CN113539974A - Chip packaging shell and brazing process thereof - Google Patents
Chip packaging shell and brazing process thereof Download PDFInfo
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- CN113539974A CN113539974A CN202111077758.1A CN202111077758A CN113539974A CN 113539974 A CN113539974 A CN 113539974A CN 202111077758 A CN202111077758 A CN 202111077758A CN 113539974 A CN113539974 A CN 113539974A
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 145
- 238000000034 method Methods 0.000 title claims abstract description 41
- 230000008569 process Effects 0.000 title claims abstract description 34
- 238000005219 brazing Methods 0.000 title claims abstract description 32
- 238000010521 absorption reaction Methods 0.000 claims abstract description 70
- 239000003063 flame retardant Substances 0.000 claims abstract description 27
- 230000017525 heat dissipation Effects 0.000 claims description 58
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 24
- 238000005538 encapsulation Methods 0.000 claims description 20
- 239000002184 metal Substances 0.000 claims description 20
- 239000000919 ceramic Substances 0.000 claims description 18
- 238000009413 insulation Methods 0.000 claims description 14
- 238000005476 soldering Methods 0.000 claims description 14
- 238000007789 sealing Methods 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 9
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 8
- 229910002804 graphite Inorganic materials 0.000 claims description 8
- 239000010439 graphite Substances 0.000 claims description 8
- 238000005245 sintering Methods 0.000 claims description 8
- 239000000565 sealant Substances 0.000 claims description 6
- 238000003825 pressing Methods 0.000 claims 2
- 230000000694 effects Effects 0.000 abstract description 11
- 239000011257 shell material Substances 0.000 description 111
- 230000009471 action Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000029058 respiratory gaseous exchange Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a chip packaging shell and a brazing process thereof, wherein the chip packaging shell comprises a packaging bottom plate, a packaging shell and a packaging top plate, the packaging shell is arranged at the top end of the packaging bottom plate, the packaging top plate is arranged at the top end of the packaging shell, an insulating integrated plate is arranged at the top end of the packaging bottom plate in the packaging shell, and pins are arranged in the insulating integrated plate; the invention adopts the brazing process of elastic positioning, and effectively prevents the shell from deforming in the shell brazing process; through setting up the insulating layer, fire-retardant layer and heat absorption frame, hinder the temperature conduction on the pin through the insulating layer, and prevent through fire-retardant layer that the high temperature from causing the chip main part to burn out, and the chip main part that is located heat absorption frame inside can heat at during operation self, the produced heat of chip main part absorbs under the effect of heat absorption frame, the effect that hinders the heat conduction has been reached, and protect alone the chip main part through the heat absorption frame, the life and the safety in utilization of chip main part have been increased.
Description
Technical Field
The invention belongs to the technical field of chip packaging, and particularly relates to a chip packaging shell and a soldering process thereof.
Background
The shell for mounting the semiconductor integrated circuit chip plays the roles of placing, fixing, sealing, protecting the chip and enhancing the electric heating performance, and is also a bridge for communicating the internal world of the chip with an external circuit; the connection points on the chip are connected to pins of the packaging shell by wires, and the pins are connected with other devices by the wires on the printed board; therefore, the package plays an important role for both the CPU and other LSI integrated circuits.
The existing chip package generally adopts integral package, so that the heat dissipation performance of the chip is poor, and when the temperature is too high, a large amount of high temperature can be conducted to the chip through the pins, so that the service life of the chip is reduced, and the normal use of the chip is not facilitated. Meanwhile, the size of some metal shells is large, and due to the complex expansion and shrinkage change in the shell brazing process, the bottom plate can deform after brazing, and the flatness of the shells cannot meet the requirement, so that the circuit board cannot be welded.
Therefore, a chip package housing and a soldering process thereof are provided.
Disclosure of Invention
The invention aims to overcome the existing defects and provides a chip packaging shell and a soldering process thereof, so as to solve the problems that the existing chip packaging proposed in the background art generally adopts integral packaging, so that the heat dissipation performance of a chip is poor, and when the temperature is too high, a large amount of high temperature is conducted onto the chip through pins, so that the service life of the chip is shortened, and the normal use of the chip is not facilitated.
