparatus, thereby electroplates through 130 pairs of flexible base plates 200 of plating tank.Below will the electrode plate structure in the plating tank be elaborated.
Please with reference to Fig. 2, Fig. 2 illustrates the electrode plate structure synoptic diagram in a kind of plating tank according to one embodiment of the invention.Electrode plate structure comprises at least one anode 132 and at least one shaped as frame shielding 134.What this needed explanation earlier be, below only introduce electrode plate structure with one group of anode 132 and shaped as frame shielding 134, right the present invention is not as limit.
On anode 132,, can anode 132 be divided into first district and second district based on the difference of distribution of current density.By can knowing that first district is the peripheral part that is positioned at anode 132 among the figure, and second district be the peripheral part that is positioned at anode 132 with respect to first district with middle body.
The situation of shaped as frame shielding 134 is not disposed in explanation at first, earlier in electrode plate structure.Because the current density that first district had of anode 132 is height than its second district; In view of the above; When 132 pairs of flexible base plates 200 of the anode in utilizing plating tank 130 were electroplated, first district of anode 132 was higher than the rate of deposition of its second district to flexible base plate 200 to the rate of deposition of flexible base plate 200.Thus, can cause the electroplating thickness of flexible base plate 200 a peripheral part is big than its middle body, that is electroplating thickness is inhomogeneous, and influences the quality of printed substrate.
Therefore, the embodiment of the invention provides shaped as frame as shown in Figure 2 shielding 134, and itself and the corresponding configuration in first district of anode 132 like this, just can shield 134 first districts with anode 132 (just high Current Zone) through shaped as frame and cover up.In other words; When utilization has the electrode plate structure of shaped as frame shielding 134; Rate of deposition is covered in first district faster, mat makes electrode plate structure utilize second district of its anode 132 to come flexible base plate 200 is electroplated, and first district of anode 132 then can not electroplate flexible base plate 200; Thus, can improve the uneven problem of electroplating thickness.
What need pay special attention to is that the width of shaped as frame shielding 134 can be adjusted.In an optional embodiment; Shaped as frame shielding 134 can be a Collapsible structure; Thus; When the finished product thickness after the electrode plate structure of the embodiment of the invention is electroplated flexible base plate shown in Figure 1 200 is uneven, can adjust shaped as frame shielding 134 to change the width of shaped as frame shielding 134 according to actual demand.For example, when finding the uneven thickness of finished product (flexible base plate 200 after electroplating), can be through transferring wide shaped as frame shielding 134 corresponding to the thicker position of finished product, can let the thicker zone of finished product to cover script, thereby make the thickness of finished product identical.
In making, anode 132 visual actual demands and adopt soluble anode or insoluble anode.In one embodiment; Anode 132 can be titanium plate or titanium net, and 134 of shaped as frame shieldings can comprise plastics, and right the present invention is not as limit; Anyly be familiar with this art; Do not breaking away from the spirit and scope of the present invention, can adopt anyly must be used as anode 132, and shaped as frame shielding 134 can be adopted and anyly must carry out galvanized material to flexible base plate 200 in order to first district of blocking anode 132 in order to carry out galvanized material or structure.
Can know by the invention described above embodiment, use the present invention and have advantage.The embodiment of the invention is through providing the electrode plate structure in a kind of plating tank, and is uneven so as to improving on the anode in the plating tank distribution of current, thereby causes the difference of rate of deposition and cause electroplating on the flexible base plate problem in uneven thickness.
Though the present invention discloses as above with embodiment; Right its is not in order to limit the present invention; Anyly be familiar with this art; Do not breaking away from the spirit and scope of the present invention, when can doing various changes and retouching, so protection scope of the present invention is as the criterion when looking the scope that appending claims defines.
