TW555646B - Cover tape for packaging electronic components - Google Patents
Cover tape for packaging electronic components Download PDFInfo
- Publication number
- TW555646B TW555646B TW91113901A TW91113901A TW555646B TW 555646 B TW555646 B TW 555646B TW 91113901 A TW91113901 A TW 91113901A TW 91113901 A TW91113901 A TW 91113901A TW 555646 B TW555646 B TW 555646B
- Authority
- TW
- Taiwan
- Prior art keywords
- layer
- tape
- electronic component
- covering
- patent application
- Prior art date
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/16—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
- C09J2301/162—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer the carrier being a laminate constituted by plastic layers only
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/414—Additional features of adhesives in the form of films or foils characterized by the presence of essential components presence of a copolymer
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
- C09J2423/006—Presence of polyolefin in the substrate
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2431/00—Presence of polyvinyl acetate
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2431/00—Presence of polyvinyl acetate
- C09J2431/006—Presence of polyvinyl acetate in the substrate
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
- C09J2433/006—Presence of (meth)acrylic polymer in the substrate
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/91—Product with molecular orientation
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- Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
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Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Laminated Bodies (AREA)
- Packages (AREA)
- Packaging Frangible Articles (AREA)
- Packaging For Recording Disks (AREA)
- Wrappers (AREA)
Description
555646 A7 B7 五、發明説明(1 ) 發明領域 (請先閱讀背面之注意事項再填寫本頁) 本發明有關一種構成包裝材料之構件,其用於貯存、 運送與安裝電子組件,而且其可以避免該電子組件污損, 並且用以將該電子組件安裝於電子電路之基板上,可以對 準並取出該電子組件;即,一種包覆帶,其可以熱密封於 塑膠製承載帶上,該塑膠製承載帶中具有規律形成之可貯 存電子組件小袋。 背景技藝 表面安裝之電子組件(諸如ic、電晶體、二極體、電容 器、壓電電阻等)係包裝在一種包裝材料中之方式供應,該 包裝材料包括(a)塑膠製承載帶,其中藉由壓紋規律地形成 貯存電子組件用之小袋,該小袋形狀與此等電子組件形狀 一致,與(b)可以熱密封於該承載帶的包覆帶。剝除該包覆 帶之後,即可自該包裝材料自動取出裝在該包裝材料中的 電子組件,並且表面安裝於電子組件電子基板上。近來, 電子組件變得更小、更輕而且更薄。 經濟部智慧財產局員工消費合作社印製 同時,表面安裝的速度提高,自該承載帶剝除該包裝 材料之包覆帶的速度也隨之提高。