In order to achieve the purpose, the invention provides the following technical scheme: the chip packaging shell comprises a packaging bottom plate, a packaging shell and a packaging top plate, wherein the packaging shell is arranged at the top end of the packaging bottom plate, the packaging top plate is arranged at the top end of the packaging shell, an insulating integrated plate is arranged in the packaging shell at the top end of the packaging bottom plate, pins are arranged in the insulating integrated plate, a heat insulation layer is arranged at the top end of the insulating integrated plate, a flame-retardant layer is arranged at the top end of the heat insulation layer, a heat absorption frame is arranged at the top end of the flame-retardant layer, a chip main body is arranged in the heat absorption frame, a heat conduction block is arranged on the inner side of the heat absorption frame, the top end of the heat conduction block is fixedly connected with the heat absorption plate, and the heat absorption plate is located at the bottom end of a heat dissipation plate.
Preferably, the heating panel is located the inside of encapsulation roof, the both sides of heating panel evenly are provided with the metal and detain, the metal detains the opposite side and all is connected with the encapsulation bottom plate block.
Preferably, a heat dissipation window is formed in the top end of the packaging top plate, a sealant is arranged between the heat dissipation window and the heat dissipation plate, and a heat conduction gel is arranged between the heat absorption plate and the heat dissipation plate.
Preferably, the package bottom plate, the package housing and the package top plate are detachably and fixedly connected.
Preferably, an internal pressure frame is arranged on the inner side of the packaging shell and is positioned at the top end of the heat insulation layer.
Preferably, the thickness position of the heat insulation layer is 3mm, and the thickness position of the flame retardant layer is 2 mm.
Preferably, a sealing ring is arranged at the top end of the heat absorption frame and is positioned between the heat absorption frame and the packaging top plate.
Preferably, the type of the packaging shell is any one of MSFM5247-W8 type, MSFM5540-W13 type, MSFM5641-W13 type and MSFM7940-W34 type.
Preferably, the invention also provides a soldering process of the packaging shell in the chip packaging shell,
brazing the lead and the ceramic piece together to manufacture an electrode, and controlling the size of the lead exposed out of the ceramic piece;
step two: sintering the shell and the electrode, and controlling the size of the exposed cavity in the lead;
step three: placing the packaging shell in a graphite boat, and positioning the packaging shell by the first electrode positioning die and the second electrode positioning die; (ii) a Or the first electrode positioning die, the second electrode positioning die, the third electrode positioning die and the fourth electrode positioning die are used for positioning the packaging shell.
Preferably, in the third step, in the brazing process, the elastic sheet is used for elastically positioning one side of the packaging shell, so that the influence of the stress of the die is reduced.
Compared with the prior art, the invention provides a chip packaging shell, which has the following beneficial effects:
1. according to the invention, the heat insulation layer, the flame-retardant layer and the heat absorption frame are arranged, the heat conduction on the pins is hindered by the heat insulation layer, the chip body is prevented from being burnt due to overhigh temperature by the flame-retardant layer, the chip body positioned in the heat absorption frame can generate heat during working, the heat generated by the chip body is absorbed under the action of the heat absorption frame, the effect of hindering the heat conduction is achieved, and the chip body is independently protected by the heat absorption frame, so that the service life and the use safety of the chip body are increased;
2. according to the invention, the chip main body is arranged inside the heat absorption frame, the heat conduction block is arranged inside the heat absorption frame, the top ends of the heat conduction blocks are fixedly connected with the heat absorption plate, and then the heat on the heat absorption frame is conducted to the heat absorption plate through the heat conduction blocks, so that the effect of hindering heat conduction is achieved, and the normal heat dissipation effect of the chip main body is also ensured;
3. according to the invention, the packaging top plate is arranged, the heat dissipation plate is arranged on the inner side of the packaging top plate, the heat dissipation plate is positioned at the top end of the heat absorption plate, the heat conducting gel is arranged between the heat absorption plate and the heat dissipation plate, so that heat on the heat absorption plate is transferred through the heat dissipation plate, and the top end of the packaging top plate is provided with the heat dissipation window, so that the contact area between the heat dissipation plate and the outside is increased, and the heat dissipation efficiency is enhanced;
4. the lead and the ceramic piece are brazed to manufacture the electrode, the size of the lead exposed out of the ceramic piece is controlled, then the shell and the electrode are sintered, the size of the exposed cavity in the lead is controlled, and meanwhile, the influence of die stress is reduced by adopting an elastic positioning mode.
5. By the brazing process, the shell is effectively prevented from deforming in the shell brazing process, the problem of deformation of the bottom plate in the brazing process can be well solved by adopting an elastic positioning mode, and the flatness of the bottom plate can reach 0.004 mm/mm.
