CN1133498A - 电路元件安装 - Google Patents

电路元件安装 Download PDF

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CN1133498A
CN1133498A CN95118933A CN95118933A CN1133498A CN 1133498 A CN1133498 A CN 1133498A CN 95118933 A CN95118933 A CN 95118933A CN 95118933 A CN95118933 A CN 95118933A CN 1133498 A CN1133498 A CN 1133498A
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小泉孝雄
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NEC Corp
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Abstract

本发明的电路元件安装结构，包括：其中有布线图A(11)的衬底(1)；在衬底(1)的表面形成的至少一个凹腔(16a)；和用于盖住凹腔的盖板(2)，特征是：该盖板包括其中的布线图B(7)和将其与布线图A(11)电气连接的连接部分B(5，5a)，和衬底包括将连接部分B与布线图A(11)电气连接的连接部分A(10，10a)。依照本发明，现在能在先有技术中为不可用空间的盖板上安装电路元件，因此也能在包括盖板区的衬底上以更高密度安装电路元件。

Description

电路元件安装
本发明涉及一种电路元件安装结构，在该结构中，在衬底的表面形成有凹腔，在凹腔中容纳电路元件，凹腔上盖有盖板，更具体地说涉及适用于复杂微波电路组件的这样一种电路元件安装结构。
近来常常使用例如复杂微波电路组件的结构，用于在微波电路上高密度地安装电子元件。包含多层衬底的复杂微波电路组件的一个例子已由日本未审专利公开NO.6—232608建议，并示于图1和图2中。
如图所示，该复杂电路组件在多层介质衬底500的上和下表面501和504包括密封表面，在上和下表面501和504中间也包括rf信号层502和503。rf信号层502和503由导电层构成，用于传输通过那里的信号，和用作信号传输电路。通过从衬底的上表面505a钻孔至密封上表面501形成凹腔505，以后要提到的盖板放入凹腔505。此外，从密封上表面501钻孔至rf信号层502形成凹腔507，在凹腔507中安装有源元件506和无源元件(未图示)。正如可看到，凹腔507比凹腔505有较小的内径。在这些元件已安装在凹腔507中后，用金属盖板508复盖凹腔505，以使有源和无源元件免受灰尘，湿气等的影响。rf信号层502由各种连线构成，其上也形成有DC布线图509。在衬底500的上表面500a上安装有若干表面安装装置510，用于实现大规模集成。
如上所述，形成凹腔505和507是为了在复杂微波电路组件的rf信号层502上安装各种元件。然而，自然不可能在凹腔上形成布线图和/或安装表面安装装置510。即是说，凹腔的形成减小了形成布线图和/或安装表面安装装置的面积，因此难于实现更高的集成度。
针对上述现有技术的问题，本发明的目的是在具有凹腔的电路衬底上以更高的密度安装元件。
本发明提供的电路元件安装结构包括：其中有布线图A的衬底，在衬底表面形成的至少一个凹腔；和盖住凹腔的盖板，其特征在于：盖板包括(a)其中的布线图B和(b)用于将布线图B与布线图A电气连接的至少一个连接部分B，和衬底包括用于将连接部分B与布线图A电气连接的至少一个连接部分A。
依照本发明，在盖板中或盖板上也形成有布线图。这样，即使存在空腔，也不再有形成布线图的任何障凝。因此，有可能在具有盖有盖板的凹腔的衬底上高密度地安装电路元件。
从以下结合附图所作的详细说明将能清楚看到本发明的以上和其他目的和优点，在各附图中相同标号表示相同或类似的元件。
图1是说明传统的复杂微波电路组件的透视图。
图2是图1所示的组件的透视截面图。
图3是依照本发明第一实施例的复杂微波电路组件的透视图。
图4A是在第一实施例中使用的盖板的底透视图。
图4B是图4A中所示的盖板的透视图。
图4C是为图4A和4B中所示盖板所盖上的凹腔的透视图。
图5是第一实施例中盖板和为该盖板所盖上的凹腔的截面图。
图6A是第二实施例中使用的盖板的底透视图。
图6B是为图6A中所示的盖板所盖上的凹腔的透视图。
图7是第二实施例中盖板和盖上盖板的凹腔的截面图。
图8A是第三实施例中使用的盖板的底透视图。
图8B是待图8A中所示盖板所盖上的凹腔的透视图。
图9是第三实施例中盖板和盖上盖板的凹腔的截面视图。
以下结合附图说明依照本发明的最佳实施例，在以下说明的实施例中，依照本发明的电路元件安装结构应用于复杂微波电路组件。
参阅图3至5，复杂微波电路组件1由多层陶瓷衬底构成，衬底的内层加工有凹腔16，如图4C所示，在凹腔16中形成信号布线图13和安装有例如晶体管和二极管的有源元件15。如图4A和4B所示，凹腔16被盖板2盖上，以使位于其中的有源元件免受灰尘和湿气。从凹腔16的上边缘至组件1的表面加工有凹腔16a，盖板2与凹腔16a相配合。
如图5所示，盖板2由三层陶瓷衬底构成，尺寸上比凹腔16a小几百微米。盖板2在上表面形成有布线图8，在布线图8上安装表面安装装置3。此外，在盖板2内形成有由铜或银组成的DC布线图23。布线图8和23通过在盖板2中形成的通路或连接器19相互电气连接。
在组件1中也形成dc布线图17。该DC布线图通过通路或连接器18连接从有源元件15伸出的连线15a。
如图4A所示，盖板2在其底表面形成有一对凹槽5和5a，在每一凹槽上形成端接线图7，每一端接线图7与DC布线图23电气连接。盖板2的整个底表面确定密封布线图6。
如图4C所示，组件1形成有一对凸块10和10a，在每一凸块10和10a上形成端接线图11。通过将盖板2盖上组件，盖板2的凹槽5和5a啮合在组件1的凸块10和10a上，因而将端接线图7和11相互连接。
凹槽5形状上与凹槽5a不同，和凹槽5只可与凸块10啮合。，而凹槽5a只可与凸块10a啮合。即，只有当凹槽5与凸块10啮合，凹槽5a与凸块10a啮合时，盖板2才可以配合地放入凹腔16a。这样，可避免盖板2放入凹腔16a时位置放错。
在组件1中形成的凹腔16a的底确定密封布线图14。当盖板2配合地放入凹腔16a时，盖板2的密封布线图6就直接与凹腔16a的密封布线图14相接触。
通过将端布线图7和11相互焊接和也将密封布线图6和14相互焊接，使盖板2和组件1固定地连接。焊接确保端接线图7和11之间的电接触和凹腔16a的密封。因为盖板2的底表面确定密封布线图6，可以获得腔16中电屏蔽。
如上所述，盖板2尺寸上设计为稍小于凹腔16a，因而在盖板2和组件1之间产生缝隙21。这样，当盖板2与组件1焊接时，当盖板2稍稍移动有可能散布焊料，从而保证焊料的浸润性。
尽管盖板2在任一侧形成有一个凹槽5或5a，也可以形成若干凹槽。此时组件1要形成有相同数量的凸块。此外，假如形成若干凹槽，对这些凹槽并不始终必须具有相同结构。各凹槽和因此与之联系的凸块可以相互具有不同形状。
盖板2的厚度等于凹腔16a的深度。然而，盖板2可以设计为其厚度大于或小于凹腔16a的深度。
以下解释复杂微波电路组件1的组装步骤。首先，如图4C和5所示，通过焊接将有源元件15安装在组件1的凹腔16中，然后，如图3所示，通过焊接在组件1表面上安装表面安装装置3。同样，通过焊接在盖板2上安装表面安装装置3。然后，通过使用熔点比为在盖板2上安装表面安装装置3所使用的焊料的熔点更低的焊料，将已安装好表面安装装置3的盖板2与组件1焊接。
如上所述电路元件安装结构确保布线图可在传统上不能使用的空间的区域中形成，和表面安装装置可以安装在这样的区域，导致不能使用的空间消除和以更高集成度安装元件。
即使凹腔16做得很大，通过将盖板2设计为相应加大，再将密封布线图14设计加大，这起着组件1的焊料储量作用，便可以增强当凹腔16盖上盖板2时所得到的气密性。
因为盖板2的下表面确定密封布线图6，与盖板2的密封提供电屏蔽效果。可以使用导电胶代替焊料。这种导电胶提高组件的组装效率。
在凹槽5，5a和凸块10，10a上形成端接线图形7和11，其优点在于可以避免用于相互连接密封布线图6和14的焊料进入端接线图7和11。通过设计盖板2具有凹槽和腔16a具有凸块，尤其可避免焊料进入端接线图。
如前所述，凹槽5和凸块10与凹槽5a和凸块10a形状上不同。假如盖板2以错误方向放入凹腔16a中，凹槽不与凸块啮合，因此盖板2不能配合地放入凹腔16a。这样，凹槽5和5a之间和凸块10和10a之间的形状不同确保了盖板2总是正确地放入凹腔16a。
在该实施例中，表面安装装置3安装在盖板2上。然而，应注意表面安装装置3可以不安装在盖板2上，和盖板2可以只形成有dc布线图23。也应注意到本发明的应用不限于上述的实施例所述的复杂微波电路组件，而是本发明可以适用于其他电路衬底，只要该衬底具有在衬底上有盖有盖板的凹腔的元件安装结构。
在上述实施例中，盖板2的设计有凹槽5，5a，而组件1设计有凸块10，10a。应注意盖板2和组件1可以设计为分别具有凸块和凹腔。此外，盖板2可以设计为既有凹槽又有凸块，此时组件1相应地设计为具有凸块和凹槽。
在上述实施例中，将盖板2的布线图7和组件1的布线图11连接的连接部分包括凹槽5，5a和凸块10，10a的组合。将盖板和组件的布线图相互连接的连接部分不限于这种组合，该连接部分可以具有其他结构。
例如，如图6A，6B和7所示，连接部分可以包括均具有相同斜度的平面的组合。如图6A所示，盖板2在下表面形成具有一定斜度的斜面30，30a。在斜面30，30a上形成类似于第一实施例的布线图7。
另一方面，如图6B所示，组件1设计为具有一对凸块，每个凸块具有三角形截面。每个凸块具有其斜度与盖板2的斜面30，30a的斜度相同的斜面31，31a。在斜面31，31a上形成布线图11。
这样，如图7所示，当盖板2放入凹腔16a时，盖板2的斜面30，30a就与组件1的斜面31，31a相面对并直接接触，造成盖板2的布线图7与组件1的布线图11相接触。盖板2的斜面30，30a和组件1的斜面31，31a具有相同的斜度，它们的组合确保在第一实施例中所获得的相同的优点。
图8A，8B和9表示用于将盖板和组件的布线图相互连接的连接部分的另一例子。如图8A所示，盖板2在其下表面形成有一对向外拱形表面40，40a，在拱形面40，40a上与第一实施例类似地形成布线图7。
另一方面，如图8B所示，组件1设计为具有一对凸块、每个凸块具有朝向内的弧形面41，41a，在向内弧形面41，41a上形成布线图11。
另一方面，如图8B所示，组件1设计为具有一对凸块，每个凸块具有朝向内的弧形面41，41a，其弧度与盖板的拱形面40。40a的弧度相同。在向内弧形面41，41a上形成布线图11。
这样，如图9所示，当将盖板2放入凹腔16a时，盖板2的向外拱形面40，40a就与组件1的向内的弧形面41，41a相面对，并直接接触，造成盖板2的布线图7与组件1的布线图11相接触。组件1的向内弧形面41，41a和盖板2的向外拱形面40，40a具有相同弧度，它们的组合确保了如第一实施例中所获得的相同的优点。
最后，虽然将盖板的布线图与组件的布线图连接的连接部分由上述实施例中一种结构构成，但连接部分可以由不同结构构成，例如，在盖板2上形成的连接部分可以具有凹槽5，凸块10，斜面30和向外的拱形面40中的一个或几个，此时在组件1上形成的连接部分设计为分别具有凸块10，凹槽5，斜面31和向内弧形面41。
虽然现已结合一些最佳实施例描述了本发明，但要理解本发明所包括的主题并不限于这些特定实施例。相反，本发明的主题要包括如以下权利要求书的精神和范围内可能包括的所有变化，修改和等同物。

