TWI580578B - 覆蓋帶與其製程方法 - Google Patents

覆蓋帶與其製程方法 Download PDF

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TWI580578B
TWI580578B TW105121469A TW105121469A TWI580578B TW I580578 B TWI580578 B TW I580578B TW 105121469 A TW105121469 A TW 105121469A TW 105121469 A TW105121469 A TW 105121469A TW I580578 B TWI580578 B TW I580578B
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layer
antistatic
heat seal
cover tape
substrate
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TW105121469A
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TW201801902A (zh
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潘宏瑋
許立昇
顏景輝
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俊馳材料科技股份有限公司
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Priority to TW105121469A priority Critical patent/TWI580578B/zh
Priority to CN201610594596.1A priority patent/CN107584820A/zh
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Publication of TWI580578B publication Critical patent/TWI580578B/zh
Priority to JP2017122175A priority patent/JP6429175B2/ja
Priority to US15/631,645 priority patent/US20180009209A1/en
Publication of TW201801902A publication Critical patent/TW201801902A/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/15—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state
    • B32B37/153—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state at least one layer is extruded and immediately laminated while in semi-molten state
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/022—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the choice of material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/16—Articles comprising two or more components, e.g. co-extruded layers
    • B29C48/18—Articles comprising two or more components, e.g. co-extruded layers the components being layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B32B7/14—Interconnection of layers using interposed adhesives or interposed materials with bonding properties applied in spaced arrangements, e.g. in stripes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