The device has the advantages that the structure is scientific and reasonable, the use is safe and convenient, and great help is provided for people.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention without limiting the invention in which:
fig. 1 is a schematic perspective view of a chip package housing and a soldering process thereof according to the present invention;
fig. 2 is an exploded view of a chip package and a soldering process thereof according to the present invention;
fig. 3 is a schematic view of an inner axial structure of a chip package and a soldering process thereof according to the present invention;
fig. 4 is a schematic structural diagram of a front view of a chip package housing and a soldering process thereof according to the present invention;
FIG. 5 is a schematic cross-sectional view taken at A-A in FIG. 4;
fig. 6 is a schematic side view of a chip package housing and a soldering process thereof according to the present invention;
FIG. 7 is a schematic view of a welding structure of a bottom plate and a frame;
FIG. 8 is a schematic diagram of the deformation of the base plate after the base plate and the frame are welded by the same material;
FIG. 9 is a schematic structural diagram of an integrally milled Kovar housing shell;
FIG. 10 is a schematic illustration of the MSFM5247-W8 metal case base mold positioning;
FIG. 11 is a schematic view of the positioning of a MSFM5540-W13 type metal shell mold;
FIG. 12 is a schematic view of the MSFM5641-W13 mold positioning of a metal shell mold;
FIG. 13 is a schematic view of a MSFM7940-W34 metal shell base mold positioning;
FIG. 14 is a schematic view of a partial positioning of a MSFM7940-W34 metal shell base mold.
In the figure: the packaging structure comprises a packaging bottom plate 1, a packaging shell 2, a packaging top plate 3, an insulating integrated plate 4, pins 5, a heat insulation layer 6, a flame retardant layer 7, a heat absorption frame 8, a chip main body 9, a heat conduction block 10, a heat absorption plate 11, a heat dissipation plate 12, metal buckles 13, a heat dissipation window 14, an internal pressure frame 15, a frame 16, a bottom plate 17, a graphite boat 18, a first electrode positioning die 19, an elastic sheet 20, a second electrode positioning die 21, a third electrode positioning die 22, a fourth electrode positioning die 23 and a bonding surface positioning die 24.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The prior art is as follows:
the package shells are respectively MSFM5247-W8 type, MSFM5540-W13 type, MSFM5641-W13 type and MSFM7940-W34 type.
The flatness of the bottom plate 17 of the MSFM5247-W8 type package shell is 0.40, the flatness of the bottom plate 17 of the MSFM5540-W13 type package shell is 0.40, the flatness of the bottom plate 17 of the MSFM5641-W13 type package shell is 0.40, and the flatness of the bottom plate 17 of the MSFM7940-W34 type package shell is 0.45.
By preventing the shell from deforming during the shell brazing process, the flatness of the shell bottom plate 17 reaches the requirement of 0.004 mm/mm.
The casing size that low resistance lead wire heavy current brushless motor drive circuit encapsulation shell has is very big, owing to there is the breathing change of complicacy at the shell in-process of brazing, and the back of brazing, the product deformation will lead to two kinds of results: the deformation of the parallel seam welding plane can lead to the failure of parallel seam welding of customers, the deformation of the bottom plate 17 can lead to the failure of the flatness of the shell to meet the requirements, and the customers can not weld the circuit board.
The material of the bottom plate 17 and the frame 16 is 4J29, and generally, in order to save material and processing cost, the welding structure of the frame 16 and the bottom plate 17 is often designed, as shown in FIG. 7;
although the bottom plate 17 and the frame 16 are made of the same material 4J29, after the bottom plate 17 and the frame 16 are welded by AgCu28 solder, the bottom plate 17 has a serious deformation phenomenon, the thickness of the metal wall is thin, when the size of the bottom plate 17 is 50.00-70.00 mm, the deformation of the bottom plate 17 can reach about 0.40-0.50 mm, and the deformation exceeds 0.007mm/mm required by the project, as shown in FIG. 8;
the shell is manufactured by adopting an integral milling method, when the deformation of the bottom plate 17 is large, the shaping mode after brazing cannot be adopted to flatten the bottom plate 17, and shaping marks are easy to appear. In order to solve the problem of deformation of the bottom plate 17, the thickness of the bottom plate 17 increases the machining allowance, when the shell is subjected to fine machining after brazing, and when a clamp is adopted for positioning, clamp marks are easy to appear, and the shell is easy to deform due to the force of the clamp, so that the air tightness of the shell is influenced, as shown in fig. 9.
