CN111968950A - Semiconductor packaging part processing structure - Google Patents
Semiconductor packaging part processing structure Download PDFInfo
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- CN111968950A CN111968950A CN202010843634.9A CN202010843634A CN111968950A CN 111968950 A CN111968950 A CN 111968950A CN 202010843634 A CN202010843634 A CN 202010843634A CN 111968950 A CN111968950 A CN 111968950A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3731—Ceramic materials or glass
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Packaging Frangible Articles (AREA)
Abstract
The invention discloses a semiconductor packaging part processing structure, which comprises a packaging movable structure, a packaging fixed structure, a circuit board, a fixed joint and a limiting bottom frame, and has the following effects: encapsulation fixed knot constructs welded fastening on the circuit board, encapsulation movable structure movable mounting is at encapsulation fixed knot structure top, and inside the encapsulation movable structure was arranged in to the chip, structure setting through encapsulation movable structure and encapsulation fixed knot constructs, can be under the condition of not dismantling the pin from the circuit board, change or maintain the chip, avoid the pin to damage at the plug in-process, ceramic package structure through the formation, can high-efficient absorption and the heat of discharge chip, high-efficient air and circuit board of utilizing are as heat conduction medium, cool down the heat dissipation to the chip, the operating efficiency of chip is improved.
Description
Technical Field
The invention relates to the field of semiconductor packaging parts, in particular to a semiconductor packaging part processing structure.
Background
DIP is an integrated circuit chip packaged by a dual in-line package form, most of small and medium-scale integrated circuits adopt the package form, the number of pins is generally not more than 100, a CPU chip packaged by the DIP has two rows of pins, the pins need to be inserted into a chip socket with the DIP structure, and the chips can also be directly inserted into a circuit board with the same number of welding holes and geometric arrangement for welding, because the packaging area and the thickness of the DIP package are larger, the pins are easy to damage in the plugging and unplugging process, most of DIP packaged chips are packaged by thermosetting resin plastic, dust is easy to accumulate, the heat dissipation effect is poor, a semiconductor package processing structure needs to be developed, so that the problems that the pins are easy to damage in the plugging and unplugging process due to the larger packaging area and the larger thickness of the DIP package, and most of the DIP packaged chips are packaged by the thermosetting resin plastic, easy dust accumulation and poor heat dissipation effect.
Summary of the invention
Aiming at the defects of the prior art, the invention is realized by the following technical scheme: the utility model provides a semiconductor packaging part processing structure, its structure includes encapsulation movable structure, encapsulation fixed knot construct, circuit board, fixed joint, spacing chassis top be equipped with the circuit board, circuit board and spacing chassis swing joint, four angles at spacing chassis top on be equipped with fixed joint perpendicularly, spacing chassis and fixed joint adopt screw-thread fit, spacing chassis pass through fixed joint and be connected with the circuit board, circuit board top be equipped with encapsulation fixed knot structure, encapsulation fixed knot construct and circuit board looks welding, encapsulation fixed knot construct the top and be equipped with encapsulation movable structure, encapsulation movable structure and encapsulation fixed knot construct and cooperate.
As the further optimization of this technical scheme, encapsulation movable structure including chip, last encapsulation cover, electrically conductive wiring, side activity rail, lower encapsulation cover, the chip about both ends be the axisymmetric structure and be equipped with encapsulation cover and lower encapsulation cover, last encapsulation cover with encapsulate cover looks block down, the chip both sides be the axisymmetric structure and be equipped with two side activity rails, side activity rail rear end be equipped with electrically conductive wiring, side activity rail be connected with the chip through electrically conductive wiring.
As a further optimization of the technical scheme, the upper packaging cover comprises an air hole, a packaging side edge strip, a packaging cover and a chip frame, the center of the bottom of the packaging cover is provided with the chip frame, the chip frame and the packaging cover are of an integrated structure, the air hole is uniformly distributed on two sides of the chip frame, the air hole and the packaging cover are of an integrated structure, the packaging cover is provided with the packaging side edge strip on two sides, and the packaging side edge strip and the packaging cover are of an integrated structure.
