CN1674278A - 电路装置 - Google Patents

电路装置 Download PDF

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Publication number
CN1674278A
CN1674278A CNA2005100061044A CN200510006104A CN1674278A CN 1674278 A CN1674278 A CN 1674278A CN A2005100061044 A CNA2005100061044 A CN A2005100061044A CN 200510006104 A CN200510006104 A CN 200510006104A CN 1674278 A CN1674278 A CN 1674278A
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CN
China
Prior art keywords
passive component
conductive pattern
bonding wire
circuit arrangement
semiconductor element
Prior art date
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Pending
Application number
CNA2005100061044A
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English (en)
Inventor
加藤敦史
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
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Sanyo Electric Co Ltd
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Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Publication of CN1674278A publication Critical patent/CN1674278A/zh
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B66—HOISTING; LIFTING; HAULING
    • B66C—CRANES; LOAD-ENGAGING ELEMENTS OR DEVICES FOR CRANES, CAPSTANS, WINCHES, OR TACKLES
    • B66C3/00—Load-engaging elements or devices attached to lifting or lowering gear of cranes or adapted for connection therewith and intended primarily for transmitting lifting forces to loose materials; Grabs
    • B66C3/20—Load-engaging elements or devices attached to lifting or lowering gear of cranes or adapted for connection therewith and intended primarily for transmitting lifting forces to loose materials; Grabs mounted on, or guided by, jibs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B66—HOISTING; LIFTING; HAULING
