CN1394797A - 电子部件包装用封带 - Google Patents

电子部件包装用封带 Download PDF

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Publication number
CN1394797A
CN1394797A CN02124947A CN02124947A CN1394797A CN 1394797 A CN1394797 A CN 1394797A CN 02124947 A CN02124947 A CN 02124947A CN 02124947 A CN02124947 A CN 02124947A CN 1394797 A CN1394797 A CN 1394797A
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China
Prior art keywords
layer
electronic parts
sealing belt
carrier tape
sealing
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Granted
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CN02124947A
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CN1231395C (zh
Inventor
中西久雄
平松正幸
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Sumitomo Bakelite Co Ltd
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Sumitomo Bakelite Co Ltd
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Priority claimed from JP2001193036A external-priority patent/JP2003012027A/ja
Priority claimed from JP2001318816A external-priority patent/JP4213375B2/ja
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Publication of CN1394797A publication Critical patent/CN1394797A/zh
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Publication of CN1231395C publication Critical patent/CN1231395C/zh
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/16—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
    • C09J2301/162—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer the carrier being a laminate constituted by plastic layers only
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/414—Additional features of adhesives in the form of films or foils characterized by the presence of essential components presence of a copolymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C09J2423/006—Presence of polyolefin in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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    • C09J2431/006—Presence of polyvinyl acetate in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Packages (AREA)
