CN109103145A - A kind of the semiconductor packages unit and packaging method of anti-electric shock and electric leakage - Google Patents
A kind of the semiconductor packages unit and packaging method of anti-electric shock and electric leakage Download PDFInfo
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- CN109103145A CN109103145A CN201810926948.8A CN201810926948A CN109103145A CN 109103145 A CN109103145 A CN 109103145A CN 201810926948 A CN201810926948 A CN 201810926948A CN 109103145 A CN109103145 A CN 109103145A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 69
- 238000000034 method Methods 0.000 title claims description 17
- 238000004806 packaging method and process Methods 0.000 title claims description 8
- 239000000758 substrate Substances 0.000 claims abstract description 132
- 239000000428 dust Substances 0.000 claims abstract description 56
- 238000003466 welding Methods 0.000 claims abstract description 23
- 229910052751 metal Inorganic materials 0.000 claims abstract description 10
- 239000002184 metal Substances 0.000 claims abstract description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 37
- 229910052802 copper Inorganic materials 0.000 claims description 34
- 239000010949 copper Substances 0.000 claims description 34
- 238000005538 encapsulation Methods 0.000 claims description 24
- 239000007788 liquid Substances 0.000 claims description 21
- 239000002775 capsule Substances 0.000 claims description 15
- 238000010521 absorption reaction Methods 0.000 claims description 13
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 11
- 238000009825 accumulation Methods 0.000 claims description 10
- 238000001746 injection moulding Methods 0.000 claims description 9
- 238000009833 condensation Methods 0.000 claims description 8
- 230000005494 condensation Effects 0.000 claims description 8
- 229910000831 Steel Inorganic materials 0.000 claims description 7
- 239000010959 steel Substances 0.000 claims description 7
- 230000017525 heat dissipation Effects 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims description 5
- 239000013078 crystal Substances 0.000 claims description 3
- 238000001514 detection method Methods 0.000 claims description 3
- 238000007689 inspection Methods 0.000 claims description 3
- 238000009434 installation Methods 0.000 claims description 3
- 238000003860 storage Methods 0.000 claims description 3
- 239000007767 bonding agent Substances 0.000 claims description 2
- 230000001681 protective effect Effects 0.000 claims description 2
- 230000003014 reinforcing effect Effects 0.000 claims 1
- 230000005611 electricity Effects 0.000 abstract description 7
- 238000010586 diagram Methods 0.000 description 5
- 238000001816 cooling Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000003670 easy-to-clean Effects 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/562—Protection against mechanical damage
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/564—Details not otherwise provided for, e.g. protection against moisture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses the semiconductor packages units of the one kind in semiconductor packages monotechnics field anti-electric shock and electric leakage, including heat-radiating substrate, radiator is uniformly arranged at the top of the heat-radiating substrate, the top of the radiator connects lower substrate, chip support plate one is arranged in the top of the lower substrate, support device is respectively provided at left and right sides of the top of the chip support plate one, upper substrate is arranged in the top of the support device, chip support plate two is arranged in the top of the upper substrate, the top left and right ends of the chip support plate one and chip support plate two are respectively provided with metal wire, outer protecting shell is arranged in the top of the heat-radiating substrate, the left and right sides outer wall of the heat-radiating substrate is respectively provided with welding piece, dust exhaust apparatus is arranged in the top of the heat-radiating substrate, it is easily installed semiconductor packages unit more, it effectively prevents from clicking the damage to component simultaneously, make Temperature is not too high to damage original part, effectively prevents the phenomenon that semiconductor packages unit leaks electricity at work.
Description
Technical field
The present invention relates to semiconductor packages monotechnics field, specially a kind of semiconductor packages list of anti-electric shock and electric leakage
Member and packaging method.
Background technique
Semiconductor packages, which refers to, to process to obtain individual chips according to product type and functional requirement by the wafer tested
Process.And existing semiconductor packages unit has shortcomings during being packaged with use, be easy to cause half
The damage of component on conductor encapsulation unit, to influence the sale and use of semiconductor packages unit.Due to existing semiconductor
Encapsulation unit demand is gradually increased, and the volume liquid of semiconductor packages unit in process of production is smaller and smaller, is carrying out semiconductor
When encapsulation unit is installed, the component in semiconductor packages unit is easy the friction initiation electrostatic that contacts with each other, and electrostatic is easy to original part
It is destroyed, existing semiconductor packages unit cannot effectively prevent the generation of electrostatic when packaged, so that semiconductor
Encapsulation unit is relatively complicated in encapsulation process step, and quality cannot be guaranteed.And semiconductor packages unit generates in use
Heat be not easy to distribute, internal dust does not allow easy to clean, so that inside the excessively high damage of semiconductor packages unit internal temperature
Original part causes internal original part to be easy to appear leaky.For this purpose, it is proposed that a kind of semiconductor packages list of anti-electric shock and electric leakage
Member and packaging method.
Summary of the invention
The purpose of the present invention is to provide the semiconductor packages units and packaging method of a kind of anti-electric shock and electric leakage, to solve
The problems mentioned above in the background art.
To achieve the above object, the invention provides the following technical scheme: a kind of semiconductor packages list of anti-electric shock and electric leakage
Member, including heat-radiating substrate, radiator is uniformly arranged at the top of the heat-radiating substrate, and the top of the radiator connects lower base
Plate, the top of the lower substrate are arranged chip support plate one, are respectively provided with support device at left and right sides of the top of the chip support plate one,
The top of the support device is arranged upper substrate, and the top of the upper substrate is arranged chip support plate two, the chip support plate one with
The top left and right ends of chip support plate two are respectively provided with metal wire, and the other end of metal wire be connected to lower substrate with it is upper
The top of substrate, the top left and right sides of the heat-radiating substrate are respectively provided with pin, and outer protecting shell is arranged in the top of the heat-radiating substrate,
And lower substrate and upper substrate are arranged at the inner cavity of outer protecting shell, the left and right sides outer wall of the heat-radiating substrate is respectively provided with welding piece,
Dust exhaust apparatus is arranged in the top of the heat-radiating substrate, and the right side of lower substrate is arranged in dust exhaust apparatus.
Preferably, the radiator includes the steel loop being fixed at the top of heat-radiating substrate, and the top of the steel loop, which connects, inhales
Hot copper sheet, and the bottom of lower substrate is connected at the top of the copper sheet that absorbs heat, the bottom of the heat absorption copper sheet connects heat-conducting copper pipe, and leads
Thermally conductive copper wire is arranged in the inner cavity of hot copper pipe, and the bottom of the heat-conducting copper pipe is through to the inner cavity of heat-radiating substrate and connects heat radiating fin
Piece, and radiating fin is embedded in the front side outer wall of heat-radiating substrate.
Preferably, the dust exhaust apparatus includes the outer sleeve being fixed at the top of heat-radiating substrate, is set at the top of the outer sleeve
Dust bar, the inner cavity setting condensation liquid capsule of the outer sleeve are set, and the lumen loading for condensing liquid capsule has the condensate liquid of ice crystal, institute
The top connection condenser pipe of condensation liquid capsule is stated, dust accumulation strainer is arranged in the inner cavity of the dust bar, and the top of condenser pipe is successively passed through
It wears outer sleeve and dust accumulation strainer and extends to the inner cavity of dust bar, the left and right sides outer wall of the dust bar is respectively provided with venthole.
Preferably, the left and right sides outer wall of the lower substrate and upper substrate is respectively provided with support column, the lower substrate outer wall
It is connected to the outer wall of the support column of upper substrate outer wall at the top of support column, and is connected at the top of the support column of upper substrate outer wall outer
The inner cavity top of protective case.
Preferably, the pin is arranged with the junction of outer protecting shell and heat-radiating substrate respectively reinforces welding aluminium flake, described to add
Admittedly one end of welding aluminium flake extends to the inner cavity of welding piece, and sealing ring, institute is arranged in the junction for welding aluminium flake and welding piece admittedly
The left and right sides outer wall for stating outer protecting shell is respectively provided with heat release hole, and strainer is arranged in the inner wall of heat release hole.
Preferably, the support device includes the pillar for connecting lower substrate and upper substrate, and the upper and lower ends of the pillar are equal
Semi-circular recesses are set, and the outer wall of lower substrate and upper substrate is respectively provided with and the matched convex block of semi-circular recesses, the semicircle
The left and right sides of groove is connected to injection molding tube, and the outer wall of the other end connection pillar of injection molding tube.
Preferably, the packaging method of a kind of anti-electric shock and the semiconductor packages unit of electric leakage:
S1: carrying out the installation of semiconductor packages first, heat-radiating substrate fixed, and the lower substrate equipped with chip support plate one is pacified
Mounted in the top of heat-radiating substrate, the upper substrate equipped with chip support plate two is connected with each other with lower substrate by support device, support
The upper and lower ends of device are cooperatively connected by semi-circular recesses and convex block, inject bonding into semi-circular recesses by injection molding tube
Agent makes lower substrate and upper substrate be fixed on the upper and lower ends of support device, then outer protecting shell is connected to the top of heat-radiating substrate,
It is connected by support column with outer protecting shell, so that outer protecting shell is not in contact with chip support plate one and chip support plate two, make semiconductor
Encapsulation unit has more leakproofness and protectiveness when packaged, while being fixed pin by welding piece.
S2: encapsulation unit is packaged in use process, protects semiconductor package in encapsulation use by radiator
Room temperature is held, the heat that semiconductor packages cell operation generates is rapidly absorbed by heat absorption copper sheet, and heat absorption copper sheet conducts heat
It to heat-conducting copper pipe, conducts heat on radiating fin by heat-conducting copper pipe, can be given out heat by radiating fin
The outside of heat-radiating substrate, while passing through dust exhaust apparatus and the dust entered in outer protecting shell is received while can cooling down again
Collect, the heat in outer protecting shell is distributed by heat release hole to the outside of outer protecting shell, and condensing the condensate liquid in liquid capsule makes the temperature of condenser pipe
Degree is lower than room temperature, and the high temperature gas flow inside outer protecting shell replaces exchange, thermal current with the cold airflow inside dust bar by venthole
In dust during being exchanged with cold airflow by dust accumulation strainer complete dust collection.
S3: after completing the encapsulation of semiconductor packages unit and using detection, carrying out subsequent processing for semiconductor packages unit,
By entering inspection, semiconductor encapsulation unit is further tested, test is packed after completing, and completes subsequent step
It is put in storage shipment.
Compared with prior art, the beneficial effects of the present invention are:
1. being respectively provided with support column in the two sides outer wall of lower substrate and upper substrate, semiconductor packages list can be made by support column
Member is remaining with gap always between outer protecting shell in encapsulation process, can effectively prevent the component in semiconductor packages unit
It rubs with outer protecting shell and causes electrostatic, while the connection between lower substrate and upper substrate can be made more stable by support device,
Making semiconductor packages unit, motion amplitude is consistent at work, not will cause component mutual collision friction at work, makes partly to lead
Body encapsulation unit is more easily installed, while effectively preventing the damage shocked by electricity to component；
2. radiator and dust exhaust apparatus are set, it can be quickly and effectively to semiconductor encapsulation unit work by radiator
While making the heat spreader generated, while outer protecting shell internal operating temperature can be reduced again by dust exhaust apparatus, ash is reduced
Pollution of the dirt to semiconductor encapsulation unit, makes semiconductor packages unit work at normal temperature, makes temperature is not too high to make to original part
At damage, the phenomenon that semiconductor packages unit leaks electricity at work is effectively prevented.
Detailed description of the invention
Fig. 1 is schematic structural view of the invention；
Fig. 2 is upper substrate of the present invention and lower substrate attachment structure schematic diagram；
Fig. 3 is pin of the present invention and outer protecting shell and circuit board connection structure schematic diagram；
Fig. 4 is construction for heat radiating device schematic diagram of the present invention；
Fig. 5 is dust exhaust apparatus structural schematic diagram of the present invention；
Fig. 6 is support device structure diagram of the present invention.
In figure: under 1 heat-radiating substrate, 2 radiators, 21 steel loops, 22 heat absorption copper sheets, 23 heat-conducting copper pipes, 24 radiating fins, 3
Substrate, 4 chip support plates one, 5 support devices, 51 pillars, 52 semi-circular recesses, 53 injection molding tubes, 6 upper substrates, 7 chip support plates two, 8
Metal wire, 9 outer protecting shells, 10 pins, 11 welding pieces, 12 dust exhaust apparatuses, 121 outer sleeves, 122 dust bars, 123 condensation liquid capsules,
124 condenser pipes, 125 dust accumulation strainers, 126 ventholes, 13 support columns, 14 reinforce welding aluminium flake, 15 heat release holes.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Fig. 1-6 is please referred to, the present invention provides a kind of technical solution: a kind of semiconductor packages unit of anti-electric shock and electric leakage,
Including heat-radiating substrate 1, the top of heat-radiating substrate 1 is uniformly arranged radiator 2, and the top of radiator 2 connects lower substrate 3, under
Chip support plate 1 is arranged in the top of substrate 3, is respectively provided with support device 5, support device 5 at left and right sides of the top of chip support plate 1
Top upper substrate 6 is set, chip support plate 27, the top of chip support plate 1 and chip support plate 27 is arranged in the top of upper substrate 6
Portion left and right ends are respectively provided with metal wire 8, and metal wire 8 is conductive metal, and the other end of metal wire 8 is connected to down
The top of substrate 3 and upper substrate 6, the top left and right sides of heat-radiating substrate 1 are respectively provided with pin 10, the top setting of heat-radiating substrate 1
Outer protecting shell 9, and lower substrate 3 and upper substrate 6 are arranged at the inner cavity of outer protecting shell 9, the left and right sides outer wall of heat-radiating substrate 1 is respectively provided with
Dust exhaust apparatus 12 is arranged in the top of welding piece 11, heat-radiating substrate 1, and the right side of lower substrate 3 is arranged in dust exhaust apparatus 12.
Wherein, radiator 2 includes the steel loop 21 for being fixed on 1 top of heat-radiating substrate, and the top of steel loop 21 connects heat-sink copper
Piece 22, and the top for the copper sheet 22 that absorbs heat is connected to the bottom of lower substrate 3, the bottom of heat absorption copper sheet 22 connects heat-conducting copper pipe 23, and
Thermally conductive copper wire is arranged in the inner cavity of heat-conducting copper pipe 23, and the bottom of heat-conducting copper pipe 23 is through to the inner cavity of heat-radiating substrate 1 and connects heat dissipation
Fin 24, and radiating fin 24 is embedded in the front side outer wall of heat-radiating substrate 1, and radiator 2 is arranged, can be with by heat absorption copper sheet 22
The heat for generating semiconductor packages unit at work quickly absorbs, and heat-conducting copper pipe 23 can accelerate the conduction of heat, passes through
Radiating fin 24 can make semiconductor packages unit the temperature remains within the normal range in operation state with rapid cooling；
Dust exhaust apparatus 12 includes the outer sleeve 121 for being fixed on 1 top of heat-radiating substrate, and dust is arranged in the top of outer sleeve 121
Bar 122, the inner cavity setting condensation liquid capsule 123 of outer sleeve 121, condensation liquid capsule 123 is thermoplastic elastic capsule, and condenses liquid capsule 123
Lumen loading have ice crystal condensate liquid, condensation liquid capsule 123 top be connected to condenser pipe 124, the inner cavity of dust bar 122 is set
Dust accumulation strainer 125 is set, and the top of condenser pipe 124 sequentially passes through outer sleeve 121 and dust accumulation strainer 125 and extends to dust bar