    • B66C—CRANES; LOAD-ENGAGING ELEMENTS OR DEVICES FOR CRANES, CAPSTANS, WINCHES, OR TACKLES
    • B66C13/00—Other constructional features or details
    • B66C13/12—Arrangements of means for transmitting pneumatic, hydraulic, or electric power to movable parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B66C23/18—Cranes comprising essentially a beam, boom, or triangular structure acting as a cantilever and mounted for translatory of swinging movements in vertical or horizontal planes or a combination of such movements, e.g. jib-cranes, derricks, tower cranes specially adapted for use in particular purposes
    • B66C23/36—Cranes comprising essentially a beam, boom, or triangular structure acting as a cantilever and mounted for translatory of swinging movements in vertical or horizontal planes or a combination of such movements, e.g. jib-cranes, derricks, tower cranes specially adapted for use in particular purposes mounted on road or rail vehicles; Manually-movable jib-cranes for use in workshops; Floating cranes
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

一种电路装置，在电路装置上安装无源元件时，由于电极部镀锡，在安装接合部由焊料固定，故不能以单层结构使配线交叉，限制了安装面积的扩大或在印刷线路板上安装时的回流温度，存在封装后的焊锡裂纹引起的可靠性恶化的问题。将无源元件的电极部镀金，在电极部上直接固定接合引线。由此，通过用于无源元件固定的安装接合部、焊盘部的降低、即使单层也可以实现配线的交叉，可谋求安装密度的提高。可避免在印刷线路板上安装时要在焊锡的熔点以下进行的限制。

Description

电路装置
技术领域
本发明涉及含有无源元件的电路装置，特别是涉及提高了配线密度的电路装置。
背景技术
参照图5说明现有的电路元件。图5(A)是电路装置的平面图，图5(B)是图5(A)的B-B线剖面图。
如图5(A)，例如在支承衬底110上的规定安装区域120上配置例如IC等半导体元件101和多个导电图案103。导电图案103具有固定接合引线108等的焊盘部103a及/或固定无源元件106的两电极部107的安装接合部103b。无源元件是例如片状电容等。
无源元件106和半导体元件101介由导电图案103连接。即利用焊锡等焊料将无源元件106的电极部107固定在安装接合部103b上，并从安装接合部103b延长导电图案103。然后，利用接合引线108等连接焊盘部103a和半导体元件101的电极焊盘102。另外，无源元件106相互之间通过两端部具有安装接合部103b的导电图案103连接。
如图5(B)，无源元件106的端部侧面镀锡，形成电极部107。而且，在安装无源元件106时，通过例如焊锡等焊料160将其固定在安装接合部103b(导电图案103)上(例如参照专利文献1)。
专利文献1：特开2003-297601号公报