  • Packaging Frangible Articles (AREA)
  • Packaging For Recording Disks (AREA)
  • Wrappers (AREA)

Abstract

本发明提供一种能够防止有关剥离强度的故障、安装时的故障，能够低成本生产且透明的封带，即，剥离强度不会过强和过弱，剥离强度的最大值和最小值的差较小且透明性优良的封带。这种封带用于电子部件包装，能够对连续形成容纳电子部件的容纳容器得到的塑料制装载带进行热封，其具有由聚酯、聚丙烯、尼龙中任意一种构成的双轴拉伸薄膜层(层A)，以及处于层A的一面上的相对于乙烯共聚物100重量份混合聚苯乙烯10～100重量份得到的热塑性树脂层(层B)。

Description

电子部件包装用封带
技术领域
本发明涉及在电子部件的保管、运输、安装时保护电子部件不受污染、为实际安装在电子回路基板上具有使之定位、取出的功能的包装体中能够密封形成收纳容器的塑料制装载带的封带(cover tape)。
背景技术
以IC为首，晶体管、二极管、电容器、压电电阻元件等表面安装用电子部件一般根据电子部件的形状包装在连续形成了能收纳的轧纹成型的容器得到的塑料制装载带以及能够密封装载带的封带构成的包装体中供给。作为内容物的电子部件在将包装体的封带剥离后，自动取出，在电子回路基板上进行表面安装。近年来，电子部件不断小型化，变得质量轻且厚度薄。
另一方面，表面安装速度不断高速化，由装载带剥离封带的速度也随之高速化。因此，剥离时的强度(以下称为剥离强度)或变强或变弱的波动现象显著出现，包装的电子部件从装载带中飞出的所谓跳跃故障增加。
包装的电子部件比较大时，多数情况下在运输途中为了防止从装载带飞出，预先将剥离强度设定为较强。但是，如果这时剥离强度经时变化，剥离强度变得过强，则安装时有时封带不能顺利剥离，不能取出电子部件，或者发生封带断裂的故障。
以前，为了防止有关剥离强度的故障，通过采用干式层压法或挤出层压法将粘结剂层中混合数种树脂制膜得到的薄膜与双轴拉伸聚酯膜等作为基材层的薄膜胶合，满足该目的。
另外，为了防止封带断裂等安装时的故障，通过采用干式层压法等将2张拉伸薄膜胶合，使基材层强韧化，满足该目的。
但是，这些对策均由制造薄膜的工序和胶合的层压工序构成，由于制造工序长，耗费制造成本，相对于电子部件近年来的低成本化来说比较贵。
另外，作为内容物的电子部件在将包装体的封带剥离后，自动取出，在电子回路基板上进行表面安装。这时，如果剥离强度的最大值和最小值的差较大，则装载带起伏，有时电子部件会飞出，如果剥离强度过强，则有时封带断裂。另外，如果过弱，则存在达到安装工序之前封带就剥落，导致电子部件脱落的问题。
发明内容
本发明提供一种能够防止上述有关剥离强度的故障、安装时的故障，能够低成本生产且透明的封带。
另外，通过缩短干式层压、挤出层压等制造工序，能够减少有机溶剂的用量，减少环境污染，并能够节约能量。
本发明还提供一种剥离强度不会过强和过弱、剥离强度的最大值和最小值的差较小且透明性优良的封带。
具体而言，本发明提供以下封带。
(1)一种电子部件包装用封带，是能够对连续形成容纳电子部件的容纳容器得到的塑料制装载带进行热封的封带，其特征在于，该封带具有由聚酯、聚丙烯、尼龙中任意一种构成的双轴拉伸薄膜层(层A)，以及处于层A的一面上的相对于乙烯共聚物100重量份混合聚苯乙烯10～100重量份得到的热塑性树脂层(层B)。
(2)如(1)所述的电子部件包装用封带，在层A和层B之间，层压选自未拉伸聚酯层、未拉伸尼龙层和未拉伸聚丙烯层的1种以上的层。
(3)如(1)或(2)所述的电子部件包装用封带，层B中含有的乙烯共聚物的共聚成分是选自醋酸乙烯酯、丙烯酸、丙烯酸酯、甲基丙烯酸、甲基丙烯酸酯及离子交联聚合物中的1种。
(4)如(1)或(2)所述的电子部件包装用封带，层B中含有的乙烯共聚物的共聚比例是，相对于100重量份乙烯而言，共聚成分为17～90重量份。
(5)如(1)或(2)所述的电子部件包装用封带，层B的厚度为0.5～50μm。
(6)如(1)或(2)所述的电子部件包装用封带，其特征在于，将该封带和装载带热封后，将封带从装载带剥离时，层B凝集破坏剥离。