    • B32B9/007—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile comprising carbon, e.g. graphite, composite carbon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B9/045—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/16—Making multilayered or multicoloured articles
    • B29C45/1657—Making multilayered or multicoloured articles using means for adhering or bonding the layers or parts to each other
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/03—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the shape of the extruded material at extrusion
    • B29C48/07—Flat, e.g. panels
    • B29C48/08—Flat, e.g. panels flexible, e.g. films
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/16—Articles comprising two or more components, e.g. co-extruded layers
    • B29C48/18—Articles comprising two or more components, e.g. co-extruded layers the components being layers
    • B29C48/185—Articles comprising two or more components, e.g. co-extruded layers the components being layers comprising six or more components, i.e. each component being counted once for each time it is present, e.g. in a layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/16—Articles comprising two or more components, e.g. co-extruded layers
    • B29C48/18—Articles comprising two or more components, e.g. co-extruded layers the components being layers
    • B29C48/21—Articles comprising two or more components, e.g. co-extruded layers the components being layers the layers being joined at their surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2023/00—Use of polyalkenes or derivatives thereof as moulding material
    • B29K2023/04—Polymers of ethylene
    • B29K2023/06—PE, i.e. polyethylene
    • B29K2023/0608—PE, i.e. polyethylene characterised by its density
    • B29K2023/0625—LLDPE, i.e. linear low density polyethylene
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2023/00—Use of polyalkenes or derivatives thereof as moulding material
    • B29K2023/04—Polymers of ethylene