无源元件106的电极部107由廉价的镀锡构成。而且，由于锡的熔点低，而不能进行高温热压装，故在安装无源元件106时，利用焊料160将其固定在导电图案104上。
在进行采用焊料160的安装时，在电极部107上形成由焊料160构成的焊痕。因此，为了使无源元件106与半导体元件101或其它无源元件、或导电图案103电连接，必须在无源元件106的电极部107下方设置比电极部107大的安装接合部103b。或设置具有连接接合引线108的焊盘部103a的导电图案103。由此，安装面积不能缩小，安装无源元件106的电路装置的制品的安装密度降低。
另外，在配线复杂，且导电图案103交叉设置时，必须如图5(A)虚线所示形成多层结构，并介由通孔TH连接，或在单层结构的情况下，将导电图案103的迂回量增大来配置。即，为了连接无源元件，必须增加成本或工时数，构成多层结构，或进一步扩大安装面积等。
另外，在通过焊料、特别是焊锡进行固定时，在具有树脂密封的结构的装置中具有如下问题。
不能将例如在印刷线路板上安装时的回流温度设为焊锡的熔点以上。这是由于当形成焊锡的熔点以上的回流温度时，会由焊锡的再熔融造成短路或封装的破坏。
另外，除焊锡以外在通过Ag膏进行粘接时也存在的问题是，当该树脂密封后的热使封装变形时，会在焊锡或Ag膏上产生裂纹，可靠性降低。
另外，在固定装置使用以锡为主成分的无铅焊锡的电路装置中还存在如下问题。例如，在利用无铅焊锡固定封装的外部端子(外部电极)和印刷线路板等安装衬底时，或利用焊锡形成外部电极本身时，在封装内部的固定中使用焊锡时必须使该焊锡比无铅焊锡的熔点高。但是，采用高熔点焊锡进行的安装会破坏元件等。
另外，在封装内部的固定采用无铅焊锡时，封装外部的固定装置为采用低熔点的焊锡进行安装，固定强度不充分。
另外，无铅焊锡的种类少，且都没有熔点差。即，当利用无铅焊锡固定封装内的无源元件，且外部端子(外部电极)也利用无铅焊锡固定在安装衬底上时，内部的无铅焊锡会产生再熔融。
发明内容
本发明是鉴于所述问题点而开发的，本发明的第一方面提供一种电路装置，其使用以锡为主成分的无铅焊锡作为固定装置，其包括：配置导电图案及与该导电图案电连接的半导体元件的安装区域；接合引线；粘接在所述安装区域上，且两侧面设置了电极部的至少一个无源元件，其中，在所述无源元件的电极部固定接合引线的一端，利用该接合引线进行电连接。
本发明的第二方面提供一种电路装置，其使用以锡为主成分的无铅焊锡作为固定装置，其包括：在支承衬底上配置半导体元件及导电图案的安装区域；接合引线；粘接在所述安装区域上，且两侧面设置了电极部的至少一个无源元件，其中，在所述无源元件的电极部上固定所述接合引线的一端，利用该接合引线进行电连接。
另外，利用树脂层至少覆盖所述导电图案、半导体元件、无源元件及接合引线，并与所述支承衬底一体支承。
本发明的第三方面提供一种电路装置，其使用以锡为主成分的无铅焊锡作为固定装置，其包括：由绝缘树脂支承的导电图案；由该导电图案或固定在所述绝缘树脂上的半导体元件构成的安装区域；接合引线；粘接在所述安装区域上，且两侧面设置了电极部的无源元件，其中，在所述无源元件的电极部固定该接合引线的一端，利用该接合引线进行电连接。
另外，利用所述绝缘树脂至少覆盖并一体支承所述导电图案、半导体元件、无源元件及接合引线。
所述无源元件由树脂或片粘接。
将所述接合引线的另一端连接在所述半导体元件或所述导电图案上。
将所述接合引线的另一端固定在其它所述无源元件的电极部。
所述无源元件的电极部镀金。
所述无源元件被粘接在所述半导体元件上。
在固定于所述无源元件上的接合引线下方配置所述导电图案的一部分。
通过热压装将所述接合引线固定在所述无源元件的电极部。
另外，所述无源元件由不能再熔融的其它固定装置固定在所述安装区域上。
在本发明中，可得到如下所示的效果。
第一，可利用接合引线将无源元件、半导体元件、导电图案或其它无源元件直接电连接。即，可不要用于固定无源元件电极部的安装接合部或用于连接无源元件和接近的半导体元件的电极焊盘的焊盘部，而实现安装面积的降低。
第二，由于通过在无源元件上直接固定接合引线来实现和其它构成要素的电连接，故可在该接合引线的下方配置导电图案的一部分。目前，是利用导电图案连接无源元件和其它构成要素，故在与连接在无源元件上的导电图案交叉时，必须构成两层配线，但根据本实施方式，可通过单层来实现这一点，可谋求安装密度的提高。