(7)如(1)或(2)所述的电子部件包装用封带，在层B中分散氧化锡、氧化锌、氧化钛、碳黑中任意一种或其组合构成的导电性微粉末和/或表面活性剂，层B表面的电阻值为1×1013Ω/□以下。
(8)如(1)或(2)所述的电子部件包装用封带，在层B表面设有将氧化锡、氧化锌、氧化钛、碳黑中任意一种或其组合构成的导电性微粉末和/或表面活性剂分散得到的抗静电层，该表面的电阻值为1×1013Ω/□以下。
(9)如(1)或(2)所述的电子部件包装用封带，将该封带和装载带热封后，将封带从装载带剥离时的强度是，每1mm宽的密封的封带为0.1～1.3N。
(10)如(1)或(2)所述的电子部件包装用封带，全光线透过率为70％以上，浊度为80％以下。
(11)如(1)或(2)所述的电子部件包装用封带，将该封带和装载带热封后，将封带从装载带剥离时的剥离强度的最大值和最小值的差是，每1mm宽的密封的封带为0.01～0.4N。
(12)电子部件包装用封带，是能够对连续形成容纳电子部件的容纳容器得到的塑料制装载带进行热封的封带，其特征在于，从与装载带热封的一侧起依次由粘结剂层、基材层至少2层构成，层压这些层的方法为共挤出法，且基材层为聚酯、尼龙、聚丙烯中任意一种。
(13)电子部件包装用封带，是能够对连续形成容纳电子部件的容纳容器得到的塑料制装载带进行热封的封带，其特征在于，从与装载带热封的一侧起依次由粘结剂层、中间层、基材层至少3层构成，层压中间层和基材层的方法为共挤出法，层压粘结剂层的方法为凹版涂布法。
(14)如(12)所述的电子部件包装用封带，粘结剂层由乙烯-α-烯烃共聚物构成，该α-烯烃为醋酸乙烯酯、丙烯酸、丙烯酸酯、甲基丙烯酸、甲基丙烯酸酯中任意一种。
(15)如(13)所述的电子部件包装用封带，中间层由乙烯-α-烯烃共聚物构成，该α-烯烃为醋酸乙烯酯、丙烯酸、丙烯酸酯、甲基丙烯酸、甲基丙烯酸酯中任意一种。
(16)如(13)或(15)所述的电子部件包装用封带，粘结剂层是α-烯烃为醋酸乙烯酯、丙烯酸、丙烯酸酯、甲基丙烯酸、甲基丙烯酸酯中任意一种的乙烯-α-烯烃共聚物，或者是聚甲基丙烯酸酯、氯乙烯-醋酸乙烯酯共聚物、氯化聚丙烯或聚氨酯。
(17)如(12)～(15)中任意一项所述的电子部件包装用封带，封带的全光线透过率为70％以上，浊度为60％以下。
附图说明
图1是表示本发明封带的层结构的截面图。
图2是表示本发明实施例中例举的封带的层结构的截面图。
图3是表示本发明封带粘结在装载带上时其使用状态的截面图。
图1～图3中的数字具有以下含义。
1：封带
2：双轴拉伸薄膜(层A)
3：热封层(层B)
4：除去层B的共挤出层
5：聚氨酯类粘结剂层
6：被密封的部分
7：装载带
发明详述
以下通过图1说明本发明第1种方式的封带1的构成要素的一个实例，层A为双轴拉伸聚酯薄膜、双轴拉伸聚丙烯薄膜、双轴拉伸尼龙薄膜中的任意一种双轴拉伸薄膜，是厚度为6～100μm的透明且刚性高的薄膜。
为了提高封带的机械强度，也可以层压二层以上该拉伸薄膜。将层B制膜的方法选择共挤出法时，也可以为了相同的目的在层A和层B之间层压未拉伸的聚酯层、尼龙层、聚丙烯层。
层B是相对于乙烯共聚物100重量份混合聚苯乙烯10～100重量份得到的热塑性树脂层。
该乙烯共聚物中含有的共聚成分由醋酸乙烯酯、丙烯酸、丙烯酸酯、甲基丙烯酸、甲基丙烯酸酯、离子交联聚合物中选择。
该聚苯乙烯的添加份数如果低于10重量份，则将装载带与封带热封后，剥离封带时，剥离强度的最大值和最小值的差达到0.4N以上，难以顺利剥离。
如果多于100重量份，则浊度达到80％以上，而且薄膜变脆，与基材层的密合变弱，引起层间剥离。
为了提高与基材的密合强度，在层A和层B之间也可以设置聚乙烯、聚乙烯类共聚物、聚氨酯类粘结剂或环氧类粘结剂。
该聚苯乙烯可以选择含有橡胶成分提高了耐冲击性的高冲击强度聚苯乙烯(HIPS)等各种聚苯乙烯，从透明性、热稳定性的方面来看，优选通用聚苯乙烯(GPPS)。
而且，从装载带剥离封带时，优选层B发生凝集破坏。采用乙烯共聚物和聚苯乙烯的组合，即使是在装载带和封带的界面发生剥离的界面剥离时，有时也能顺利剥离，但是如果层B发生凝集破坏，则封带和装载带的粘结面与剥离面不同，因此在制造封带时可以控制剥离强度，易于稳定化。
层B中含有的乙烯共聚物的共聚比例是相对于乙烯100重量份，共聚成分为17～90重量份。
如果少于17重量份，虽然对装载带能够热封，但密封后存在剥离强度随时间降低的趋势，有时会最终剥落。