The left and right sides outer wall of 122 inner cavity, dust bar 122 is respectively provided with venthole 126, can be to outer protecting shell 9 by dust exhaust apparatus 12
It is convenient in progress outer protecting shell 9 using the exchange between thermal current and cold airflow while internal temperature is cooled down twice
Dust be collected, guarantee the operating temperature of outer protecting shell 9 internal semiconductor unit, reduce dust and work semiconductor unit
It influences；
The left and right sides outer wall of lower substrate 3 and upper substrate 6 is respectively provided with support column 13, the support column 13 of 3 outer wall of lower substrate
Top is connected to the outer wall of the support column 13 of 6 outer wall of upper substrate, and the top of the support column 13 of 6 outer wall of upper substrate is connected to outer shield
The inner cavity top of shell 9, by support column 13 can make between outer protecting shell 9 and chip support plate 1 and chip support plate 27 there are
Gap, can effectively prevent chip support plate 1 and chip support plate 27, friction appearance is quiet between outer protecting shell 9 during the installation process
Electricity prevents electrostatic to the damage of semiconductor encapsulation unit, effectively prevents from shocking by electricity；
Pin 10 is arranged with the junction of outer protecting shell 9 and heat-radiating substrate 1 respectively reinforces welding aluminium flake 14, reinforces welding aluminium flake
14 one end extends to the inner cavity of welding piece 11, and sealing ring, sealing is arranged in the junction of welding aluminium flake 14 and welding piece 11 admittedly
Circle is insulated enclosure circle, can effectively prevent semiconductor packages unit and leaks electricity from pin 10, outside the left and right sides of outer protecting shell 9
Wall is respectively provided with heat release hole 15, and strainer is arranged in the inner wall of heat release hole 15, convenient for the heat dissipation of heat in outer protecting shell 9, reduce dust into
Enter in outer protecting shell 9；
Support device 5 includes the pillar 51 of connection lower substrate 3 and upper substrate 6, and the upper and lower ends of pillar 51 are respectively provided with semicircle
Connected in star 52, and the outer wall of lower substrate 3 and upper substrate 6 is respectively provided with and the matched convex block of semi-circular recesses 52, semi-circular recesses 52
The left and right sides be connected to injection molding tube 53, and the outer wall of the other end connection pillar 51 of injection molding tube 53 can be with by support device 5
Keep upper substrate 6 and the connection of chip support plate 1 more stable, while being embedded in semi-circular recesses by convex block, makes semiconductor
Encapsulation unit at work stablize by motion amplitude, so that semiconductor packages unit is not influenced each other work, avoids generation electrostatic,
Effectively raise the anti-electric shock characteristic of semiconductor packages unit.
A kind of packaging method of anti-electric shock and the semiconductor packages unit to leak electricity:
S1: carrying out the installation of semiconductor packages first, and heat-radiating substrate 1 is fixed, and the lower substrate of chip support plate 1 will be housed
3 are mounted on the top of heat-radiating substrate 1, are interconnected the upper substrate 6 equipped with chip support plate 27 with 3 phase of lower substrate by support device 5
It connects, the upper and lower ends of support device 5 are cooperatively connected by semi-circular recesses 52 and convex block, by injection molding tube 53 to semi-circular recesses
Bonding agent is injected in 52, so that lower substrate 3 and upper substrate 7 is fixed on the upper and lower ends of support device 5, is then clamped outer protecting shell 9
At the top of heat-radiating substrate 1, it is connected by support column 13 with outer protecting shell 9, makes outer protecting shell 9 will not be with chip support plate 1 and core
Piece support plate 27 is in contact, and so that semiconductor packages unit is had more leakproofness and protectiveness when packaged, while will by welding piece 11
Pin 10 is fixed.