第三，可在半导体元件上粘接无源元件。由此，实现安装面积的降低和连接在半导体元件上的接合引线的缩短得到的高频特性的提高。
第四，由于无源元件的安装可使用粘接剂或粘接片，故没有将在印刷线路板上安装电路装置模块时的回流温度设定为焊锡的熔点以下的限制。
第五，由于可不使用焊料进行固定，故可防止树脂封装的应力引起的焊料裂纹的产生，提高可靠性。
第六，不在无源元件的侧面部形成由焊料构成的焊痕。因此，可减小无源元件的安装面积，可提高装置整体的安装密度。
第七，在固定装置使用无铅焊锡的电路装置中，可在外部端子(外部电极)和安装衬底的固定时采用无铅焊锡。或外部电极本身可采用无铅焊锡。
由于无铅焊锡的种类少，没有熔点差，故不能在封装内部和封装外部两侧使用无铅焊锡。根据本实施方式，由于利用接合引线对应封装内部无源元件的电连接，故可在外部端子和安装衬底的连接中采用无铅焊锡。
第八，由于不再需要现有无源元件的电连接必要的安装接合部，故可接近半导体元件配置无源元件。因此，例如无源元件采用片状电容等时噪声的吸收良好。
附图说明
图1是本发明电路装置的平面图(A)、剖面图(B)；
图2(A)、(B)、(C)是安装有本发明电路装置的封装之一例的剖面图；
图3(A)、(B)是安装有本发明电路装置的封装之一例的剖面图；
图4(A)、(B)是安装有本发明电路装置的封装之一例的平面图(A)、剖面图(B)；
图5(A)、(B)是现有电路装置的平面图(A)、剖面图(B)。
符号说明
1  半导体元件
2  电极焊盘
3  导电图案
3a   焊盘部
6    无源元件
7    电极部
8    接合引线
9    粘接材料
10   电路装置
20   安装区域
31   绝缘树脂
33   绝缘树脂
34   背面电极
41   绝缘树脂
42   导电膜
43   树脂片
44   外敷树脂
45   镀敷膜
46   多层连接装置
47   通孔
48   外敷树脂
50   引线架
51   衬底
101  半导体元件
102  电极焊盘
103  导电图案
103a 焊盘部
103b 安装接合部
106  无源元件
107  电极部
108  接合引线
110  支承衬底
TH   通孔
IL   岛
具体实施方式
参照图1～图4说明本发明电路装置的一实施例。
图1是本实施例电路装置的图示，图1(A)是平面图，图1(B)是图1(A)的A-A线剖面图。
本实施例的电路装置10由半导体元件1、导电图案2、无源元件6、接合引线8构成。
如图1(A)，电路装置在例如虚线所示的规定区域上具有安装区域20。另外，本实施例的安装区域20上至少配置例如IC等半导体元件1及导电图案3和无源元件6。在此指构成虚线所示的规定电路的连续的一区域。导电图案3的端部具有固定接合引线8的焊盘部3a。
在本实施例中，无源元件6是指在例如片状电阻、片状电容、电感、热敏电阻、天线、振荡器等元件两端部具有电极部7的片状元件。电极部7在细长形成的无源元件6的两端部形成，且在电极部7的表面施行了镀金。而且，在本实施例中，通过在无源元件6的电极部7上固定接合引线8的一端实现电连接。无源元件6通过不再熔融的固定装置固定在安装区域20上。具体地说，是绝缘性或导电性的粘接材料(粘接剂、粘接片等)。
具体地说，如图1(A)所示，本实施例的无源元件6例如粘接在不配置导电图案3的区域。但是，只要使用绝缘性粘接材料，则也可粘接在密集的导电图案3上。
无论如何，无源元件6由于是利用接合引线8进行电连接，故可不考虑导电图案3的配置，而被固定在安装区域20上。
另外，也可以利用绝缘性粘接材料将无源元件6固定在半导体元件1上，由此，可实现无源元件6和半导体元件1的叠层安装。
在无源元件6上固定的接合引线8的另一端连接在半导体元件1的电极焊盘2及/或导电图案3的焊盘部3a上。或利用接合引线8将无源元件6的电极部7相互之间连接。
因此，电极部7进行了镀金，可利用接合引线8进行接合。即由接合引线8的材料(Au或Al等)决定电极部7最表面的金属。
即对无源元件6不是通过焊料或Ag膏等固定在安装接合部，而是利用粘接树脂或粘接片等粘接材料固定在安装区域20上，并使用金属细线进行电连接的情况有意义。