結果,波動現象增加, 該波動現象即剝除時該強度高底起伏的現象(下文將此強度 稱爲「剝離強度」),顯現出經包裝之電子組件自該承載帶 跳出所致之明顯與跳出問題。 當該電子組件包裝於較大的包裝材料中時,該包裝材 料的剝離強度通常事先設定得較高,以避免運送期間電子 本纸張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -4- 555646 A7 B7 五、發明説明(2 ) (請先閱讀背面之注意事項再填寫本頁) 組件自該承載帶跳出。不過,在此情況下,若該剝離強度 隨著時間改變並變得太高,於安裝時,該包覆帶變得難以 平順地剝除,在某些情況下,如此會導致無法取出該電子 組件或是該包覆帶破裂的問題。藉由在一基底層膜(諸如雙 軸定向聚酯膜等)上層壓使用數種樹脂的混合物所製得的黏 著層膜、藉由乾式層壓或擠壓層壓,已經可以避免伴隨剝 離強度所產生的問題。 藉由乾式層壓等方法,將兩片經定向膜彼此層壓在一 起,製得強韌基底層,已經避免於安裝期間出現的問題(諸 如包覆帶破裂等)。 不過,此等對策任一者當中,膜形成步驟與層壓步驟 是獨立的,需要長時間處理,導致製造成本高,而且並不 符合近來降低電子組件成本的需求。 經濟部智慧財產局員工消費合作社印製 剝除包裝材料的包覆帶之後,自動取出裝在該包裝材 料內的電子組件,並且表面安裝在電子電路之基板上。此 時,若該包覆帶的剝離強度最大値與最小値之間差異很大 ,會造成該承載帶呈波浪狀以及裝於其中的電子組件跳出 等情況;若該剝離強度太高,則會造成該包覆帶斷裂;若 該剝離強度太小,則該包覆帶可能於到達安裝步驟之前即 被剝除,而且該電子組件自該承載帶移除。 發明揭示 本發明提出一種包覆帶,其可以避免上述伴隨剝離強 度所發生的問題或是於安裝期間出現的問題,可以低成本 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -5- 555646 A7 B7 五、發明説明(3 ) 生產彼,而且其呈透明狀。 (請先閱讀背面之注意事項再填寫本頁) 此外,根據本發明,藉由減少製造步驟,諸如乾式層 壓、擠壓層壓等,可以減少所使用之有機溶劑量,因而降 低環境污染,另外還可以節省所需要能源。 本發明另外提供一種包覆帶,其剝離強度不會太高也 不會太低,最大値與最小値間之差異小,而且具有高度透 明度。 更明確地說,本發明提出下列包覆帶。 (1) 一種電子組件包裝用包覆帶,其可以熱密封於塑膠 製承載帶上,該塑膠製承載帶中具有規律形成之可貯存電 子組件小袋,而且該包覆帶包括(A)由聚酯、聚丙烯或耐綸 形成的雙軸定向膜層,與(B)—種熱塑性樹脂層,其由100 重量份數乙烯共聚物與10至100重量份數聚苯乙烯所組成 ,並層壓於層A其中一面。 (2) 根據上述(1)之電子組件包裝用包覆帶,其中該層中 至少一種係選自層A與層B之間夾有無定向聚酯層、無定 向耐綸層與無定向聚丙烯層組成群組。 經濟部智慧財產局員工消費合作社印製 (3) 根據上述(1)或(2)之電子組件包裝用包覆帶,其中包 含於層B中的乙烯共聚物之共聚單體係選自醋酸乙烯酯、 丙烯酸、丙烯酸酯、甲基丙烯酸、甲基丙烯酸酯與一種異 構物所組成群組中至少一者。 (4) 根據上述(1)或(2)之電子組件包裝用包覆帶,其中包 含於層B中的乙烯共聚物之共聚單體的比例係,相對於 1〇〇重量份數乙烯,使用17至90重量份數。 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -6 - 555646 A7 B7 五、發明説明(4 ) (5) 根據上述(1)或(2)之電子組件包裝用包覆帶,其中層 B厚度爲0.5至50 μηι。 (請先聞讀背面之注意事項再填寫本頁} (6) 根據上述(1)或(2)之電子組件包裝用包覆帶,其中當 包覆帶熱密封於該承載帶時,層Β會造成黏合失效並剝離 ,然後自該承載帶剝除。 (7) 根據上述(1)或(2)之電子組件包裝用包覆帶,其中將 一種由氧化錫、氧化鋅、氧化駄、碳黑或其組合物及/或界 面活性劑所製得的導電細微粉末分散在層Β中,層Β的表 面電阻係數爲lx 1〇13 Ω /□以下。 (8) 根據上述(1)或(2)之電子組件包裝用包覆帶,其中在 層B表面上形成一層抗靜電層,其中分散有由氧化錫、氧 化鋅、氧化鈦、碳黑或其組合物及/或界面活性劑所製得的 導電細微粉末,而且該抗靜電層的表面電阻係數爲IX 1〇13 Ω /□以下。 (9) 根據上述(1)或(2)之電子組件包裝用包覆帶,當該包 覆帶熱密封於該承載帶,然後自該承載帶剝除時,其剝離 強度係每mm該帶密封長度0.1至1 .3 N。 經濟部智慧財產局員工消費合作社印製 (10) 根據上述(1)或(2)之電子組件包裝用包覆帶,其光 透射比爲7〇°/〇或以上,濁度爲80%或以下。 (11) 根據上述(1)或(2)之電子組件包裝用包覆帶,當該 包覆帶熱於該承載帶,然後自該承載帶剝除時,其剝離強 度的最大値與最小値間的差異係每mm該帶密封長度〇 . 〇 1 至 0.4 N。 (12) —種包裝用包覆帶,其可熱密封於塑膠製承載帶上 本紙張尺度適用中國國家標準(CNS )八4規格(2Κ)χ297公釐)~' 555646 A7 B7 五、發明説明(5 ) (請先閲讀背面之注意事項再填寫本頁) ,該承載帶中具有規律形成之可貯存電子組件小袋,而且 至少包括黏著層與基底層這兩層,該黏著層位於該包覆帶 熱密封於該承載帶那面,此二層係藉由共同擠壓彼此層壓 在一起,而該基底層係聚酯、耐綸或聚丙烯。 (13) —種電子組件包裝用包覆帶,其可熱密封於塑膠製 承載帶上,該承載帶中具有規律形成之可貯存電子組件小 袋,而且依序至少包括黏著層、中間層與基底層這三層, 該黏著層位於該包覆帶熱密封於該承載帶那面,該中間層 與基底層係藉由共同擠壓彼此層壓在一起,而該黏著層係 藉由照相凹版塗覆層壓。 (14) 根據(12)之電子組件包裝用包覆帶,其中該黏著層 係由一種乙烯-α-烯烴共聚物所製得,該α-烯烴係醋酸乙 烯酯、丙烯酸、一種丙烯酸酯、甲基丙烯酸或甲基丙烯酸 酯。 經濟部智慧財產局員工消費合作社印製 (15) 根據上述(I3)之電子組件包裝用包覆帶,其中該中 間層係由一種乙烯-α-烯烴共聚物所製得,該烯烴係醋 酸乙烯酯、丙烯酸、一種丙烯酸酯、甲基丙烯酸或甲基丙 烯酸酯。 (16) 根據上述(I3)或(I5)之電子組件包裝用包覆帶,其 中該黏著層係由一種乙烯-α-烯烴共聚物所製得,該a-jt 烴係醋酸乙烯酯、丙烯酸、一種丙烯酸酯、曱基丙烯酸或 甲基丙烯酸酯,一種聚(甲基丙烯酸酯)、乙烯基氯-丙烯酸 乙烯酯共聚物、聚氯化丙烯或聚胺基甲酸酯。 (1 7)根據上述(1 2)至(1 5)任一項之電子組件包裝用包覆 本紙張尺度適用中國國家標準(CNS ) A4規格(210 X 297公釐) -8- 555646 A7 B7 五、發明説明(6 ) 帶,其光透射比爲7〇%或以上,濁度爲60%或以下。 圖式簡述 圖1係顯示本發明包覆帶層構造的剖面圖。 圖2係顯示本發明實施例所述包覆帶之層構造的剖面 圖。 圖3係顯示本發明包覆帶黏附於承載帶之使用狀態的 剖面圖。 圖1至3中所使用之數字參考下文: 1 :包覆帶 2 :雙軸定向膜(層A) 3 :熱密封層(層B) 4:層B以外之共擠壓層 5:聚胺基甲酸酯爲底質之黏著層 6 :欲密封部分 7 :承載帶 發明詳細說明 經濟部智慧財產局S工消費合作社印製 (請先閱讀背面之注意事項再填寫本頁) 茲參考圖1,解釋根據本發明第一具體實施例之包覆帶 的組成元件實例。此包覆帶中,層A係選自雙軸定向聚酯 膜、雙軸定向聚丙烯膜與雙軸定向耐綸膜之雙軸定向膜, 其厚度爲6至1〇〇 μιη,具有透明度與高度剛性。 層Α可爲兩層以上定向膜層的層壓製件,以使該包覆 帶具有更高機械強度。基於相同目的,當層B係由共擠壓 本紙張尺度適用中國國家榡準(CNS ) A4規格(210X 297公釐) -9 - 555646 A7 B7 五、發明説明(7 ) 法形成時,可於層A與層B存在一層無定向聚酯層、無定 向耐層或無定向聚丙烯層。 (請先閲讀背面之注意事項再填寫本頁) 層B係一混合100重量份數乙烯共聚物與1〇至100重 量份數聚苯乙烯所製得的熱塑性樹脂層。 該乙烯共聚物中所包含的共聚單體係選自醋酸乙烯酯 、丙烯酸、丙烯酸酯、甲基丙烯酸、甲基丙烯酸酯與異構 物的單體。 當層B中的聚苯乙烯量低於10重量份數,於該包覆帶 熱密封於承載帶然後剝除時,最大剝離強度與最小剝離強 度間的差異變成大於0.4 N ,以致於難以平順地剝除。 當層B中之聚苯乙烯量多於100重量份數時,該包覆 帶的濁度大於80%,層B變得易碎而且與基底層(層A)的黏 著力低,因而導致層離。 層A與層B之間可存在一種聚乙烯爲底質、乙烯共聚 物爲底質或是聚胺基甲酸酯爲底質黏著劑或是環氧樹脂爲 底質黏著劑,以提高層B對基底層A的黏著強度。 經濟部智慧財產局員工消費合作社印製 該聚苯乙烯可選自各種包括高耐衝擊性聚苯乙烯 (HIPS)的聚苯乙烯,該高耐衝擊性聚苯乙烯(HIPS)包含具有 更高耐衝擊性之橡膠組份。不過,由透明度與熱安定性觀 點來看,該聚苯乙烯係一般用途聚苯乙烯(GPPS)爲宜。 自該承載帶剝除包覆帶時,層B必須產生黏合失效。 可以藉由界面剝離均勻平順地剝除該包覆帶,其中視層B 所使用之乙烯共聚物與聚苯乙烯之組合物而定,該剝離作 用係於該包覆帶與承載帶界面處發生。不過,當層B造成 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -10- 555646 A7 B7 五、發明説明(8 ) (請先閱讀背面之注意事項再填寫本頁) 占合失效時,介於該包覆帶與承載帶間的黏著平面與剝離 平面不同;因此藉由此種層B,於製造包覆帶時,很容易 控制且穩定包覆帶的剝離強度。 層B的乙烯共聚物中之共聚單體比例係,相對於1〇〇 重量份數乙烯,使用17至90重量份數共聚單體。 當該共聚單體比例低於1 7重量份數時,該包覆帶可以 熱密封於承載帶;不過密封之後,隨著時間增長,該剝離 強度可能降低,而且最後可能發生自發性剝離。 當該共聚單體比例高於90重量份數時,該包覆帶也可 以熱密封於承載帶;不過,密封之後,隨著時間增長,該 剝離強度可能增加,最後可能難以剝除。至於包含9 0重量 份數乙烯以外之共聚單體的乙烯共聚物,市售的種類很有 限,而且係特殊產物,因此相當昂貴。 層B的厚度必須爲〇.5至50 μιη。 當該厚度小於0.5 μπι時,層Β對基底層的黏著力低, 會造成層離。 經濟部智慧財產局員工消費合作社印製 當該厚度大於50 μιη時,該包覆帶的透明度相當低, 濁度高於8〇%,使得難以看穿該包覆帶,並確認承載帶小 袋內的內容物。 層Α與層Β的層壓作用係藉由共擠壓、擠壓塗覆或照 相凹版塗覆進行。 較佳做法係在層B中分散一種抗靜電劑,以避免剝除 該包覆帶進行安裝時,該包裝的電子組件被靜電毀壞或是 因靜電造成小型電子組件黏附於該包覆帶等問題。或者, 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -11 - 555646 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明説明(9 ) 可以在層B上形成一層分散有抗靜電劑之層。 