    • B29K2023/06—PE, i.e. polyethylene
    • B29K2023/0608—PE, i.e. polyethylene characterised by its density
    • B29K2023/0633—LDPE, i.e. low density polyethylene
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2023/00—Use of polyalkenes or derivatives thereof as moulding material
    • B29K2023/04—Polymers of ethylene
    • B29K2023/06—PE, i.e. polyethylene
    • B29K2023/0608—PE, i.e. polyethylene characterised by its density
    • B29K2023/065—HDPE, i.e. high density polyethylene
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/0005—Condition, form or state of moulded material or of the material to be shaped containing compounding ingredients
    • B29K2105/0008—Anti-static agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/05—5 or more layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2270/00—Resin or rubber layer containing a blend of at least two different polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2274/00—Thermoplastic elastomer material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/21—Anti-static
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/31—Heat sealable
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/732—Dimensional properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2405/00—Adhesive articles, e.g. adhesive tapes

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Description

覆蓋帶與其製程方法
本發明係有關一種覆蓋帶與其製程方法，特別是關於一種多層材料一次擠壓成型的覆蓋帶與其製程方法。
電子元件例如積體電路晶片在組裝於印刷電路板上之前一般是收納於載帶(carrier tape)中。載帶具有多個可容納電子元件的收納袋或收納槽，並以覆蓋帶以熱封的方式將電子元件包裝在載帶之內。當進行組裝時，先將覆蓋帶剝離，接著沿載帶方向由自動化設備例如機械手臂將電子元件逐一取出放置於印刷電路板上。
覆蓋帶一般須具備足夠的透光率以利於觀察辨識載帶內的電子元件。覆蓋帶同時必須具備良好的抗靜電性質，以保護載帶內的電子元件免於受到靜電的損害。
傳統的覆蓋帶主要包含基材層、中間層、剝離層以及熱封層。基材層與熱封層一般均塗佈或添加抗靜電材料，基材層多為聚對酞酸乙二酯 (PET) 材質，而熱封層多為丙烯酸系樹脂。中間層、剝離層以及熱封層則必須分別形成，再採用塗佈(coating)或積層(lamination)的方式利用黏膠層附著在基材層上。傳統的覆蓋帶使用擠壓製程的部分一般僅限於基材或中間層等，後續再將熱封層及抗靜電層等具特殊功能的材料以積層或塗佈等方式附著於基材上。因此傳統覆蓋帶需要多個製程步驟才能完成。
本發明則提出一種覆蓋帶之製程方法，利用直接擠壓的方式將至少包含基材層、中間層、以及熱封層的覆蓋帶一次成型，免除傳統覆蓋帶製程所需的多個製程步驟。
鑑於上述，本發明實施的目的之一在於提供一種直接擠壓成型之覆蓋帶及其製程方法。覆蓋帶包含依序排列之抗靜電層、第一中間層、第一連接層、基材層、第二連接層、第二中間層與具抗靜電性質之熱封層，其中抗靜電層、第一中間層、第一連接層、基材層、第二連接層、第二中間層與熱封層係經共擠壓熔融黏合。
於一實施例中，本發明提出一種覆蓋帶之製程方法，包含以下步驟。首先提供抗靜電層材料、第一中間層材料、第一連接層材料、基材層材料、第二連接層材料、第二中間層材料與熱封層材料。接著將抗靜電層材料、第一中間層材料、第一連接層材料、基材層材料、第二連接層材料、第二中間層材料與熱封層材料分別加入各自對應的七個擠壓設備內，並設定各個擠壓設備對應抗靜電層材料、第一中間層材料、第一連接層材料、基材層材料、第二連接層材料、第二中間層材料與熱封層材料之塑化溫度。最後將抗靜電層材料、第一中間層材料、第一連接層材料、基材層材料、第二連接層材料、第二中間層材料與熱封層材料加熱成熔融狀，並黏合成單一薄膜。
於另一實施例中，本發明提出的覆蓋帶之製程方法包含將具有抗靜電層、中間層、基材層、連接層及熱封層之覆蓋帶之七層材料備料後分別加入各自對應的七個擠壓設備內，以各自對應之塑化溫度一併進行共擠壓黏合，以形成覆蓋帶。其中覆蓋帶各層之排列順序為抗靜電層、中間層、連接層、基材層、連接層、中間層及熱封層。
本發明的一些實施例將詳細描述如下。然而，除了如下描述外，本發明還可以廣泛地在其他的實施例施行，且本發明的範圍並不受實施例之限定，其以之後的專利範圍為準。再者，為提供更清楚的描述及更易理解本發明，圖式內各部分並沒有依照其相對尺寸繪圖，某些尺寸與其他相關尺度相比已經被變更；不相關之細節部分也未完全繪出，以求圖式的簡潔。
第一圖為根據本發明一實施例之覆蓋帶之截面圖。於此實施例中， 覆蓋帶至少包含一基材層10、二連接層12、二中間層13、一抗靜電層14及一熱封層15。連接層12主要係連結基材層10與中間層13。抗靜電層14具有抗靜電功能，熱封層15用於將覆蓋帶熱封於載帶同時亦具有抗靜電功能。於此實施例中，覆蓋帶的各層排列方式為抗靜電層14/中間層13/連接層12/基材層10/連接層12/中間層13/熱封層15，如第一圖所示。第一圖所示之覆蓋帶僅為本發明一較佳實施例，並非限制。本發明之覆蓋帶可具有其他排列結構，但本發明之覆蓋帶必須具有熱封層與抗靜電層雙面抗靜電特性以及各層同步共擠壓成型。相較於傳統利用塗佈或積層的方式製作的覆蓋帶，本發明之覆蓋帶係利用共擠壓的方式，使各層在熔融狀態下互相黏著，冷卻後形成厚度範圍為約40至70μm的薄膜。
於本發明之一實施例中，基材層10之材料包含聚醯胺6(Polyamide 6)或聚醯胺66(polyamide 66)或聚醯胺6/66共聚合物(polyamide 6/66 co-polymer)或聚對酞酸乙二酯(PET)，但不限於此。中間層13之材料包含聚烯烴類(polyolefin)，例如線性低密度聚乙烯(Polyethylene)、高密度聚乙烯及低密度聚乙烯、聚丙烯(Polypropylene)或聚丙烯共聚物(Copolymer)等，但不限於此。
連接基材層10與中間層13的連接層12之材料包含酸酐改性之聚乙烯或聚丙烯以及聚烯烴類，例如線性低密度聚乙烯、高密度聚乙烯及低密度聚乙烯、聚丙烯或聚丙烯共聚物等，但不限於此。
抗靜電層14之材料包含聚烯烴類與抗靜電劑，但不限於此；抗靜電劑包含高分子型抗靜電劑、離子型抗靜電劑或奈米碳管，抗靜電劑的添加重量比為約15-30%，使本發明之覆蓋帶二面之表面電阻值介於1.0E+9至9.0E+11 歐姆(Ω)，測定方法使用絕緣材料的直流電阻或電導的標準測試方法ASTM D257，測定條件為相對溼度(RH)為50%，溫度為攝氏23℃。
熱封層15之材料包含抗靜電劑、增黏劑(氫化石油樹脂) 及熱塑性彈性體、丙烯酸系樹脂及礦物油等，但不限於此；抗靜電劑包含高分子型抗靜電劑，抗靜電劑的添加重量比例為約15-30%，使本發明之覆蓋帶二面之表面電阻值介於1.0E+9至9.0E+11歐姆(Ω)。測定方法同樣為絕緣材料的直流電阻或電導的標準測試方法ASTM D257，測定條件為相對溼度為50%，溫度為攝氏23℃。
本發明之覆蓋帶可具有各種排列結構，但必須具有熱封層與抗靜電層雙面抗靜電特性，以及必須各層同步共擠壓成型。在本發明的一實施例中，覆蓋帶之製程方法係將基材層、連接層、中間層、抗靜電層及熱封層之各層材料備料後一併進行共擠壓 ，即特殊功能的原料與基材一同擠壓成型以形成覆蓋帶。與傳統的覆蓋帶不同，本發明之覆蓋帶並無任何一層係使用塗佈或積層的方式製作。
在本發明的一實施例中，基材層的材料包含聚醯胺6及聚醯胺6/66共聚合物乾拌混合，聚醯胺6佔重量百分比20-80%。
中間層的材料包含線性低密度聚乙烯 (LLDPE)。
連接層的材料包含酸酐改性之聚乙烯與線性低密度聚乙烯，酸酐改性之聚乙烯之比例範圍為20-40%、線性低密度聚乙烯之比例範圍為80-60%，二者乾拌後備用。