由此，不再需要作为无源元件电极部的固定区域的现有安装接合部(图5的103b虚线标记)。另外，也不需要连接接近的半导体元件1的电极焊盘和无源元件6的焊盘部3a。即，可降低安装面积。另外，可接近配置半导体元件1和无源元件6。由此，在无源元件6为例如电容等时噪声的吸收良好。
另外，在本实施例中，在连接从半导体元件1远离的位置的无源元件6和半导体元件1时，也要使导电图案3迂回，故必须设置接近半导体元件1的电极焊盘2的焊盘部3(图1(A)的虚线标记)，在此进行引线接合。但是，即使在这样迂回形成导电图案3的情况下，在无源元件6侧作为导电图案3的焊盘部3a也不需要可固定电极部7的尺寸，只要确保可进行引线接合的面积就足够了。另外，由于可将导电图案3在连接于无源元件6上的接合引线8的下方进行配线，故可防止安装面积的增大。
参照图1(B)的剖面图说明在安装衬底上固定了无源元件6的状态。
无源元件6通过粘接材料9被粘接在安装区域。由于无源元件6的粘接是用粘接树脂或粘接片，故与采用焊料160时不同，不形成焊痕。因此，在安装无源元件6时需要的面积和无源元件6的平面大小程度相同。
而且，如图所示，无源元件6和半导体元件1在接近的位置利用接合引线8直接连接。另外，如前所述，由于可在半导体元件1上层积无源元件6，故可大幅降低安装面积。而且，此时，由于不再需要连接半导体元件1和无源元件6的导电图案3，也可缩短接合引线8，故通过降低电导可得到良好的高频特性，也有加速噪声的吸收的优点。
在半导体元件1上固定无源元件6时的粘接材料只要采用粘度比较高的材料即可。只要流动性低，具有以涂敷状态保持一定程度的厚度的程度的粘度，则可吸收无源元件6引线结合时的冲击，可缓和施加在半导体元件1上的应力。另外，例如在涂敷的状态下，如具有数十μm～100μm程度的厚度，则可相应地有利于固定时上下方向(高度方向)的对位精度。
另外，可在一端固定于无源元件6上的接合引线8的下方配置导电图案3的一部分。目前，在这样配线交叉时，必须将导电图案形成多层配线结构，并介由通孔进行连接，但在本实施例中可以由单层结构进行配线的交叉。
如上所述，通过利用接合引线连接无源元件6，或采用利用接合引线连接的芯片元件会产生各种效果。
其次，参照图2～图4说明上述电路装置的封装例。
首先，参照图2，图2(A)是不要安装衬底的类型的电路装置，图2(B)是使用具有导电图案的树脂片进行封装的结构，图2(C)是使用多层配线结构的衬底时的剖面图。
图2(A)中，可在具有例如所希望的导电图案的支承衬底上如图所示安装、模制元件后，剥离支承衬底。另外，可在半蚀刻Cu膜，安装元件并模制后，蚀刻存在于封装背面上的Cu箔。另外，使冲切引线架的背面接触下模具并进行模制也可实现。在此，以采用第二次半蚀刻的情况为例进行说明。
即，在安装区域20上配置导电图案3。导电图案3被埋入绝缘树脂31内并被其支承，背面从绝缘树脂31露出。此时，导电图案3是以Cu为主材料的导电箔、以Al为主材料的导电箔、或由Fe-Ni等合金构成的导电箔等，但也可以采用其它导电材料，最好采用可蚀刻的导电材料。
此时，在制造工序中，在片状导电箔上通过半蚀刻设置不达到导电箔厚度的分离槽32，形成导电图案3。而且，分离槽32内填充绝缘树脂31，与导电图案侧面的弯曲结构嵌合，而牢固地结合。然后，通过蚀刻分离槽32下方的导电箔将导电图案3一一分离，并利用绝缘树脂31支承。
即，绝缘树脂31使导电图案3的背面露出，密封安装区域20整体，在此是密封半导体元件1、无源元件6、接合引线8。绝缘树脂31可采用利用传递模模制形成的热硬性树脂或利用注入模模制形成的热塑性树脂。具体地说，可使用环氧树脂等热硬性树脂、聚酰亚胺树脂、硫化聚苯等热塑性树脂。另外，只要绝缘树脂是可使用模具固定的树脂、可进行浸渍、涂敷覆盖的树脂，则可采用全部树脂。在该封装中，绝缘树脂31密封半导体元件1等，同时还具有支承电路模块整体的作用。这样，通过利用绝缘树脂31密封整体，可防止半导体元件1或无源元件6自导电图案3分离。
半导体元件1根据其用途由绝缘性或导电性粘接剂固定在安装区域20内的导电图案(接合区域)3上，接合引线8热压装在电极焊盘上，与导电图案3或无源元件6连接。