As a further optimization of the technical scheme, the side movable rail comprises a conductive rail, an elastic rubber column, a conductive spring side plate, an elastic rubber layer and a conductive spring piece, wherein the conductive spring piece is arranged inside the conductive rail, the rear end of the conductive spring piece is provided with the elastic rubber layer, the elastic rubber layer and the conductive spring piece are in interference fit, the rear end of the elastic rubber layer is provided with the elastic rubber column, the elastic rubber column and the elastic rubber layer are of an integrated structure and are fixedly connected with the conductive rail, the conductive spring side plate is arranged inside the elastic rubber column, the conductive spring side plate and the elastic rubber column are in interference fit, and the conductive spring piece is connected with the conductive rail through the conductive spring side plate.
As a further optimization of the technical scheme, the packaging and fixing structure comprises a reinforcing bottom frame, a conductive transverse bar and an insulating bar, wherein the insulating bar is arranged at the center of the bottom of the reinforcing bottom frame, the insulating bar is fixedly connected with the reinforcing bottom frame, the conductive transverse bar is arranged at the top of the reinforcing bottom frame, and the conductive transverse bar is fixedly connected with the reinforcing bottom frame.
As a further optimization of the technical scheme, the reinforcing bottom frame comprises a reinforcing bottom plate, heat absorbing sheets, pins and reinforcing side bars, wherein the heat absorbing sheets are arranged at the top of the reinforcing bottom plate, the heat absorbing sheets are vertically arranged at the top of the reinforcing bottom plate and are of an integrated structure, the reinforcing side bars are arranged on two sides of the reinforcing bottom plate, the reinforcing side bars and the reinforcing bottom plate are of an integrated structure, the pins are uniformly arranged on the reinforcing side bars, and the pins are fixedly connected with the reinforcing side bars.
As a further optimization of the technical scheme, the pins are L-shaped structures, one vertical ends of the pins penetrate through and are fixed on the reinforcing side edge strips and are welded with the conductive cross strips, and the horizontal ends of the pins are arranged on the circuit board and are welded with the circuit.
As a further optimization of the technical solution, the preferable materials of the package side bar, the package cover and the chip frame are ceramics.
As a further optimization of the technical solution, the preferable material of the conductive cross bar is copper.
As a further optimization of the technical solution, the material of the reinforced bottom plate, the reinforced side strips and the heat absorbing plate is preferably ceramic.
Advantageous effects
The semiconductor packaging part processing structure is reasonable in design and strong in functionality, and has the following beneficial effects:
the packaging movable structure is arranged at the top of the packaging fixed structure and matched with the packaging fixed structure, the packaging fixed structure is fixedly welded on the circuit board, the packaging movable structure is movably arranged at the top of the packaging fixed structure, the chip is arranged in the packaging movable structure, and through the structural arrangement of the packaging movable structure and the packaging fixed structure, the chip can be replaced or maintained without disassembling the pin from the circuit board, so that the pin is prevented from being damaged in the plugging and unplugging process;
the chip of the invention is arranged and fixed in the ceramic packaging structure formed by the upper packaging cover and the lower packaging cover, the chip frame is rectangular and the bottom is open, both sides are provided with wiring notches, and the packaging side edge strips are provided with two parallel forming structures which are connected with the packaging cover, the chip is clamped and fixed by the chip frame, and a distance is reserved between the chip and the packaging cover to form a cavity in the fixing process, and the heat generated in the operation of the chip can be quickly conducted through the semi-surrounding structure of the ceramic, under the arrangement of the air hole structures which are uniformly distributed, air can enter the inner cavity of the package through the air holes, and the air slowly moves along the periphery of the chip frame to absorb partial heat by utilizing the air, the ceramic packaging body is used for quickly conducting heat to the circuit board and the outside of the packaging body, so that the heat dissipation efficiency of the chip is greatly improved;
the invention relates to a conductor rail U which is of a shape structure and is arranged between an upper packaging cover and a lower packaging cover, one end of an opening is arranged outwards, a conductive transverse bar is of a hollow rectangular strip structure and is in sliding fit with the conductor rail, a packaging body is movably connected with a packaging fixing structure under the connection action of the structure, two conductive spring pieces are arranged in the conductor rail in an axial symmetry structure and are fixedly connected in the conductor rail through an elastic rubber layer and an elastic rubber column and are electrically connected with the conductor rail through a conductive spring side piece, when the conductive transverse bar slides into the conductor rail, the two conductive spring pieces are arranged in the elastic rubber layer and the elastic rubber column to generate opposite acting force, so that the conductive transverse bar can be stably arranged in the conductor rail for electric conduction, and the chip is electrified and operated in a conductive structure formed by the conductor rail and a conductive connecting wire, be L shape structure and perpendicular one end through the pin and run through to fix on consolidating the side strake to weld mutually with electrically conductive horizontal bar, and pin level one end arrange in on the circuit board and with circuit looks welded structure setting, can make the pin welding of arranging the setting on the circuit board, it is not fragile, can improve the stability and the intensity of pin greatly.
Drawings
Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:
FIG. 1 is a schematic diagram of a front view of a semiconductor package processing structure according to the present invention;
FIG. 2 is a cross-sectional front view of the package active structure of the present invention;
FIG. 3 is a bottom view of the upper package cover of the present invention;
FIG. 4 is a schematic front sectional view of the side movable rail according to the present invention;
FIG. 5 is a front view of the package mounting structure of the present invention;
fig. 6 is a schematic top view of a reinforced chassis of the present invention.
In the figure: the packaging structure comprises a packaging movable structure-1, a chip-11, an upper packaging cover-12, an air hole-12 a, a packaging side edge strip-12 b, a packaging cover-12 c, a chip frame-12 d, a conductive wiring-13, a side movable rail-14, a conductive rail-14 a, an elastic rubber column-14 b, a conductive spring side sheet-14 c, an elastic rubber layer-14 d, a conductive spring piece-14 e, a lower packaging cover-15, a packaging fixed structure-2, a reinforcing bottom frame-21, a reinforcing bottom plate-21 a, a heat absorbing sheet-21 b, a pin-21 c, a reinforcing side edge strip-21 d, a conductive transverse strip-22, an insulating strip-23, a circuit board-3, a fixed joint-4 and a limiting bottom frame-5.
Detailed Description
In order to make the technical means, the original characteristics, the achieved purposes and the effects of the invention easy to understand, the following description and the accompanying drawings further illustrate the preferred embodiments of the invention.
Example 1
Referring to fig. 1-4, the present invention provides an embodiment of a semiconductor package processing structure:
referring to fig. 1, a semiconductor package processing structure includes a package moving structure 1, a package fixing structure 2, a circuit board 3, a fixing joint 4, and a limiting bottom frame 5, where the limiting bottom frame 5 is a convex structure and the top of the limiting bottom frame is provided with the circuit board 3, the circuit board 3 is movably connected with the limiting bottom frame 5, the fixing joint 4 is vertically arranged at four corners of the top of the limiting bottom frame 5, the limiting bottom frame 5 and the fixing joint 4 are in threaded fit, the limiting bottom frame 5 is connected with the circuit board 3 through the fixing joint 4, the top of the circuit board 3 is provided with the package fixing structure 2, the package fixing structure 2 is welded with the circuit board 3, the top of the package fixing structure 2 is provided with the package moving structure 1, and the package moving structure 1 is matched with the package fixing structure 2.
Referring to fig. 2, the package movable structure 1 includes a chip 11, an upper package cover 12, a conductive connection wire 13, a side movable rail 14, and a lower package cover 15, wherein the upper and lower ends of the chip 11 are axisymmetric and are provided with the upper package cover 12 and the lower package cover 15, the upper package cover 12 and the lower package cover 15 are engaged with each other, the two sides of the chip 11 are axisymmetric and are provided with two side movable rails 14, the rear end of the side movable rail 14 is provided with the conductive connection wire 13, and the side movable rail 14 is connected to the chip 11 through the conductive connection wire 13.
