CN112738980A - Insulation method between heat dissipation plate and printed board - Google Patents
Insulation method between heat dissipation plate and printed board Download PDFInfo
- Publication number
- CN112738980A CN112738980A CN202011508475.3A CN202011508475A CN112738980A CN 112738980 A CN112738980 A CN 112738980A CN 202011508475 A CN202011508475 A CN 202011508475A CN 112738980 A CN112738980 A CN 112738980A
- Authority
- CN
- China
- Prior art keywords
- plate
- heat dissipation
- epoxy
- board
- dissipation plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0064—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a polymeric substrate
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to the technical field of printed board heat dissipation, in particular to an insulation method between a heat dissipation plate and a printed board, which comprises the following steps: preparing a heat dissipation plate and an epoxy plate, wherein the area of the epoxy plate is larger than that of the heat dissipation plate, pre-positioning the epoxy plate and the heat dissipation plate through a clamp, and pressing the heat dissipation plate and the epoxy plate together in a vacuumizing and pressing mode; preparing an adhesive film, and bonding the adhesive film with an epoxy board by using an adhesive, wherein the area of the adhesive film is the same as that of the epoxy board; the subassembly that forms heating panel, epoxy board and glued membrane is fixed a position, will the glued membrane and the printing board laminating of subassembly are put and are carried out the hot pressing in the vulcanizer, and the melting point of epoxy board is far higher than the glued membrane in this application, can not make the epoxy board be heated and produce deformation when subassembly and the printing board hot pressing that form heating panel, epoxy board, glued membrane to make the insulating nature between heating panel and the printing board more reliable.
Description
Technical Field
The invention relates to the technical field of printed board heat dissipation, in particular to an insulation method between a heat dissipation plate and a printed board.
Background
Along with the rapid development of electronic technology, the integration and miniaturization of printed circuit board components bring outstanding heat dissipation problems, and along with the improvement of power density, the heat dissipation problem becomes an important link influencing the reliability and the service life of electronic equipment. In order to solve the temperature problem, it is important to set a reasonable radiator for the printed board. In the prior art, the heat dissipation of the printed board mainly comprises a heat dissipation plate, the heat dissipation plate and the printed board are bonded by an adhesive film, but after the adhesive film is heated, the thickness is easy to change, and the reduction of the thickness may cause the reduction of the insulation reliability between the heat dissipation plate and the printed board.
Disclosure of Invention
The applicant aims at the defects in the prior art and provides an insulation method between a heat dissipation plate and a printed board, so that the insulation between the heat dissipation plate and the printed board is more reliable.
The technical scheme adopted by the invention is as follows: an insulation method between a heat dissipation plate and a printed board comprises the following steps:
preparing a heat dissipation plate and an epoxy plate, wherein the area of the epoxy plate is larger than that of the heat dissipation plate, pre-positioning the epoxy plate and the heat dissipation plate through a clamp, and pressing the heat dissipation plate and the epoxy plate together in a vacuumizing and pressing mode;
preparing an adhesive film, and bonding the adhesive film with an epoxy board by using an adhesive, wherein the area of the adhesive film is the same as that of the epoxy board;
and positioning an assembly formed by the heat dissipation plate, the epoxy plate and the adhesive film, and adhering the adhesive film of the assembly and the printed board and putting the assembly and the printed board into a vulcanizing machine for hot pressing.
As a further improvement of the above technical solution:
the thickness range of the epoxy plate is 0.1mm-0.3 mm.
An avoiding through hole is formed in the assembly, and the component is welded with the printed board at the avoiding through hole.
The peripheral edge of the heat dissipation plate and the peripheral edge of the epoxy plate are arranged at equal intervals, and the distance between the peripheral edge of the heat dissipation plate and the peripheral edge of the epoxy plate is 0.1 mm.
The invention has the following beneficial effects: the melting point of epoxy board is far above the glued membrane in this application, can not make the epoxy board be heated and produce deformation when subassembly and the printing board hot pressing that will heat dissipation plate, epoxy board, glued membrane formed to make the insulating nature between heating dissipation plate and the printing board more reliable.
Drawings
Fig. 1 is a schematic structural view of the present invention.
Wherein: 10. a heat dissipation plate; 20. an epoxy board; 30. a glue film; 40. and (7) printing the board.
Detailed Description
The following describes embodiments of the present invention with reference to the drawings.
As shown in fig. 1, the method for insulating a heat dissipation plate from a printed board of the present embodiment includes the steps of:
preparing a heat dissipation plate 10 and an epoxy plate 20, wherein the area of the epoxy plate 20 is larger than that of the heat dissipation plate 10, pre-positioning the epoxy plate 20 and the heat dissipation plate 10 through a clamp, and pressing the heat dissipation plate 10 and the epoxy plate 20 together in a vacuumizing and pressing mode;
preparing an adhesive film 30, and bonding the adhesive film 30 to the epoxy board 20 by using an adhesive, wherein the area of the adhesive film 30 is the same as that of the epoxy board 20, and the size of the adhesive film 30 needs to be produced and processed according to the external dimension of the epoxy board 20.
Positioning an assembly formed by the heat dissipation plate 10, the epoxy plate 20 and the adhesive film 30, attaching the adhesive film 30 of the assembly to the printed board 40, and putting the assembly into a vulcanizing machine for hot pressing.
The thickness of the epoxy board 20 ranges from 0.1mm to 0.3 mm.
An avoiding through hole is formed in the assembly, and the component is welded with the printed board 40 at the avoiding through hole.
The peripheral edge of the heat radiating plate 10 and the peripheral edge of the epoxy plate 20 are arranged at equal intervals, and the distance between the peripheral edge of the heat radiating plate 10 and the peripheral edge of the epoxy plate 20 is 0.1 mm.
