CN216054671U

CN216054671U - Integrated circuit packaging structure

Info

Publication number: CN216054671U
Application number: CN202122327289.6U
Authority: CN
Inventors: 柴赛; 付志成; 吕玉芹
Original assignee: Shanghai Linjie Electronic Technology Co ltd
Current assignee: Shanghai Linjie Electronic Technology Co ltd
Priority date: 2021-09-26
Filing date: 2021-09-26
Publication date: 2022-03-15
Anticipated expiration: 2031-09-26

Abstract

The utility model discloses an integrated circuit packaging structure which comprises a bottom plate and a chip body, wherein pins are fixedly connected to two sides of the chip body, a lower shell is arranged at the bottom of the chip body, an upper shell is packaged at the top of the lower shell, a buffer gasket is fixedly connected to the bottom of the lower shell, heat dissipation holes are formed in the top of the upper shell, a heat dissipation fin is fixedly connected to the bottom of the upper shell, a heat conduction plate is fixedly connected to the top of the chip body, and the top of the heat conduction plate is attached to the heat dissipation fin. By adopting the structure, the chip body is placed in the lower shell, the upper shell is used for packaging, the heat of the main part can be conducted by using the heat dissipation plate, the presser foot and the heat conduction plate can be effectively connected in a heat conduction manner by using the heat dissipation silicone grease, so that the heat dissipation effect is better, the heat dissipation can be realized by using the heat dissipation fins and the heat dissipation holes, and the sealing performance of the packaging is not influenced while the better heat dissipation effect is realized.

Description

Integrated circuit packaging structure

Technical Field

The utility model belongs to the field of dust collecting circuits, and particularly relates to an integrated circuit packaging structure.

Background

In a manufacturing process of a semiconductor device, in order to protect a semiconductor chip, a certain packaging process is required to encapsulate the semiconductor chip. The chip packaging technology is a process technology for wrapping a chip to avoid the chip from contacting with the outside and preventing the chip from being damaged by the outside.

However, the packaging structure is improved along with the actual use condition, the current packaging structure is not beneficial to heat dissipation of the chip, the service life is shortened, a buffering structure is not provided during installation, the buffering protection effect cannot be achieved, and the chip is easy to damage.

SUMMERY OF THE UTILITY MODEL

In view of the problems mentioned in the background art, an object of the present invention is to provide an integrated circuit package structure to solve the problems of poor heat dissipation effect and inability to perform buffer protection.

The technical purpose of the utility model is realized by the following technical scheme:

the utility model provides an integrated circuit packaging structure, includes bottom plate and chip body, the both sides fixedly connected with pin of chip body, the bottom of chip body is provided with down the casing, the top of casing is packaged with last casing down, the bottom fixedly connected with buffer spacer of casing down, the louvre has been seted up at the top of going up the casing, the bottom fixedly connected with fin of going up the casing, the top fixedly connected with heat-conducting plate of chip body, the top and the fin of heat-conducting plate laminate mutually.

Through adopting above-mentioned technical scheme, through placing the chip body in the casing down to utilize the casing to encapsulate, can conduct the heat at main part through utilizing the heating panel, utilize fin and louvre can dispel the heat, thereby when playing better radiating effect, do not influence the leakproofness of encapsulation, can make the casing laminating compacter down on the bottom plate through setting up buffer gasket, can also play the effect of buffering shock attenuation and protection to casing down.

Further, as a preferable technical solution, an encapsulation resin is provided inside the lower case, and the chip body is bonded in the encapsulation resin.

By adopting the technical scheme, the chip body can be better sealed and packaged by utilizing the packaging resin.

Further, as a preferred technical scheme, a clamping groove is formed in the edge of the top of the chip body, and the edge of the heat conducting plate penetrates through the clamping groove.

Through adopting above-mentioned technical scheme, can be convenient for the fin to dock through setting up the draw-in groove.

Further, as a preferred technical scheme, heat dissipation silicone grease is packaged in the clamping groove, a presser foot is fixedly connected to the bottom of the heat dissipation sheet, and the presser foot is attached to the surface of the heat dissipation silicone grease.

Through adopting above-mentioned technical scheme, utilize heat dissipation silicone grease can effectively carry out the heat conduction between presser foot and the heat-conducting plate and be connected to make radiating effect better.

Further, as a preferred technical scheme, an insulating protective coating is fixedly connected inside the heat conducting plate.