可提出界面活性劑與導電細微粉末作爲該抗靜電劑。 因爲導電細微粉末的抗靜電能力起伏較小,故以彼爲佳。 可以提出氧化錫、氧化鋅、氧化鈦與碳黑作爲該導電 細微粉末。單獨使用此等粉末即可獲得效果;不過,可以 倂用其中二者以上。可於其中添加界面活性劑。分散此等 抗靜電劑時,所形成層的表面電阻係數必須爲lx ΙΟ13 Ω/ □以下,惟該電阻會視所使用的抗靜電劑而有所不同。當 該電阻大於lx ΙΟ13 Ω/□時,會發生上述因靜電所致的問 題。 製備該包覆帶時,層A與層B必須進行層壓,如此該 包覆帶的光透射比爲70%或以上,濁度爲80%或以下。當 該光透射比爲70%或以下,而濁度爲80%或以上時,由檢 查者確認具有該包覆帶之電子組件包裝正確性的確認工作 可能會變困難。 其次,已說明本發明第二具體實施例之包覆帶構成組 件,詳見實施例。 稍後說明的實施例Π係有關一種膜,其中藉由共擠壓 法依序層壓一種耐綸(下文簡稱爲Ny)、經順式丁烯二酸酐 改良之PE層(下文簡稱爲AD)、低密度聚乙烯層(下文簡稱 爲LDPE)、AD與一種乙烯-醋酸乙烯酯共聚物(下文簡稱爲 EVA)。Ny係主張權項12項中提及的基底層,而EVA係一 黏著層。該LDPE層係用以降低成本的中間層。若不需要 降低成本,則可以增加該黏著層的厚度代替該LDPE中間 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) —·--·-----1衣----^---1T----- (請先閱讀背面之注意事項再填寫本頁) -12- 555646 A7 _ B7 _ 五、發明説明(1〇 ) 層的厚度。AD具有提高其相鄰兩層之層間強度之黏著劑的 作用。 (請先閲讀背面之注意事項再填寫本頁) 可以一種聚酯或聚丙烯取代Ny。此外,可以主張權項 第14項所提的任何乙烯-α -烯烴共聚物代替EVA。 在下述實施例以及對照實例中,可由主張權項中所提 的樹脂代替該基底層、該中間層與該黏著層。 對照實例1 1有關一種膜,其具有與實施例1 1基本上 相同的構造。該膜中,使用雙軸定向耐綸膜作爲基底層Ny ;其中一面上塗覆一種anchor塗料(下文簡稱爲AC),其係 一種胺基甲酸酯爲底質熱固性黏著劑;藉由擠壓層壓法在 其上依序層壓經層壓之LDPE與EVA。 與對照實例1 1相較之下,實施例1 1不必事先形成Ny 膜,因此可以減少一個步驟。 實施例12有關一種膜,其係藉由共擠壓法依序層壓 Ny、AD、Ny、AD與EVA,然後對EVA表面進行光暈處理 ,並藉由照相凹版塗覆作用在所形成的EVA表面上塗覆聚 甲基丙烯酸甲酯(下文簡稱爲PMMA)。 經濟部智慧財產局員工消費合作社印製 反之,對照實例1 2當中,使用雙軸定向耐綸膜作爲兩 層Ny層;在一層Ny層的一面上塗覆乾式層壓用之黏著劑( 下文簡稱爲DL),其係一種胺基甲酸酯爲底質之熱固性黏 著劑;藉由乾式層壓在其上層壓另一層Ny層。在所形成的 層壓製件一面上塗覆DL,並藉由乾式層壓在其上層壓EVA 膜。以實施例12相同方式形成PMMA層。 與對照實例1 2相較之下,實施例1 2不必事先形成兩 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -13- 555646 A7 B7_ 五、發明説明(11 ) 層Ny層與EVA層,因此可以減少三個步驟。 (請先閱讀背面之注意事項再填寫本頁) 實施例13與對照實例13中,除了以LDPE代替EVA 以及以甲基丙烯酸甲酯-甲基丙烯酸丁酯共聚物(下文簡稱爲 PMMA-BMA)代替PMMA之外,其製程與實施例12及對照 實例12相同。不過,在PMMA-BMA中混合摻雜鋁之氧化 鋅(下文簡稱爲ZnO),使其具有導電性,並塗覆混合ZnO 之 PMMA-BMA 〇 與對照實例13相較之下,實施例13不需要事先形成 兩層Ny層與LDPE層,因此可以減少三個步驟。 實施例1 4係有關一種膜,其係藉由共擠壓作用依序層 壓Ny、AD與LDPE,並對LDPE表面進行電暈處理,藉由 照相凹版塗覆作用在該LDPE的經電暈處理表面上塗覆 PMMA-BMA,並藉由使用DL的乾式層壓法,於所形成之 層壓製件的Ny面上層壓一雙軸定向聚對苯二甲酸伸乙酯膜 (下文簡稱爲PET),以改善韌度。如同實施例13 ,於 PMMA-BMA中混合摻雜銻的氧化錫(下文簡稱爲ΑΤΟ),使 之具有導電性,並塗覆混合ΑΤΟ之PMMA-BMA。 經濟部智慧財產局員工消費合作社印製 反之,對照實例14有關一種膜,其係藉由乾式層壓作 用,依序層壓PET、DL、Ny、DL與LDPE,然後對LDPE 表面進行電暈處理,並以實施例1 4之相同方式塗覆混合 ΑΤΟ 之 PMMA-BMA。 與對照實例14相較之下,實施例14不需要事先形成 Ny層與LDPE層,因此可以減少兩個步驟。 實施例1 5有關一種膜,其係藉由共擠壓法依序層壓 ^紙張尺度適用中國國家標準(〇奶)八4規格(210'/ 297公釐) -14 - 555646 A7 B7 五、發明説明(12 ) (請先閲讀背面之注意事項再填寫本頁)