The melting point of epoxy board 20 is far above glued membrane 30 in this application, can not make epoxy board 20 be heated and produce deformation when the subassembly that forms heating panel 10, epoxy board 20, glued membrane 30 and printed board 40 hot pressing to make the insulating nature between heating panel 10 and the printed board 40 more reliable.
The area of epoxy board 20 is greater than the area of heating panel 10 in this application, and the distance of the edge all around of heating panel 10 and epoxy board 20 is 0.1mm, and the edge all around of epoxy board 20 can block effectively heating panel 10 promptly, prevents heating panel 10 and printed board 40 contact, and further assurance is the insulating nature between heating panel 10 and the printed board 40.
This application makes not have the air between epoxy board 20 and the heating panel 10 through the mode of evacuation for laminating between the two is better, and heat transfer performance is stable, and insulating nature is reliable.
The above description is intended to be illustrative and not restrictive, and the scope of the invention is defined by the appended claims, which may be modified in any manner within the scope of the invention.
Claims (4)
1. An insulation method between a heat dissipation plate and a printed board is characterized by comprising the following steps:
preparing a heat dissipation plate (10) and an epoxy plate (20), wherein the area of the epoxy plate (20) is larger than that of the heat dissipation plate (10), pre-positioning the epoxy plate (20) and the heat dissipation plate (10) through a clamp, and pressing the heat dissipation plate (10) and the epoxy plate (20) together in a vacuum pumping and pressing mode;
preparing an adhesive film (30), and bonding the adhesive film (30) with the epoxy plate (20) by using an adhesive, wherein the area of the adhesive film (30) is the same as that of the epoxy plate (20);
positioning an assembly formed by the heat dissipation plate (10), the epoxy plate (20) and the adhesive film (30), attaching the adhesive film (30) of the assembly and the printed board (40), and placing the assembly into a vulcanizing machine for hot pressing.
2. The method of insulating a heat radiating plate from a printed board according to claim 1, wherein: the thickness range of the epoxy plate (20) is 0.1mm-0.3 mm.
3. The method of insulating a heat radiating plate from a printed board according to claim 1, wherein: an avoiding through hole is formed in the assembly, and the component is welded with the printed board (40) at the avoiding through hole.
4. The method of insulating a heat radiating plate from a printed board according to claim 1, wherein: the peripheral edge of the heat dissipation plate (10) and the peripheral edge of the epoxy plate (20) are arranged at equal intervals, and the distance between the peripheral edge of the heat dissipation plate (10) and the peripheral edge of the epoxy plate (20) is 0.1 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011508475.3A CN112738980A (en) | 2020-12-18 | 2020-12-18 | Insulation method between heat dissipation plate and printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011508475.3A CN112738980A (en) | 2020-12-18 | 2020-12-18 | Insulation method between heat dissipation plate and printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112738980A true CN112738980A (en) | 2021-04-30 |
Family
ID=75603256
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011508475.3A Pending CN112738980A (en) | 2020-12-18 | 2020-12-18 | Insulation method between heat dissipation plate and printed board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112738980A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114227177A (en) * | 2021-12-31 | 2022-03-25 | 无锡市五十五度科技有限公司 | Connection process of welded device printed board and heat dissipation plate |
-
2020
- 2020-12-18 CN CN202011508475.3A patent/CN112738980A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114227177A (en) * | 2021-12-31 | 2022-03-25 | 无锡市五十五度科技有限公司 | Connection process of welded device printed board and heat dissipation plate |
| CN114227177B (en) * | 2021-12-31 | 2023-01-10 | 无锡市五十五度科技有限公司 | Connection process of welded device printed board and heat dissipation plate |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2009110376A1 (en) | Leadframe substrate, semiconductor module and method for manufacturing leadframe substrate | |
| WO2009141413A1 (en) | Printed circuit board with co-planar plate and method of manufacturing therefor | |
| CN111430315B (en) | Insulated metal substrate and method for manufacturing same | |
| JP2012248602A (en) | Resin-sealed electronic control device and manufacturing method of the same | |
| JP2002033558A (en) | Circuit board and its manufacturing method | |
| JPWO2003083940A1 (en) | Method for manufacturing thermally conductive substrate | |
| US8188376B2 (en) | Insulation substrate, power module substrate, manufacturing method thereof, and power module using the same | |
| CN112738980A (en) | Insulation method between heat dissipation plate and printed board | |
| CN2134033Y (en) | High heat elimination printed circuit board | |
| CN112040635B (en) | Soft-hard combined PCB and preparation method thereof | |
| CN210640175U (en) | Electronic chip packaging structure | |
| EP1705969A2 (en) | Electronic assembly having a substrate laminated within a backplate cavity | |
| CN104869751A (en) | PCB and production process thereof | |
| CN201270625Y (en) | Printed circuit board and adhering structure for heat radiation fin | |
| CN219644440U (en) | Single-sided dense circuit high-heat-conductivity copper substrate | |
| CN114290769B (en) | Metal plate, insulated metal plate and preparation method and application of insulated metal plate | |
| CN220943746U (en) | Cutting jig for micro-pad flexible circuit board | |
| JPS6235593B2 (en) | ||
| JP2010225619A (en) | Circuit board, and circuit board manufacturing method | |
| CN111182728A (en) | Manufacturing method of printed circuit board with metal substrate of aluminum dam | |
| JP2005093582A (en) | Heat radiation circuit board and method of manufacturing the same | |
| CN118099006A (en) | Preparation method of fast diode | |
| CN113068321A (en) | Mounting process of conductive adhesive, production process of circuit board and circuit board | |
| CN114361117A (en) | Preparation method of heat dissipation substrate and heat dissipation substrate | |
| CN117729747A (en) | Film bonding method for nonmetal heat dissipation plate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |