CN1294651C - 半导体器件 - Google Patents
半导体器件 Download PDFInfo
- Publication number
- CN1294651C CN1294651C CNB021233454A CN02123345A CN1294651C CN 1294651 C CN1294651 C CN 1294651C CN B021233454 A CNB021233454 A CN B021233454A CN 02123345 A CN02123345 A CN 02123345A CN 1294651 C CN1294651 C CN 1294651C
- Authority
- CN
- China
- Prior art keywords
- solder joint
- wiring
- power supply
- signal
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48235—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a via metallisation of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
- H01L2924/15172—Fan-out arrangement of the internal vias
- H01L2924/15173—Fan-out arrangement of the internal vias in a single layer of the multilayer substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Geometry (AREA)
- Wire Bonding (AREA)
- Semiconductor Integrated Circuits (AREA)
Abstract
Description
Claims (5)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP310861/1995 | 1995-11-29 | ||
JP31086195A JP3294490B2 (ja) | 1995-11-29 | 1995-11-29 | Bga型半導体装置 |
JP310861/95 | 1995-11-29 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN96123495A Division CN1089491C (zh) | 1995-11-29 | 1996-11-29 | 半导体器件 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1492498A CN1492498A (zh) | 2004-04-28 |
CN1294651C true CN1294651C (zh) | 2007-01-10 |
Family
ID=18010279
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB021233454A Expired - Fee Related CN1294651C (zh) | 1995-11-29 | 1996-11-29 | 半导体器件 |
CN96123495A Expired - Fee Related CN1089491C (zh) | 1995-11-29 | 1996-11-29 | 半导体器件 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN96123495A Expired - Fee Related CN1089491C (zh) | 1995-11-29 | 1996-11-29 | 半导体器件 |
Country Status (7)
Country | Link |
---|---|
US (1) | US6163071A (zh) |
JP (1) | JP3294490B2 (zh) |
KR (1) | KR100240525B1 (zh) |
CN (2) | CN1294651C (zh) |
MY (1) | MY124454A (zh) |
SG (1) | SG47197A1 (zh) |
TW (1) | TW309640B (zh) |
Families Citing this family (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6734545B1 (en) * | 1995-11-29 | 2004-05-11 | Hitachi, Ltd. | BGA type semiconductor device and electronic equipment using the same |
MY123146A (en) * | 1996-03-28 | 2006-05-31 | Intel Corp | Perimeter matrix ball grid array circuit package with a populated center |
JP3797797B2 (ja) * | 1997-08-13 | 2006-07-19 | 三菱化学株式会社 | 半導体発光素子の製造方法 |
JP3447961B2 (ja) * | 1998-08-26 | 2003-09-16 | 富士通株式会社 | 半導体装置の製造方法及び半導体製造装置 |
WO2000042896A2 (en) * | 1999-01-19 | 2000-07-27 | Koninklijke Philips Electronics N.V. | X-ray detector |
JP2001203470A (ja) * | 2000-01-21 | 2001-07-27 | Toshiba Corp | 配線基板、半導体パッケージ、および半導体装置 |
US6403896B1 (en) * | 2000-09-27 | 2002-06-11 | Advanced Semiconductor Engineering, Inc. | Substrate having specific pad distribution |
US7434305B2 (en) | 2000-11-28 | 2008-10-14 | Knowles Electronics, Llc. | Method of manufacturing a microphone |
US8623709B1 (en) | 2000-11-28 | 2014-01-07 | Knowles Electronics, Llc | Methods of manufacture of top port surface mount silicon condenser microphone packages |
DE10121241B4 (de) * | 2001-04-30 | 2005-07-07 | Infineon Technologies Ag | Integrierte Schaltung |
CA2390627C (en) * | 2001-06-18 | 2007-01-30 | Research In Motion Limited | Ic chip packaging for reducing bond wire length |
EP1434264A3 (en) * | 2002-12-27 | 2017-01-18 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method using the transfer technique |
WO2005013359A1 (ja) * | 2003-07-31 | 2005-02-10 | Matsushita Electric Industrial Co., Ltd. | 半導体装置 |