如果共聚成分多于90重量份，虽然同样能够对装载带进行热封，但密封后存在剥离强度随时间上升的趋势，有时最终不能剥离。另外，多于90重量份的乙烯共聚物市售的商品少，是特殊商品，成为成本上升的原因。
层B的厚度优选为0.5～50μm。
如果低于0.5μm，则与基材的密合变弱，引起层间剥离。
如果超过50μm，则透明性显著变差，浊度超过80％，内容物的目视性降低。
作为层压方法，采用共挤出、挤出涂覆或凹版涂布器。
为了防止包装的电子部件被静电破坏，或者由于电子部件的大小较小在安装工序中剥离封带时由于静电附着在封带上等故障，优选在层B上分散抗静电材料。另外，也可以在层B的上面设置分散了抗静电剂的层。
作为抗静电剂可以例举表面活性剂、导电性微粉末，由于后者抗静电性能的偏移较小，因此更优选。
作为导电性微粉末，例如氧化锡、氧化锌、氧化钛、碳黑。这些物质单独使用即可得到效果，但是也可以2种以上组合使用。另外，也可以向其中添加表面活性剂。但是，尽管在使这些物质分散时根据材料有所不同，但必须配制达到制膜时的表面电阻值为1×1013Ω/□以下。如果超过1×1013Ω/□，则有时会发生上述静电故障。
该封带必须层压达到全光线透过率为70％以上，浊度为80％以下。如果全光线透过率低于70％、浊度超过80％，尽管取决于检验员，但是在检查用封带包装电子部件后内容物是否正确***时，变得很困难。
其次，采用实施例说明本发明第2种方式的封带的构成要素。下述实施例11是采用共挤出法依次层压尼龙(以下简称为Ny)、马来酸酐改性PE层(以下简称为AD)、低密度聚乙烯层(以下简称为LDPE)、AD、乙烯-醋酸乙烯酯共聚物(以下简称为EVA)得到的薄膜。Ny是权利要求12中例举的基材层，EVA是粘结剂层。LDPE层是以降低成本为目的作为中间层设置的。如果没有降低成本的必要性，也可以按相同的厚度增加粘结剂层的厚度。AD发挥用于提高各层的层间强度的粘结剂的作用。
Ny也可以用聚酯或聚丙烯代用。另外，EVA也可以用权利要求14中例举的任何一种乙烯-α-烯烃共聚物代替。
在以下叙述的实施例、比较例中，同样也可以用权利要求中例举的任意树脂代替基材层、中间层和粘结剂层。
比较例11与实施例11的构成几乎相同，但基材层的Ny是使用双轴拉伸尼龙薄膜，在其一面设有聚氨酯类热固性粘结剂即增粘涂层材料(以下简称为AC)，采用挤出层压法在该表面上依次层压LDPE、EVA得到的薄膜。
实施例11与比较例11相比，由于没有必要预先将Ny制膜，可以缩短1个工序。
实施例12是采用共挤出法依次层压Ny、AD、Ny、AD、EVA后，对EVA表面进行电晕处理后，采用凹版涂布法涂覆聚甲基丙烯酸甲酯(以下简称为PMMA)得到的薄膜。
对此相对，比较例12中2个Ny均使用双轴拉伸尼龙薄膜，在一个薄膜上涂覆聚氨酯类热固性粘结剂即干式层压用粘结剂(以下简称为DL)，采用干式层压法与另一Ny粘结。同样，得到的层压薄膜的一面涂覆DL，采用干式层压法与EVA薄膜粘结。PMMA层采用与实施例12相同的方法制膜。
实施例12与比较例12相比，由于没有必要预先将2层Ny膜、EVA制膜，可以缩短3个工序。
实施例13、比较例13是采用与实施例12、比较例12同样的制备方法，用LDPE代替EVA，用甲基丙烯酸甲酯-甲基丙烯酸丁酯共聚物(以下简称为PMMA-BMA)代替PMMA的实例。但是，为了赋予导电性，在PMMA-BMA中混合掺杂有铝的氧化锌(以下简称为ZnO)进行涂覆。
实施例13与比较例13相比，由于没有必要预先将2层Ny膜、LDPE制膜，可以缩短3个工序。
实施例14是采用共挤出法依次层压Ny、AD、LDPE后，对LDPE表面进行电晕处理后，采用凹版涂布法用PMMA-BMA涂覆，为了使得到的薄膜强韧化，采用干式层压法将Ny侧与双轴拉伸聚对苯二甲酸乙二醇酯薄膜(以下简称为PET)粘结得到的薄膜。该实施例也与实施例13同样，为了赋予导电性，在PMMA-BMA中混合掺杂有锑的氧化锡(以下简称为ATO)进行涂覆。
与此相对，比较例14是采用干式层压法依次层压PET、DL、Ny、DL、LDPE后，对LDPE表面进行电晕处理后，与实施例14同样进行涂覆得到的薄膜。
实施例14与比较例14相比，由于没有必要预先将Ny、LDPE制膜，可以分别缩短2个工序。
实施例15是采用共挤出法依次层压Ny、AD、使用金属茂催化剂生产的线性低密度聚乙烯(以下简称为MLLDPE)后，对MLLDPE表面进行电晕处理后，采用凹版涂布法用氯乙烯-醋酸乙烯酯共聚物(以下简称为PVC-VA)进行涂覆，采用干式层压法将所得薄膜的Ny侧与PET粘结得到的薄膜。
