TWI723755B - Workpiece holding jig and surface treatment device - Google Patents
Workpiece holding jig and surface treatment device Download PDFInfo
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- TWI723755B TWI723755B TW109102484A TW109102484A TWI723755B TW I723755 B TWI723755 B TW I723755B TW 109102484 A TW109102484 A TW 109102484A TW 109102484 A TW109102484 A TW 109102484A TW I723755 B TWI723755 B TW I723755B
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
- C25D17/08—Supporting racks, i.e. not for suspending
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/007—Current directing devices
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/008—Current shielding devices
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
Abstract
使工件(20)垂下並加以保持,且可與整流器電氣性連接的工件保持治具(30)具有:支承部(531、532),可與整流器導通;及導電性的夾持器(510、520),由支承部所支承,用來夾持工件的緣部。夾持器含有:固定部(521),固定於支承部;和可動部(523),相對於固定部被支承成可搖動,在與固定部的第1面(521A)之間,夾持工件;和導電性的虛設板(700),具有「與固定部的第2面(521B)相對向的第3面(700A)」、與第4面(700B),基端部(701)由固定部所支承;及絕緣性的調整構件(720),覆蓋虛設板的第4面,且可移動地由虛設板所支承。調整構件,可調整在虛設板的前端部(704)之第4面側的露出導電面積(S2)。The workpiece holding jig (30), which allows the workpiece (20) to hang down and holds it, and can be electrically connected to the rectifier, has: a support portion (531, 532) that can be connected to the rectifier; and a conductive holder (510, 520), supported by the supporting part, used to clamp the edge of the workpiece. The holder includes: a fixed part (521), fixed to the supporting part; and a movable part (523), which is supported so as to be swayable with respect to the fixed part, and clamps the workpiece between the first surface (521A) of the fixed part ; And the conductive dummy board (700), with "the third surface (700A) facing the second surface (521B) of the fixed part", and the fourth surface (700B), the base end (701) is fixed by Part supported; and insulating adjustment member (720), covering the fourth surface of the dummy board, and movably supported by the dummy board. The adjustment member can adjust the exposed conductive area (S2) on the fourth surface side of the front end portion (704) of the dummy board.
Description
本發明關於:電解電鍍(Electrolytic plating)等表面處理所使用的工件保持治具及表面處理裝置等。The present invention relates to a workpiece holding jig and a surface treatment device used for surface treatment such as electrolytic plating.
已知有一種連續電鍍裝置,利用工件保持治具使工件垂下而浸漬於處理槽內的處理液,連續搬送工件並執行電解電鍍(專利文獻1、2)。工件保持治具,用來保持工件,並將工件設定於陰極。 [先前技術文獻] [專利文獻]There is known a continuous electroplating apparatus that uses a workpiece holding jig to hang down the workpiece and immerse the workpiece in a processing solution in a processing tank, continuously convey the workpiece and perform electrolytic plating (Patent Documents 1 and 2). The workpiece holding jig is used to hold the workpiece and set the workpiece to the cathode. [Prior Technical Literature] [Patent Literature]
[專利文獻1]日本特許第5898540號公報 [專利文獻2]WO2018/062259號公報[Patent Document 1] Japanese Patent No. 5898540 [Patent Document 2] WO2018/062259 Publication
工件保持治具,藉由上側夾持器及下側夾持器而保持工件,並且藉由均為導電性的上側夾持器及下側夾持器與整流器電氣性連接,將工件設定於陰極。如此一來,一旦對工件進行電解電鍍,將存在以下的問題:工件由下側夾持器所保持的下緣部,僅在完全沒入處理液中的下側夾持器附近,局部性地形成厚膜電鍍。上側夾持器,僅前端部的夾持領域沒入處理液中,而產生與「下側夾持器的上述問題」相同的問題。Workpiece holding jig. The workpiece is held by the upper gripper and the lower gripper, and the upper and lower grippers are electrically connected to the rectifier to set the workpiece on the cathode. . As a result, once the workpiece is electrolytically plated, there will be the following problem: the lower edge of the workpiece held by the lower gripper is only partially near the lower gripper that is completely submerged in the treatment liquid. Form thick film plating. In the upper gripper, only the gripping area of the tip is submerged in the processing liquid, and the same problem as the "problem of the lower gripper" occurs.
本發明的幾個樣態,其目的為:調整流動於「在被夾持器所夾持的領域附近之工件的緣部」的電流,提高欲表面處理之工件的面內均一性。The several aspects of the present invention aim to adjust the current flowing in the "edge of the workpiece near the area clamped by the gripper" to improve the in-plane uniformity of the workpiece to be surface-treated.
(1)本發明的一種樣態,是將欲表面處理的工件予以垂下並保持,使前述工件浸漬於處理液中,並可與整流器電氣性連接的工件保持治具,其特徵為: 具有:支承部,可與前述整流器導通;和 導電性的夾持器,由前述支承部所支承,用來夾持前述工件的緣部;和 前述夾持器含有: 固定部,固定於前述支承部;和 可動部,相對於前述固定部被支承成可搖動,在與前述固定部的第1面之間,夾持前述工件的前述緣部;和 導電性的虛設板,具有與前述固定部的前述第1面之相反側的第2面相對向的第3面、前述第3面之相反側的第4面、基端部、前端部,前述第4面與前述固定部的前述第2面成為平行,前述基端部由前述固定部所支承;及 絕緣性的調整構件,覆蓋前述虛設板的前述第4面,且可移動地由前述虛設板所支承, 前述調整構件,用來調整前述虛設板的前述前端部之前述第4面側的露出導電面積。(1) One aspect of the present invention is to hang down and hold the workpiece to be surface-treated, so that the aforementioned workpiece is immersed in the treatment liquid and can be electrically connected to the rectifier. It is characterized by: Having: a support part that can be connected to the aforementioned rectifier; and A conductive holder, supported by the aforementioned supporting part, for clamping the edge of the aforementioned workpiece; and The aforementioned holder contains: The fixing part is fixed to the aforementioned supporting part; and The movable part is swayably supported with respect to the fixed part, and clamps the edge of the workpiece between the first surface of the fixed part; and The conductive dummy board has a third surface facing the second surface on the opposite side of the first surface of the fixing portion, a fourth surface on the opposite side of the third surface, a base end portion, and a front end portion. The fourth surface is parallel to the second surface of the fixing portion, and the base end portion is supported by the fixing portion; and An insulating adjustment member covers the fourth surface of the dummy board and is movably supported by the dummy board, The adjustment member is used to adjust the exposed conductive area on the fourth surface side of the front end portion of the dummy board.
根據本發明的一種樣態,與工件一起,在虛設板的前端部之前述第4面側的露出導電面,受到表面處理。藉由變更虛設板的露出導電面積,可調整對虛設板表面處理時所耗費的電流。藉此,透過夾持器的固定部而流動於工件之緣部的電流受到調整。倘若沒有虛設板及調整構件,透過夾持器的固定部而流動於工件之下緣部的電流將增大,電流集中於與固定部接觸之領域附近的工件的緣部,且與固定部接觸之那一側的面。結果導致在該領域的表面處理局部地進行。根據本發明的一種樣態,可調整「流動於工件的緣部之局部領域的電流」,而提高欲表面處理之工件的面內均一性。本發明之一種樣態的治具,可在處理槽內連續搬送或者間歇搬送,或者亦可不搬送地在處理槽內支承成自由進出。According to one aspect of the present invention, together with the workpiece, the exposed conductive surface on the fourth surface side of the front end portion of the dummy board is subjected to surface treatment. By changing the exposed conductive area of the dummy board, the current consumed during the surface treatment of the dummy board can be adjusted. Thereby, the current flowing to the edge of the workpiece through the fixed part of the clamper is adjusted. If there is no dummy plate and adjustment member, the current flowing through the fixed part of the holder and the lower edge of the workpiece will increase, and the current will be concentrated on the edge of the workpiece near the area in contact with the fixed part, and will be in contact with the fixed part. On that side of the face. As a result, the surface treatment in this field is performed locally. According to one aspect of the present invention, the "current flowing in the local area of the edge of the workpiece" can be adjusted to improve the in-plane uniformity of the workpiece to be surface treated. One aspect of the jig of the present invention can be continuously transported or intermittently transported in the processing tank, or can be supported in the processing tank without being transported so as to be freely in and out.
