CN1235286C - 一种电子装置与制作此装置的方法 - Google Patents
一种电子装置与制作此装置的方法 Download PDFInfo
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- CN1235286C CN1235286C CNB011253703A CN01125370A CN1235286C CN 1235286 C CN1235286 C CN 1235286C CN B011253703 A CNB011253703 A CN B011253703A CN 01125370 A CN01125370 A CN 01125370A CN 1235286 C CN1235286 C CN 1235286C
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- H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2924/15738—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C
- H01L2924/15747—Copper [Cu] as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19043—Component type being a resistor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Wire Bonding (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Semiconductor Memories (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
Description
Claims (16)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000262511A JP3822040B2 (ja) | 2000-08-31 | 2000-08-31 | 電子装置及びその製造方法 |
JP262511/2000 | 2000-08-31 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1340857A CN1340857A (zh) | 2002-03-20 |
CN1235286C true CN1235286C (zh) | 2006-01-04 |
Family
ID=18750182
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB011253703A Expired - Fee Related CN1235286C (zh) | 2000-08-31 | 2001-08-31 | 一种电子装置与制作此装置的方法 |
Country Status (6)
Country | Link |
---|---|
US (2) | US6492737B1 (zh) |
JP (1) | JP3822040B2 (zh) |
KR (1) | KR100776867B1 (zh) |
CN (1) | CN1235286C (zh) |
SG (1) | SG99937A1 (zh) |
TW (1) | TW563214B (zh) |
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-
2000
- 2000-08-31 JP JP2000262511A patent/JP3822040B2/ja not_active Expired - Fee Related
-
2001
- 2001-08-06 US US09/921,919 patent/US6492737B1/en not_active Expired - Lifetime
- 2001-08-08 TW TW090119334A patent/TW563214B/zh not_active IP Right Cessation
- 2001-08-08 SG SG200104737A patent/SG99937A1/en unknown
- 2001-08-31 CN CNB011253703A patent/CN1235286C/zh not_active Expired - Fee Related
- 2001-08-31 KR KR1020010053225A patent/KR100776867B1/ko not_active IP Right Cessation
-
2002
- 2002-10-25 US US10/279,865 patent/US20030102570A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
SG99937A1 (en) | 2003-11-27 |
US20030102570A1 (en) | 2003-06-05 |
US6492737B1 (en) | 2002-12-10 |
KR20020018591A (ko) | 2002-03-08 |
JP2002076057A (ja) | 2002-03-15 |
KR100776867B1 (ko) | 2007-11-16 |
TW563214B (en) | 2003-11-21 |
CN1340857A (zh) | 2002-03-20 |
JP3822040B2 (ja) | 2006-09-13 |
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