与此相对，比较例15是采用干式层压法依次层压PET、DL、Ny、DL、MLLDPE后，对MLLDPE表面进行电晕处理后，采用凹版涂布法用PVC-VA涂覆得到的薄膜。
实施例15与比较例15相比，由于没有必要预先将Ny、MLLDPE制膜，可以缩短2个工序。
实施例16、比较例16是采用干式层压法将实施例11、比较例11得到的薄膜的Ny侧与PET粘结得到的薄膜。
实施例16与比较例16相比，由于没有必要预先将Ny制膜，可以缩短1个工序。
在本发明的方式中，基材层的表面不具有抗静电剂层，但是更优选具有抗静电剂层。抗静电剂层也可以使用表面活性剂；聚吡咯类、聚苯胺类、聚噻吩类等π电子共轭类导电性聚合物；或者由氧化锡、氧化铟、氧化锌、氧化钛、碳黑、Si类有机化合物、聚亚烷基二醇与高氯酸锂等高氯酸盐的复合体等导电性填充物构成，为了提高抗静电性，在导电性填充物中可以使用掺杂锑等得到的物质。
为了使权利要求12和13中例举的粘结剂层具有抗静电性，可以在粘结剂层表面涂覆导电性聚合物、导电性填充物、表面活性剂等抗静电剂，或者将相同的抗静电剂混入粘结剂中。
该封带必须层压达到全光线透过率为70％以上，浊度为60％以下，如果全光线透过率低于70％或浊度超过60％，尽管取决于检验员，但是在检查用封带包装电子部件后内容物是否正确***时，变得很困难。发明的最佳实施方式
以下列出本发明的实施例，但是本发明并不受这些实施例任何限定。
实施例1～7以及比较例1
实施例1～7为本发明第1种方式的实施例。
将表1中列出的双轴拉伸薄膜(第1层，相当于本发明的层A)以及采用共挤出法将表1中列出的第2层～第7层以及热封层(相当于本发明的层B)制膜得到的薄膜干式层压，得到图2所示层结构的封带。
将得到的封带切割成5.5mm宽后，在密封温度160℃下与8mm宽的聚苯乙烯制装载带进行密封，测定剥离强度。
表面电阻值采用SIMCO制Work Surface Tester进行测定，全光线透过率、浊度按照JIS K7105进行测定。
实施例和比较例的结果列于表1。
各层的右边数字表示各层的厚度(单位：μm)，热封层框内的乙烯共聚物栏表示乙烯共聚物的共聚成分。聚苯乙烯栏的PS下的数字是指添加材料(PS)相对于乙烯共聚物100重量份的添加重量份。括号内的数字是指乙烯共聚物的共聚比例。全光线透过率以下右边的框内的符号表示各项的单位。
表1
实施例1 实施例2 实施例3 实施例4 实施例5 实施例6 实施例7 比较例1
基材 第1层 O-PET 12 O-PET 12 O-PP 12 O-PET 9 O-Ny 15 O-PP 20 O-PET 25 O-Ny 12
共挤出层 第2层 DL 2 DL 2 DL 2 DL 2 DL 2 DL 2 DL 2 DL 2
第3层 PET 5 PET 5 Ny 25 Ny 25 Ny 25 Ny 25 Ny 25 Ny 25
第4层 AD 3 AD 3 AD 3 AD 3 AD 3 AD 3 AD 3 AD 3
第5层 Ny 12 Ny 12 无 无 无 无 无 无
第6层 AD 3 AD 3 无 无 无 无 无 无
第7层 LDPE 20 LDPE 20 无 无 无 无 无 无
热封层乙烯共聚物聚苯乙烯抗静电剂 EVA(40)100PS40 8 EVA(40)100PS40氧化锡280 1 EVA(40)100PS10 25 EMMA(49)100PS20 25 EEA(52)100PS30表面活性材料0.5 25 ION(17)100PS40 25 EVA(40)100PS50 25 EVA(40)100PS0 25
涂层 抗静电层 无 无 无 无 无 无 氧化锡 1 无
光线透过率 ％ 88 88 90 92 92 91 71 89
浊度 ％ 53 21 65 75 79 79 79 3
剥离强度 N 0.18 0.18 1.24 0.79 0.55 0.46 0.42 1.29
最大值-最小值 N 0.09 0.09 0.35 0.24 0.19 0.09 0.09 0.43
表面电阻值 Ω/□ ＞1.0×1012 2.6×107 ＞1.0×1012 ＞1.0×1012 9.2×1012 ＞1.0×1012 3.2×107 ＞1.0×1012
比较例2
按照与实施例7相同的组成，将PS的添加份数每次增加10重量份，实施同样的评价，虽然达到100重量份没有问题，但是在达到110重量份的时候，发生膜断裂，不能制膜。
表1中的符号如下所述。