在该图中，无源元件6在安装区域20内也通过粘接剂9固定在导电图案3上。在此，在本实施例中，通过接合引线8实现无源元件6和半导体元件1等其它构成要素的电连接。即无源元件6虽然也可以不固定在导电图案3上，但在采用图2(A)所示的封装结构的情况下，通过固定在导电图案3上可提高无源元件6的支承强度。
接合引线8的一端直接固定在无源元件6的电极部7上，另一端与半导体元件1的电极焊盘、导电图案3、其它无源元件6的电极部7的任意之一者连接。
另外，调整绝缘树脂31的厚度，从电路装置20的接合引线8的最顶部起覆盖约100μm左右。该厚度也可以根据强度而增厚、减薄。
绝缘树脂31的背面和导电图案3的背面形成实质上一致的结构。而且，在背面设置将所希望的区域开口的绝缘树脂(例如焊锡保护剂)33。而且，在构成外部电极的露出的导电图案3上覆盖焊锡等导电材料，形成背面电极34，完成电路装置。
此时，构成背面电极(外部电极)34的一部分，并作为与安装衬底连接的连接装置的焊锡可采用以锡为主成分的无铅焊锡。无铅焊锡的种类少，几乎没有熔点差。因此，在图示的结构中，当封装内部的固定装置也使用无铅焊锡时，在将封装件固定在安装衬底上时，封装件内部的无铅焊锡会再熔融。
但是，在本实施例中，封装件内部的无源元件6由不再熔融的粘接材料固定，并利用接合引线实现电连接。即可在背面电极34使用无铅焊锡。另外，在图2(A)中，如利用绝缘树脂覆盖导电图案3上，则可与导电图案3的配置无关地将无源元件3固定在安装衬底20上。
其次，根据图2(B)所示的结构，可提高导电图案3的配线的自由度。
在安装区域20内将导电图案3和电路装置10的其它构成要素一体埋入绝缘树脂31内，并由绝缘树脂31支承。此时的导电图案3通过准备在绝缘树脂41表面上形成导电膜42的绝缘树脂片43，并对导电膜42构图而形成，这一点后述。
绝缘树脂41的材料利用由聚酰亚胺树脂或环氧树脂等高分子构成的绝缘材料构成。另外，考虑导热性，也可以在其中混入填充物。材料可考虑玻璃、氧化硅、氧化铝、氮化铝、硅碳化物、氮化硼等。在涂敷膏状物质形成片的模铸法时，绝缘树脂41的膜厚为10～100μm程度。另外，市售的25μm为最小膜厚。
导电膜42最好是以Cu为主材料的物质、Al、Fe、Fe-Ni、或公知的引线架材料。通过镀敷法、蒸镀法或喷溅法覆盖在绝缘树脂2上，或也可以粘贴利用压延法或镀敷法形成的金属箔。
导电图案3利用所希望图案的光致抗蚀剂覆盖在导电膜42上，通过化学蚀刻形成所希望的图案。
导电图案3使引线接合的焊盘部3a露出，利用外敷树脂44覆盖其它部分。外敷树脂44是通过网印粘附利用溶剂溶解的环氧树脂等并使其热硬化而得到的。
另外，考虑接合性，在焊盘部3a上形成Au、Ag等的镀敷膜45。以外敷树脂44为掩膜，在焊盘部3a上选择性地无电解镀敷该镀敷膜45。
半导体元件1及无源元件6在裸片的状态下被例如绝缘性粘接剂(粘接树脂)9接合在安装区域20内的外敷树脂44上。
而且，半导体元件1的各电极焊盘通过接合引线8连接在焊盘部3a上。
然后，在无源元件6的电极部7上直接固定接合引线8的一端，接合引线8的另一端与半导体元件1、焊盘部3a、其它无源元件6之任意一者连接。
绝缘树脂片43被绝缘树脂31覆盖，由此，导电图案3也被埋入绝缘树脂31内。模制方法也可以采用传递模模制、注入模模制、涂敷、浸渍等。但是，当考虑批量生产性时，适用传递模模制、注入模模制。
背面露出绝缘树脂片43的背面即绝缘树脂41，将绝缘树脂41的所希望位置开口，在导电图案3的露出部分设置外部电极34。外部电极34可采用例如无铅焊锡等。
根据该结构，由于半导体元件1、无源元件6和其下的导电图案3被外敷树脂44电绝缘，故导电图案3即使在半导体元件1之下，也可以自由配线。
例如，在图2(A)中，通过在固定于无源元件6上的接合引线8的下方配置导电图案3的一部分来谋求安装面积的降低，但根据图2(B)的结构，也可以在半导体元件1或无源元件6的下方配置这样的导电图案3，进一步实现安装面积的降低或配线自由度的提高。
以上以形成了导电图案3的绝缘树脂片43的情况为例进行了说明，但本发明不限于此，也可以是利用外敷树脂44覆盖图2(A)的导电图案3上的结构。另外，也可以是利用外敷树脂44覆盖设置于挠性板等支承衬底上的导电图案3上的封装，无论哪种情况，都可在半导体元件1下方对导电图案3进行配线，故可实现配线自由度提高的封装件。