The first embodiment of the invention:
referring to fig. 1-6, the present invention provides a technical solution: a chip packaging shell comprises a packaging bottom plate 1, a packaging shell 2 and a packaging top plate 3, wherein the packaging shell 2 is arranged at the top end of the packaging bottom plate 1, the packaging top plate 3 is arranged at the top end of the packaging shell 2, an insulating integrated plate 4 is arranged at the top end of the packaging bottom plate 1 and positioned in the packaging shell 2, pins 5 are arranged in the insulating integrated plate 4, a heat insulating layer 6 is arranged at the top end of the insulating integrated plate 4, a flame-retardant layer 7 is arranged at the top end of the heat insulating layer 6, a heat absorbing frame 8 is arranged at the top end of the flame-retardant layer 7, a chip main body 9 is arranged in the heat absorbing frame 8, heat conducting blocks 10 are arranged on the inner side of the heat absorbing frame 8, the top ends of the heat conducting blocks 10 are fixedly connected with a heat absorbing plate 11, the heat absorbing plate 11 is positioned at the bottom end of a heat radiating plate 12, temperature conduction on the pins 5 is blocked by the heat insulating layer 6, and the flame-retardant layer 7 prevents the chip main body 9 from being burnt due to overhigh temperature, and the chip main body 9 located inside the heat absorption frame 8 can generate heat when working, the heat generated by the chip main body 9 is absorbed under the action of the heat absorption frame 8, the effect of blocking heat conduction is achieved, and the chip main body 9 is protected independently through the heat absorption frame 8, so that the service life and the use safety of the chip main body 9 are increased.
In the present invention, preferably, the heat dissipation plate 12 is located inside the package top plate 3, the metal buckles 13 are uniformly arranged on both sides of the heat dissipation plate 12, and the other sides of the metal buckles 13 are all connected with the package bottom plate 1 in a snap-fit manner, so that the stability of the heat dissipation plate 12 inside the package top plate 3 is increased.
In the present invention, preferably, the top end of the package top plate 3 is provided with a heat dissipation window 14, a sealant is disposed between the heat dissipation window 14 and the heat dissipation plate 12, a heat conductive gel is disposed between the heat absorption plate 11 and the heat dissipation plate 12, and the heat on the heat absorption plate 11 is transferred through the heat dissipation plate 12.
In the invention, preferably, the packaging bottom plate 1, the packaging shell 2 and the packaging top plate 3 are detachably and fixedly connected, so that the packaging bottom plate 1, the packaging shell 2 and the packaging top plate 3 are conveniently detached; the inboard of encapsulation shell 2 is provided with interior pressure frame 15, presses frame 15 to be located the top of insulating layer 6 in, and at fixed in-process, the inboard interior pressure frame 15 of encapsulation shell 2 compresses tightly insulating layer 6 and then, and then has guaranteed the leakproofness between encapsulation bottom plate 1 and the encapsulation shell 2.
In the invention, preferably, the thickness of the heat insulation layer 6 is 3mm, the thickness of the flame retardant layer 7 is 2mm, the heat insulation layer 6 blocks the temperature conduction on the pins 5, and the flame retardant layer 7 prevents the chip main body 9 from being burnt due to overhigh temperature; the sealing ring is arranged at the top end of the heat absorption frame 8 and located between the heat absorption frame 8 and the packaging top plate 3, when the packaging bottom plate 1, the packaging shell 2 and the packaging top plate 3 are fixed thick, the sealing ring is pressed on the top end of the heat absorption frame 8 under the extrusion of the packaging top plate 3, and then the sealing performance inside the heat absorption frame 8 is guaranteed.
Preferably, the package housing 2 is any one of MSFM5247-W8, MSFM5540-W13, MSFM5641-W13 and MSFM 7940-W34.
