KR20100066988A - Uniform pating method for pcb - Google Patents

Uniform pating method for pcb Download PDF

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Publication number
KR20100066988A
KR20100066988A KR1020080125542A KR20080125542A KR20100066988A KR 20100066988 A KR20100066988 A KR 20100066988A KR 1020080125542 A KR1020080125542 A KR 1020080125542A KR 20080125542 A KR20080125542 A KR 20080125542A KR 20100066988 A KR20100066988 A KR 20100066988A
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KR
South Korea
Prior art keywords
plating
circuit board
electronic circuit
current
cathode
Prior art date
Application number
KR1020080125542A
Other languages
Korean (ko)
Inventor
허영민
Original Assignee
삼성테크윈 주식회사
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Filing date
Publication date
Application filed by 삼성테크윈 주식회사 filed Critical 삼성테크윈 주식회사
Priority to KR1020080125542A priority Critical patent/KR20100066988A/en
Publication of KR20100066988A publication Critical patent/KR20100066988A/en

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/007—Current directing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor
    • C25D17/04—External supporting frames or structures
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating

Abstract

PURPOSE: A uniform plating method for an electronic circuit board is provided to form a uniform plating layer on an electrified layer by restricting biased current and prevent a failure of semiconductor package. CONSTITUTION: A uniform plating method for an electronic circuit board comprises the steps of: immersing an electrode(120,130) and an electronic circuit board(140) in a plating area including electrolyte, and placing a window shield frame(150) between the cathode and anode of an electrolytic cell. The window shield frame is composed of one or more channels and controlled by varying the induction current of an applied magnetic field.

Description

Uniform Plating Method for Electronic Circuit Boards

The present invention relates to a uniform plating method of an electronic circuit board, and more particularly, immersing an electrode and a lead frame in a plating region including an electrolyte, and a plurality of electrodes between a cathode (electrolyte bath cathode) and an anode (electrolyte bath anode) during electroplating. The present invention relates to a plating method capable of increasing the amount of charge on the surface of a plated surface and increasing the plating speed by placing a window shield frame, which is a structure having a channel structure, and applying a current to each frame to generate a magnetic field.

1 to 4 illustrate an electronic circuit board plating method according to the prior art. Hereinafter, a description will be given of the technology and the problems that are specifically applied.

First, as shown in FIG. 1, in the conventional plating apparatus, a negative potential is applied from the cathode 22 to the outer circumferential portion of the semiconductor substrate 3, which causes a potential difference between the central portion and the outer circumferential portion of the semiconductor substrate 3 to occur. Will be created. Therefore, there exists a problem that the current density which flows from the anode 5 toward the semiconductor substrate 3 will become nonuniform on the semiconductor substrate 3. That is, there is a problem that current concentration occurs in the outer peripheral portion of the semiconductor substrate 3. Here, the film thickness of the conductive film formed on the semiconductor substrate 3 is proportional to the current flowing from the anode 5 to the surface of the semiconductor substrate 3, that is, the metal ions attracted to the surface of the semiconductor substrate 3. For this reason, there existed a problem that the film thickness of the conductive film which precipitates became thick and the in-plane uniformity of the film thickness of the conductive film formed on the semiconductor substrate 3 deteriorated.

2 relates to a plating technique in which a magnetic field generator 10 is added to a plating bath 1 to form a uniform film on a large area substrate. That is, by employing the deflection coil 11 in the plating bath 1 to arbitrarily adjust the thickness of the plating film, by adjusting the distribution of ions arriving at the substrate by the signal applied to the deflection coil 11, It has a form similar to a cathode ray with an electron gun. However, in this case, complicated and expensive equipment is required to control the magnetic field by controlling the deflection coil in the wet process where material reaction takes place in the chemical such as electroplating, and a significant decrease in production is expected.

3 illustrates a magnetic field generated by an electromagnet 30 between a wafer W and a copper ion electrolyte 20 in which copper plating is performed, and copper ions exposed to the magnetic field are perpendicular to a magnetic field and a current (copper ion movement direction). The present invention discloses a plating structure capable of accelerating the deposition rate by continuously increasing the concentration of copper ions in the plating liquid required for copper plating under the force. In this case, however, the magnetic field strength of the entire area of the substrate is controlled, but fine control is not possible for each partial region, and the improvement of the plating layer thickness uniformity remains a problem.

4 is a method of electroplating a printed circuit board using a magnetic field having a periodic directionality, and generates a magnetic field through the magnetic field generator 5, which is generated in a direction substantially perpendicular to the current direction and has a periodic directionality of forward and reverse waves. A method of electroplating a printed circuit board is disclosed. However, even in this case, a limit point is exposed to finely controlling the thickness of the plating layer for each partial region.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned conventional problems. In the process of forming a plating layer on an electronic circuit board, the present invention provides a plating method that suppresses an electric current pulling phenomenon and makes the layer thickness uniformly plated on the electrification layer. The main purpose is to improve the quality and improve the defect rate of the semiconductor package.

In addition, it is possible to apply to the plating process in the manufacturing process, such as a printed wiring board, in particular, there is another object to provide a plating method that can be easily applied even in the continuous plating process of the flexible substrate of the substrate in the form of tape.

Plating method according to the present invention for solving the above-mentioned conventional problems, the electrode and the electronic circuit board is immersed in the plating region containing the electrolyte, and during electroplating current and between the Cathode (electrolytic bath cathode) and Anode (electrolytic bath anode) In the electroplating method of inducing a magnetic field change, the window shielding frame is positioned between the electrolyzer cathode and the electrolyzer anode by varying the induced current of the applied magnetic field.

Here, the electrolytic cell cathode is characterized in that the electronic circuit board to be plated in the inward direction so as to face the electrolytic cell anode.

On the other hand, the window shield frame is characterized by consisting of at least one channel.

In addition, the amount of current applied to the window shielding frame and the current intensity is greater than both ends as a central portion is characterized in that to form a uniform thickness of the plating layer plated on the surface of the electronic circuit board.

In addition, by forming a magnetic field by the Lorentz force in accordance with the current direction applied to the window shielding frame, it is possible to increase the amount of charge on the surface of the plating layer to improve the plating speed.

In the case of the plating method according to the above-described problem solving means, in the process of forming the plating layer on the electronic circuit board, by providing a plating method of suppressing the phenomenon of the current to uniform the layer thickness to be plated on the electrification layer, It has the effect of improving the quality and improving the defect rate of the semiconductor package.

In particular, it can be easily applied in the continuous plating process of the flexible substrate, which is a tape substrate.

Hereinafter, a plating method according to the present invention will be described in detail with reference to the accompanying drawings.

First, the electromagnetic induction in the magnetic field in which the Lorentz force is generated is briefly described as follows. The phenomenon of electromagnetic induction in the changing magnetic field occurs when the magnetic field at a point in space changes, the electric field is induced at that point, and if there is a conductor circuit, the charge in the conductor is moved by the action of the electric field. It's a starting phenomenon. Therefore, it is not a circuit that exists in the changing magnetic field, and even when charged particles, the force by the electric field acts and the particles start to move. In this case, the edge portion of the electronic circuit board is the place where electricity is collected the most and the center portion is low in electrical density. Therefore, in order to compensate for this and to evenly plate the plating layer on the electronic circuit board, it is necessary to have a shielding film between the electronic circuit board and the anode to interrupt the flow of electricity so that the distribution of electricity (high current site side) can be uniformly obtained. have. Here, the shielding film refers to a structure that evenly distributes a current distribution by artificially interfering a large amount of current with a high current as a non-conductive material between the anode and the cathode (electronic circuit board). In this case, the shielding film may be configured differently according to the shape of the plating bath and the shape of the product. The shielding film structure according to the present invention will be described later.

In addition, electroplating, as is well known, refers to the deposition of metal ions by supplying electrons to metal ions (Zn 2+ for example, zinc plating) dissolved in a solution. That is, a reaction such as Zn 2+ + 2e = Zn (1) should occur at the metal and the plating liquid interface (metal surface). If the power is applied periodically by changing the polarity or AC instead of DC, as the reaction of (1) occurs, the reverse reaction of (1) occurs, and the precipitated metal melts in reverse. Of course, in order to improve the adhesion of the plating, to adjust the composition and to control the surface roughness, a pulse current may be applied.