S2: encapsulation unit is packaged in use process, protects semiconductor package in encapsulation use by radiator 2
Hold room temperature, the heat that semiconductor packages cell operation generates is rapidly absorbed by heat absorption copper sheet 22, and heat absorption copper sheet 22 is by heat
Conduction conducts heat on radiating fin 24 on heat-conducting copper pipe 23 by heat-conducting copper pipe 23, can be with by radiating fin 24
To entrance outer protecting shell 9 while heat to be given out to the outside of heat-radiating substrate 1, while can be cooled down again by dust exhaust apparatus 12
In dust be collected, the heat in outer protecting shell 9 is distributed by heat release hole 15 to the outside of outer protecting shell 9, and liquid capsule 123 is condensed
In condensate liquid make the temperature of condenser pipe 124 lower than room temperature, the high temperature gas flow inside outer protecting shell 9 is by venthole 126 and dust
Cold airflow inside bar 122 alternately exchanges, and the dust in thermal current passes through dust accumulation strainer 125 during exchanging with cold airflow
Complete the collection of dust.
S3: after completing the encapsulation of semiconductor packages unit and using detection, carrying out subsequent processing for semiconductor packages unit,
By entering inspection, semiconductor encapsulation unit is further tested, test is packed after completing, and completes subsequent step
It is put in storage shipment.
It although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
A variety of variations, modification, replacement can be carried out to these embodiments without departing from the principles and spirit of the present invention by understanding
And modification, the scope of the present invention is defined by the appended.
Claims (7)
1. a kind of semiconductor packages unit of anti-electric shock and electric leakage, including heat-radiating substrate (1), it is characterised in that: the heat dissipation base
It is uniformly arranged at the top of plate (1) radiator (2), the top of the radiator (2) connects lower substrate (3), the lower substrate
(3) chip support plate one (4) are arranged in top, are respectively provided with support device (5) at left and right sides of the top of the chip support plate one (4),
Upper substrate (6) are arranged in the top of the support device (5), and chip support plate two (7) are arranged in the top of the upper substrate (6), described
The top left and right ends of chip support plate one (4) and chip support plate two (7) are respectively provided with metal wire (8), and metal wire (8) is another
One end is connected to the top of lower substrate (3) Yu upper substrate (6), is respectively provided at left and right sides of the top of the heat-radiating substrate (1)
Pin (10), top setting outer protecting shell (9) of the heat-radiating substrate (1), and lower substrate (3) and upper substrate (6) are arranged at outer
The left and right sides outer wall of the inner cavity of protective case (9), the heat-radiating substrate (1) is respectively provided with welding piece (11), the heat-radiating substrate (1)
Dust exhaust apparatus (12) are arranged in top, and dust exhaust apparatus (12) setting is on the right side of lower substrate (3).
2. the semiconductor packages unit of one kind anti-electric shock and electric leakage according to claim 1, it is characterised in that: the heat dissipation
Device (2) includes the steel loop (21) being fixed at the top of heat-radiating substrate (1), the top connection heat absorption copper sheet of the steel loop (21)
(22), it and at the top of heat absorption copper sheet (22) is connected to the bottom of lower substrate (3), the bottom connection of heat absorption copper sheet (22) is thermally conductive
Copper pipe (23), and thermally conductive copper wire is arranged in the inner cavity of heat-conducting copper pipe (23), the bottom of the heat-conducting copper pipe (23) is through to heat dissipation base
The inner cavity of plate (1) simultaneously connects radiating fin (24), and radiating fin (24) is embedded in the front side outer wall of heat-radiating substrate (1).