US7074049B2 (en) * | 2004-03-22 | 2006-07-11 | Johnstech International Corporation | Kelvin contact module for a microcircuit test system |
CN100447966C (zh) * | 2004-05-12 | 2008-12-31 | 库利克和索夫工业公司 | 集成球与过孔的封装和形成工艺 |
JP4591886B2 (ja) * | 2004-07-21 | 2010-12-01 | ローム株式会社 | 半導体装置を用いた電源回路装置 |
DE102005008512B4 (de) | 2005-02-24 | 2016-06-23 | Epcos Ag | Elektrisches Modul mit einem MEMS-Mikrofon |
DE102005008511B4 (de) | 2005-02-24 | 2019-09-12 | Tdk Corporation | MEMS-Mikrofon |
DE102005053765B4 (de) | 2005-11-10 | 2016-04-14 | Epcos Ag | MEMS-Package und Verfahren zur Herstellung |
DE102005053767B4 (de) | 2005-11-10 | 2014-10-30 | Epcos Ag | MEMS-Mikrofon, Verfahren zur Herstellung und Verfahren zum Einbau |
KR100681398B1 (ko) * | 2005-12-29 | 2007-02-15 | 삼성전자주식회사 | 열방출형 반도체 칩과 테이프 배선기판 및 그를 이용한테이프 패키지 |
JP2007235004A (ja) * | 2006-03-03 | 2007-09-13 | Mitsubishi Electric Corp | 半導体装置 |
US7616451B2 (en) * | 2006-10-13 | 2009-11-10 | Stmicroelectronics S.R.L. | Semiconductor package substrate and method, in particular for MEMS devices |
JP2009054993A (ja) * | 2007-08-02 | 2009-03-12 | Tokyo Electron Ltd | 位置検出用治具 |
JP5255929B2 (ja) * | 2008-07-04 | 2013-08-07 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
WO2013066343A1 (en) | 2011-11-04 | 2013-05-10 | Knowles Electronics, Llc | Embedded dielectric as a barrier in an acoustic device and method of manufacture |
KR101511946B1 (ko) | 2011-11-17 | 2015-04-14 | 인벤센스, 인크. | 사운드 파이프를 갖춘 마이크로폰 모듈 |
JP2013236039A (ja) * | 2012-05-11 | 2013-11-21 | Renesas Electronics Corp | 半導体装置 |
US9738515B2 (en) | 2012-06-27 | 2017-08-22 | Invensense, Inc. | Transducer with enlarged back volume |
US9078063B2 (en) | 2012-08-10 | 2015-07-07 | Knowles Electronics, Llc | Microphone assembly with barrier to prevent contaminant infiltration |
DE102013106353B4 (de) * | 2013-06-18 | 2018-06-28 | Tdk Corporation | Verfahren zum Aufbringen einer strukturierten Beschichtung auf ein Bauelement |
US9794661B2 (en) | 2015-08-07 | 2017-10-17 | Knowles Electronics, Llc | Ingress protection for reducing particle infiltration into acoustic chamber of a MEMS microphone package |
WO2020097767A1 (zh) * | 2018-11-12 | 2020-05-22 | 北京比特大陆科技有限公司 | 电路板及超算设备 |
JP7238481B2 (ja) | 2019-03-05 | 2023-03-14 | 株式会社アイシン | 半導体モジュール及び半導体装置 |
CN113008353B (zh) * | 2021-02-10 | 2022-07-01 | 西北工业大学 | 集成式多阵元的小型换能器基阵设计方法及小型换能器基阵 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5216278A (en) * | 1990-12-04 | 1993-06-01 | Motorola, Inc. | Semiconductor device having a pad array carrier package |
JPH06302757A (ja) * | 1993-04-15 | 1994-10-28 | Ibiden Co Ltd | 電子部品搭載装置及びその実装方法 |
JPH0738008A (ja) * | 1993-06-25 | 1995-02-07 | Matsushita Electric Works Ltd | チップキャリア |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4437141A (en) * | 1981-09-14 | 1984-03-13 | Texas Instruments Incorporated | High terminal count integrated circuit device package |
US4614194A (en) * | 1984-01-20 | 1986-09-30 | Cordis Corporation | Implantable pulse generator having a single printed circuit board for carrying integrated circuit chips thereon with chip carrier means |
JPH0324753A (ja) * | 1989-06-22 | 1991-02-01 | Nec Corp | 半導体装置用パッケージ |
JPH04352436A (ja) * | 1991-05-30 | 1992-12-07 | Fujitsu Ltd | 半導体装置 |
JP3228583B2 (ja) * | 1992-03-31 | 2001-11-12 | 株式会社東芝 | 半導体集積回路装置 |
US5285352A (en) * | 1992-07-15 | 1994-02-08 | Motorola, Inc. | Pad array semiconductor device with thermal conductor and process for making the same |
US5592025A (en) * | 1992-08-06 | 1997-01-07 | Motorola, Inc. | Pad array semiconductor device |