抗靜電層的材料包含高分子型抗靜電劑與線性低密度聚乙烯，高分子型抗靜電劑與線性低密度聚乙烯以1:5比例，加入抗氧化助劑、開口劑(避免製程中與熱封層黏死)及內滑劑，以雙螺桿壓出機混合造粒，粒子於攝氏90℃乾燥後備用。
熱封層的材料包含高分子型抗靜電劑、增黏劑、丙烯酸系樹脂、熱塑性彈性體、礦物油，四種主要原料照以比例(10-20): (10-20): (20-30): (35-45): (5-10)混合，加入抗氧化助劑、開口劑(避免製程中與抗靜電層黏死)及內滑劑，以雙螺桿壓出機混合造粒，粒子於攝氏90℃乾燥後備用。
最後將基材層、二中間層、二連接層、抗靜電層、熱封層共七層材料共擠吹膜機吹膜，由內而外依照抗靜電層/中間層/連接層/基材層/連接層/中間層/熱封層的順序於各層所屬的擠壓設備內加入對應原料，各擠壓設備設定對應材料適合之塑化溫度。擠壓設備包含單螺桿壓出機，但不限於此。各層塑料經過加熱塑化成熔融狀，經過七層圓形螺旋模頭內流道後形成七層圓柱狀熔融薄膜，在出模頭處各層在高溫下黏合成單一圓柱薄膜。此柱狀薄膜(筒膜)因上方牽引及膜泡內吹入冷空氣，使直徑脹大，經過牽引裝置上的夾輥壓平成一片膜(兩層)，經過冷卻後分切為兩片膜(單層)並收卷。分條成所需寬度以及長度。
膜厚由空氣冷卻效果控制在60±5 μm(單層)。最後收卷之平膜寬度為約1200 mm，長度3200 m(單一卷，共兩卷)。總膜厚範圍為約40-70 μm。其中基材層佔膜厚度的範圍為約25-30%，二連接層佔膜厚度的範圍為約8%-10，二中間層佔膜厚度的範圍為約25-30%，抗靜電層佔膜厚度的範圍為約10-12%，熱封層佔膜厚度的範圍為約20-25%。
本發明之覆蓋帶製程方法並不受限於上述實施例中所述之各層排列方式，但必須具有熱封層與抗靜電層雙面抗靜電特性以及各層同步共擠壓成型的特性。於一實施例中，如第二圖所示，本發明之覆蓋帶製程方法包含以下步驟。首先，於步驟20中，提供至少包含基材層、抗靜電層、熱封層的材料。接著於步驟22中，依照各層排列的順序將各層材料加入所屬的擠壓設備內，並設定各擠壓設備對應材料適合之塑化溫度。然後於步驟24中，將各層材料經過加熱塑化成熔融狀，經過各層材料各自擠壓設備形成熔融薄膜，各層在出模處於高溫下黏合成單一薄膜。於較佳實施例中，覆蓋帶製程方法使用的材料包含基材層、二中間層、二連接層、抗靜電層、熱封層的材料。
與傳統覆蓋帶製程技術相比，本發明之覆蓋帶與其製程方法具有熱封層與抗靜電層雙面抗靜電特性以及各層同步共擠壓成型的特性。不同於傳統覆蓋帶製程需要多個製程步驟才能完成的缺點，本發明利用各層材料同步共擠壓成型，具有製程步驟簡化等優點。傳統覆蓋帶製程技術一般需將熱封層及抗靜電層等具特殊功能的材料以積層或塗佈等方式附著於基材上。而本發明之覆蓋帶與其製程方法使用共擠壓的方式則是將具有特殊功能的原料與基材一同擠壓成型，無須再另作表面處理。
上述之實施例僅係為說明本發明之技術思想及特點，其目的在使熟悉此技藝之人士能了解本發明之內容並據以實施，當不能據以限定本發明之專利範圍，即凡其他未脫離本發明所揭示精神所完成之各種等效改變或修飾都涵蓋在本發明所揭露的範圍內，均應包含在以下之申請專利範圍內。
10‧‧‧基材層
12‧‧‧連接層
13‧‧‧中間層
14‧‧‧抗靜電層
15‧‧‧熱封層
20‧‧‧提供至少包含基材層、抗靜電層、熱封層的材料
22‧‧‧依照各層排列的順序將各層材料加入所屬的擠壓設備內，並設定各擠壓設備對應材料適合之塑化溫度
24‧‧‧將各層材料經過加熱成熔融狀，經過各層材料各自擠壓設備形成熔融薄膜，各層並在出模處於高溫下黏合成單一薄膜
第一圖為根據本發明一實施例之覆蓋帶之截面圖。 第二圖為根據本發明一實施例之覆蓋帶製程方法步驟。
10‧‧‧基材層
12‧‧‧連接層
13‧‧‧中間層
14‧‧‧抗靜電層
15‧‧‧熱封層

Claims (20)

  1. 一種覆蓋帶之製程方法，包含：提供一抗靜電層材料、一第一中間層材料、一第一連接層材料、一基材層材料、一第二連接層材料、一第二中間層材料與一熱封層材料，其中該基材層材料之主要高分子材料成分與該抗靜電層材料、該第一與第二中間層材料、該第一與第二連接層材料及該熱封層材料不同，該抗靜電層材料與該熱封層材料之成分不同；將該抗靜電層材料、該第一中間層材料、該第一連接層材料、該基材層材料、該第二連接層材料、該第二中間層材料與該熱封層材料分別加入各自對應的七個擠壓設備內，並設定各個該擠壓設備對應該抗靜電層材料、該第一中間層材料、該第一連接層材料、該基材層材料、該第二連接層材料、該第二中間層材料與該熱封層材料之塑化溫度；及依各層之塑化溫度將該抗靜電層材料、該第一中間層材料、該第一連接層材料、該基材層材料、該第二連接層材料、該第二中間層材料與該熱封層材料加熱成熔融狀，經過七層流道形成七層熔融薄膜，並於出模處在高溫下黏合成單一薄膜，其中該薄膜包含一抗靜電層、一第一中間層、一第一連接層、一基材層、一第二連接層、一第二中間層與一熱封層，該熱封層與該抗靜電層具有抗靜電特性。