(2)在本發明的一種樣態(1)中,前述虛設板,最好是除了前述前端部的前述第4面之外,被施以絕緣塗裝。如此一來,除了虛設板的前端部的第4面以外,皆有效地實施表面處理。(2) In an aspect (1) of the present invention, it is preferable that the dummy board is coated with an insulating coating except for the fourth surface of the front end portion. In this way, except for the fourth surface of the front end of the dummy board, the surface treatment is effectively performed.
(3)在本發明的一種樣態(1)或(2)中,前述虛設板,其前述基端部對前述固定部的固定位置,在與前述調整構件可移動的方向平行的方向上可變更。一旦如此,可以調整:在從「與工件的主面正交的方向」所見的側面視角中,夾持器的第2面或者工件的主面、與虛設板之間的重疊面積。藉由這樣的位置調整,也能調整對虛設板表面處理時所耗費的電流。(3) In one aspect (1) or (2) of the present invention, the fixed position of the base end of the dummy board to the fixed portion can be in a direction parallel to the movable direction of the adjustment member. change. Once so, you can adjust: in the side view from the "direction orthogonal to the main surface of the workpiece", the overlap area between the second surface of the gripper or the main surface of the workpiece and the dummy plate can be adjusted. With this position adjustment, the current consumed in the surface treatment of the dummy board can also be adjusted.
(4)在本發明的一種樣態(1)至(3)中,前述支承部,可以是配置於前述工件之下方的下框,前述夾持器,可以是由前述下框所支承,並用來夾持前述工件之下緣部的導電性的下側夾持器。如此一來,能調整流動於工件的下緣部之局部領域的電流,而提高欲表面處理之工件的面內均一性。(4) In one aspect (1) to (3) of the present invention, the support portion may be a lower frame arranged below the workpiece, and the holder may be supported by the lower frame and used in combination A conductive lower gripper to hold the lower edge of the aforementioned workpiece. In this way, the current flowing in the local area of the lower edge of the workpiece can be adjusted, and the in-plane uniformity of the workpiece to be surface treated can be improved.
(5)在本發明的一種樣態(1)至(3)中,前述支承部,可以是配置於前述工件之上方的上框,前述夾持器,可以是由前述上框所支承,並用來夾持前述工件之上緣部的導電性的上側夾持器。如此一來,能調整流動於工件的上緣部之局部領域的電流,而提高欲表面處理之工件的面內均一性。(5) In one aspect (1) to (3) of the present invention, the support portion may be an upper frame arranged above the workpiece, and the holder may be supported by the upper frame and used in combination A conductive upper gripper to hold the upper edge of the aforementioned workpiece. In this way, the current flowing in the local area of the upper edge of the workpiece can be adjusted, and the in-plane uniformity of the workpiece to be surface treated can be improved.
(6)本發明的另外一種樣態,關於具有下述構件的表面處理裝置: 上述(1)~(5)之其中任一個的工件保持治具;和 供電部,連接於整流器,並與前述工件保持治具接觸;及 表面處理槽,至少在與前述虛設板的前述第4面相對向的位置,具備連接於前述整流器的陽極, 前述工件保持治具含有:與前述供電部接觸,並與前述下框導通的接觸部。 (6) Another aspect of the present invention relates to a surface treatment device having the following components: The workpiece holding fixture of any one of (1) to (5) above; and The power supply part is connected to the rectifier and keeps the fixture in contact with the aforementioned workpiece; and The surface treatment tank is provided with an anode connected to the rectifier at least at a position facing the fourth surface of the dummy board, The workpiece holding jig includes a contact part that is in contact with the power supply part and is electrically connected to the lower frame.
根據本發明的另一種樣態,能藉由上述(1)~(5)之各樣態的作用效果,提高欲表面處理之工件的面內均一性。在治具於表面處理槽內搬送的場合中,設於表面處理裝置且接觸治具的供電部,由供電軌道形成。在不搬送治具的場合中,供電部,可形成與治具的導電構件接觸的固定接點。 According to another aspect of the present invention, the in-plane uniformity of the workpiece to be surface treated can be improved by the effects of each aspect of (1) to (5) above. When the jig is transported in the surface treatment tank, the power supply part provided in the surface treatment device and in contact with the jig is formed by a power supply rail. When the jig is not transported, the power supply part can form a fixed contact that contacts the conductive member of the jig.
在以下的揭示中,提供多個不同的實施形態和實施例,用來實施所提示之主題的不同特徵。當然,這些說明僅為例子,並不具有限定本發明的意圖。除此之外,在本揭示中,有時參考號碼及/或文字反覆地於各種的例子出現。反覆的內容,是為了有助於理解本發明,其本身在各個實施形態及/或所說明的構造之間不具有關聯。除此之外,當描述第1元件「連接」或者「連結」於第2元件時,這樣的描述包含:第1元件與第2元件彼此直接地連接或者連結的實施形態,並且包含:第1元件與第2元件,具有1個以上的其他元件存在於兩者之間,而彼此間接地連接或者連結的實施形態。此外,當描述成第1元件相對於第2元件「移動」時,該描述包含「第1元件及第2元件中的至少其中一個,相對於另一個移動」之相對移動的實施形態。In the following disclosure, a number of different implementation forms and examples are provided to implement different features of the suggested theme. Of course, these descriptions are only examples, and are not intended to limit the present invention. In addition, in the present disclosure, sometimes reference numbers and/or characters appear repeatedly in various examples. The content of the repetition is to help the understanding of the present invention, and it does not have any relationship between the respective embodiments and/or the described structures. In addition, when describing the first element "connected" or "connected" to the second element, such description includes: the first element and the second element are directly connected or connected to each other, and include: the first The element and the second element have an embodiment in which one or more other elements exist between them and are indirectly connected or connected to each other. In addition, when it is described that the first element "moves" with respect to the second element, the description includes an embodiment of relative movement of "at least one of the first element and the second element moves with respect to the other".
