CN1507053A - 半导体集成电路器件 - Google Patents
半导体集成电路器件 Download PDFInfo
- Publication number
- CN1507053A CN1507053A CNA031598676A CN03159867A CN1507053A CN 1507053 A CN1507053 A CN 1507053A CN A031598676 A CNA031598676 A CN A031598676A CN 03159867 A CN03159867 A CN 03159867A CN 1507053 A CN1507053 A CN 1507053A
- Authority
- CN
- China
- Prior art keywords
- unit
- power
- interior circuit
- semiconductor substrate
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
- G11C7/10—Input/output [I/O] data interface arrangements, e.g. I/O data control circuits, I/O data buffers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/528—Geometry or layout of the interconnection structure
- H01L23/5286—Arrangements of power or ground buses
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0556—Disposition
- H01L2224/05571—Disposition the external layer being disposed in a recess of the surface
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/05573—Single external layer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/05599—Material
- H01L2224/056—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Landscapes
- Physics & Mathematics (AREA)
- Geometry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Semiconductor Integrated Circuits (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
Abstract
Description
Claims (24)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002281607A JP4776861B2 (ja) | 2002-09-26 | 2002-09-26 | 半導体装置 |
JP281607/2002 | 2002-09-26 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1507053A true CN1507053A (zh) | 2004-06-23 |
CN100369254C CN100369254C (zh) | 2008-02-13 |
Family
ID=32089135
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB031598676A Expired - Lifetime CN100369254C (zh) | 2002-09-26 | 2003-09-26 | 半导体集成电路器件 |
Country Status (5)
Country | Link |
---|---|
US (1) | US6911683B2 (zh) |
JP (1) | JP4776861B2 (zh) |
KR (1) | KR100983409B1 (zh) |
CN (1) | CN100369254C (zh) |
TW (1) | TW200405516A (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101952956A (zh) * | 2008-02-19 | 2011-01-19 | 株式会社理技独设计*** | 半导体芯片及半导体装置 |
CN104037156A (zh) * | 2009-07-15 | 2014-09-10 | 瑞萨电子株式会社 | 半导体装置 |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4510370B2 (ja) * | 2002-12-25 | 2010-07-21 | パナソニック株式会社 | 半導体集積回路装置 |
US7411601B2 (en) * | 2004-08-03 | 2008-08-12 | Seiko Epson Corporation | Exposure head |
KR100674936B1 (ko) | 2005-01-10 | 2007-01-26 | 삼성전자주식회사 | 강화된 파우워를 갖는 반도체 메모리장치 및 이의 파우워강화 방법 |
JP2008541126A (ja) * | 2005-05-19 | 2008-11-20 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 機能アセンブリ及びそれを得る方法 |
JP4934325B2 (ja) * | 2006-02-17 | 2012-05-16 | 株式会社フジクラ | プリント配線板の接続構造及びプリント配線板の接続方法 |
JP5264135B2 (ja) * | 2006-11-09 | 2013-08-14 | パナソニック株式会社 | 半導体集積回路及びマルチチップモジュール |
JP2008147374A (ja) * | 2006-12-08 | 2008-06-26 | Fujitsu Ltd | 半導体装置 |
JP5147234B2 (ja) | 2006-12-28 | 2013-02-20 | パナソニック株式会社 | 半導体集積回路装置 |
US8106487B2 (en) * | 2008-12-23 | 2012-01-31 | Pratt & Whitney Rocketdyne, Inc. | Semiconductor device having an inorganic coating layer applied over a junction termination extension |
JP5535490B2 (ja) * | 2009-01-30 | 2014-07-02 | 住友電工デバイス・イノベーション株式会社 | 半導体装置 |
US10892236B2 (en) * | 2019-04-30 | 2021-01-12 | Qualcomm Incorporated | Integrated circuit having a periphery of input/output cells |
US11749572B2 (en) * | 2020-05-19 | 2023-09-05 | Macronix International Co., Ltd. | Testing bonding pads for chiplet systems |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0346352A (ja) * | 1989-07-14 | 1991-02-27 | Mitsubishi Electric Corp | 半導体集積回路装置 |
JPH03165543A (ja) * | 1989-11-25 | 1991-07-17 | Seiko Epson Corp | 半導体装置 |