The working principle and the using process of the invention are as follows: when in use, the connecting ends of the chip main body 9 and the pins 5 are correspondingly connected through wires, then the pins 5 are arranged through the insulating integrated board 4 in an integrated manner, then the insulating integrated board 4 is correspondingly arranged at the inner side of the packaging bottom board 1, the pins 5 are mutually corresponding to the clamping grooves at the two sides of the packaging bottom board 1, then the top end of the insulating integrated board 4 is provided with the heat-insulating layer 6 with the thickness of 3mm, then the packaging shell 2 is correspondingly assembled at the top end of the packaging bottom board 1, the inner side of the packaging shell 2 is provided with the internal pressure frame 15, the internal pressure frame 15 is positioned at the edge of the top end of the heat-insulating layer 6, then the top end of the heat-insulating layer 6 is provided with the flame-retardant layer 7 with the thickness of 2mm, then the top end of the flame-absorbing frame 8 is assembled at the top end of the flame-retardant layer 7, the chip main body 9 is assembled inside the heat-absorbing frame 8, further the heat-conducting on the pins 5 is blocked through the heat-insulating layer 6, and the flame-retardant layer 7 prevents the chip main body 9 from being burnt down due to overhigh temperature, the chip main body 9 positioned in the heat absorption frame 8 can generate heat when working, the heat generated by the chip main body 9 is absorbed under the action of the heat absorption frame 8, the inner side of the heat absorption frame 8 is provided with a heat conduction block 10, the top ends of the heat conduction blocks 10 are fixedly connected with a heat absorption plate 11, then the heat on the heat absorption frame 8 is conducted to the heat absorption plate 11 through the heat conduction blocks 10, the top end of the heat absorption plate 11 is provided with a heat dissipation plate 12, heat conduction gel is arranged between the heat absorption plate 11 and the heat dissipation plate 12, then the heat on the heat absorption plate 11 is transferred through the heat dissipation plate 12, the heat dissipation plate 12 is positioned at the inner side of the encapsulation top plate 3, sealant is arranged between the heat dissipation plate and the heat dissipation plate, the top end of the encapsulation top plate 3 is provided with a heat dissipation window 14, further the contact area between the heat dissipation plate 12 and the outside is increased, the heat dissipation efficiency is enhanced, and the effect of hindering heat conduction is achieved, still guaranteed the normal radiating effect of chip main part 9, can dismantle fixed connection between final encapsulating bottom plate 1, packaging shell 2 and the encapsulation roof 3, at fixed in-process, the inboard interior pressure frame 15 of packaging shell 2 compresses tightly insulating layer 6 and then, and then has guaranteed the leakproofness between packaging bottom plate 1 and the packaging shell 2.
The second embodiment of the invention:
referring to fig. 1-14, the present invention provides a technical solution: a chip packaging shell comprises a packaging bottom plate 1, a packaging shell 2 and a packaging top plate 3, wherein the packaging shell 2 is arranged at the top end of the packaging bottom plate 1, the packaging top plate 3 is arranged at the top end of the packaging shell 2, an insulating integrated plate 4 is arranged at the top end of the packaging bottom plate 1 and positioned in the packaging shell 2, pins 5 are arranged in the insulating integrated plate 4, a heat insulating layer 6 is arranged at the top end of the insulating integrated plate 4, a flame-retardant layer 7 is arranged at the top end of the heat insulating layer 6, a heat absorbing frame 8 is arranged at the top end of the flame-retardant layer 7, a chip main body 9 is arranged in the heat absorbing frame 8, heat conducting blocks 10 are arranged on the inner side of the heat absorbing frame 8, the top ends of the heat conducting blocks 10 are fixedly connected with a heat absorbing plate 11, the heat absorbing plate 11 is positioned at the bottom end of a heat radiating plate 12, temperature conduction on the pins 5 is blocked by the heat insulating layer 6, and the flame-retardant layer 7 prevents the chip main body 9 from being burnt due to overhigh temperature, and the chip main body 9 located inside the heat absorption frame 8 can generate heat when working, the heat generated by the chip main body 9 is absorbed under the action of the heat absorption frame 8, the effect of blocking heat conduction is achieved, and the chip main body 9 is protected independently through the heat absorption frame 8, so that the service life and the use safety of the chip main body 9 are increased.
In the present invention, preferably, the heat dissipation plate 12 is located inside the package top plate 3, the metal buckles 13 are uniformly arranged on both sides of the heat dissipation plate 12, and the other sides of the metal buckles 13 are all connected with the package bottom plate 1 in a snap-fit manner, so that the stability of the heat dissipation plate 12 inside the package top plate 3 is increased.
In the present invention, preferably, the top end of the package top plate 3 is provided with a heat dissipation window 14, a sealant is disposed between the heat dissipation window 14 and the heat dissipation plate 12, a heat conductive gel is disposed between the heat absorption plate 11 and the heat dissipation plate 12, and heat on the heat absorption plate 11 is transferred through the heat dissipation plate 12.