1、表面處理裝置的概要
圖1,為表面處理裝置譬如連續電鍍處理裝置的縱剖面圖。連續電鍍處理裝置10,分別用來保持電路基板等工件20的複數個搬送治具30,朝向與圖1的紙面垂直的方向循環搬送。在圖1中,於循環搬送通路100之中,顯示了平行的2個直線搬送通路110、120。該2個直線搬送通路110、120,於兩端連結而形成環圈狀的循環搬送通路100。1. Outline of the surface treatment device
Fig. 1 is a longitudinal sectional view of a surface treatment device such as a continuous electroplating treatment device. The continuous
在循環搬送通路100設有:電鍍槽(廣義的表面處理槽)200,由複數個工件保持治具30所分別保持,對工件20執行表面處理,譬如電鍍處理;和搬入部(圖面中未顯示),將未處理的工件20搬入複數個搬送治具30;及搬出部(圖面中未顯示),將處理完畢的工件20從複數個工件保持治具30搬出。The circulating
在本實施形態中,電鍍槽200沿著第2直線搬送通路120設置,搬入部及搬出部則設於第1直線搬送通路110。在循環搬送通路100,更進一步具有:配置於電鍍槽200之上游側的前處理槽群230、及配置於電鍍槽200之下游側的後處理槽群(圖面中未顯示)。In this embodiment, the
如圖1所示,連續電鍍處理裝置10具有:收容電鍍液(廣義的處理液),且具有上端開口201的電鍍槽(廣義的表面處理槽)200。連續電鍍處理裝置10,更進一步如放大顯示圖1之局部的圖2所示,在從電鍍槽200之上端開口201的上方分離的位置,具有沿著與「電鍍槽200之長度方向」平行的第1方向(與紙面垂直的方向)延伸設置的至少1個,譬如2個第1導引軌道130及第2導引軌道140。複數個搬送治具30,配置於電鍍槽200的處理液中分別保持工件20,並由第1、第2導引軌道130、140所支承。As shown in FIG. 1, the continuous
複數個工件保持治具30,分別如圖3所示,大致具有搬送部300、工件保持部500。作為搬送部300,具有水平臂部301、第1被導引部310、第2被導引部320。第1被導引部310,由水平臂部301的其中一端側所支承,並由第1導引軌道130所導引。第2被導引部320,由水平臂部301的另一端側所支承,並由第2導引軌道140所導引。第1被導引部310含有:與第1導引軌道130的上表面及兩側面滾動接觸的滾子311、312、313。第2被導引部320含有:與第2導引軌道140的上表面滾動接觸的滾子321。The plural
在電鍍處理裝置10中,將工件20作為陰極(cathode),電鍍槽200在隔著工件20之搬送路徑的兩側,設有用來收容陽極(anode)410L、410R的陽極箱202、203。由圖面中未顯示的整流器在陰極與陽極之間形成電場(electric field)而對電鍍液進行電解(electrolysis),進而對工件20進行電解電鍍。因此,有必要對搬送中的工件20通電。為了對工件20供電,而設有供電部,譬如供電軌道210。特別是,本實施形態的供電軌道210,為了實施日本特開2009-132999所揭示的電流控制方法,而如圖2所示,具有彼此絕緣的複數個,譬如4個分支(Branched)供電軌道210A~210D。複數個工件保持治具30,分別具有:與4個分支供電軌道210A~210D之其中任一個接觸而被供電的被供電部340(圖2及圖3)。In the
圖4,顯示被供電部340的細部。被供電部340,在固定於水平臂部301的支承板330,具有與供電軌道210接觸之導電性的接觸部(集電器;current collector)341。接觸部341,藉由「具有2個平行連桿342A、342B的平行連桿機構342」而連結於支承板330。2個連桿342A、342B,藉由本身為彈推構件的扭力螺旋彈簧(torsion coil spring)343、343,而持續地朝順時鐘方向移動彈推。其結果,能以適度的接觸壓使接觸部341接觸於供電軌道210。FIG. 4 shows the details of the
此外,2個平行連桿342A、342B,相對於治具30的搬送方向A形成傾斜,而成為上側支點在前,下側支點在後。其結果,由於接觸部341以被工件保持治具30所牽引的狀態行走,因此行走穩定。In addition, the two
2、工件保持部
如圖5所示,工件保持部500具有:導電性的複數個上側夾持器510,夾持矩形工件20的上緣部20a;和導電性的複數個下側夾持器520,夾持矩形工件20的下緣部20b;及框體530,配置成包圍矩形工件20,並支承複數個上側夾持器510及複數個下側夾持器520。2. Workpiece holding part
As shown in FIG. 5, the
框體530具有:導電性的上框531,支承複數個上側夾持器510;和導電性的下框532,支承複數個下側夾持器520;及導電性的一對縱框533、534,分別與上框531的兩端部與下框532的兩端部連結。在此,一對縱框533、534,與上框531的兩端部形成電氣性絕緣,另外與下框532的兩端部形成電氣性連接。上框531及/或下框532,也被稱為:用來支承夾持器(上側夾持器510及/或下側夾持器520)的支承部。The
3、將工件設定為陰極的導電構件
在本實施形態中,設於工件保持治具30且可與整流器及工件20電氣性連接的導電構件,含有:第1及第2分歧導電構件;以及共通導電構件,與第1及第2分歧導電構件電氣性連接。3. Set the workpiece as the conductive member of the cathode
In this embodiment, the conductive member that is provided in the
具體地說,如圖5所示,一對接觸部341,在工件保持治具30的搬送方向A,保持間隔地配置2個。將搬送方向A之上游側的接觸部341稱為第1接觸部341A,將搬送方向A之下游側的接觸部341稱為第2接觸部341B。在第1、第2接觸部341A、341B,電氣性地連接有一對第1纜線350A、350B的各自一端。Specifically, as shown in FIG. 5, the pair of
一對第1纜線350A、350B之各自的另一端,共通連接於共通連接部360。作為共通導電構件的共通連接部360,可含有:第1導電構件361,可供一對第1纜線350A、350B的各自另一端電氣性地共通連接;及一對第2導電構件362、363,固定於第1導電構件361的兩端部。一對第2導電構件362、363,在從「一對第1纜線350A、350B之各自的另一端電氣性地共通連接於第1導電構件361的位置」起之相等距離L的位置,固定於第1導電構件361的兩端部。為了在「從第1導電構件361的兩端部起相等距離L的位置」,共通連接一對第1纜線350A、350B,亦可將一對第1纜線350A、350B的其中一個連接於第1導電構件361的表面,並將另一個連接於第1導電構件361的背面。The other ends of each of the pair of
作為設於工件保持治具30的導電構件,更進一步具有:一對第1連接部370A、370B,電氣性地連接上框531的兩端部與共通連接部360;及一對第2連接部380A、380B,電氣性地連接「與下框532的兩端部電氣性連接的一對縱框533、534」、與共通連接部360。一對縱框533、534,與上框531形成電氣性絕緣。藉由調整一對第2連接部380A、380B的形狀、厚度、材質等,進而調整電阻值,藉此,能調整流動於上側夾持器510的電流。As a conductive member provided in the
第1分歧導電構件,是由「使共通連接部360,經由一對第1連接部370A、370B的其中一個以及上框531,而與複數個上側夾持器510的其中一個形成電氣性導通」的構件形成。在該場合中,第2分歧導電構件,是由「使共通連接部360,經由一對第1連接部370A、370B中的另一個以及上框531,而與複數個上側夾持器510中的另一個形成電氣性導通」的構件形成。The first branch conductive member is formed by "making the
或者,第1分歧導電構件,是由「使共通連接部360,經由一對第2連接部380A、380B的其中一個;一對縱框533、534的其中一個;以及下框532,而與複數個下側夾持器520的其中一個形成電氣性導通」的構件形成。在該場合中,第2分歧導電構件,是由「使共通連接部360,經由一對第2連接部380A、380B中的另一個;一對縱框533、534中的另一個;以及下框532,而與複數個下側夾持器520中的另一個形成電氣性導通」的構件形成。Alternatively, the first branched conductive member is composed of "the
在此,共通導電構件亦即共通連接部360含有:電阻值r的高電阻材料,該電阻值r為第1及第2分歧導電構件間之最大電阻差ΔRΩ的103
倍以上,並且大於銅及鋁的電阻值。在本實施形態中,共通連接部360,其一對第2導電構件362、363是由高電阻材料所形成,第1導電構件361是由低電阻構件所形成。Here, the common conductive member, that is, the common connecting
作為高電阻材料,譬如可列舉出不鏽鋼(SUS)。舉例來說,SUS304的體積電阻率(volume resistivity) (Ω·m)為73.7,相對於銅的1.7Ω·m和鋁的2.8Ω·m,更大一位數。由於所測得的最大電阻差ΔRΩ為10~20mΩ,因此該高電阻材料的電阻值r,符合r≧ΔR×103 。同樣地,舉例來說,53.3Ω·m的鈦,也適合作為高電阻材料。As the high-resistance material, for example, stainless steel (SUS) can be cited. For example, the volume resistivity (Ω·m) of SUS304 is 73.7, which is one digit larger than copper's 1.7Ω·m and aluminum's 2.8Ω·m. Since the measured maximum resistance difference ΔRΩ is 10-20mΩ, the resistance value r of the high-resistance material conforms to r≧ΔR×10 3 . Similarly, for example, 53.3Ω·m titanium is also suitable as a high-resistance material.