Ny、AD與使用金屬錯合物觸媒所製得之直鏈低密度聚乙烯 (該聚乙烯於下文簡稱爲MLLDPE),然後對MLLDPE表面 進行電暈處理,並藉由照相凹版塗覆作用在該MLLDPE的 經電暈處理表面上塗覆乙烯基氯-醋酸乙烯酯共聚物(下文簡 稱爲PVC-VA),並藉由使用DL的乾式層壓法將PET層壓 在所形成之層壓製件的Ny面上。 反之,對照實例有關一種膜,其係藉由乾式層壓法, 依序層壓 PET、DL、Ny、DL 與 MLLDPE,三該 MLLDPE 表面進行電暈處理,並藉由照相凹版塗覆作用在該 MLLDPE的經電暈處理表面上塗覆PVC-VA 〇 與對照實例1 5相較之下,實施例1 5不需要事先形成 Ny層與MLLDPE層,因此可以減少兩個步驟。 實施例16與對照實例16有關藉由使用DL的乾式層壓 法,分別將PET層壓於實施例1 1或對照實例1 1所製得膜 之Ny面的膜。 與對照實例1 6相較之下,實施例1 6不需要事先形成 Ny膜,因此可以減少一個步驟。 經濟部智慧財產局員工消費合作社印製 上述本發明具體實施例當中,該基底層上並無抗靜電 劑層。不過,存在抗靜電劑層爲佳。該抗靜電劑包括一種 界面活性劑、一種π -電子共軛系統導電性聚合物,諸如聚 吡咯型、聚苯胺型、聚噻吩型等等,以及一種導電性塡料 ,諸如氧化錫、氧化鋅、氧化鈦、碳黑、含矽有機化合物 、烷二醇-過氯酸鹽(例如過氯化鋰)複合物等等。該導電性 塡料可摻雜銻等元素以提高抗靜電能力。 本紙張尺度適用中國國家標準(CNS ) A4規格(210X 297公釐) -15- 555646 A7 —B7 五、發明説明(13 ) (請先閱讀背面之注意事項再填寫本頁) 爲了使主張權項第12與13項所提出的黏著層具有抗 靜電劑能力,該黏著可以塗覆一種抗靜電劑,諸如導電性 聚合物、導電性塡料、界面活性劑等等;或是可將抗靜電 劑捏合至該黏著層內。 於製備該包覆帶時,必須進行層的層壓作用,如此該 包覆帶的光透射比爲70%或以上,濁度爲60%或以下。當 該光透射比低於70%而且濁度高於60%時,由檢查者確認 具有該包覆帶之電子組件包裝正確性的確認工作可能會變 困難。 進行本發明的最佳模式 下文顯示本發明實施例。不過,本發明並不受此等實 施例所限制。 實施例1辛7與對照實例1 實施例1至7係作爲本發明第一具體實施例。 經濟部智慧財產局員工消費合作社印製 於表1所示之雙軸定向膜(其係第一層,而且相當於本 發明之層A)上乾式層壓表1所示之膜,其係藉由共擠壓第 二層至第七層以及該熱密封層(其相當於本發明層B)所製得 ,如此製得包覆帶,各具有圖2所示之層構造。 將該包覆帶各者切成寬5.5 mm,然後在160°C密封溫 度下,密封於寬8 mm的聚苯乙烯製承載帶上,並測量剝離 強度。 亦使用SIM C Ο所製的工作面試驗器測量各包覆帶的表 本紙張尺度適用中國國家標準(CNS ) Α4規格(210Χ297公釐) -16- 555646 A7 B7 五、發明説明(14 ) 面電阻,以及使用Π S K 7 1 0 5測量光透射比與濁度。 實施例1至7的結果與對照實例1之層構造及結果示 於表1。 在基底層與共擠壓層的欄位中,顯示於各層種類(0-PET、DL等等)後面的每個數目係指該層厚度(單位:μπι); 在該熱密封層之乙烯共聚物欄位中,EVA、EMMA等係指 乙烯與該共聚單體,各括弧中的數字係指該共聚單體於乙 烯共聚物中之比例;在該熱密封層的聚乙烯欄位中,PS下 的各個數字係指相對於1〇〇重量份數乙烯共聚物之PS重量 份數。光透射比至表面電阻係數等欄位之後的%、N與Ω / □係指各性質的單位。 (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -17- 555646 A7 B7 五、發明説明(15 ϊ 經濟部智慧財產局員工消費合作社印製 CA <N CN cn ii 不使用 ON 00 CO 1.29 0.43 >1.0χ 1012 對照實例 O-Ny Q 受 壊 壊 壊 EVA(40) 100 PS 0 實施例7 <N m cs ί—Η F—Η ON 0.42 0.09 O-PET l-l Q 专 璀 摧 摧 EVA(40) 100 PS 50 氧化錫 3.2χ 10 CN m gN 0.46 0.09 >1.0χ ΙΟ12 镯 Μ O-PP -l Q 穿 壊 摧 璀 ION(17) 100 PS 40 不使用 CN cn 不使用 <s Os Os 0.55 0.19 9.2χ ΙΟ12 實施例5 O-Ny H-l Q AD 璀 摧 摧 EEA(52) 100 PS 30 界面活性劑 0.5 實施例4 σ\ <N r4 m 不使用 CN C\ 0.79 0.24 >1.0χ ΙΟ12 O-PET Q 摧 摧 壊 EMMA(49) 100 PS 20 m cs (N m »/Ί CN ΓΤΓ ^T) 1.24 0.35 >1.0χ ΙΟ12 實施例 O-PP Q 鹿 璀 壊 EVA(40) 100 PS 40 LU-. 赵 2 CN »〇 m m γ·Η 00 00 口 0.18 0.09 2.6χ 107 實施例 O-PET hJ Q PET | AD | LDPE I EVA(40) 100 PS 40 氧化錫 280 不使月 F-H 2 CN m Oj m 00 00 00 m 0.18 0.09 >1.0χ ΙΟ12 實施例 I O-PET | Q \ PET | AD I ldpeJ EVA(40) 100 PS 40 不使月 I 搬 第二層 第三層 第四層 第五層 第六層 第七層 熱密封層 乙烯共聚物 聚苯乙烯 抗靜電劑 抗靜電層 Ω/口 基底層 共擠 壓層 塗覆層 光透射比 濁度 剝除強度 最大値 表面電阻 係數 -ϋ : ία: αν 簾疏 :ΝΟΙ-isw 鬆齡¥ 餾K1氍SM-裝No: V33 : VA3 :Sd wdcn :ό 二N :dd :IHd (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準(CNS ) Α4規格(210Χ297公釐) -18- 555646 A7 B7 五、發明説明(16 ) 實施例1 1至1 6與對眧眚例U至1 6 其次,顯示本發明第二具體實施例之實例。由於先前 已提過此等實施例與對照實例之包覆帶的層構造與製程細 節,故不再說明。此等包覆帶之層構造輪廓與其性能示於 下文。不過,本發明不受此等實施例限制。 將製得的各包覆帶切成寬5.5 mm,然後在180°C密封 溫度下,密封於寬8 mm的聚乙烯基氯爲底質承載帶上,並 於5分鐘後測量剝離強度。 亦以JIS K 7105測量各包覆帶之光透射比與濁度。 表2中顯示實施例之層構造與測量數據(剝離強度、光 透射比與濁度);表3中顯示對照實例之層構造與測量數據( 剝離強度、光透射比與濁度)。 (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準(CNS ) A4規格(210X 297公釐) -19- 555646 A7 Β7 五、發明説明(17 ) 經濟部智慧財產局員工消費合作社印製
I ^ 裝 ^ 訂 (請先閲讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準(CNS ) Α4規格(210Χ 297公釐) -20- 555646 A7 7 Β 五、發明説明(1S ) 經濟部智慧財產局員工消費合作社印製
^ ^ 裝 ^ 訂 (請先閲讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準(CNS ) Α4規格(210X 297公釐) -21 - 555646 A7 B7 五、發明説明(19) 表2與3的第一至第七層各欄中,顯示在Ny、AD等 右側的每個數字表示每層的厚度(單位:Pm) °表2與3中 ,剝離強度的單位爲N,光透射比單位爲%,而濁度單位爲 %。 由上述實施例淸楚地看出,本發明的包覆帶可具有不 會太高也不會太低的剝離強度,而且其最大値與最小値間 的差異小;因此,藉由本包覆帶可以安裝電子組件步驟中 所出現伴隨剝離強度而發生的問題。 此外,本包覆帶欲密封於承載帶的表面之表面電阻係 數爲lx 1013或以下;因此可以避免同一步驟當中伴隨靜電 而發生的問題。 本包覆帶中,對各層進行層壓作用,因此該帶的光透 射比爲7〇%以上,濁度爲8〇%以下,很容易看穿該帶確認 所包裝的電子組件。 此外,本發明可以藉由簡單製造方法提供具有安定剝 離強度的透明包覆帶。 (請先閲讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -22-
Claims (1)
- 555646 A8 Β8 C8 D8 六、申請專利範圍1 (請先閲讀背面之注意事項再填寫本頁) 1、 一種電子組件包裝用包覆帶,其可以熱密封於塑膠 製承載帶上,該塑膠製承載帶中具有規律形成之可貯存電 子組件之小袋,而且該包覆帶包括(A)由聚酯、聚丙烯或耐 綸形成的雙軸定向膜層,與(B) —種熱塑性樹脂層,其由 1〇〇重量份數乙烯共聚物與10至100重量份數聚苯乙烯所 組成,並層壓於層A其中一面。 2、 如申g靑專利範圍弟1項之電子組件包裝用包覆帶, 其中在層A與層B之間夾有至少一種選自由無定向聚酯層 、無定向耐綸層與無定向聚丙烯層組成群組之層。 3、 如申請專利範圍第1或2項之電子組件包裝用包覆 帶,其中包含於層B中的乙烯共聚物之共聚單體係選自醋 酸乙烯酯、丙烯酸、丙烯酸酯、甲基丙烯酸、甲基丙烯酸 酯與一種離子聚合物所組成群組中至少一者。 4、 如申請專利範圍第1或2項之電子組件包裝用包覆 帶,其中包含於層B中的乙烯共聚物之共聚單體的比例係 ,相對於100重量份數乙烯,使用17至90重量份數。 經濟部智慧財產局員工消費合作社印製 5、 如申請專利範圍第1或2項之電子組件包裝用包覆 帶,其中層B厚度爲0.5至50 μιη。 6、 如申請專利範圍第〗或2項之電子組件包裝用包覆 帶,其中當包覆帶熱密封於該承載帶時,層Β會造成黏合 失效並剝離,然後自該承載帶剝除。 7、 如申請專利範圍第1或2項之電子組件包裝用包覆 帶,其中將一種由氧化錫、氧化鋅、氧化鈦、碳黑或其組 合所製得的導電細微粉末及/或界面活性劑分散在層Β中, 本紙張尺度適用中國國家樣準(CNS ) Α4規格(210Χ297公釐:) -23- 555646 A8 B8 C8 D8 六、申請專利範圍2 層B的表面電阻係數爲lXl〇13 〇/□或以下。 (請先閲讀背面之注意事項再填寫本頁) 8、 如申請專利範圍第1或2項之電子組件包裝用包覆 帶,其中在層B表面上形成一層抗靜電層,其中分散有由 氧化錫、氧化鋅、氧化鈦、碳黑或其組合所製得的導電細 微粉末及/或界面活性劑,而且該抗靜電層的表面電阻係數 爲lx ΙΟ13 Ω /□或以下。 9、 如申請專利範圍第1或2項之電子組件包裝用包覆 帶,當該包覆帶熱密封於該承載帶,然後自該承載帶剝除 時,其剝離強度係每mm該包覆帶密封寬度〇. 1至1.3 N。 1 〇、如申請專利範圍第1或2項之電子組件包裝用包 覆帶,其光透射比爲70%或以上,濁度爲80%或以下。 1 1、如申請專利範圍第1或2項之電子組件包裝用包 覆帶,當該包覆帶熱密封於該承載帶,然後自該承載帶剝 除時,其剝離強度的最大値與最小値間的差異係每mm該 包覆帶密封寬度0.01至0.4 N。 