In addition, in the case of electroplating, the problem of hydrogen embrittlement is that if an electron is applied to the electrode where plating occurs, all materials capable of reducing may naturally be reduced. And, if the material is the most reducing in water, of course, the water is decomposed to generate hydrogen reaction, especially when plating an active metal (zinc, aluminum, etc.) hydrogen generation is particularly enormous.

In this case, once hydrogen is generated, a problem occurs in plating efficiency. In other words, I tried to plate 100 zinc, but about 50 are consumed by hydrogen generation and the other 500,000 are consumed by zinc plating. Therefore, power should be supplied at least twice as much. Naturally, hydrogen will be generated more than twice in this process, and eventually the excessively generated hydrogen atoms should normally be combined with each other to occur on the metal surface in the form of molecules (ie hydrogen bubbles), but supply more power to supply excessive amounts of hydrogen. Is likely to fail to bind into the molecule at a rate.

As a result, some of the metals penetrate into the metal, thereby causing a problem of reducing the ductility of the metal. Of course, the degree of embrittlement will depend on the environment, metal, plating conditions and the like.

That is, a problem arises that the workability of the metal base material or the plating layer is deteriorated and the scope of application thereof is limited, and in order to prevent such brittleness from occurring, hydrogen generation is minimized once and the desired metal is well deposited. There must be a way to improve the plating efficiency.

As a method for this, appropriate additives may be added to the plating solution, and if possible, plating with minimal power, or plating on a metal surface which is difficult to generate hydrogen.

Hereinafter, the uniform plating method of the electronic circuit board according to the present invention will be described in detail with reference to the accompanying drawings based on the above-described electromagnetic induction and electroplating process. 5 is a block diagram showing a plating apparatus according to the present invention, Figure 6 is a cross-sectional view showing a window shield frame structure according to the present invention.

First, as shown in FIG. 5, the basic structure of the electroplating apparatus according to the present invention will be described with the electrodes 120 and 130 and the electronic circuit board 140 in the plating region containing the electrolyte in the plating bath 100 filled with the plating liquid. In the electroplating method by changing the current and magnetic field between the Cathode (electrolyte cathode, 120) and Anode (electrolyte anode, 130) during electroplating, the electrolyzer cathode 120 and the electrolyzer anode 130 A plate having a rectangular plate shape, and the plating plate located on the electrolytic cell cathode 120 is positioned inward to face the electrolytic cell anode 130 to be plated, and to face the electrolytic cell anode 130. Between the electrolytic cell cathode 120 and the electrolytic cell anode 130 is configured by placing a rectangular window shielding frame 150 consisting of a plurality of channels that can be adjusted by varying the current applied.

The interior of the electrolytic cell 100 is composed of two electrodes, the anode 130 and the cathode 120 and an electrolyte existing between the two electrodes.

On the other hand, after dipping the electronic circuit board 140 in the electrolytic cell 100, that is, located on the electrolytic cell cathode 120 side, before applying a current to the electrodes 120, 130 by applying a fine current to the metal seed layer It may include the step of strengthening, in this case it is greatly affected by the electrolyte composition and the applied current, and before applying a current to the electrode (DC) method or pulse (pulse) method can be applied.

Then, a predetermined power is applied to the electrolyzer cathode 120 and the electrolyzer anode 130 in the electrolyzer 100, and various process variables such as temperature, current density, PH, and the like are formed on the electrolyzer cathode 120. The plated metal layer having a desired thickness is formed on the circuit board 140.

In this case, ultrasonic agitation may be used. In this case, the ion transport in the plating bath 100 may be greatly activated to remove hydrogen adsorption during plating, to refine the plating layer structure, and to improve current efficiency. Can improve the adhesion and finally the corrosion resistance can be greatly improved.