Referring to fig. 3, the upper package cover 12 includes an air hole 12a, a package side bar 12b, a package cover 12c, and a chip frame 12d, the chip frame 12d is disposed at the center of the bottom of the package cover 12c, the chip frame 12d and the package cover 12c are integrated, the chip frame 12d is rectangular and has an open bottom, the chip frame 12d and the chip 11 are disposed at two sides thereof with wire connection notches, the chip frame 12d is matched with the chip 11, the air holes 12a are uniformly distributed at two sides of the chip frame 12d, the air hole 12a and the package cover 12c are integrated, the package cover 12c is disposed at two sides thereof with package side bars 12b, the package side bar 12b and the package cover 12c are integrated, and the package side bar 12b is disposed in parallel and connected with the package cover 12c to form a U-shaped structure. The preferred materials of the packaging side edge strip 12b, the packaging cover 12c and the chip frame 12d are ceramics.
Referring to fig. 4, the side movable rail 14 includes a conductive rail 14a, an elastic rubber column 14b, a conductive spring side plate 14c, an elastic rubber layer 14d, and a conductive spring piece 14e, the conductive rail 14a is connected to the chip 11 through a conductive connection 13, two conductive spring pieces 14e are parallel and equidistantly disposed inside the conductive rail 14a, an elastic rubber layer 14d is disposed at the rear end of the conductive spring piece 14e, the elastic rubber layer 14d and the conductive spring pieces 14e are in interference fit, more than two elastic rubber columns 14b are parallel and equidistantly disposed at the rear end of the elastic rubber layer 14d, the elastic rubber column 14b and the elastic rubber layer 14d are of an integrated structure and are fixedly connected to the conductive rail 14a, the conductive spring side plate 14c is disposed inside the elastic rubber column 14b, and the conductive spring side plate 14c and the elastic rubber column 14b are in interference fit, the conductive spring piece 14e is connected with the conductive rail 14a through the conductive spring side piece 14 c.
It also includes that the side movable rail 14 is provided with two and is arranged between the upper packaging cover 12 and the lower packaging cover 15 in an axisymmetric structure.
The conducting rail 14a is in a U-shaped structure and is arranged between the upper packaging cover 12 and the lower packaging cover 15, and one end of the opening is arranged outwards.
Example 2
Referring to fig. 1-6, the present invention provides an embodiment of a semiconductor package processing structure:
referring to fig. 1, a semiconductor package processing structure includes a package moving structure 1, a package fixing structure 2, a circuit board 3, a fixing joint 4, and a limiting bottom frame 5, where the limiting bottom frame 5 is a convex structure and the top of the limiting bottom frame is provided with the circuit board 3, the circuit board 3 is movably connected with the limiting bottom frame 5, the fixing joint 4 is vertically arranged at four corners of the top of the limiting bottom frame 5, the limiting bottom frame 5 and the fixing joint 4 are in threaded fit, the limiting bottom frame 5 is connected with the circuit board 3 through the fixing joint 4, the top of the circuit board 3 is provided with the package fixing structure 2, the package fixing structure 2 is welded with the circuit board 3, the top of the package fixing structure 2 is provided with the package moving structure 1, and the package moving structure 1 is matched with the package fixing structure 2.
Referring to fig. 2, the package movable structure 1 includes a chip 11, an upper package cover 12, a conductive connection wire 13, a side movable rail 14, and a lower package cover 15, wherein the upper and lower ends of the chip 11 are axisymmetric and are provided with the upper package cover 12 and the lower package cover 15, the upper package cover 12 and the lower package cover 15 are engaged with each other, the two sides of the chip 11 are axisymmetric and are provided with two side movable rails 14, the rear end of the side movable rail 14 is provided with the conductive connection wire 13, and the side movable rail 14 is connected to the chip 11 through the conductive connection wire 13.
Referring to fig. 3, the upper package cover 12 includes an air hole 12a, a package side bar 12b, a package cover 12c, and a chip frame 12d, the chip frame 12d is disposed at the center of the bottom of the package cover 12c, the chip frame 12d and the package cover 12c are integrated, the chip frame 12d is rectangular and has an open bottom, the chip frame 12d and the chip 11 are disposed at two sides thereof with wire connection notches, the chip frame 12d is matched with the chip 11, the air holes 12a are uniformly distributed at two sides of the chip frame 12d, the air hole 12a and the package cover 12c are integrated, the package cover 12c is disposed at two sides thereof with package side bars 12b, the package side bar 12b and the package cover 12c are integrated, and the package side bar 12b is disposed in parallel and connected with the package cover 12c to form a U-shaped structure. The preferred materials of the packaging side edge strip 12b, the packaging cover 12c and the chip frame 12d are ceramics.
