TW215453B - - Google Patents
Info
- Publication number
- TW215453B TW215453B TW081105027A TW81105027A TW215453B TW 215453 B TW215453 B TW 215453B TW 081105027 A TW081105027 A TW 081105027A TW 81105027 A TW81105027 A TW 81105027A TW 215453 B TW215453 B TW 215453B
- Authority
- TW
- Taiwan
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
- C08L53/02—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
- C08L53/02—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
- C08L53/025—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes modified
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/16—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
- C09J2301/162—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer the carrier being a laminate constituted by plastic layers only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dicing (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18539791 | 1991-06-28 | ||
JP09209492A JP3326195B2 (ja) | 1991-06-28 | 1992-03-18 | 半導体ウエハ固定用粘着テープ |
JP11392892 | 1992-03-18 | ||
JP9209392A JP3291017B2 (ja) | 1992-03-18 | 1992-03-18 | 半導体ウエハ固定用粘着テープ |
Publications (1)
Publication Number | Publication Date |
---|---|
TW215453B true TW215453B (zh) | 1993-11-01 |
Family
ID=27467997
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW081105027A TW215453B (zh) | 1991-06-28 | 1992-06-26 |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP0520515B1 (zh) |
KR (1) | KR0162103B1 (zh) |
DE (1) | DE69206331T2 (zh) |
MY (1) | MY111332A (zh) |
TW (1) | TW215453B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI558781B (zh) * | 2012-04-13 | 2016-11-21 | 東京應化工業股份有限公司 | 黏著劑組成物,黏著薄膜及黏貼方法 |
TWI586776B (zh) * | 2012-10-25 | 2017-06-11 | 東京應化工業股份有限公司 | 接著劑組成物及接著薄膜 |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB9301929D0 (en) * | 1993-02-01 | 1993-03-17 | Raychem Ltd | Low-temperature-tolerant gels |
FR2717487B1 (fr) * | 1994-03-16 | 1998-06-26 | Atochem Elf Sa | Composition de liant de coextrusion et complexe multicouche coextrudé dans lequel ladite composition est utilisée comme couche adhésive. |
FR2717489B1 (fr) * | 1994-03-16 | 1999-09-24 | Atochem Elf Sa | Composition de liant de coextrusion et complexe multicouche coextrudé dans lequel ladite composition est utilisée comme couche adhésive. |
TW311927B (zh) * | 1995-07-11 | 1997-08-01 | Minnesota Mining & Mfg | |
US5648136A (en) * | 1995-07-11 | 1997-07-15 | Minnesota Mining And Manufacturing Co. | Component carrier tape |
WO1997019140A1 (en) * | 1995-11-22 | 1997-05-29 | Sumitomo Bakelite Company, Limited | Cover tape for packaging electronic components |
JP4153577B2 (ja) | 1997-11-28 | 2008-09-24 | 旭化成ケミカルズ株式会社 | 耐油性に優れた熱可塑性エラストマー |
US6235387B1 (en) * | 1998-03-30 | 2001-05-22 | 3M Innovative Properties Company | Semiconductor wafer processing tapes |
DE60213914T2 (de) * | 2001-06-26 | 2007-02-22 | Sumitomo Bakelite Co. Ltd. | Abdeckband zum Verpacken von elektronischen Komponenten |
JP2012094834A (ja) | 2010-09-13 | 2012-05-17 | Sumitomo Bakelite Co Ltd | ダイシングフィルム |
JP5117629B1 (ja) * | 2012-06-28 | 2013-01-16 | 古河電気工業株式会社 | ウェハ加工用粘着テープ |
WO2014136181A1 (ja) * | 2013-03-04 | 2014-09-12 | リンテック株式会社 | ダイシングシート用基材フィルムおよび当該基材フィルムを備えるダイシングシート |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH083081B2 (ja) * | 1988-06-06 | 1996-01-17 | 日立化成工業株式会社 | 回路接続用接着剤組成物 |
JPH02215528A (ja) * | 1989-02-17 | 1990-08-28 | Sumitomo Bakelite Co Ltd | 多層フィルム |
-
1992
- 1992-06-26 MY MYPI92001221A patent/MY111332A/en unknown
- 1992-06-26 TW TW081105027A patent/TW215453B/zh not_active IP Right Cessation
- 1992-06-27 KR KR1019920011393A patent/KR0162103B1/ko not_active IP Right Cessation
- 1992-06-29 EP EP92110997A patent/EP0520515B1/en not_active Expired - Lifetime
- 1992-06-29 DE DE69206331T patent/DE69206331T2/de not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI558781B (zh) * | 2012-04-13 | 2016-11-21 | 東京應化工業股份有限公司 | 黏著劑組成物,黏著薄膜及黏貼方法 |
US10793756B2 (en) | 2012-04-13 | 2020-10-06 | Tokyo Ohka Kogyo Co., Ltd. | Adhesive composition, adhesive film, and bonding method |
TWI586776B (zh) * | 2012-10-25 | 2017-06-11 | 東京應化工業股份有限公司 | 接著劑組成物及接著薄膜 |
Also Published As
Publication number | Publication date |
---|---|
MY111332A (en) | 1999-11-30 |
KR0162103B1 (ko) | 1999-01-15 |
EP0520515A2 (en) | 1992-12-30 |
KR930000642A (ko) | 1993-01-15 |
EP0520515B1 (en) | 1995-11-29 |
DE69206331T2 (de) | 1996-08-29 |
EP0520515A3 (en) | 1993-08-25 |
DE69206331D1 (de) | 1996-01-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK4A | Expiration of patent term of an invention patent |