In the invention, preferably, the packaging bottom plate 1, the packaging shell 2 and the packaging top plate 3 are detachably and fixedly connected, so that the packaging bottom plate 1, the packaging shell 2 and the packaging top plate 3 are conveniently detached; the inboard of encapsulation shell 2 is provided with interior pressure frame 15, presses frame 15 to be located the top of insulating layer 6 in, and at fixed in-process, the inboard interior pressure frame 15 of encapsulation shell 2 compresses tightly insulating layer 6 and then, and then has guaranteed the leakproofness between encapsulation bottom plate 1 and the encapsulation shell 2.
In the invention, preferably, the thickness of the heat insulation layer 6 is 3mm, the thickness of the flame retardant layer 7 is 2mm, the heat insulation layer 6 blocks the temperature conduction on the pins 5, and the flame retardant layer 7 prevents the chip main body 9 from being burnt due to overhigh temperature; the sealing ring is arranged at the top end of the heat absorption frame 8 and located between the heat absorption frame 8 and the packaging top plate 3, when the packaging bottom plate 1, the packaging shell 2 and the packaging top plate 3 are fixed thick, the sealing ring is pressed on the top end of the heat absorption frame 8 under the extrusion of the packaging top plate 3, and then the sealing performance inside the heat absorption frame 8 is guaranteed.
Preferably, the package housing 2 is any one of MSFM5247-W8, MSFM5540-W13, MSFM5641-W13 and MSFM 7940-W34.
Preferably, the invention also provides a soldering process of the packaging shell in the chip packaging shell,
brazing the lead and the ceramic piece together to manufacture an electrode, and controlling the size of the lead exposed out of the ceramic piece;
step two: sintering the shell and the electrode, and controlling the size of the exposed cavity in the lead;
step three: placing the packaging shell 2 in a graphite boat 18, and positioning the packaging shell 2 by using a first electrode positioning die 19 and a second electrode positioning die 21; or the first electrode positioning die 19, the second electrode positioning die 21, the third electrode positioning die 22 and the fourth electrode positioning die 23 are used for positioning the packaging shell 2.
In the present invention, preferably, in the third step, in the soldering process, the elastic sheet 20 is used to elastically position one side of the package housing 2, so as to reduce the influence of the die stress.
The working principle and the using process of the invention are as follows: when in use, the connecting ends of the chip main body 9 and the pins 5 are correspondingly connected through wires, then the pins 5 are arranged through the insulating integrated board 4 in an integrated manner, then the insulating integrated board 4 is correspondingly arranged at the inner side of the packaging bottom board 1, the pins 5 are mutually corresponding to the clamping grooves at the two sides of the packaging bottom board 1, then the top end of the insulating integrated board 4 is provided with the heat-insulating layer 6 with the thickness of 3mm, then the packaging shell 2 is correspondingly assembled at the top end of the packaging bottom board 1, the inner side of the packaging shell 2 is provided with the internal pressure frame 15, the internal pressure frame 15 is positioned at the edge of the top end of the heat-insulating layer 6, then the top end of the heat-insulating layer 6 is provided with the flame-retardant layer 7 with the thickness of 2mm, then the top end of the flame-absorbing frame 8 is assembled at the top end of the flame-retardant layer 7, the chip main body 9 is assembled inside the heat-absorbing frame 8, further the heat-conducting on the pins 5 is blocked through the heat-insulating layer 6, and the flame-retardant layer 7 prevents the chip main body 9 from being burnt down due to overhigh temperature, the chip main body 9 positioned in the heat absorption frame 8 can generate heat when working, the heat generated by the chip main body 9 is absorbed under the action of the heat absorption frame 8, the inner side of the heat absorption frame 8 is provided with a heat conduction block 10, the top ends of the heat conduction blocks 10 are fixedly connected with a heat absorption plate 11, then the heat on the heat absorption frame 8 is conducted to the heat absorption plate 11 through the heat conduction blocks 10, the top end of the heat absorption plate 11 is provided with a heat dissipation plate 12, heat conduction gel is arranged between the heat absorption plate 11 and the heat dissipation plate 12, then the heat on the heat absorption plate 11 is transferred through the heat dissipation plate 12, the heat dissipation plate 12 is positioned at the inner side of the encapsulation top plate 3, sealant is arranged between the heat dissipation plate and the heat dissipation plate, the top end of the encapsulation top plate 3 is provided with a heat dissipation window 14, further the contact area between the heat dissipation plate 12 and the outside is increased, the heat dissipation efficiency is enhanced, and the effect of hindering heat conduction is achieved, still guaranteed the normal radiating effect of chip main part 9, can dismantle fixed connection between final encapsulating bottom plate 1, packaging shell 2 and the encapsulation roof 3, at fixed in-process, the inboard interior pressure frame 15 of packaging shell 2 compresses tightly insulating layer 6 and then, and then has guaranteed the leakproofness between packaging bottom plate 1 and the packaging shell 2.
The shell is positioned by a die with a coefficient of linear expansion similar to that of the shell material in the shell brazing process, but for the shell, no die can limit free expansion and contraction in the shell brazing process to cause deformation, so the best method for preventing the shell from deforming in the shell brazing process is to have no influence of die stress.
Firstly, brazing the lead and the ceramic piece together to manufacture the electrode, controlling the size of the lead exposed out of the ceramic piece, then sintering the shell and the electrode, and controlling the size of the exposed cavity in the lead. The method specifically comprises the following steps:
model MSFM5247-W8 metal shell mold (see fig. 10): brazing the lead and the ceramic piece together to manufacture an electrode, and controlling the size of the lead exposed out of the ceramic piece; sintering the shell and the electrode, and controlling the size of the exposed cavity in the lead; placing the packaging shell 2 in a graphite boat 18, positioning the packaging shell 2 by using a first electrode positioning die 19 and a second electrode positioning die 21, and elastically positioning one side of the packaging shell 2 by using an elastic sheet 20 in the brazing process to reduce the influence of die stress (the elastic sheet 20 is arranged on the same side of the second electrode positioning die 21);
model MSFM5540-W13 metal shell mold (see fig. 11): brazing the lead and the ceramic piece together to manufacture an electrode, and controlling the size of the lead exposed out of the ceramic piece; sintering the shell and the electrode, and controlling the size of the exposed cavity in the lead; placing the packaging shell 2 in a graphite boat 18, positioning the packaging shell 2 by using a first electrode positioning die 19 and a second electrode positioning die 21, and elastically positioning one side of the packaging shell 2 by using an elastic sheet 20 in the brazing process to reduce the influence of the stress of the dies (the elastic sheet 20 is arranged on the opposite side of the second electrode positioning die 21);
model MSFM5641-W13 metal shell mold (see fig. 12): brazing the lead and the ceramic piece together to manufacture an electrode, and controlling the size of the lead exposed out of the ceramic piece; sintering the shell and the electrode, and controlling the size of the exposed cavity in the lead; placing the packaging shell 2 in a graphite boat 18, positioning the packaging shell 2 by using a first electrode positioning die 19 and a second electrode positioning die 21, and elastically positioning one side of the packaging shell 2 by using an elastic sheet 20 in the brazing process to reduce the influence of the stress of the dies (the elastic sheet 20 is arranged on the opposite side of the second electrode positioning die 21);
model MSFM7940-W34 metal shell mold (see fig. 13 and 14): brazing the lead and the ceramic piece together to manufacture an electrode, and controlling the size of the lead exposed out of the ceramic piece; sintering the shell and the electrode, and controlling the size of the exposed cavity in the lead; the packaging shell 2 is placed in the graphite boat 18, the first electrode positioning die 19, the second electrode positioning die 21, the third electrode positioning die 22 and the fourth electrode positioning die 23 are used for positioning the packaging shell 2, in the brazing process, elastic positioning is conducted on one side of the packaging shell 2 through the elastic sheet 20, the influence of die stress is reduced, the elastic sheet 20 is arranged on the same side of the second electrode positioning die 21, and the bonding face positioning die 24 is further arranged on one side of the elastic sheet 20.
And putting four representative varieties into three verification batches respectively, wherein the flatness of the shell bottom plate 17 can meet the requirement of 0.004 mm/mm.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. The utility model provides a chip package shell, includes package bottom plate (1), package shell (2) and encapsulation roof (3), its characterized in that: the packaging structure is characterized in that a packaging shell (2) is arranged on the top end of the packaging bottom plate (1), a packaging top plate (3) is arranged on the top end of the packaging shell (2), an insulating integrated plate (4) is arranged inside the packaging shell (2) on the top end of the packaging bottom plate (1), pins (5) are arranged inside the insulating integrated plate (4), a heat insulation layer (6) is arranged on the top end of the insulating integrated plate (4), a flame-retardant layer (7) is arranged on the top end of the heat insulation layer (6), a heat absorption frame (8) is arranged on the top end of the flame-retardant layer (7), a chip main body (9) is arranged inside the heat absorption frame (8), a heat conduction block (10) is arranged on the inner side of the heat absorption frame (8), the top end of the heat conduction block (10) is fixedly connected with a heat absorption plate (11), and the heat absorption plate (11) is arranged at the bottom end of a heat dissipation plate (12).