3. the semiconductor packages unit of one kind anti-electric shock and electric leakage according to claim 1, it is characterised in that: the dust suction
Device (12) includes the outer sleeve (121) being fixed at the top of heat-radiating substrate (1), and dust is arranged in the top of the outer sleeve (121)
Bar (122), inner cavity setting condensation liquid capsule (123) of the outer sleeve (121), and the lumen loading for condensing liquid capsule (123) has
The top of the condensate liquid of ice crystal, condensation liquid capsule (123) is connected to condenser pipe (124), the inner cavity setting of the dust bar (122)
Dust accumulation strainer (125), and sequentially pass through outer sleeve (121) and dust accumulation strainer (125) at the top of condenser pipe (124) and extend to collection
The left and right sides outer wall of the inner cavity of dirt bar (122), the dust bar (122) is respectively provided with venthole (126).
4. the semiconductor packages unit of one kind anti-electric shock and electric leakage according to claim 1, it is characterised in that: the lower base
Plate (3) and the left and right sides outer wall of upper substrate (6) are respectively provided with support column (13), the support column (13) of lower substrate (3) outer wall
Top be connected to upper substrate (6) outer wall support column (13) outer wall, and the top of the support column (13) of upper substrate (6) outer wall
It is connected to the inner cavity top of outer protecting shell (9).
5. the semiconductor packages unit of one kind anti-electric shock and electric leakage according to claim 1, it is characterised in that: the pin
(10) it is arranged respectively with the junction of outer protecting shell (9) and heat-radiating substrate (1) and reinforces welding aluminium flake (14), aluminium flake is welded in the reinforcing
(14) one end extends to the inner cavity of welding piece (11), and sealing is arranged in the junction of welding aluminium flake (14) and welding piece (11) admittedly
Circle, the left and right sides outer wall of the outer protecting shell (9) are respectively provided with heat release hole (15), and strainer is arranged in the inner wall of heat release hole (15).
6. the semiconductor packages unit of one kind anti-electric shock and electric leakage according to claim 1, it is characterised in that: the support
Device (5) includes the pillar (51) of connection lower substrate (3) and upper substrate (6), and the upper and lower ends of the pillar (51) are respectively provided with half
Circular groove (52), and lower substrate (3) and the outer wall of upper substrate (6) are respectively provided with and semi-circular recesses (52) matched convex block, institute
The left and right sides for stating semi-circular recesses (52) is connected to injection molding tube (53), and other end connection pillar (51) of injection molding tube (53)
Outer wall.
7. the packaging method of a kind of anti-electric shock and the semiconductor packages unit of electric leakage, it is characterised in that:
S1: carrying out the installation of semiconductor packages first, and heat-radiating substrate (1) is fixed, and the lower substrate of chip support plate one (4) will be housed
(3) it is mounted on the top of heat-radiating substrate (1), the upper substrate (6) of chip support plate two (7) will be equipped with under by support device (5)
Substrate (3) is connected with each other, and the upper and lower ends of support device (5) are cooperatively connected by semi-circular recesses (52) and convex block, passes through note
Modeling pipe (53) injects bonding agent into semi-circular recesses (52), and lower substrate (3) and upper substrate (7) is made to be fixed on support device (5)
Upper and lower ends, outer protecting shell (9) is then connected to the top of heat-radiating substrate (1), passes through support column (13) and outer protecting shell (9) phase
Connection, makes outer protecting shell (9) not to be in contact with chip support plate one (4) and chip support plate two (7), is sealing semiconductor packages unit
More leakproofness and protectiveness when dress, at the same it is by welding piece (11) that pin (10) are fixed；
S2: encapsulation unit is packaged in use process, keeps semiconductor package in encapsulation use by radiator (2)
Room temperature, the heat that semiconductor packages cell operation generates are rapidly absorbed by heat absorption copper sheet (22), and heat absorption copper sheet (22) will be hot
In amount conduction to heat-conducting copper pipe (23), conducted heat on radiating fin (24) by heat-conducting copper pipe (23), by heat radiating fin
Heat can be given out the outside of heat-radiating substrate (1) by piece (24), while it is same to be cooled down again by dust exhaust apparatus (12)
When the dust entered in outer protecting shell (9) is collected, the heat in outer protecting shell (9) is distributed to outer protecting shell by heat release hole (15)
(9) outside, condensing the condensate liquid in liquid capsule (123) makes the temperature of condenser pipe (124) be lower than room temperature, outer protecting shell (9) inside
High temperature gas flow replaces exchange by cold airflow inside venthole (126) and dust bar (122), the dust in thermal current with it is cold
Air-flow completes the collection of dust by dust accumulation strainer (125) during exchanging；
S3: after completing the encapsulation of semiconductor packages unit and using detection, semiconductor packages unit is subjected to subsequent processing, is passed through
Enter inspection, semiconductor encapsulation unit is further tested, test is packed after completing, and completing subsequent step can be put in storage
Shipment.