經濟部智慧財產局員工消費合作社印製 12、 一種電子組件包裝用包覆帶,其可熱密封於塑膠 製承載帶上,該承載帶中具有規律形成之可貯存電子組件 之小袋,而且該包覆帶至少包括黏著層與基底層這兩層, 該黏著層位於該包覆帶熱密封於該承載帶那面,此二層係 藉由共同擠壓彼此層壓在一起,而該基底層係聚酯、耐綸 或聚丙嫌。 13、 一種電子組件包裝用包覆帶,其可熱密封於塑膠 製承載帶上,該承載帶中具有規律形成之可貯存電子組件 之小袋,而且該包覆帶依序至少包括黏著層、中間層與基 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -24- 555646 Α8 Β8 C8 D8 經濟部智慧財產局員工消費合作社印製 々、申請專利範圍3 底層這三層,該黏著層位於該包覆帶熱密封於該承載帶那 面,該中間層與基底層係藉由共同擠壓彼此層壓在一起, 而該黏著層係藉由照相凹版塗覆層壓。 14、如申請專利範圍第12項之電子組件包裝用包覆帶 ,其中該黏著層係由一種乙烯-α-烯烴共聚物所製得,該 α-烯烴係醋酸乙烯酯、丙烯酸、一種丙烯酸酯、甲基丙烯 酸或甲基丙烯酸酯。 1 5、如申請專利範圍第1 3項之電子組件包裝用包覆帶 ,其中該中間層係由一種乙烯-α -烯烴共聚物所製得,該 α -烯烴係醋酸乙烯酯、丙烯酸、一種丙烯酸酯、甲基丙烯 酸或甲基丙烯酸酯。 1 6、如申請專利範圍第1 3或1 5項之電子組件包裝用 包覆帶,其中該黏著層係由一種乙烯-α-烯烴共聚物所製得 ,該α -烯烴係醋酸乙烯酯、丙烯酸、一種丙烯酸酯、甲基 丙烯酸或甲基丙烯酸酯,一種聚(甲基丙烯酸酯)、乙烯基 氯-丙烯酸乙烯酯共聚物、聚氯化丙烯或聚胺基甲酸酯。 1 7、如申請專利範圍第1 2至1 5項中任一項之電子組 件包裝用包覆帶,其光透射比爲70%或以上,濁度爲60% 或以下。 (請先閲讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準(CNS ) Α4規格(210Χ297公嫠) -25-
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JP2001193036A JP2003012027A (ja) | 2001-06-26 | 2001-06-26 | 電子部品包装用カバーテープ |
JP2001318816A JP4213375B2 (ja) | 2001-10-17 | 2001-10-17 | 電子部品包装用カバーテープ |
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TW91113901A TW555646B (en) | 2001-06-26 | 2002-06-25 | Cover tape for packaging electronic components |
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US (1) | US6787224B2 (zh) |
EP (1) | EP1270210B1 (zh) |
KR (1) | KR100822095B1 (zh) |
CN (1) | CN1231395C (zh) |
AT (1) | ATE336371T1 (zh) |
CA (1) | CA2391525C (zh) |
DE (1) | DE60213914T2 (zh) |
MY (1) | MY134801A (zh) |
SG (1) | SG120872A1 (zh) |
TW (1) | TW555646B (zh) |
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TWI615324B (zh) * | 2013-11-22 | 2018-02-21 | Tokyo Weld Co Ltd | 載帶捲取收納裝置及載帶捲取收納方法 |
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EP1607426B1 (en) * | 2003-03-19 | 2016-08-24 | Toyo Seikan Group Holdings, Ltd. | Film for laminate and laminate comprising the same |
KR100571538B1 (ko) * | 2004-05-24 | 2006-04-17 | (주)코스탯아이앤씨 | 전자부품 포장용 커버 테이프 및 그 제조방법 |
KR100964050B1 (ko) * | 2005-05-19 | 2010-06-16 | 닛토덴코 가부시키가이샤 | 포장재용 적층 테이프 |
US8247057B2 (en) * | 2005-09-16 | 2012-08-21 | 3M Innovative Properties Company | Cover tape and method for manufacture |
JP5554561B2 (ja) * | 2007-04-11 | 2014-07-23 | 住友ベークライト株式会社 | 電子部品包装体 |
KR101139545B1 (ko) * | 2009-07-22 | 2012-04-27 | 스미또모 베이크라이트 가부시키가이샤 | 전자부품 포장용 커버 테이프 및 전자부품 포장체 |
CN101973150B (zh) * | 2010-08-25 | 2012-12-19 | 浙江洁美电子科技有限公司 | 用于电子元器件包装载体的上胶带及其制备方法 |