By adopting the technical scheme, the insulating protective coating can play a role in protecting an internal circuit.

Further, as a preferred technical scheme, a protruding block is fixedly connected to the top of the bottom plate, the top of the protruding block is arched, the pins are welded to the top of the protruding block, and grooves are formed in two sides of the top of the protruding block.

Through adopting above-mentioned technical scheme, can be convenient for the pin to weld through setting up the arch protruding piece in top, be difficult to the rosin joint to the recess that utilizes to set up can make welding solder can not trickle, makes the splice cleaner and tidier, and the welding is more firm.

Further, as a preferred technical solution, the bump is made of nickel, gold, nickel, copper or other conductive materials, and the pin and the bump are provided in plurality.

By adopting the technical scheme, the electric conduction is convenient to carry out.

Further, as a preferred technical scheme, caulking grooves are formed in two sides of the top of the lower shell, and the pins penetrate through the caulking grooves.

Through adopting above-mentioned technical scheme, the caulking groove reserves the installation position for the pin.

In summary, the utility model mainly has the following beneficial effects:

first, through placing the chip body in the casing down to utilize the casing to encapsulate, can conduct the heat at main part through utilizing the heating panel, utilize heat dissipation silicone grease can effectively be connected the heat conduction between presser foot and the heat-conducting plate, thereby make radiating effect better, utilize fin and louvre to dispel the heat, thereby when playing better radiating effect, do not influence the leakproofness of encapsulation.

The second, can make the laminating of inferior valve body compacter on the bottom plate through setting up buffer shim, can also play the effect of buffering shock attenuation and protection to inferior valve body.

The pin that can be convenient for through setting up the arch protruding piece in top welds, is difficult to the rosin joint to the recess that utilizes to set up can make welding solder can not trickle, makes the splice cleaner and tidier, and the welding is more firm.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic view of the upper housing portion of the present invention;

FIG. 3 is an enlarged view of the structure of portion A of FIG. 1 according to the present invention.

Reference numerals: 1. the heat-conducting plate comprises a base plate, 2, a chip body, 3, pins, 4, a lower shell, 5, an upper shell, 6, a buffer gasket, 7, heat dissipation holes, 8, a heat dissipation fin, 9, a heat-conducting plate, 10, packaging resin, 11, a clamping groove, 12, heat dissipation silicone grease, 13, a pressure foot, 14, an insulating protective coating, 15, a protruding block, 16, a groove, 17 and a caulking groove.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Examples

Referring to fig. 1-3, the integrated circuit package structure of the present embodiment includes a bottom plate 1 and a chip body 2, two sides of the chip body 2 are fixedly connected with pins 3, the bottom of the chip body 2 is provided with a lower casing 4, the top of the lower casing 4 is packaged with an upper casing 5, the bottom of the lower casing 4 is fixedly connected with a buffer gasket 6, the top of the upper casing 5 is provided with a heat dissipation hole 7, the bottom of the upper casing 5 is fixedly connected with a heat dissipation fin 8, the top of the chip body 2 is fixedly connected with a heat conduction plate 9, and the top of the heat conduction plate 9 is attached to the heat dissipation fin 8.

Referring to fig. 1, for the purpose of packaging, the lower case 4 of the present embodiment is provided with a packaging resin 10 inside, and the chip body 2 is bonded in the packaging resin 10; the chip body 2 can be sealed and encapsulated with the encapsulating resin 10.

Referring to fig. 1-3, in order to achieve the purpose of butt joint, a card slot 11 is formed at the edge of the top of the chip body 2, and the edge of the heat conducting plate 9 penetrates through the card slot 11; the heat radiating fins 8 can be conveniently butted by arranging the clamping grooves 11.

Referring to fig. 1-3, in order to achieve the purpose of heat conduction, a heat dissipation silicone grease 12 is encapsulated inside the slot 11 of this embodiment, a presser foot 13 is fixedly connected to the bottom of the heat dissipation plate 8, and the presser foot 13 is attached to the surface of the heat dissipation silicone grease 12; the heat-conducting connection between the presser foot 13 and the heat-conducting plate 9 can be effectively carried out by utilizing the heat-radiating silicone grease 12, so that the heat-radiating effect is better.

Referring to fig. 1-3, for protection purposes, the heat-conducting plate 9 of the present embodiment has an insulating protective coating 14 fixedly attached to the inside thereof; the use of the insulating protective coating 14 can function to protect the internal circuitry.