US5283717A (en) * | 1992-12-04 | 1994-02-01 | Sgs-Thomson Microelectronics, Inc. | Circuit assembly having interposer lead frame |
US5457340A (en) * | 1992-12-07 | 1995-10-10 | Integrated Device Technology, Inc. | Leadframe with power and ground planes |
US5490324A (en) * | 1993-09-15 | 1996-02-13 | Lsi Logic Corporation | Method of making integrated circuit package having multiple bonding tiers |
US5545923A (en) * | 1993-10-22 | 1996-08-13 | Lsi Logic Corporation | Semiconductor device assembly with minimized bond finger connections |
US5380681A (en) * | 1994-03-21 | 1995-01-10 | United Microelectronics Corporation | Three-dimensional multichip package and methods of fabricating |
JPH07297313A (ja) * | 1994-04-20 | 1995-11-10 | Fujitsu Ltd | 半導体装置及びその製造方法 |
US5583378A (en) * | 1994-05-16 | 1996-12-10 | Amkor Electronics, Inc. | Ball grid array integrated circuit package with thermal conductor |
US5444303A (en) * | 1994-08-10 | 1995-08-22 | Motorola, Inc. | Wire bond pad arrangement having improved pad density |
US5442230A (en) * | 1994-09-16 | 1995-08-15 | National Semiconductor Corporation | High density integrated circuit assembly combining leadframe leads with conductive traces |
US5801440A (en) * | 1995-10-10 | 1998-09-01 | Acc Microelectronics Corporation | Chip package board having utility rings |
US5672911A (en) * | 1996-05-30 | 1997-09-30 | Lsi Logic Corporation | Apparatus to decouple core circuits power supply from input-output circuits power supply in a semiconductor device package |
US5691568A (en) * | 1996-05-31 | 1997-11-25 | Lsi Logic Corporation | Wire bondable package design with maxium electrical performance and minimum number of layers |
-
1995
- 1995-11-29 JP JP31086195A patent/JP3294490B2/ja not_active Expired - Fee Related
-
1996
- 1996-11-18 KR KR1019960054777A patent/KR100240525B1/ko not_active IP Right Cessation
- 1996-11-25 TW TW085114513A patent/TW309640B/zh not_active IP Right Cessation
- 1996-11-26 SG SG1996011438A patent/SG47197A1/en unknown
- 1996-11-26 MY MYPI96004933A patent/MY124454A/en unknown
- 1996-11-27 US US08/757,350 patent/US6163071A/en not_active Expired - Lifetime
- 1996-11-29 CN CNB021233454A patent/CN1294651C/zh not_active Expired - Fee Related
- 1996-11-29 CN CN96123495A patent/CN1089491C/zh not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5216278A (en) * | 1990-12-04 | 1993-06-01 | Motorola, Inc. | Semiconductor device having a pad array carrier package |
JPH06302757A (ja) * | 1993-04-15 | 1994-10-28 | Ibiden Co Ltd | 電子部品搭載装置及びその実装方法 |
JPH0738008A (ja) * | 1993-06-25 | 1995-02-07 | Matsushita Electric Works Ltd | チップキャリア |
Also Published As
Publication number | Publication date |
---|---|
US6163071A (en) | 2000-12-19 |
KR100240525B1 (ko) | 2000-01-15 |
TW309640B (zh) | 1997-07-01 |
JP3294490B2 (ja) | 2002-06-24 |
CN1492498A (zh) | 2004-04-28 |
CN1089491C (zh) | 2002-08-21 |
CN1169593A (zh) | 1998-01-07 |
MY124454A (en) | 2006-06-30 |
KR970030750A (ko) | 1997-06-26 |
JPH09148476A (ja) | 1997-06-06 |
SG47197A1 (en) | 1998-03-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: RENESAS ELECTRONICS CORPORATION Free format text: FORMER OWNER: HITACHI, LTD. Effective date: 20121116 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20121116 Address after: Kawasaki, Kanagawa, Japan Patentee after: Renesas Electronics Corporation Address before: Tokyo, Japan, Japan Patentee before: Hitachi Ltd. |
|
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20070110 Termination date: 20131129 |