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| CN109103145A true CN109103145A (en) | 2018-12-28 |
| CN109103145B CN109103145B (en) | 2020-10-23 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111855076A (en) * | 2020-07-24 | 2020-10-30 | 深圳信息职业技术学院 | Packaging mechanism for pressure sensor chip packaging test and packaging method thereof |
| CN113539974A (en) * | 2021-09-15 | 2021-10-22 | 凯瑞电子(诸城)有限公司 | Chip packaging shell and brazing process thereof |
| CN115332199A (en) * | 2022-08-29 | 2022-11-11 | 王岳健 | Integrated circuit package |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN207529920U (en) * | 2017-12-22 | 2018-06-22 | 深圳市亚世欧实业有限公司 | A kind of circuit integrating device with dust reduction capability |
| CN207719204U (en) * | 2017-11-28 | 2018-08-10 | 东莞中之光电股份有限公司 | A kind of encapsulating structure with dust-proof effect |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN207719204U (en) * | 2017-11-28 | 2018-08-10 | 东莞中之光电股份有限公司 | A kind of encapsulating structure with dust-proof effect |
| CN207529920U (en) * | 2017-12-22 | 2018-06-22 | 深圳市亚世欧实业有限公司 | A kind of circuit integrating device with dust reduction capability |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111855076A (en) * | 2020-07-24 | 2020-10-30 | 深圳信息职业技术学院 | Packaging mechanism for pressure sensor chip packaging test and packaging method thereof |
| CN111855076B (en) * | 2020-07-24 | 2021-10-08 | 深圳信息职业技术学院 | Packaging mechanism for pressure sensor chip packaging test and packaging method thereof |
| CN113539974A (en) * | 2021-09-15 | 2021-10-22 | 凯瑞电子(诸城)有限公司 | Chip packaging shell and brazing process thereof |
| CN113539974B (en) * | 2021-09-15 | 2021-11-23 | 凯瑞电子(诸城)有限公司 | Chip packaging shell and brazing process thereof |
| CN115332199A (en) * | 2022-08-29 | 2022-11-11 | 王岳健 | Integrated circuit package |
| CN115332199B (en) * | 2022-08-29 | 2023-07-11 | 杭州芯正微电子有限公司 | Integrated circuit package |
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| CN109103145B (en) | 2020-10-23 |
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Effective date of registration: 20200925 Address after: 518000 Factory Building of Xinhao Second Industrial Zone, Qiaotou Community, Fuhai Street, Baoan District, Shenzhen City, Guangdong Province Applicant after: SHENZHEN XINZHANTONG ELECTRONICS Co.,Ltd. Address before: 215000 Fengyang Road 293, Yangchenghu Town, Xiangcheng District, Suzhou City, Jiangsu Province Applicant before: Wang Xiaoyong |
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