PET：聚对苯二甲酸乙二醇酯
PP：聚丙烯
Ny：尼龙
O-：双轴拉伸的含意。
LDPE：低密度聚乙烯
PS：聚苯乙烯
EVA：乙烯-醋酸乙烯酯共聚物
EEA：乙烯-丙烯酸乙酯共聚物
EMMA：乙烯-甲基丙烯酸甲酯共聚物
ION：离子交联聚合物
AD：粘结性树脂(聚乙烯酸改性物)
DL：干式层压粘结剂层
实施例11～16以及比较例11～16
其次，列出本发明第二种方式的实施例。关于实施例和比较例的层结构、制备方法的详细内容，由于上面已经叙述，因而省略。以下列出本发明的实施例和比较例的大致层结构及其特性，但是本发明并不受这些实施例的任何限定。
将表2和表3得到的封带切割成5.5mm宽后，在180℃下对8mm宽的以聚氯乙烯为材料的装载带进行密封，5分钟后测定剥离强度得到的值列于剥离强度栏。
全光线透过率、浊度按照JIS K7105进行测定。
以下，表2表示实施例的层结构、剥离强度、全光线透过率以及浊度的测定值，表3表示比较例的层结构、剥离强度、全光线透过率以及浊度的测定值。
表2
层 实施例11 实施例12 实施例13 实施例14 实施例15 实施例16
第1层 Ny       15 Ny       12 Ny           12 PET           9 PET        12 PET      16
第2层 AD        2 AD        2 AD            2 DL            2 DL          2 DL        2
第3层 LDPE     15 Ny       12 Ny           12 Ny           15 Ny         15 Ny       15
第4层 AD        2 AD        2 AD            2 AD            2 AD          2 AD        2
第5层 EVA      15 EVA      40 LDPE         40 LDPE         40 MLLDPE     30 LDPE     15
第6层 PMMA      1 PMMA-BMA      1+ZnO PMMA-BMA      1+ATO PVC-VA      1 AD        2
第7层 EVA      15
剥离强度        0.35        0.41            0.25            0.28          0.51        0.48
全光线透过率          88          89              78              90            89          87
浊度          15          17              54              26            21          15
表3
层 比较例11 比较例12 比较例13 比较例14 比较例15 比较例16
第1层 Ny       15 Ny     12 Ny           12 PET           9 PET        12 PET      16
第2层 AC        1 DL      2 DL            2 DL            2 DL          2 DL        2
第3层 LDPE     15 Ny     12 Ny           12 Ny           15 Ny         15 Ny       15
第4层 EVA      15 DL      2 DL            2 DL            2 DL          2 AC        1
第5层 EVA    40 LDPE         40 LDPE         40 MLLDPE     30 LDPE     15
第6层 PMMA    1 PMMA-BMA      1+ZnO PMMA-BMA      1+ATO PVC-VA      1 EVA      15
第7层
剥离强度        0.38      0.42            0.28            0.26          0.52        0.46