其次，图2(C)是实现导电图案3的多层配线结构的图示。另外，与图2(B)相同的构成要素利用同一符号表示，并省略说明。
在安装区域20内，导电图案3与电路装置10的其它构成要素一体被埋入绝缘树脂31内，并被其支承。此时的导电图案3如下形成，准备绝缘树脂片43，该绝缘树脂片43在绝缘树脂41表面的实质整个区域上形成第一导电膜42a，在背面实质整个区域上形成第二导电膜42b，通过对这些导电膜42构图而导电图案3。
绝缘树脂41、第一导电膜42a及第二导电膜42b的材料与图2(B)的情况相同，导电图案3是将第一导电膜42a、第二导电膜42b上利用所希望图案的光致抗蚀剂覆盖，利用化学蚀刻形成所希望的图案。
另外，在图2(C)中，利用多层连接装置46介由绝缘树脂41电连接被分离为上层、下层的导电图案3。多层连接装置46是将Cu等的镀敷膜埋入通孔47内而成的。镀敷膜在此采用Cu，但也可以采用Au、Ag、Pd等。
安装面侧的导电图案3使要引线接合的焊盘部3a露出，利用外敷树脂44覆盖其它部分，在焊盘部3a上设置镀敷膜45。
半导体元件1及无源元件6在裸片的状态下被例如绝缘性粘接剂(粘接树脂)9装在安装区域20内的外敷树脂44上。
而且，半导体元件1的各电极焊盘通过接合引线8连接在焊盘部3a上，在无源元件6的电极部7上直接固定接合引线8的一端，接合引线8的另一端与半导体元件1、焊盘部3a、其它无源元件6的任意之一连接。
绝缘树脂片43被绝缘树脂31覆盖，由此，由第一导电膜42a构成的导电图案3也被埋入绝缘树脂31内，被其一体地支承。
由绝缘树脂下方的第二导电膜42b构成的导电图案3从绝缘树脂31露出，通过利用绝缘树脂31覆盖绝缘片43的一部分而被其一体地支承，并介由多层连接装置12与由第一导电膜42a构成的导电图案3电连接，实现多层配线结构。下层的导电图案3使形成外部电极34的部分露出，网印通过溶剂溶解的环氧树脂等，利用外敷树脂43将大部分覆盖，并利用焊锡的回流或焊锡膏的网印将外部电极34设置在该露出部分上。外部电极34可采用例如无铅焊锡等。
另外，蚀刻第二镀敷膜42b利用金或钯镀敷膜覆盖其表面的凸起电极也可以实现外部电极34。
在这样的多层配线结构中，不仅连接于无源元件6上的接合引线8下方的导电图案3，即使必须在安装区域上大迂回的导电图案3也可以在半导体元件1及无源元件6的下方配线，可有利于芯片尺寸的降低。
其次，图3表示使用了支承衬底的芯片尺寸封装之一例。图3(A)是在图2(C)所示的封装中不需要外敷树脂44时的封装件，图3(B)是三层以上的多层配线结构的情况。
支承衬底51是例如玻璃环氧树脂衬底等绝缘衬底，另外，作为支承衬底51采用挠性板也同样。
在构成安装区域20的玻璃环氧树脂衬底51的表面压装Cu箔，配置构图后的导电图案3，并在衬底51背面设置外部连接用的背面电极(外部电极)34。然后，介由通孔TH将背面电极34与导电图案3电连接。
在衬底51表面利用粘接剂9固定裸的半导体元件1、无源元件6。在半导体元件1的电极焊盘上压装接合引线8，实现与电路装置10的其它构成要素的电连接。
另外，在无源元件6的电极部7上直接固定接合引线8的一端，接合引线8的另一端与半导体元件1、导电图案3、其它无源元件6连接。
而且，半导体元件1、无源元件6、导电图案3、接合引线8利用绝缘树脂31密封，并与衬底51被一体支承。绝缘树脂31的材料可采用利用传递模模制形成的热硬性树脂或利用注入模模制形成的热塑性树脂。这样，通过利用绝缘树脂31密封整体，可防止半导体元件1、无源元件6从导电图案3分离。即，无源元件6被粘接剂9及绝缘树脂31两个构成要素粘接在导电图案3上。
另一方面，也可以使用陶瓷衬底作为支承衬底51，此时，导电图案3及背面电极34利用导电膏印刷、烧结设置在衬底51的表面和背面，并介由通孔TH连接，通过绝缘树脂31一体地支承衬底31和电路装置10。外部电极34被焊锡等固定在安装衬底上，此时的焊锡可采用无铅焊锡。
另外，如图3(B)，在多个支承衬底51的每个上设置作为配线层的导电图案3，通过介由通孔TH连接上层和下层的导电图案3，即使具有支承衬底51，也可以形成多层配线结构。
另外，图4是采用引线架作为支承衬底时的封装件之一例。图4(A)是平面图，图4(B)是B-B线剖面图。