Claims (10)

1.一种电路元件安装结构，包括：其中有布线图A(11)的衬底(1)；在衬底(1)的表面形成的至少一个凹腔(16a)；和用于盖住凹腔(16a)的盖板(2)，其特征在于：盖板(2)包括(a)其中的布线图B(7)和(b)用于将布线图B(7)与布线图A(11)电气连接的至少一个连接部分B(5，5a，30，30a，40，40a)，和衬底(1)包括用于将连接部分B与布线图A(11)电气连接的至少一个连接部分A(10，10a，31，31a，41，41a)。
2.依据权利要求1所述的电路元件安装结构，其特征在于：连接部分B包括凹槽(5，5a)和凸块(10，10a)的其中一个，盖板(2)在连接部分B与衬底(1)相接触，和连接部分A包括位于凹腔(16a)中凹槽(5，5a)和凸块(10，10a)的另一个，凹槽(5，5a)和凸块(10，10a)结构上可相互啮合。
3.依据权利要求2所述的电路元件安装结构，其特征在于：形成有若干对连接部分A和B，其中一对的连接部分A和B包括凹槽(5，5a)或凸块(10，10a)，形状上不同于另一对中连接部分A和B包括的凹槽或凸块。
4.依据权利要求3所述的电路元件安装结构，其特征在于：在一些对中连接部分A形状为凸块(10，10a)，和与之对应的连接部分B形状为凹槽(5，5a)，和在其余对中连接部分A形状为凹槽(5，5a)和与之对应的连接部分B形状为凸块(10，10a)。
5.依据权利要求1所述的电路元件安装结构，其特征在于：连接部分B包括斜面C(30，30a)，盖板(2)在斜面C与衬底(1)相接触，和连接部分A包括与斜面C(30，30a)斜度相同的斜面D(31，31a)，斜面C(30，30a)和D(31，31a)结构上相互面对接触。
6.依据权利要求1所述的电路元件安装结构，其特征在于：连接部分B包括向外的拱形面E(40，40a)，盖板(2)在拱形面E(40，40a)与衬底(1)相接触，连接部分A包括向内弧形面F(41，41a)，拱形面E(40，40a)和弧形面F(41，41a)结构上相互配合。
7.依据权利要求1所述的电路元件安装结构，其特征在于：形成若干对连接部分A和B，每个连接部分B包括凹槽(5，5a)，凸块(10，10a)斜面C(30，30a)和向外的拱形面E(40，40a)的其中之一，和每个连接部分A分别包括凸块(10，10a)，凹槽(5，5a)，与斜面C(30，30a)斜面相同的斜面D(31，31a)和向内的弧形面F(41，41a)，凹槽(5，5a)和凸块(10，10a)结构上可相互啮合，斜面C(30，30a)和D(31，31a)结构上相互面对接触，和拱形面E，(40，40a)和弧形面F(41，41a)结构上相互配合。
8.依照上述任一权利要求所述的电路元件安装结构，其特征在于：盖板(2)在尺寸上比凹腔(16a)稍小些，因此在盖板(2)和凹腔(16a)之间形成缝隙(21)。
9.依照1至7任一权利要求所述的电路元件安装结构，其特征在于：盖板(2)的厚度等于凹腔(16a)的深度。
10.依照1至7任一权利要求所述的电路元件安装结构，其特征在于：盖板(2)在其表面形成具有至少一个接线端(8)，用于将所述盖板(2)与安装在所述盖板(2)上的电路元件电气连接。
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* Cited by examiner, † Cited by third party
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CN106028649A (zh) * 2016-07-28 2016-10-12 广东欧珀移动通信有限公司 移动终端的电路板和具有其的移动终端
CN106028649B (zh) * 2016-07-28 2019-02-12 Oppo广东移动通信有限公司 移动终端的电路板和具有其的移动终端
CN109121293A (zh) * 2018-09-30 2019-01-01 西安易朴通讯技术有限公司 印刷电路板组件及电子设备
CN109121293B (zh) * 2018-09-30 2020-05-15 西安易朴通讯技术有限公司 印刷电路板组件及电子设备

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TW343425B (en) 1998-10-21
CA2161569C (en) 2000-01-25
EP0713252A2 (en) 1996-05-22
KR960020637A (ko) 1996-06-17
CA2161569A1 (en) 1996-05-17
EP0713252A3 (en) 1998-01-07
AU699516B2 (en) 1998-12-03
AU3787695A (en) 1996-05-23
KR100288520B1 (ko) 2001-05-02
JPH08148800A (ja) 1996-06-07
JP2682477B2 (ja) 1997-11-26
US5712767A (en) 1998-01-27

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