全光线透过率          89        90              78              90            89          90
浊度          16        16              53              28            27          14
各层的栏中右边的数字表示各层的厚度(单位μm)。表中，剥离强度的单位为N，全光线透过率的单位为％，浊度的单位为％。
如上述实施例表明的那样，如果按照本发明，剥离强度不会过强和过弱，另外可以控制剥离强度的最大值和最小值的差较小，因此可以防止安装工序中由于剥离强度引起的故障。
另外，由于密封面的表面电阻值为1×1013Ω/□以下，因此可以防止该工序中静电引起的故障。
由于层压达到全光线透过率为70％以上、浊度为80％以下，因此电子部件包装后内容物的确认变得容易。
另外，按照本发明，能够采用简单的制备工序，提供剥离强度稳定的透明封带。

Claims (17)

1、一种电子部件包装用封带，是能够对连续形成容纳电子部件的容纳容器的塑料制装载带进行热封的封带，其特征在于，该封带具有由聚酯、聚丙烯、尼龙中任意一种构成的双轴拉伸薄膜层(层A)，以及处于层A的一面上的相对于乙烯共聚物100重量份混合聚苯乙烯10～100重量份得到的热塑性树脂层(层B)。
2、如权利要求1所述的电子部件包装用封带，在层A和层B之间，层压选自未拉伸聚酯层、未拉伸尼龙层和未拉伸聚丙烯层的1种以上的层。
3、如权利要求1或2所述的电子部件包装用封带，层B中含有的乙烯共聚物的共聚成分是选自醋酸乙烯酯、丙烯酸、丙烯酸酯、甲基丙烯酸、甲基丙烯酸酯及离子交联聚合物中的1种。
4、如权利要求1或2所述的电子部件包装用封带，层B中含有的乙烯共聚物的共聚比例是，相对于乙烯100重量份，共聚成分为17～90重量份。
5、如权利要求1或2所述的电子部件包装用封带，层B的厚度为0.5～50μm。
6、如权利要求1或2所述的电子部件包装用封带，其特征在于，将该封带和装载带热封后，将封带从装载带剥离时，层B发生凝集破坏剥离。
7、如权利要求1或2所述的电子部件包装用封带，在层B中分散氧化锡、氧化锌、氧化钛、碳黑中任意一种或其组合构成的导电性微粉末和/或表面活性剂，层B表面的电阻值为1×1013Ω/□以下。
8、如权利要求1或2所述的电子部件包装用封带，在层B表面设有将氧化锡、氧化锌、氧化钛、碳黑中任意一种或其组合构成的导电性微粉末和/或表面活性剂分散得到的抗静电层，该表面的电阻值为1×1013Ω/□以下。
9、如权利要求1或2所述的电子部件包装用封带，将该封带和装载带热封后，将封带从装载带剥离时的强度是，每1mm宽的密封的封带为0.1～1.3N。
10、如权利要求1或2所述的电子部件包装用封带，全光线透过率为70％以上，浊度为80％以下。
11、如权利要求1或2所述的电子部件包装用封带，将该封带和装载带热封后，将封带从装载带剥离时的剥离强度的最大值和最小值的差是，每1mm宽的密封的封带为0.01～0.4N。
12、电子部件包装用封带，是能够对连续形成容纳电子部件的容纳容器的塑料制装载带进行热封的封带，其特征在于，从与装载带热封的一侧起依次由粘结剂层、基材层至少2层构成，层压这些层的方法为共挤出法，且基材层为聚酯、尼龙、聚丙烯中任意一种。
13、电子部件包装用封带，是能够对连续形成容纳电子部件的容纳容器的塑料制装载带进行热封的封带，其特征在于，从与装载带热封的一侧起依次由粘结剂层、中间层、基材层至少3层构成，层压中间层和基材层的方法为共挤出法，层压粘结剂层的方法为凹版涂布法。
14、如权利要求12所述的电子部件包装用封带，粘结剂层由乙烯-α-烯烃共聚物构成，该α-烯烃为醋酸乙烯酯、丙烯酸、丙烯酸酯、甲基丙烯酸、甲基丙烯酸酯中任意一种。
15、如权利要求13所述的电子部件包装用封带，中间层由乙烯-α-烯烃共聚物构成，该α-烯烃为醋酸乙烯酯、丙烯酸、丙烯酸酯、甲基丙烯酸、甲基丙烯酸酯中任意一种。
16、如权利要求13或15所述的电子部件包装用封带，粘结剂层是α-烯烃为醋酸乙烯酯、丙烯酸、丙烯酸酯、甲基丙烯酸、甲基丙烯酸酯中任意一种的乙烯-α-烯烃共聚物，或者是聚甲基丙烯酸酯、氯乙烯-醋酸乙烯酯共聚物、氯化聚丙烯或聚氨酯。
17、如权利要求12～15中任意一项所述的电子部件包装用封带，封带的全光线透过率为70％以上，浊度为60％以下。
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