Referring to fig. 1, in order to achieve the purpose of firm welding, a convex block 15 is fixedly connected to the top of the bottom plate 1 in this embodiment, the top of the convex block 15 is arched, the pins 3 are welded to the top of the convex block 15, and grooves 16 are formed in two sides of the top of the convex block 15; through setting up the arch-shaped protruding piece 15 in top can be convenient for pin 3 and weld, be difficult to the rosin joint to utilize the recess 16 that sets up to make welding solder can not flow, make the splice neater, it is more firm to weld.

Referring to fig. 1, in order to achieve the purpose of electrical conduction, the bump 15 of the present embodiment is made of nickel, gold, nickel, copper or other conductive materials, and the pin 3 and the bump 15 are provided in plurality; facilitating electrical conduction.

Referring to fig. 1-2, in order to achieve the purpose of facilitating the encapsulation of the pins 3, both sides of the top of the lower housing 4 are provided with caulking grooves 17, and the pins 3 penetrate through the caulking grooves 17; the caulking groove 17 reserves an installation position for the pin 3.

The use principle and the advantages are as follows: by placing the chip body 2 in the lower shell 4 and utilizing the upper shell 5 for packaging, the heat of the main part can be conducted by utilizing the heat dissipation plate, the heat dissipation can be carried out by utilizing the heat dissipation plate 8 and the heat dissipation holes 7, thereby achieving better heat dissipation effect without influencing the sealing performance of the packaging, the lower shell 4 can be more compactly attached on the bottom plate 1 by arranging the buffer gasket 6, the lower shell 4 can also play the roles of buffering, damping and protecting the lower shell 4, the chip body 2 can be better sealed and packaged by utilizing the packaging resin 10, the butt joint of the heat dissipation plate 8 can be facilitated by arranging the clamping groove 11, the heat dissipation silicone grease 12 can effectively carry out heat conduction connection between the presser foot 13 and the heat conduction plate 9, thereby achieving better heat dissipation effect, the function of protecting the internal circuit can be achieved by utilizing the insulating protective coating 14, the welding of the pin 3 can be facilitated by arranging the convex block 15 with the arched top, the cold joint is not easy to occur, and the welding solder can not flow by utilizing the arranged groove 16, so that the welding position is cleaner and tidier, and the welding is firmer.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. An integrated circuit package structure, comprising: including bottom plate (1) and chip body (2), both sides fixedly connected with pin (3) of chip body (2), the bottom of chip body (2) is provided with down casing (4), the top of casing (4) is packaged with casing (5) down, the bottom fixedly connected with buffer pad (6) of casing (4) down, louvre (7) have been seted up at the top of going up casing (5), the bottom fixedly connected with fin (8) of going up casing (5), the top fixedly connected with heat-conducting plate (9) of chip body (2), the top and fin (8) of heat-conducting plate (9) are laminated mutually.

2. The integrated circuit package structure of claim 1, wherein: and the lower shell (4) is internally provided with packaging resin (10), and the chip body (2) is bonded in the packaging resin (10).

3. The integrated circuit package structure of claim 1, wherein: the top edge part of the chip body (2) is provided with a clamping groove (11), and the edge part of the heat conducting plate (9) penetrates through the clamping groove (11).

4. The integrated circuit package structure of claim 3, wherein: the radiating silicone grease (12) is packaged in the clamping groove (11), the bottom of the radiating fin (8) is fixedly connected with a pressing foot (13), and the pressing foot (13) is attached to the surface of the radiating silicone grease (12).

5. The integrated circuit package structure of claim 1, wherein: and an insulating protective coating (14) is fixedly connected inside the heat conducting plate (9).

6. The integrated circuit package structure of claim 1, wherein: the novel LED lamp is characterized in that a convex block (15) is fixedly connected to the top of the bottom plate (1), the top of the convex block (15) is arched, the pins (3) are welded to the top of the convex block (15), and grooves (16) are formed in two sides of the top of the convex block (15).

7. The integrated circuit package structure of claim 6, wherein: the protruding blocks (15) are made of nickel, gold, nickel, copper or other conductive materials, and the pins (3) and the protruding blocks (15) are arranged in a plurality.

8. The integrated circuit package structure of claim 1, wherein: caulking grooves (17) are formed in two sides of the top of the lower shell (4), and the pins (3) penetrate through the caulking grooves (17).