在此,透過供電軌道210而與工件保持治具30電氣性連接的整流器,為了流過所設定的一定(恆定)電流I,而對應電流路徑之閉環系統的阻抗(impedance)Z來調整電壓E,以形成E=R×I。在本實施形態中,閉環系統的電阻R,含有共通導電構件亦即一對第2導電構件的高電阻值r,該電阻值r具有較一般認為低電阻的銅和鋁更大的電阻值。相對於在第1、第2分歧導電構件間(亦即,複數個上側夾持器510之間、或者複數個下側夾持器520之間)所產生的最大電阻差ΔRΩ,倘若為r≧103
×ΔRΩ,含有電阻值r之系統的電阻R也變大。因此,整流器調整成較大的電壓V,並供給一定(恆定)電流I。如此一來,流動於第1、第2分歧導電構件的電流(或者電子)在共通連接部360合流,並且只要以電壓E來流通電流I,便能無視電阻的變化ΔRΩ,該電壓E遠遠大於:相當於「第1、第2分歧導電構件間之電阻的變化ΔRΩ」的變化電壓ΔV。Here, the rectifier electrically connected to the
3.1、比較例的電流監控
圖6,示意地顯示比較例的治具,該比較例並未如本實施形態般,於共通連接部360含有高電阻值r的材料。將圖6中,流動於比較例的治具之搬送方向A上游側之接觸部的電流設為A1,流動於搬送方向A下游側之接觸部的電流設為A2。3.1. Current monitoring of the comparative example
FIG. 6 schematically shows a jig of a comparative example. The comparative example does not contain a material with a high resistance value r in the
在圖7所示的測量中,將整流器的設定電流設為204A(=A1+A2),將分歧為2個部分而流動的分歧設定電流(A1、A2)設為102A。將工件保持治具朝圖6的搬送方向A搬送的同時,所測得的電流A1、A2,如圖7所示,相對於分歧設定電流值,上下地變動。在時刻T1、T2的前後,如同日本特開2009-132999號所揭示,由於治具是透過供電軌道之間的接縫,從其中一個供電軌道轉移至另一個供電軌道,因此,採用整流器來實施以下的控制:與其中一個供電軌道接觸之接觸部的電流值逐漸減少,與另一個供電軌道接觸之接觸部的電流值逐漸增加。在這種「電流逐漸減少-逐漸增加」之控制以外的區間,整流器則依據設定電流進行輸出控制。但是,圖7所示之比較例的電流A1、A2,在恆定電流控制區間形成小幅度的變動,在「電流逐漸減少-逐漸增加」的控制下則大幅變動。In the measurement shown in FIG. 7, the set current of the rectifier is set to 204A (=A1+A2), and the branch set currents (A1, A2) flowing in two parts are set to 102A. While the workpiece holding jig is being conveyed in the conveying direction A of Fig. 6, the measured currents A1 and A2, as shown in Fig. 7, fluctuate up and down with respect to the branch setting current value. Before and after time T1 and T2, as disclosed in Japanese Patent Application Publication No. 2009-132999, the fixture is transferred from one of the power supply rails to the other power supply rail through the joint between the power supply rails. Therefore, a rectifier is used for implementation. The following control: the current value of the contact part in contact with one of the power supply rails gradually decreases, and the current value of the contact part in contact with the other power supply rail gradually increases. In areas other than the control of "gradual decrease-gradual increase of current", the rectifier performs output control according to the set current. However, the currents A1 and A2 of the comparative example shown in FIG. 7 have small fluctuations in the constant current control section, and have large fluctuations under the control of "gradual current decrease-gradual increase".
3.2、本實施形態的電流監控
圖8,示意地顯示於共通連接部360含有高電阻值r的材料之本實施形態的治具30。將圖8中,流動於治具30的搬送方向A上游側之接觸部341A的電流設為A1,流動於搬送方向A下游側之接觸部341B的電流設為A2,將流動於一對第1連接部370A、370B的電流設為A3、A4,將流動於一對第2連接部380A、380B的電流設為A5、A6。3.2. Current monitoring of this embodiment
FIG. 8 schematically shows the
在圖9所示的測量中,將整流器的設定電流設為131A(=A1+A2),將分歧為2個部分而流動的分歧電流(A1、A2)設為65.5A。在時刻T的前後,執行與圖7所示之時刻T1、T2相同的「電流逐漸減少-逐漸增加」控制,並在其他的區間,依據設定電流進行輸出控制。將工件保持治具30朝圖8的搬送方向A搬送的同時,所測得的電流A3~A6,如圖9所示,從治具30的左右流向上側夾持器510的分歧電流A3、A4形成恆定(一定),從治具30的左右流向下側夾持器520的分歧電流A5、A6也形成恆定(一定)。
In the measurement shown in FIG. 9, the set current of the rectifier is set to 131A (=A1+A2), and the branch currents (A1, A2) flowing in two parts are set to 65.5A. Before and after the time T, the same "current gradual decrease-gradual increase" control is executed as the time T1 and T2 shown in FIG. 7, and in other sections, the output control is performed according to the set current. While the
在本實施形態中,雖然在整流器與共通連接部360之間的導通路徑,存在「因為供電軌道210的局部髒污而產生的第1、第2接觸部341A、341B之接觸電阻的變化」所衍生的電阻差、和供電軌道210之轉移時的電阻差,但藉由設置具有上述電阻值的共通連接部360,能降低上述的不良影響。
In the present embodiment, although the conduction path between the rectifier and the
在本實施形態中,除了一對第1連接部含有一對金屬板370A、370B之外,一對第2連接部也可以含有一對第2纜線380A、380B。如此一來,能使「從共通連接部360到達上側夾持器510為止的電阻值」,大於「從共通連接部360到達下側夾持器520為止的電阻值」。
In this embodiment, in addition to the pair of first connecting portions including a pair of
一旦如此,相較於僅前端部浸漬於處理液中的上側夾持器510,可使整體浸漬於處理液中的下側夾持器520的表面處理所額外耗費之電流量的電流,透過下側夾持器520對工件通電。在圖9中,藉由使流動於下側夾持
器520的電流A5、A6,大於流動於上側夾持器510的電流A3、A4,結果能使從上下流向工件20的電流形成大致一定(恆定)。
Once this is done, compared to the
4、上側虛設板/下側虛設板 4. Upper dummy board/lower dummy board
如圖5所示,當將上框531及/或下框532作為導電性的支承部時,在支承部除了上側及/或下側夾持器510、520之外,也能具有導電性的上側虛設板610及/或導電性的下側虛設板620。上側虛設板610,在工件20的上緣部20a中未受到上側夾持器510所保持的領域,配置成接近工件20的上緣部20a。下側虛設板620,在工件20的下緣部20b中未受到下側夾持器520所保持的領域,配置成接近工件20的下緣部20b。
As shown in FIG. 5, when the
上側虛設板610及導電性的下側虛設板620,分別可在至少其中一面譬如表面、背面,具有絕緣板630,該絕緣板630被支承成可移動而能分別覆蓋表面及背面,並能分別調整虛設板610、620的露出導電面積。
The
放大上側虛設板610並顯示於圖10。圖10所示的構造,也應用於下側虛設板620。如圖10所示,上側虛設板610,透過與上側虛設板610形成一體、或者不同個體的鉸鍊611,譬如由螺絲612固定於上框531。覆蓋上側虛設板610之兩面的絕緣板630,可以具有「覆蓋上側虛設板610之表面的絕緣板630A」、「覆蓋上側虛設板610之背面的絕緣板630B」的其中任一個或者雙方。絕緣板
620A、620B,是藉由螺栓641、與鎖合於螺栓641的螺帽642,而例如共同鎖附於上側虛設板610,該螺栓641可穿過:絕緣板630A、630B所分別設置之縱向的長孔631A、631B(在圖10中,僅顯示長孔631A);及設於上側虛設板610的孔612。
The
絕緣板620A、620B,分別可在長孔631A、631B的範圍內,相對於上側虛設板610(下側虛設板620)調整上下方向的位置。藉此,如圖10所示,上側虛設板610的前端部610A所露出之導電面的露出面積S,可在表面與背面獨立地調整。藉由變更上側虛設板610的露出導電面積S,可調整對上側虛設板610表面處理時所耗費的電流。藉此,透過上側夾持器510而流動於工件20之上緣部20a的電流受到調整。如此一來,能調整流動於工件20之上緣部20a的電流,而提高欲表面處理之工件的面內均一性。針對下側虛設板620,藉由相同的調整,能調整流動於工件20之下緣部20b的電流,而提高欲表面處理之工件的面內均一性。
The insulating plates 620A and 620B can be adjusted in the vertical direction relative to the upper dummy plate 610 (lower dummy plate 620) within the range of the
上側虛設板610,可透過鉸鍊611,而在圖12的實線所示的第1位置P1、與鏈線所示的第2位置P2之間擺動(移動)。在第1位置P1,上側虛設板610接近工件20之上緣部20a中未被上側夾持器510保持的領域,並配置成與工件20平行。在第2位置P2,上側虛設板610與工件20的主面形成非平行,舉例來說,對工件20的主面交叉成直角。
The
當對工件20表面處理時,上側虛設板610被
設定在第1位置P1。另外,當利用自動機器對工件保持治具30裝卸工件20時,上側虛設板610被設定在第2位置P2。藉由將上側虛設板610設定於第2位置P2,可在工件20的上緣部20a與上框351之間確保間隙。藉此,在與「工件保持治具30之上側夾持器510」不同的位置,可藉由自動機器夾持工件20的上緣部。在該場合中,亦可由自動機器推動上側虛設板610,使上側虛設板610從第1位置P1朝向第2位置P2移動於箭號F1方向。舉例來說,亦可如圖12所示,藉由設於自動機器且可移動之臂1000前端的輥子1100,推動上側虛設板610。下側虛設板620也是一樣,可在第1位置P1與第2位置P2之間擺動(移動)。
When processing the surface of the
上側虛設板610,亦可藉由鉸鍊611本身的彈性、或者設於鉸鍊611的板簧或螺旋彈簧等的彈推構件,而朝第1位置P1彈推移動。一旦如此,不必作用外部的復原力,便能使上側虛設板610沿著箭號F2方向從第2位置P2朝向第1位置P1復位。下側虛設板620也是一樣,不必作用外部的復原力,便能沿著箭號F2方向從第2位置P2朝向第1位置P1復位。
The
在「工件保持治具,具有夾持矩形工件20的四邊之上下左右的夾持器」的場合中,亦可將虛設板及絕緣板設於四邊的各夾持器。
In the case of a "work holding jig with clamps that clamp the four sides of the
5、夾持器的虛設板及調整構件 5. The dummy plate and adjustment components of the holder
以下,列舉下側夾持器520作為例子,說明設在上側夾持器510及下側夾持器520之其中一個或雙方的虛設板及調整構件。藉由將以下的說明中的「下側夾持器520」置換為「上側夾持器510」,並將「下框532」置換為「上框531」,便能理解上側夾持器510所設置的虛設板及調整構件。Hereinafter, the
圖13,顯示設於下側夾持器520的虛設板700及調整構件720。首先,下側夾持器520含有:固定於下框532的固定部521、支承成可相對於固定部521搖動的可動部523。固定部521具有第1面521A、及相反側的第2面521B。固定部521,其第2面521B與下框532形成面接觸,並由螺栓522固定於下框532。固定部521,具有從第1面521A垂直豎起的2個側壁521C。FIG. 13 shows the
在可搖動的可動部523、與固定部521的第1面521A之間,工件20的下緣部20b局部地受到夾持。可動部523,可繞著「由固定部521的2個側壁521C所支承的銷524」搖動。螺旋彈簧525穿過銷524。可動部523,由螺旋彈簧525所彈推而朝向固定部521移動。可動部523,經由固定部521、銷524或者螺旋彈簧525,而與下框532電氣性連接。為了降低該導通路徑的電阻值,亦可將螺旋彈簧525變更為板簧等。Between the swingable
導電性的虛設板700含有:面向固定部521之第2面521B的第3面700A、第3面700A之相反側的第4面700B。此外,將虛設板700的其中一端部稱為基端部701,並將另一端部稱為前端部704。虛設板700,其第4面700B與固定部521的第2面521B形成平行,基端部701由固定部521所支承。The
在此,如圖14所示,可在虛設板700的基端部701,形成有譬如2個長孔702、703。將螺栓710穿過該長孔702、703,並將螺栓710連結(鎖緊)於下框532。藉由長孔702、703,虛設板700可在圖13的箭號C方向調整固定位置。Here, as shown in FIG. 14, the
如圖13及圖14所示,絕緣性的調整構件720,覆蓋虛設板700之第4面700B的局部,而重疊於虛設板700。並未由調整構件720所經常覆蓋的導電面,可以僅設為前端部704。在圖13及圖14中如同剖面線所示,並未由調整構件720所覆蓋的其他面,被施以絕緣塗裝。As shown in FIGS. 13 and 14, the insulating
如圖14所示,在調整構件720形成有譬如2個長孔721、722。將螺栓730穿過該長孔721、722,並將螺栓730連結(鎖緊)於虛設板700。藉由長孔702、703,調整構件720可在圖13的箭號C方向調整固定位置。藉此,調整構件720可調整:在虛設板700的前端部704之第4面700B側的露出導電面積S2。As shown in FIG. 14, for example, two
在虛設板700的前端部704之第4面700B側的露出導電面,受到表面處理。藉由變更虛設板700的露出導電面積S2,可調整對虛設板700表面處理時所耗費的電流。藉此,透過下側夾持器520的固定部521而流動於工件20之下緣部20b的電流受到調整。倘若沒有虛設板700及調整構件720,透過下側夾持器520的固定部521而流動於工件20之下緣部20b的電流將增大。這是由於如以上所述,可動部523與下框532之間的電阻值比較大的緣故。據此,電流不會集中於與可動部523接觸的領域附近之工件20的下緣部20b,且不會集中於與可動部523接觸的那一側的面20b1(圖13)。另外,以下的傾向則明顯強烈:電流集中於與固定部521接觸的領域附近之工件20的下緣部20b,且集中於與固定部521接觸的那一側的面20b2(圖13)。結果導致在固定部521附近的領域,局部地進行工件20的表面處理。根據本實施形態,可調整「流動於工件20的下緣部20b之局部領域20b2的電流」,而提高欲表面處理之工件的面內均一性。The exposed conductive surface on the