JP3101077B2 (ja) * | 1992-06-11 | 2000-10-23 | 株式会社日立製作所 | 半導体集積回路装置 |
JP3177464B2 (ja) * | 1996-12-12 | 2001-06-18 | 株式会社日立製作所 | 入出力回路セル及び半導体集積回路装置 |
JPH1140754A (ja) | 1997-07-17 | 1999-02-12 | Mitsubishi Electric Corp | 半導体装置 |
US6008532A (en) * | 1997-10-23 | 1999-12-28 | Lsi Logic Corporation | Integrated circuit package having bond fingers with alternate bonding areas |
JP3679923B2 (ja) * | 1998-05-07 | 2005-08-03 | 株式会社東芝 | 半導体装置 |
US6078068A (en) * | 1998-07-15 | 2000-06-20 | Adaptec, Inc. | Electrostatic discharge protection bus/die edge seal |
JP3236583B2 (ja) * | 1999-06-24 | 2001-12-10 | ローム株式会社 | 半導体集積回路装置 |
US7089517B2 (en) * | 2000-09-29 | 2006-08-08 | Advantest Corp. | Method for design validation of complex IC |
JP2002170844A (ja) * | 2000-12-04 | 2002-06-14 | Oki Electric Ind Co Ltd | 半導体装置 |
US6798069B1 (en) * | 2003-03-28 | 2004-09-28 | Lsi Logic Corporation | Integrated circuit having adaptable core and input/output regions with multi-layer pad trace conductors |
-
2002
- 2002-09-26 JP JP2002281607A patent/JP4776861B2/ja not_active Expired - Lifetime
-
2003
- 2003-09-10 US US10/658,402 patent/US6911683B2/en not_active Expired - Lifetime
- 2003-09-10 TW TW092125055A patent/TW200405516A/zh not_active IP Right Cessation
- 2003-09-22 KR KR1020030065482A patent/KR100983409B1/ko active IP Right Grant
- 2003-09-26 CN CNB031598676A patent/CN100369254C/zh not_active Expired - Lifetime
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101952956A (zh) * | 2008-02-19 | 2011-01-19 | 株式会社理技独设计*** | 半导体芯片及半导体装置 |
CN104037156A (zh) * | 2009-07-15 | 2014-09-10 | 瑞萨电子株式会社 | 半导体装置 |
CN104037156B (zh) * | 2009-07-15 | 2019-01-11 | 瑞萨电子株式会社 | 半导体装置 |
Also Published As
Publication number | Publication date |
---|---|
KR100983409B1 (ko) | 2010-09-20 |
US6911683B2 (en) | 2005-06-28 |
JP4776861B2 (ja) | 2011-09-21 |
TWI327354B (zh) | 2010-07-11 |
TW200405516A (en) | 2004-04-01 |
KR20040028518A (ko) | 2004-04-03 |
US20040075157A1 (en) | 2004-04-22 |
CN100369254C (zh) | 2008-02-13 |
JP2004119712A (ja) | 2004-04-15 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: NEC CORP. Free format text: FORMER OWNER: RENESAS TECHNOLOGY CORP. Effective date: 20100812 |
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C41 | Transfer of patent application or patent right or utility model | ||
C56 | Change in the name or address of the patentee |
Owner name: RENESAS ELECTRONICS CO., LTD. Free format text: FORMER NAME: NEC CORP. |
|
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: TOKYO, JAPAN TO: KANAGAWA, JAPAN |
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CP01 | Change in the name or title of a patent holder |
Address after: Kanagawa, Japan Patentee after: Renesas Electronics Corp. Address before: Kanagawa, Japan Patentee before: NEC ELECTRONICS Corp. |
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TR01 | Transfer of patent right |
Effective date of registration: 20100812 Address after: Kanagawa, Japan Patentee after: NEC ELECTRONICS Corp. Address before: Tokyo, Japan Patentee before: Renesas Technology Corp. |
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ASS | Succession or assignment of patent right |
Owner name: MURATA MANUFACTURING CO. LTD. Free format text: FORMER OWNER: RENESAS ELECTRONICS CORPORATION Effective date: 20120423 |
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C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20120423 Address after: Kyoto Japan Patentee after: Murata Manufacturing Co.,Ltd. Address before: Kanagawa, Japan Patentee before: Renesas Electronics Corp. |
|
CX01 | Expiry of patent term | ||
CX01 | Expiry of patent term |
Granted publication date: 20080213 |