Referring to fig. 4, the side movable rail 14 includes a conductive rail 14a, an elastic rubber column 14b, a conductive spring side plate 14c, an elastic rubber layer 14d, and a conductive spring piece 14e, the conductive rail 14a is connected to the chip 11 through a conductive connection 13, two conductive spring pieces 14e are parallel and equidistantly disposed inside the conductive rail 14a, an elastic rubber layer 14d is disposed at the rear end of the conductive spring piece 14e, the elastic rubber layer 14d and the conductive spring pieces 14e are in interference fit, more than two elastic rubber columns 14b are parallel and equidistantly disposed at the rear end of the elastic rubber layer 14d, the elastic rubber column 14b and the elastic rubber layer 14d are of an integrated structure and are fixedly connected to the conductive rail 14a, the conductive spring side plate 14c is disposed inside the elastic rubber column 14b, and the conductive spring side plate 14c and the elastic rubber column 14b are in interference fit, the conductive spring piece 14e is connected with the conductive rail 14a through the conductive spring side piece 14 c.
Referring to fig. 5, the package fixing structure 2 includes a reinforcing bottom frame 21, a conductive cross bar 22 and an insulating bar 23, the insulating bar 23 is disposed at the center of the bottom of the reinforcing bottom frame 21, the insulating bar 23 is fixedly connected to the reinforcing bottom frame 21, two conductive cross bars 22 are disposed at the top of the reinforcing bottom frame 21 in an axisymmetric structure, and the conductive cross bars 22 are fixedly connected to the reinforcing bottom frame 21. The preferred material of the conductive cross bars 22 is copper.
Referring to fig. 6, the reinforcing chassis 21 includes a reinforcing bottom plate 21a, heat absorbing sheets 21b, pins 21c, and reinforcing side bars 21d, the reinforcing bottom plate 21a is disposed on the top of the insulating strip 23 and fixedly connected to the insulating strip, two or more heat absorbing sheets 21b are uniformly arranged on the top of the reinforcing bottom plate 21a, the heat absorbing sheets 21b are vertically disposed on the top of the reinforcing bottom plate 21a and are integrated with each other, the reinforcing side bars 21d are disposed on both sides of the reinforcing bottom plate 21a, the reinforcing side bars 21d and the reinforcing bottom plate 21a are integrated with each other, two or more pins 21c are uniformly arranged on the reinforcing side bars 21d, the pins 21c and the reinforcing side bars 21d are fixedly connected to each other, the pins 21c have an L-shaped structure, and one vertical end of each pin 21c penetrates through and is fixed to the reinforcing side bar 21d and is welded to the conductive cross bar 22, the horizontal end of the pin 21c is placed on the circuit board 3 and soldered to the circuit, and the reinforcing bottom plate 21a, the reinforcing side bar 21d and the heat sink 21b are preferably made of ceramic.
It also includes that the side movable rail 14 is provided with two and is arranged between the upper packaging cover 12 and the lower packaging cover 15 in an axisymmetric structure.
The conducting rail 14a is in a U-shaped structure and is arranged between the upper packaging cover 12 and the lower packaging cover 15, and one end of the opening is arranged outwards.
The conductive transverse bar 22 is in a hollow rectangular strip structure and is in sliding fit with the conductive rail 14 a.