此外,藉由長孔702、703,可在與「調整構件720可移動的箭號C方向」平行的方向上,調整「虛設板700的基端部701相對於固定部521的固定位置」。一旦如此,可以調整:在從「與工件20的主面正交的方向」所見的側面視角中,下側夾持器520之固定部521的第2面521B或者工件的主面、與虛設板700之間的重疊面積。藉由這樣的位置調整,也能調整對虛設板700表面處理時所耗費的電流。In addition, with the
在此,圖1所示之處理槽200內的處理液Q,相對於治具30設定了圖5所示的液面L。據此,下側夾持器520整體沒入處理液Q。因此,虛設板700,除了位於前端部704的第4面700B,在圖13及圖14中如同剖面線所示,並未由調整構件720所覆蓋的其他面,被施以絕緣塗裝。如此一來,除了虛設板700在前端部704的第4面700B以外,皆有效地實施表面處理。Here, the processing liquid Q in the
上述設於下側夾持器520的虛設板700及調整構件720的構造,也能適用於設於上側夾持器510的虛設板及調整構件。而與下側夾持器520不同之處在於:從圖5所示的處理液Q之液面L的位置起,上側夾持器510並未整體沒入處理液Q。因此,設於上側夾持器510的虛設板,亦可將絕緣塗裝領域,限縮成沒入處理液Q中的領域。這是因為:未浸漬於處理液Q的領域並未表面處理,因此不需要絕緣塗裝。The structures of the
6、第1、第2側面虛設構件
如圖5所示,工件保持治具30,可以進一步具有:配置成接近工件20的兩側緣部之導電性的第1及第2側面虛設構件800A、800B。如作為圖5之D-D箭號方向視圖的圖15所示,第1側面虛設構件800A,配置於工件20的側緣部20d與縱框534之間。第2側面虛設構件800B,配置於工件20的側緣部20c與縱框534之間。6. Dummy members on the first and second sides
As shown in FIG. 5, the
在此,「與共通導電構件360的第2導電構件362電氣性連接,且從共通導電構件360分歧,透過上側夾持器510而與工件20導通」的第1分歧導通構件,是由一對第1連接部370A、370B;及該一對第1連接部370A、370B連接於兩端部的上框531所定義。工件保持治具30更進一步具有:與共通導電構件360電氣性連接,且從共通導電構件360分歧,與第1及第2側面虛設構件800A、800B導通的第2分歧導通構件900(900A、900B)。第2分歧導通構件900的第1虛設導通構件900A,從共通導電構件360分歧,並與第1側面虛設構件800A導通。第2分歧導通構件900的第2虛設導通構件900B,從共通導電構件360分歧,並與第2側面虛設構件800B導通。Here, the first branching conductive member "which is electrically connected to the second
可與整流器電氣性連接的共通導電構件360,經由第1分歧導通構件370A、370B、531,藉由上側夾持器510與工件20導通。該共通導電構件360,透過第2分歧導通構件900(900A、900B)與第1及第2側面虛設構件800A、800B導通。流動於工件20、第1及第2側面虛設構件800A、800B的全體電流,可藉由整流器來設定。在此,縱框533、534被施以絕緣塗裝。倘若沒有第1及第2側面虛設構件800A、800B,電場將集中於工件20的兩側緣部20c、20d,流動於工件20之兩側緣部20c、20d的電流變多。在縱框533、534未絕緣塗裝的場合中,為了對導電性的縱框533、534進行電鍍而耗費電流,而使流動於工件20之兩側緣部20c、20d的電流減少。因此,設置第1虛設導通構件900A與第2虛設導通構件900B,可調整流動於工件20之兩側緣部20c、20d的電流。不僅如此,相對於第1分歧導通構件370A、370B、531,藉由獨自地設定第2分歧導通構件900(900A、900B)的電阻值,而與流動於工件20的電流形成獨立,可設定流動於第1及第2側面虛設構件800A、800B的電流。藉此,藉由對「配置成接近工件20之側緣部20c、20d的第1及第2側面虛設構件」實施表面處理,能調整流動於工件20之側緣部20c、20d的電流,而提高欲表面處理之工件的面內均一性。此外,藉由獨自地設定第1虛設導通構件900A與第2虛設導通構件900B之間的電阻值,能獨自地設定流動於第1及第2側面虛設構件800A、800B的電流。如此一來,可以調整流動於工件20之其中一個側緣部20c與另一個側緣部20d的電流。The common
第1虛設導通構件900A,譬如具有:纜線910A,其中一端連接於共通導電構件360的第2導電構件362;和導電板920A,連接著纜線910A的另一端;及纜線930A,其中一端連接於導電板,另一端連接於第1側面虛設構件800A。第2虛設導通構件900B,也同樣具有纜線910B、導電板920B及纜線930B。The first
第1、第2虛設導通構件900A、900B,可具有第1、第2可變電阻器。設於第1虛設導通構件900A的第1可變電阻器,是由設於導電板920A的長孔921A、與沿著長孔921A移動的可動接點部922A所構成。長孔921A,將「從纜線910A的連接部起的距離變長的方向(圖5中的水平方向)」作為長度方向。藉由變更「與纜線930A連接之可動接點部922A」的位置,可變更電阻值。設於第2虛設導通構件900B的第2可變電阻器,也同樣是由長孔921B與可動接點部922B所構成。如此一來,藉由以第1、第2可變電阻器調整電阻值,可在特定的範圍內,任意地調整第1虛設導通構件900A的電阻值、與第2側面虛設構件800B的電阻值。可動接點部922A及可動接點部922B,能以手動或者自動進行位置調整。The first and second dummy
在本實施形態中,如圖5所示,第1虛設導通構件900A與第1側面虛設構件800A的上部導通,第2虛設導通構件900B與第2側面虛設構件800B的上部導通。在該場合中,如圖16所示,第1側面虛設構件800A及第2側面虛設構件800B,最好是分別形成:與工件20的厚度方向平行的寬度W1、W2、W3,上部較下部更窄(W1<W2<W3)。寬度,可階段性地改變,亦可連續性地改變。第1及第2側面虛設構件800A、800B,由於上部靠近整流器,而具有:上部較下部受到更多表面處理的傾向。因為這緣故,而具有「工件20之兩側緣部20c、20d的上部不易表面處理」的傾向(電鍍厚度變薄)。藉由在上部將第1及第2側面虛設構件800A、800B的寬度變窄,工件20之兩側緣部20c、20d的上部變得容易表面處理,即使是上部也能確保電鍍膜厚。藉此,在工件20的兩側緣部,能有效地執行「從上部朝下部流動之電流」的調整。In this embodiment, as shown in FIG. 5, the first
參考圖17~圖19,說明設於工件保持治具30的第1、第2側面虛設支承部。在圖17~圖19中,第1、第2側面虛設支承部,舉例來說,可使第1、第2側面虛設構件800A、800B如圖15所示,朝向表示工件20之寬度方向的箭號E方向、與表示工件20之厚度方向的箭號F方向移動。Referring to FIGS. 17 to 19, the dummy support portions provided on the first and second side surfaces of the
圖17及圖18,為用來支承第1側面虛設構件800A的上部之支承部的前視圖及俯視圖。在縱框534的上部,設有朝向工件保持治具30的內側延伸的2個安裝片820A。在該2個安裝片820A之間,配置用來支承第1側面虛設構件800A之上部的上部支承片830A。2個安裝片820A,具有將箭號E方向作為長度方向的長孔821。穿過該長孔821的螺栓835,鎖合於上部支承片830A。只要鬆開螺栓835,上部支承片830A便能與第1側面虛設構件800A一起朝箭號E方向移動。只要將螺栓835鎖緊,上部支承片830A便固定於2個安裝片820A。17 and 18 are a front view and a plan view of the supporting part for supporting the upper part of the first
如圖18所示,上部支承片830A具有:貫穿上下,並將箭號F方向作為長度方向的長孔831。穿過該長孔831的螺栓810,鎖合於第1側面虛設構件800A的上部。只要鬆開螺栓810,第1側面虛設構件800A便能朝箭號F方向移動。只要將螺栓810鎖緊,第1側面虛設構件800A便固定於上部支承片830A。雖然圖示省略,但是第2側面虛設構件800B的上部,也和第1側面虛設構件800A的上部一樣受到支承。As shown in FIG. 18, the