In this case, the window shield frame 150 is composed of a plurality of channels (150a, 150b, 150c) in a rectangular shape having a predetermined thickness, each divided channel, more specifically, the upper and lower shielding frame 150 And it is preferable to be able to control by changing the current intensity and the amount of current applied to the central portion. That is, it is possible to control the magnetic field strength by appropriately adjusting the current conditions of the window shielding frame to generate a magnetic field, which in turn can control the induced current of each shielding frame channel 150a, 150b, 150c. It means.

This configuration and magnetic field and induced current generation is to prevent the plating layer from being uneven because the current is concentrated toward the outer side in the plating region of the electronic circuit board 140 for the product implementation pointed out by the problems of the prior art described above.

That is, in the electroplating, the thickness of the plating layer is proportional to the current applied to the unit area, and the current strength supplied from the power source is concentrated on the edge portion of the electronic circuit board 140 to be plated. The induced current is weakened and the induced current of the window shielding frame 150 in the center is made stronger, thereby easily solving the problem of concentrating current to the first edge. Therefore, the plating speed can also be improved than before.

As such, the metal plating layer formed on the surface of the electronic circuit board 140 may include the current strength formed in the window shielding frame 150 by applying electricity from the outside of the plating bath 100 and introducing the electrolyte into the plating bath 100. By generating a magnetic field along the direction, the generated magnetic field increases the amount of charge on the surface of the plating layer, which serves to increase the plating speed.

In addition, the general part of the plating apparatus configuration for the electroplating is the same as the existing plating apparatus configuration and can be selectively applied, the detailed description thereof will be omitted.

As described above, although the present invention has been described by way of limited embodiments and drawings, the present invention is not limited thereto and is intended by those skilled in the art to which the present invention pertains. Of course, various modifications and variations are possible within the scope of equivalents of the claims to be described.

That is, in the embodiment of the present invention, the window shielding frame has a rectangular shape having a plurality of channels, but the present invention is not limited thereto and may be disposed in the electrolytic cell in various structures and shapes.

1 to 4 is a block diagram showing a plating apparatus according to the prior art

5 is a block diagram showing a plating apparatus according to the present invention.

Figure 6 is a cross-sectional view showing a window shield frame structure according to the present invention.

<Description of the symbols for the main parts of the drawings>

100: plating bath 120: electrolytic cathode (Cathode)

130: electrolytic anode 140: electronic circuit board

150: window shield frame 150a, 150b, 150c: channel

Claims (5)

In the electroplating method of immersing the electrode and the electronic circuit board in the plating region containing the electrolyte, and inducing current and magnetic field changes between the cathode (electrode bath cathode) and the anode (electrode bath anode) during electroplating, And a window shielding frame which is arranged between the electrolyzer cathode and the electrolyzer anode by varying the induced current of the applied magnetic field. The method of claim 1, The electrolytic cell cathode is a uniform plating method for an electronic circuit board, characterized in that the electronic circuit board to be plated in the inward direction facing the electrolytic cell anode is configured. 3. The method of claim 2, The window shielding frame is a uniform plating method of an electronic circuit board, characterized in that composed of at least one channel. The method of claim 1, The amount of current applied to the window shielding frame and the current intensity are greater than both ends of the center portion to improve plating thickness variation and to form a uniform thickness of the plating layer plated on the surface of the electronic circuit board. Uniform plating method. The method of claim 4, wherein And forming a magnetic field by Lorentz force in accordance with the current direction applied to the window shielding frame, thereby increasing the amount of charge on the surface of the plating layer to improve the plating speed.
KR1020080125542A 2008-12-10 2008-12-10 Uniform pating method for pcb KR20100066988A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140135108A (en) * 2013-05-14 2014-11-25 신꼬오덴기 고교 가부시키가이샤 Method of manufacturing plating films
CN115058760A (en) * 2022-07-04 2022-09-16 厦门海辰新材料科技有限公司 Electroplating equipment and coating machine

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140135108A (en) * 2013-05-14 2014-11-25 신꼬오덴기 고교 가부시키가이샤 Method of manufacturing plating films
CN115058760A (en) * 2022-07-04 2022-09-16 厦门海辰新材料科技有限公司 Electroplating equipment and coating machine

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