The specific realization principle is as follows:
the packaging movable structure 1 is arranged at the top of the packaging fixed structure 2 and matched with the packaging fixed structure 2, the packaging fixed structure 2 is welded and fixed on the circuit board 3, the packaging movable structure 1 is movably arranged at the top of the packaging fixed structure 2, the chip 11 is arranged in the packaging movable structure 1, through the structural arrangement of the packaging movable structure 1 and the packaging fixed structure 2, the chip 11 can be replaced or maintained without disassembling the pin 21c from the circuit board 3, the pin 21c is prevented from being damaged in the plugging and unplugging process, the heat of the chip 11 can be efficiently absorbed and exhausted through the formed ceramic packaging structure, the air and the circuit board 3 are efficiently utilized as heat conduction media to cool and radiate the chip 11, the operation efficiency of the chip 11 is improved, because the chip 11 is arranged and fixed in the ceramic packaging structure formed by the upper packaging cover 12 and the lower packaging cover 15, the chip frame 12d is rectangular and the bottom is open, two sides are provided with wiring notches, two packaging side strips 12b are arranged in parallel and connected with the packaging cover 12c to form a U-shaped structure, the chip 11 is clamped and fixed through the chip frame 12d, in the fixing process, a cavity is formed between the chip 11 and the packaging cover 12c at a distance, the heat generated in the operation of the chip 11 can be quickly conducted through a ceramic semi-surrounding structure, under the arrangement of the uniformly distributed air hole 12a structure, air can enter the packaging inner cavity through the air hole 12a and slowly move along the periphery of the chip frame 12d, partial heat is absorbed by the air, the heat is quickly conducted to the outer parts of the circuit board 3 and the packaging body through the ceramic packaging body, and further the heat dissipation efficiency of the chip 11 is greatly improved, because the conductor rail 14a is U-shaped and is arranged between the upper packaging cover 12 and the lower packaging cover 15, and one end of the opening is arranged outwards, the conductive transverse bar 22 is in a hollow rectangular strip structure and is in sliding fit with the conductive rail 14a, under the connection action of the structure, the packaging body is movably connected with the packaging fixing structure 2, two conductive spring pieces 14e are arranged in the conductive rail 14a in an axial symmetry structure, the conductive spring pieces 14e are fixedly connected in the conductive rail 14a through elastic rubber layers 14d and elastic rubber columns 14b and are electrically connected with the conductive rail 14a through conductive spring side pieces 14c, when the conductive transverse bar 22 slides into the conductive rail 14a, the two conductive spring pieces 14e are arranged in the elastic rubber layers 14d and the elastic rubber columns 14b, the generated opposite acting force enables the conductive transverse bar 22 to be stably arranged in the conductive rail 14a for electric conduction, and the conductive structure is formed by the conductive rail 14a and the conductive connecting wires 13, make 11 circular telegram operation of chip, it runs through to fix on consolidating side strake 21d to be L shape structure and perpendicular one end through pin 21c, and weld with electrically conductive horizontal bar 22 mutually, and pin 21c level one end is arranged in on circuit board 3 and with circuit looks welded structure setting, pin 21c welding that can make the range set up is on circuit board 3, it is not fragile, can improve pin 21 c's stability and intensity greatly, solve with this because the packaging area and the thickness of its DIP encapsulation are bigger, the pin is damaged easily at the plug in-process, and most DIP encapsulation chip all uses the thermosetting resin plastic to encapsulate, easy laying dust, the poor problem of radiating effect.
While there have been shown and described what are at present considered the fundamental principles of the invention, the essential features and advantages thereof, it will be understood by those skilled in the art that the present invention is not limited by the embodiments described above, which are merely illustrative of the principles of the invention, but rather, is capable of numerous changes and modifications in various forms without departing from the spirit or essential characteristics thereof, and it is intended that the invention be limited not by the foregoing descriptions, but rather by the appended claims and their equivalents.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (7)
1. The utility model provides a semiconductor package processing structure, its structure includes encapsulation movable structure (1), encapsulation fixed knot constructs (2), circuit board (3), fixed joint (4), spacing chassis (5), its characterized in that:
spacing chassis (5) top be equipped with circuit board (3), four angles at spacing chassis (5) top on be equipped with fixed joint (4), spacing chassis (5) be connected with circuit board (3) through fixed joint (4), circuit board (3) top be equipped with encapsulation fixed knot construct (2), encapsulation fixed knot construct (2) and circuit board (3) weld mutually, encapsulation fixed knot construct (2) top be equipped with encapsulation movable structure (1).