圖19,顯示用來支承第1側面虛設構件800A之下部的支承部。在縱框534的上部,設有朝向工件保持治具30的內側延伸的2個安裝片820A。在該2個安裝片820A之間,配置用來支承第1側面虛設構件800A之下部的下部支承片830B。下部支承片830B,除了稍後所述之用來支承連接部850的構造之外,具有與上部支承片830A相同的構造。此外,第2側面虛設構件800B的下部,也和第1側面虛設構件800A的下部一樣受到支承。Fig. 19 shows a supporting part for supporting the lower part of the first
第1、第2側面虛設構件800A、800B,藉由將纜線930A、930B連接於譬如圖18所示的螺栓810,能與整流器連接。為了使第1、第2側面虛設構件800A、800B從縱框933、934電氣性絕緣,安裝片820A及/或上部、下部支承片830A、830B,是由絕緣體所形成。
The first and second
藉由使第1、第2側面虛設構件800A、800B在工件20的寬度方向E移動,可分別在工件的兩側緣部20c、20d,調整工件的表面處理量(電鍍膜厚)。舉例來說,只要使第1側面虛設構件800A朝圖15的左側方向移動,便能使工件20之側緣部20d的電鍍膜厚變薄。相反地,只要使第1側面虛設構件800A朝圖15的右側方向移動,便能使工件20之側緣部20d的電鍍膜厚變厚。據此,使第1、第2側面虛設構件800A、800B僅朝工件20的寬度方向E移動的構造即可。
By moving the first and second
藉由使第1、第2側面虛設構件800A、800B在工件20的厚度方向F移動,可分別在工件20的兩側緣部20c、20d,調整圖15所示之工件20的表面20d1及背面20d2處的表面處理量(電鍍膜厚)。舉例來說,只要使第1側面虛設構件800A朝圖15的上側方向移動,便能使工件20之表面20d1的電鍍膜厚變薄。相反地,只要使第1側面虛設構件800A朝圖15的下側方向移動,便能使工件20之背面20d2的電鍍膜厚變薄。據此,使第1、第2側面虛設構件800A、800B僅朝工件20的厚度方向F移動的構造即可。
By moving the first and second
如圖19所示,可以更進一步設置:電氣性連
接第1側面虛設構件800A的下部、與第2側面虛設構件800B的下部的連接構件850。藉由設置連接構件850,電流容易流動於第1及第2側面虛設構件800A、800B的下部,在工件20的兩側緣部20c、20d,能有效地執行「從上部朝下部流動之電流」的調整。
As shown in Figure 19, it can be further set: electrical connection
The connecting
連接構件850的兩端部,譬如由圖19所示的2個下部支承片830B支承成可滑動。藉此,容許2個下部支承片830B朝圖15所示之箭號E方向移動。此外,連接構件850的兩端部,在第1、第2側面虛設構件800A、800B的下部,以可撓的導電構件形成電氣性連接。藉此,容許第1、第2側面虛設構件800A、800B朝圖15所示之箭號E、F方向移動。Both ends of the connecting
20:工件 20: Workpiece
20a:上緣部 20a: Upper edge
20b:下緣部 20b: lower edge
20c,20d:側緣部 20c, 20d: side edge
30:工件保持治具 30: Workpiece holding fixture
210:供電部(供電軌道) 210: Power supply department (power supply rail)
341A,341B:第1,第2接觸部 341A, 341B: the first and second contacts
341A,350A:第1分歧導電構件 341A, 350A: first branch conductive member
341B,350B:第2分歧導電構件 341B, 350B: second branch conductive member
350A,350B:一對第1纜線 350A, 350B: a pair of first cables
360:共通連接部(共通導電構件) 360: Common connection part (common conductive member)
361:第1導電構件 361: The first conductive member
362,363:一對第2導電構件 362,363: A pair of second conductive members
370A,370B:一對第1連接部(一對金屬板) 370A, 370B: A pair of first connecting parts (a pair of metal plates)
370A,370B,531:第1分歧導通構件 370A, 370B, 531: the first branch conduction member
380A,380B:一對第2連接部(一對第2纜線) 380A, 380B: A pair of second connecting parts (a pair of second cables)
380A,380B,533,534:第1分歧導通構件 380A, 380B, 533, 534: the first branch conduction member
410R,410L:陽極 410R, 410L: anode
510:上側夾持器(upper clamper) 510: upper clamper
520:下側夾持器 520: Lower side gripper
521:固定部 521: Fixed part
521A:第1面 521A: Side 1
521B:第2面 521B: Side 2
523:可動部 523: movable part
530:框體 530: Frame
531:上框(支承部) 531: Upper frame (support part)
532:下框(支承部) 532: Lower frame (support part)
533,534:一對縱框 533,534: a pair of vertical frames
610:上側虛設板 610: upper dummy board
620:下側虛設板 620: lower dummy board
611:鉸鍊 611: Hinge
630,630A,630B:絕緣板(上側絕緣板,下側絕緣板,表側絕緣板,背側絕緣板) 630, 630A, 630B: Insulation board (upper side insulation board, lower side insulation board, front side insulation board, back side insulation board)
700:虛設板(dummy board) 700: dummy board
700A:第3面 700A: Side 3
700B:第4面 700B: Side 4
701:基端部 701: base end
704:前端部 704: Front end
720:調整構件 720: adjustment component
800A:第1側面虛設構件 800A: Dummy member on the first side
800B:第2側面虛設構件 800B: Dummy member on the second side
850:連接構件 850: connecting member
900(900A,900B):第2分歧導通構件 900 (900A, 900B): The second branch conduction member
900A(910A,920A,922A,930A):第1虛設導通構件 900A (910A, 920A, 922A, 930A): the first dummy conduction member
900B(910B,920B,922B,930B):第2虛設導通構件 900B (910B, 920B, 922B, 930B): the second dummy conduction member
920A,921A,922A:第1可變電阻器(variable resistor) 920A, 921A, 922A: the first variable resistor (variable resistor)
920B,921B,922B:第2可變電阻器 920B, 921B, 922B: 2nd variable resistor
P1:第1位置 P1: 1st position
P2:第2位置 P2: 2nd position
S,S2:露出導電面積 S, S2: exposed conductive area
[圖1]:為本發明之實施形態的表面處理裝置的縱剖面圖。 [Fig. 1]: It is a longitudinal cross-sectional view of the surface treatment apparatus according to the embodiment of the present invention.