Claims (13)
1. the electrode plate structure in the plating tank is characterized in that, comprises:
At least one anode; Comprise one first district and one second district; Wherein this first district is positioned at this at least one anodic peripheral part; This second district be positioned at respect to this first district this at least one anodic peripheral part with middle body, this first district carries out galvanized speed to a flexible base plate and is higher than this second district this flexible base plate is carried out galvanized speed; And
At least one shaped as frame shielding with this corresponding configuration in first district of this at least one anodic, makes this first district covered by this shaped as frame shielding with respect to this flexible base plate.
2. electroplanting device according to claim 1 is characterized in that, the width-adjustable of this shaped as frame shielding is whole.
3. electroplanting device according to claim 1 is characterized in that, when this flexible base plate was electroplated, electroplated this flexible base plate in this second district of this at least one anodic, and does not electroplate this flexible base plate in this first district of this at least one anodic.
4. electroplanting device according to claim 1 is characterized in that, this at least one anode is soluble anode or insoluble anode.
5. electroplanting device according to claim 1 is characterized in that, this at least one anode is a titanium plate or a titanium net.
6. electroplanting device according to claim 1 is characterized in that, this shaped as frame shielding comprises plastics.
7. the volume to volume electroplanting device of a controllable current homogeneity is characterized in that, comprises:
One first drum apparatus;
One second tin roller device forms a transport path between this first drum apparatus and this second tin roller device; And
One plating tank is disposed between this first drum apparatus and this second tin roller device and is positioned on this transport path, and wherein this plating tank comprises:
At least one anode; Comprise one first district and one second district; Wherein this first district is positioned at this at least one anodic peripheral part; This second district with respect to this first district be positioned at this at least one anodic peripheral part with middle body, this first district carries out galvanized speed to a flexible base plate and is higher than this second district this flexible base plate is carried out galvanized speed; And
At least one shaped as frame shielding makes this first district covered by this shaped as frame shielding with this corresponding configuration in first district of this at least one anodic.
8. electroplanting device according to claim 7 is characterized in that, the width-adjustable of this shaped as frame shielding is whole, so that the thickness of this flexible base plate after electroplating is identical.
9. electroplanting device according to claim 7 is characterized in that, this second district of this at least one anodic is in order to this substrate is electroplated.
10. electroplanting device according to claim 7 is characterized in that, this electroplanting device is a vertical type electroplanting device or a horizontal electroplanting device.
11. electroplanting device according to claim 7 is characterized in that, this at least one anode is soluble anode or insoluble anode.
12. electroplanting device according to claim 7 is characterized in that, this at least one anode is a titanium plate or a titanium net.
13. electroplanting device according to claim 7 is characterized in that, this shaped as frame shielding comprises plastics.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105756055A CN102477576A (en) | 2010-11-30 | 2010-11-30 | Electroplating device and electrode plate structure in electroplating bath thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2010105756055A CN102477576A (en) | 2010-11-30 | 2010-11-30 | Electroplating device and electrode plate structure in electroplating bath thereof |
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| CN102477576A true CN102477576A (en) | 2012-05-30 |
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| CN2010105756055A Pending CN102477576A (en) | 2010-11-30 | 2010-11-30 | Electroplating device and electrode plate structure in electroplating bath thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103668376A (en) * | 2013-12-25 | 2014-03-26 | 清华大学深圳研究生院 | Roll-to-roll fabrication method of electrode material |
| CN103820839A (en) * | 2014-01-14 | 2014-05-28 | 杭州三耐环保科技有限公司 | Positive and negative plate structure for efficiently restraining electrodeposition acid mist, and realization method of plate structure |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103668376A (en) * | 2013-12-25 | 2014-03-26 | 清华大学深圳研究生院 | Roll-to-roll fabrication method of electrode material |
| CN103820839A (en) * | 2014-01-14 | 2014-05-28 | 杭州三耐环保科技有限公司 | Positive and negative plate structure for efficiently restraining electrodeposition acid mist, and realization method of plate structure |
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Application publication date: 20120530 |