JP2012214252A (ja) | 2010-09-30 | 2012-11-08 | Sumitomo Bakelite Co Ltd | 電子部品包装用カバーテープ |
JP5762556B2 (ja) * | 2010-12-17 | 2015-08-12 | スリーエム イノベイティブ プロパティズ カンパニー | ヒートシール、及び電子部品をパッケージングするためのカバーテープ |
WO2013095522A1 (en) * | 2011-12-22 | 2013-06-27 | Intel Corporation | Electrostatic discharge compatible dicing tape with laser scribe capability |
WO2015005330A1 (ja) * | 2013-07-09 | 2015-01-15 | 住友ベークライト株式会社 | 電子部品包装用カバーテープ |
JP2015110441A (ja) * | 2013-10-31 | 2015-06-18 | 株式会社村田製作所 | 電子部品の包装体、電子部品連およびキャリアテープ |
CN105934396B (zh) * | 2014-01-29 | 2018-12-18 | 住友电木株式会社 | 电子部件包装用盖带 |
US20170051185A1 (en) * | 2014-02-20 | 2017-02-23 | 3M Innovative Properties Company | Multi-layer cover tape constructions with graphite coatings |
CN104673140B (zh) * | 2015-03-05 | 2017-11-21 | 深圳市格莱特印刷材料有限公司 | 一种可剥胶及其制备方法 |
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CN109790345B (zh) * | 2016-09-28 | 2021-02-12 | 住友电木株式会社 | 树脂组合物、外封带及电子组件用包装体 |
CN106947404A (zh) * | 2017-03-22 | 2017-07-14 | 北京康得新功能材料有限公司 | 一种电热膜用耐高温预涂封装复合膜 |
CN113999623B (zh) * | 2021-11-18 | 2023-08-08 | 太仓展新胶粘材料股份有限公司 | 一种一体化复合散热缓冲件及其制备方法 |
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MY111332A (en) * | 1991-06-28 | 1999-11-30 | Furukawa Electric Co Ltd | Semiconductor wafer-securing adhesive tape. |
WO1997019140A1 (en) * | 1995-11-22 | 1997-05-29 | Sumitomo Bakelite Company, Limited | Cover tape for packaging electronic components |
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2002
- 2002-06-24 DE DE2002613914 patent/DE60213914T2/de not_active Expired - Lifetime
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TWI615324B (zh) * | 2013-11-22 | 2018-02-21 | Tokyo Weld Co Ltd | 載帶捲取收納裝置及載帶捲取收納方法 |
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CA2391525A1 (en) | 2002-12-26 |
EP1270210B1 (en) | 2006-08-16 |
CA2391525C (en) | 2010-11-30 |
MY134801A (en) | 2007-12-31 |
KR20030004075A (ko) | 2003-01-14 |
EP1270210A3 (en) | 2003-01-29 |
CN1394797A (zh) | 2003-02-05 |
EP1270210A2 (en) | 2003-01-02 |
DE60213914D1 (de) | 2006-09-28 |
US6787224B2 (en) | 2004-09-07 |
SG120872A1 (en) | 2006-04-26 |
ATE336371T1 (de) | 2006-09-15 |
DE60213914T2 (de) | 2007-02-22 |
US20030035946A1 (en) | 2003-02-20 |
KR100822095B1 (ko) | 2008-04-15 |
CN1231395C (zh) | 2005-12-14 |
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