[圖2]:為圖1的局部放大圖。 [Figure 2]: is a partial enlarged view of Figure 1.
[圖3]:是從搬送方向所見之工件保持治具的側視圖。 [Figure 3]: It is a side view of the workpiece holding jig as seen from the conveying direction.
[圖4]:是顯示設於工件保持治具之接觸部的支承構造的圖。 [Fig. 4]: A diagram showing the supporting structure provided in the contact portion of the workpiece holding jig.
[圖5]:為工件保持治具的前視圖。 [Figure 5]: Front view of holding jig for workpiece.
[圖6]:為示意地顯示比較例之治具的圖。 [Fig. 6]: A diagram schematically showing the jig of the comparative example.
[圖7]:為顯示流動於圖6中之治具的電流的比較例的特性圖。 [Fig. 7]: A characteristic diagram showing a comparative example of current flowing through the jig in Fig. 6.
[圖8]:為示意地顯示本發明實施形態之治具的圖。 [Fig. 8]: A diagram schematically showing a jig according to an embodiment of the present invention.
[圖9]:為顯示流動於圖8中之治具的電流的本實施形態的特性圖。 [Fig. 9]: A characteristic diagram of the present embodiment showing the current flowing through the jig in Fig. 8. [Fig.
[圖10]:為放大顯示上側虛設板及絕緣板的圖。 [Figure 10]: An enlarged view showing the upper dummy board and insulating board.
[圖11]:為上側虛設板的側視圖。 [Figure 11]: A side view of the upper dummy board.
[圖12]:是顯示上側虛設板可在第1位置與第2位置之間移動的圖。 [Fig. 12]: A diagram showing that the upper dummy board can move between the first position and the second position.
[圖13]:為顯示設於下側夾持器的虛設板及調整構件的圖。 [Fig. 13]: A diagram showing the dummy board and the adjustment member provided on the lower clamp.
[圖14]:為顯示調整構件重疊於虛設板之狀態的俯視圖。 [Fig. 14]: A plan view showing the state where the adjustment member overlaps the dummy board.
[圖15]:是圖5的D-D箭號方向視圖。 [Fig. 15]: A view from the direction of the arrow D-D in Fig. 5.
[圖16]:為第1側面虛設構件的前視圖。 [Figure 16]: A front view of the first side dummy member.
[圖17]:為顯示第1及第2側面虛設構件之上部支承構造的圖。 [Fig. 17]: A diagram showing the supporting structure of the upper portion of the first and second side dummy members.
[圖18]:為第1及第2側面虛設構件之上部支承構造的俯視圖。 [Fig. 18]: A plan view of the upper support structure of the first and second side dummy members.
[圖19]:為顯示第1及第2側面虛設構件之下部支承構造的圖。 [Fig. 19]: A diagram showing the supporting structure of the lower portion of the first and second side dummy members.
20:工件 20: Workpiece
20b:下緣部 20b: lower edge
20b1:與可動部接觸的那一側的面 20b1: The surface on the side that is in contact with the movable part
20b2:與固定部接觸的那一側的面 20b2: The surface on the side that is in contact with the fixed part
520:下側夾持器 520: Lower side gripper
521:固定部 521: Fixed part
521A:第1面 521A: Side 1
521B:第2面 521B: Side 2
521C:側壁 521C: Sidewall
522:螺栓 522: Bolt
523:可動部 523: movable part
524:銷 524: pin
525:螺旋彈簧 525: coil spring
532:下框(支承部) 532: Lower frame (support part)
700:虛設板(dummy board) 700: dummy board
700A:第3面 700A: Side 3
700B:第4面 700B: Side 4
710:螺栓 710: Bolt
720:調整構件 720: adjustment component
730:螺栓 730: Bolt
Claims (6)
Applications Claiming Priority (2)
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JP2019-015828 | 2019-01-31 | ||
JP2019015828 | 2019-01-31 |
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TW202033842A TW202033842A (en) | 2020-09-16 |
TWI723755B true TWI723755B (en) | 2021-04-01 |
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TW109102484A TWI723755B (en) | 2019-01-31 | 2020-01-22 | Workpiece holding jig and surface treatment device |
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JP (1) | JP6909527B2 (en) |
KR (1) | KR20210123336A (en) |
CN (1) | CN113396250A (en) |
TW (1) | TWI723755B (en) |
WO (1) | WO2020158569A1 (en) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1847465A (en) * | 2005-04-14 | 2006-10-18 | 日本梅克特隆株式会社 | Plating method for printing circuit board |
TW201323668A (en) * | 2011-06-30 | 2013-06-16 | Almex Pe Inc | Surface treatment system and workpiece-holding jig |
WO2018062259A1 (en) * | 2016-09-29 | 2018-04-05 | アルメックスPe株式会社 | Workpiece holding jig and surface treatment device |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05148693A (en) * | 1992-01-14 | 1993-06-15 | Toshiba Corp | Copper electroplating jig |
JP5613499B2 (en) * | 2010-08-25 | 2014-10-22 | アルメックスPe株式会社 | Surface treatment equipment |
JP5898540B2 (en) * | 2012-03-22 | 2016-04-06 | アルメックスPe株式会社 | Work holding jig and surface treatment apparatus |
JP6234731B2 (en) * | 2013-08-08 | 2017-11-22 | 上村工業株式会社 | Holder with clamper |
JP6448494B2 (en) * | 2015-07-29 | 2019-01-09 | 株式会社エリアデザイン | Suction plating equipment |
TWI615510B (en) * | 2016-09-05 | 2018-02-21 | 艾里亞設計股份有限公司 | Suction plating apparatus |
-
2020
- 2020-01-22 TW TW109102484A patent/TWI723755B/en active
- 2020-01-23 KR KR1020217027627A patent/KR20210123336A/en unknown
- 2020-01-23 JP JP2020569561A patent/JP6909527B2/en active Active
- 2020-01-23 WO PCT/JP2020/002315 patent/WO2020158569A1/en active Application Filing
- 2020-01-23 CN CN202080011920.7A patent/CN113396250A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1847465A (en) * | 2005-04-14 | 2006-10-18 | 日本梅克特隆株式会社 | Plating method for printing circuit board |
TW201323668A (en) * | 2011-06-30 | 2013-06-16 | Almex Pe Inc | Surface treatment system and workpiece-holding jig |
WO2018062259A1 (en) * | 2016-09-29 | 2018-04-05 | アルメックスPe株式会社 | Workpiece holding jig and surface treatment device |
Also Published As
Publication number | Publication date |
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CN113396250A (en) | 2021-09-14 |
TW202033842A (en) | 2020-09-16 |
KR20210123336A (en) | 2021-10-13 |
WO2020158569A1 (en) | 2020-08-06 |
JP6909527B2 (en) | 2021-07-28 |
JPWO2020158569A1 (en) | 2021-05-20 |
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