2. The semiconductor package handling structure of claim 1, wherein: encapsulation revolution mechanic (1) including chip (11), go up encapsulation cover (12), electrically conductive wiring (13), side activity rail (14), lower encapsulation cover (15), chip (11) about both ends be equipped with encapsulation cover (12) and lower encapsulation cover (15), chip (11) both sides be equipped with side activity rail (14), side activity rail (14) rear end be equipped with electrically conductive wiring (13), side activity rail (14) be connected with chip (11) through electrically conductive wiring (13).
3. The semiconductor package handling structure of claim 2, wherein: go up encapsulation cover (12) including gas pocket (12a), encapsulation side strake (12b), encapsulation lid (12c), chip frame (12d), encapsulation lid (12c) bottom central point put and to be equipped with chip frame (12d), chip frame (12d) both sides evenly distributed have gas pocket (12a), encapsulation lid (12c) both sides all be equipped with encapsulation side strake (12 b).
4. The semiconductor package handling structure of claim 2, wherein: the side movable rail (14) include conductor rail (14a), elasticity rubber column (14b), electrically conductive spring lateral plate (14c), elastic rubber layer (14d), electrically conductive spring leaf (14e), conductor rail (14a) inside be equipped with electrically conductive spring leaf (14e), electrically conductive spring leaf (14e) rear end be equipped with elastic rubber layer (14d), elastic rubber layer (14d) rear end be equipped with elasticity rubber column (14b), elasticity rubber column (14b) and elastic rubber layer (14d) be the integrated configuration and with conductor rail (14a) fixed connection, elasticity rubber column (14b) inside be equipped with electrically conductive spring lateral plate (14c), electrically conductive spring leaf (14e) be connected with conductor rail (14a) through electrically conductive spring lateral plate (14 c).
5. The semiconductor package handling structure of claim 1, wherein: the packaging and fixing structure (2) comprises a reinforcing bottom frame (21), a conductive transverse bar (22) and an insulating bar (23), wherein the insulating bar (23) is arranged at the center of the bottom of the reinforcing bottom frame (21), and the conductive transverse bar (22) is arranged at the top of the reinforcing bottom frame (21).
6. The semiconductor package handling structure of claim 5, wherein: the reinforced chassis (21) comprises a reinforced bottom plate (21a), heat absorbing sheets (21b), pins (21c) and reinforced side bars (21d), wherein the heat absorbing sheets (21b) are arranged at the top of the reinforced bottom plate (21a), the heat absorbing sheets (21b) are vertically arranged at the top of the reinforced bottom plate (21a) and are of an integrated structure, the reinforced side bars (21d) are arranged on two sides of the reinforced bottom plate (21a), and the pins (21c) are uniformly arranged on the reinforced side bars (21 d).
7. The semiconductor package handling structure of claim 6, wherein: the pins (21c) are L-shaped structures, one vertical end of each pin (21c) penetrates through and is fixed on the reinforcing side edge strip (21d) and is welded with the conductive cross strip (22), and the horizontal end of each pin (21c) is arranged on the circuit board (3) and is welded with a circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010843634.9A CN111968950A (en) | 2020-08-20 | 2020-08-20 | Semiconductor packaging part processing structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010843634.9A CN111968950A (en) | 2020-08-20 | 2020-08-20 | Semiconductor packaging part processing structure |
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| Publication Number | Publication Date |
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| CN111968950A true CN111968950A (en) | 2020-11-20 |
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| CN202010843634.9A Withdrawn CN111968950A (en) | 2020-08-20 | 2020-08-20 | Semiconductor packaging part processing structure |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113539974A (en) * | 2021-09-15 | 2021-10-22 | 凯瑞电子(诸城)有限公司 | Chip packaging shell and brazing process thereof |
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2020
- 2020-08-20 CN CN202010843634.9A patent/CN111968950A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113539974A (en) * | 2021-09-15 | 2021-10-22 | 凯瑞电子(诸城)有限公司 | Chip packaging shell and brazing process thereof |
| CN113539974B (en) * | 2021-09-15 | 2021-11-23 | 凯瑞电子(诸城)有限公司 | Chip packaging shell and brazing process thereof |
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