  2. 如申請專利範圍第1項所述之方法，其中該抗靜電層材料包含聚烯烴類與抗靜電劑。
  3. 如申請專利範圍第1項所述之方法，其中該第一與該第二中間層材料包含聚烯烴類。
  4. 如申請專利範圍第1項所述之方法，其中該第一與該第二連接層材料包含酸酐改性之聚乙烯、聚丙烯與聚烯烴類。
  5. 如申請專利範圍第1項所述之方法，其中該基材層材料包含聚醯胺6、聚醯胺66、聚醯胺6/66共聚合物。
  6. 如申請專利範圍第1項所述之方法，其中該熱封層材料包含抗靜電劑、氫化石油樹脂、熱塑性彈性體、丙烯酸系樹脂及礦物油。
  7. 如申請專利範圍第1項所述之方法，其中該擠壓設備包含單螺桿壓出機。
  8. 一種覆蓋帶之製程方法，包含：將具有一抗靜電層、二中間層、一基材層、二連接層及一熱封層之一覆蓋帶之七層材料備料後分別加入各自對應的七個擠壓設備內，以各自對應之塑化溫度將該抗靜電層、該中間層、該連接層、該基材層與該熱封層加熱成熔融狀一併進行共擠壓黏合，以形成該覆蓋帶，其中該覆蓋帶各層之排列順序為該抗靜電層、該中間層、該連接層、該基材層、該連接層、該中間層及該熱封層，其中該基材層之主要高分子材料成分與該抗靜電層、該中間層、該連接層及該熱封層不同，該抗靜電層與該熱封層之成分不同。
  9. 如申請專利範圍第8項所述之方法，其中該抗靜電層的材料包含高分子型抗靜電劑與線性低密度聚乙烯，該高分子型抗靜電劑與該線性低密度聚乙 烯混合，高分子型抗靜電劑佔重量百分比15-30%，並加入抗氧化助劑、開口劑及內滑劑，以一雙螺桿壓出機混合造粒，粒子於攝氏90℃進行乾燥。
  10. 如申請專利範圍第8項所述之方法，其中該中間層之材料包含線性低密度聚乙烯、高密度聚乙烯及低密度聚乙烯、聚丙烯或聚丙烯共聚物。
  11. 如申請專利範圍第8項所述之方法，其中該基材層的材料包含聚醯胺6、聚醯胺6/66共聚合物乾拌混合，聚醯胺6佔重量百分比20-80%。
  12. 如申請專利範圍第8項所述之方法，其中該連接層的材料包含酸酐改性之聚乙烯與線性低密度聚乙烯，以比例範圍為20-40%之酸酐改性之聚乙烯以及比例範圍為80-60%之線性低密度聚乙烯乾拌混合。
  13. 如申請專利範圍第8項所述之方法，其中該熱封層的材料包含高分子型抗靜電劑、增黏劑、丙烯酸系樹脂、熱塑性彈性體、礦物油，以比例(10-20)：(10-20)：(20-30)：(35-45)：(5-10)混合，加入抗氧化助劑、開口劑及內滑劑，以雙螺桿壓出機混合造粒，粒子於攝氏90℃進行乾燥。
  14. 如申請專利範圍第8項所述之方法，其中該抗靜電層、該二中間層、該基材層、該二連接層及該熱封層之七層材料以七層共擠吹膜機吹膜，依照該抗靜電層、該中間層、該連接層、該基材層、該連接層、該中間層與該熱封層的順序加入各層所屬的單螺桿壓出機，設定各單螺桿壓出機之塑化溫度，各層材料經過單螺桿加熱塑化成熔融狀，經過七層圓形螺旋模頭內流道後形成七層圓柱狀熔融薄膜，在出模頭處各層在高溫下黏合成單一圓柱薄膜。
  15. 一種覆蓋帶，包含： 依序排列之一抗靜電層、一第一中間層、一第一連接層、一基材層、一第二連接層、一第二中間層與一具抗靜電性質之熱封層，其中該抗靜電層、該第一中間層、該第一連接層、該基材層、該第二連接層、該第二中間層與該熱封層係經各自對應的七個擠壓設備，以各自對應之塑化溫度加熱成熔融狀一併進行共擠壓熔融黏合，且該基材層之主要高分子材料成分與該抗靜電層、該中間層、該連接層及該熱封層不同，該抗靜電層與該熱封層之成分不同。
  16. 如申請專利範圍第15項所述之覆蓋帶，其中該抗靜電層之材料包含聚烯烴類與抗靜電劑，抗靜電劑包含高分子型抗靜電劑、離子型抗靜電劑或奈米碳管，抗靜電劑的添加重量比為約15-30%。
  17. 如申請專利範圍第15項所述之覆蓋帶，其中該熱封層之材料包含抗靜電劑、包含氫化石油樹脂及熱塑性彈性體的增黏劑、丙烯酸系樹脂及礦物油，抗靜電劑包含高分子型抗靜電劑、離子型抗靜電劑或奈米碳管，抗靜電劑的添加重量比例為約15-30%。
  18. 如申請專利範圍第15項所述之覆蓋帶，其中該基材層佔總厚度的範圍為約25-30%，該第一與該第二連接層佔總厚度的範圍為約8%-10，該第一與該第二中間層佔總厚度的範圍為約25-30%，該抗靜電層佔總厚度的範圍為約10-12%，該熱封層佔總厚度的範圍為約20-25%。
  19. 如申請專利範圍第15項所述之覆蓋帶，其中該基材層之材料包含聚醯胺6、聚醯胺66或兩者之共聚物及聚對酞酸乙二酯。
  20. 如申請專利範圍第15項所述之覆蓋帶，其中該中間層13之材料包含聚烯烴類，該連接層之材料包含酸酐改性之聚乙烯、聚丙烯以及聚烯烴類。
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