作为支承衬底的引线架50在安装区域20内具有岛IL和作为导电图案的多个引线3。
在岛IL上利用粘接剂9等固定裸的半导体元件1。在半导体元件1的电极焊盘上压装接合引线8，与引线3实现电连接。
无源元件6被绝缘性粘接片9粘接在引线3上。具体地说，被粘接在多个引线3上。然后，在无源元件6的电极部7上直接固定接合引线8的一端，接合引线8的另一端与半导体元件1、引线3或同样利用绝缘性粘接片粘接的其它无源元件6连接。另外，无源元件6也可以被粘接在岛IL上。
绝缘树脂31密封岛IL和电路装置10及引线3的一部分。绝缘树脂31的材料可采用利用传递模模制形成的热硬性树脂或利用注入模模制形成的热塑性树脂。从绝缘树脂31的侧面导出引线3的一部分，并利用无铅焊锡等将其安装在印刷线路板等上。
另外，虽省略图示，但在这样的封装件中，也可以不利用绝缘树脂31进行密封，而由金属壳或其它壳体材料密封。
另外，在将无源元件6固定在安装区域20上时，也可以利用导电性粘接材料将电极部7固定在分别绝缘的导电图案3上。由此，也可以并用接合引线8和导电图案3进行无源元件6的电连接。

Claims (13)

1、一种电路装置，其使用以锡为主成分的无铅焊锡作为固定装置，其特征在于，包括：配置导电图案及与该导电图案电连接的半导体元件的安装区域；接合引线；粘接在所述安装区域上，且两侧面设置了电极部的至少一个无源元件，其中，在所述无源元件的电极部固定接合引线的一端，利用该接合引线进行电连接。
2、一种电路装置，其使用以锡为主成分的无铅焊锡作为固定装置，其特征在于，包括：在支承衬底上配置半导体元件及导电图案的安装区域；接合引线；粘接在所述安装区域上，且两侧面设置了电极部的至少一个无源元件，其中，在所述无源元件的电极部固定所述接合引线的一端，利用该接合引线进行电连接。
3、如权利要求2所述的电路装置，其特征在于，用树脂层至少覆盖所述导电图案、半导体元件、无源元件及接合引线，并与所述支承衬底一体支承。
4、一种电路装置，其使用以锡为主成分的无铅焊锡作为固定装置，其特征在于，包括：由绝缘树脂支承的导电图案；利用固定在该导电图案或所述绝缘树脂上的半导体元件构成的安装区域；接合引线；粘接在所述安装区域上，且两侧面设置了电极部的无源元件，其中，在所述无源元件的电极部固定该接合引线的一端，利用该接合引线进行电连接。
5、如权利要求4所述的电路装置，其特征在于，利用所述绝缘树脂至少覆盖并一体地支承所述导电图案、半导体元件、无源元件及接合引线。
6、如权利要求1或权利要求2或权利要求4所述的电路装置，其特征在于，所述无源元件由树脂或片粘接。
7、如权利要求1或权利要求2或权利要求4所述的电路装置，其特征在于，将所述接合引线的另一端连接在所述半导体元件或所述导电图案上。
8、如权利要求1或权利要求2或权利要求4所述的电路装置，其特征在于，将所述接合引线的另一端固定在其它所述无源元件的电极部。
9、如权利要求1或权利要求2或权利要求4所述的电路装置，其特征在于，所述无源元件的电极部镀金。
10、如权利要求1或权利要求2或权利要求4所述的电路装置，其特征在于，所述无源元件被粘接在所述半导体元件上。
11、如权利要求1或权利要求2或权利要求4所述的电路装置，其特征在于，在固定于所述无源元件上的接合引线下方配置所述导电图案的一部分。
12、如权利要求1或权利要求2或权利要求4所述的电路装置，其特征在于，所述接合引线通过热压装固定在所述无源元件的电极部。
13、如权利要求1或权利要求2或权利要求4所述的电路装置，其特征在于，所述无源元件由不能再熔融的其它固定装置固定在所述安装区域上。
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CN106356358B (zh) * 2015-07-13 2021-04-09 艾马克科技公司 半导体封装及其制造方法

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TWI260059B (en) 2006-08-11
KR100665151B1 (ko) 2007-01-09

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