2. The chip package housing according to claim 1, wherein: the heat dissipation plate (12) is located inside the encapsulation top plate (3), metal buckles (13) are evenly arranged on two sides of the heat dissipation plate (12), and the other sides of the metal buckles (13) are connected with the encapsulation bottom plate (1) in a clamping mode.
3. The chip package housing of claim 2, wherein: the packaging structure is characterized in that a heat dissipation window (14) is formed in the top end of the packaging top plate (3), a sealant is arranged between the heat dissipation window (14) and the heat dissipation plate (12), and heat conduction gel is arranged between the heat absorption plate (11) and the heat dissipation plate (12).
4. The chip package housing according to claim 1, wherein: the packaging bottom plate (1), the packaging shell (2) and the packaging top plate (3) are detachably and fixedly connected.
5. The chip package housing according to claim 1, wherein: an inner pressing frame (15) is arranged on the inner side of the packaging shell (2), and the inner pressing frame (15) is located at the top end of the heat insulation layer (6).
6. The chip package housing of claim 5, wherein: the thickness of insulating layer (6) is 3mm, the thickness of fire-retardant layer (7) is 2 mm.
7. The chip package housing according to claim 1, wherein: and a sealing ring is arranged at the top end of the heat absorption frame (8), and the sealing ring is positioned between the heat absorption frame (8) and the packaging top plate (3).
8. The chip package housing according to claim 1, wherein: the type of the packaging shell (2) is any one of MSFM5247-W8 type, MSFM5540-W13 type, MSFM5641-W13 type and MSFM7940-W34 type.
9. A soldering process of a chip packaging shell is characterized in that: the chip packaging shell adopts any one of claims 1-8, and the specific soldering step is as follows:
brazing the lead and the ceramic piece together to manufacture an electrode, and controlling the size of the lead exposed out of the ceramic piece;
step two: sintering the shell and the electrode, and controlling the size of the exposed cavity in the lead;
step three: placing the packaging shell (2) in a graphite boat (18), and positioning the packaging shell (2) by using an electrode positioning mould I (19) and an electrode positioning mould II (21); or the first electrode positioning die (19), the second electrode positioning die (21), the third electrode positioning die (22) and the fourth electrode positioning die (23) are used for positioning the packaging shell (2).
10. The soldering process for chip package housing according to claim 9, wherein: in the third step, in the brazing process, the elastic sheet (20) is used for elastically positioning one side of the packaging shell (2), so that the influence of the stress of the die is reduced.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116864464A (en) * | 2023-07-14 | 2023-10-10 | 江苏爱矽半导体科技有限公司 | Semiconductor packaging structure and use method thereof |
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| CN109103145A (en) * | 2018-08-15 | 2018-12-28 | 王晓勇 | A kind of the semiconductor packages unit and packaging method of anti-electric shock and electric leakage |
| CN111968950A (en) * | 2020-08-20 | 2020-11-20 | 杨月英 | Semiconductor packaging part processing structure |
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| JPH04168750A (en) * | 1990-10-31 | 1992-06-16 | Kyocera Corp | Package for semiconductor element |
| CN207542232U (en) * | 2017-11-28 | 2018-06-26 | 深圳市鑫宇鹏电子科技有限公司 | A kind of encapsulating structure of IC chip |
| CN109103145A (en) * | 2018-08-15 | 2018-12-28 | 王晓勇 | A kind of the semiconductor packages unit and packaging method of anti-electric shock and electric leakage |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN116864464A (en) * | 2023-07-14 | 2023-10-10 | 江苏爱矽半导体科技有限公司 | Semiconductor packaging structure and use method thereof |
| CN116864464B (en) * | 2023-07-14 | 2024-04-09 | 江苏爱矽半导体科技有限公司 | Semiconductor packaging structure and use method thereof |
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Denomination of invention: A chip packaging shell and its soldering process Effective date of registration: 20230116 Granted publication date: 20211123 Pledgee: Shandong Zhucheng rural commercial bank Limited by Share Ltd. Pledgor: Kairui Electronics (Zhucheng) Co.,Ltd. Registration number: Y2023980031117 |
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Denomination of invention: A chip packaging shell and its brazing process Effective date of registration: 20231225 Granted publication date: 20211123 Pledgee: Shandong Zhucheng rural commercial bank Limited by Share Ltd. Pledgor: Kairui Electronics (Zhucheng) Co.,Ltd. Registration number: Y2023980073888 |
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